CN105552007B - A kind of device and method improving etching uniformity - Google Patents
A kind of device and method improving etching uniformity Download PDFInfo
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- CN105552007B CN105552007B CN201610101512.6A CN201610101512A CN105552007B CN 105552007 B CN105552007 B CN 105552007B CN 201610101512 A CN201610101512 A CN 201610101512A CN 105552007 B CN105552007 B CN 105552007B
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- chemical liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
The invention discloses a kind of device and methods for improving etching uniformity, including the first spray arm and the first spray equipment, first spray equipment is mounted on the first spray arm that can drive its rotation and/or lifting, the length of first spray equipment is consistent with the radius of chip or diameter, and the chemical liquid sprayed can cover simultaneously the surface of chip moment.The present invention passes through the first spray equipment of setting, when spraying chemical liquid, with the high-speed rotating state of chip, it can be in the instantaneous uniform fold chemical liquid of wafer surface, so that wafer surface is reacted with chemical liquid generation simultaneously everywhere, solve the problems, such as in the prior art chemical liquid rise specking at corrosion rate be higher than chip other everywhere, improve the uniformity of the corrosion of chip；Further, can also be accurate to control etching rate by adjusting the flutter rate of the second spray equipment during etching, further increase the erosion uniformity of chip.
Description
Technical field
It is equal more specifically to a kind of raising etching the present invention relates to semiconductor devices and processing and manufacturing field
The device and method of even property.
Background technique
Requirement with the continuous diminution of integrated circuit feature size, to the cleannes and flatness of wafer surface oxidation film
It is higher and higher, it will have a direct impact on the quality of subsequent technique as wafer surface oxide thickness transfinites, so as to cause ic core
The degradation of piece, declines product yield.Although the flatness of oxidation film can be controlled by changing oxidation process conditions
System, but still need to further improve the uniformity of chip film thickness after this technique.Monolithic wet etching due to no cross contamination and
A kind of very important technology for improving film thickness uniformity can be become the advantages that zonal corrosion.But it is continuous with wafer size
Increase, the uniformity for being precisely controlled monolithic wet etching rate and corrosion also becomes increasingly have challenge.
It, can be with wafer surface object using the wafer surface of spray arm configuration injection chemical liquid to rotation in prior art
Chemical reaction occurs for matter to erode the unwanted oxidation film of wafer surface or coating film layer.But according to current process results
Show that the corrosion rate of wafer surface everywhere and the position of spray arm specking are closely related, that is, it is high to play corrosion rate at specking
In chip other everywhere, therefore the uniformity of wafer surface corrosion rate is caused to be deteriorated, and this phenomenon can be with corrosion medical fluid
The increase of concentration and the raising of temperature become increasingly severe.If the etching time for increasing wafer surface helps to improve chip table
The uniformity of face corrosion rate, but the reduction of chip production efficiency certainly will be will lead to simultaneously.Therefore, how in shorter technique
It is interior to solve the problems, such as that etching uniformity difference becomes those skilled in the art's urgent problem to be solved.
Summary of the invention
The purpose of the present invention is to provide a kind of device and methods for improving etching uniformity, to solve chemical drugs
Liquid rise specking at corrosion rate be higher than chip other everywhere the problem of, improve etching uniformity.
The present invention is to solve above-mentioned technical problem and the technical solution adopted is that provide a kind of raising etching uniformity
Device, including the chip carrier for bearing wafer, the chip carrier can drive afer rotates to default rotation speed, also
Including the first spray arm and the first spray equipment, first spray equipment be mounted on can drive its rotate and/or lifting
On first spray arm；Wherein, the length of first spray equipment is consistent with the radius of the chip or diameter, can be in chip table
The instantaneous uniform fold chemical liquid in face has the hollow cavity for containing chemical liquid, the upper surface of the hollow cavity
It is connected to the first inlet pipe for supplying chemical liquid, first inlet pipe is equipped with the first control valve to control chemistry
The circulation of medical fluid, the lower surface of the hollow cavity are equipped with several equally distributed spray-holes and the second control valve, and described the
Two control valves control the opening and closing of each spray-hole simultaneously, so that the chemical liquid that the spray-hole sprays covers the chip table simultaneously
Face.
Preferably, the shape of first spray equipment is cuboid, segment or cylindrical body, when the first spray dress
When the shape set is cuboid, the length of the cuboid is consistent with the radius of the chip or diameter；When first spray
When the shape of device is segment, the side length of the segment is consistent with the radius of the chip；When first spray equipment
Shape be cylindrical body when, the diameter of the cylindrical body is consistent with the diameter of the chip.
Preferably, the liquid level for sensing chemical solution liquid level is equipped in the hollow cavity of first spray equipment
Sensor.
Preferably, the liquid level sensor has display lamp, when chemical solution reaches default liquid level, the display
Lamp lights.
Preferably, the device for improving etching uniformity further includes the second spray arm and the second spray equipment, described
Second spray equipment is mounted on the second spray arm that can drive its rotation and/or lifting, and second spray equipment is used for
One end margin of chip between another end margin to moving reciprocatingly and spray chemical liquid.
Preferably, second spray equipment is connected to the second inlet pipe for supplying chemical liquid, described second into
There is the third control valve of control chemical liquid circulation on liquid pipeline.
Preferably, second spray arm is equipped with velocity sensor and speed regulator, and the velocity sensor is used
In sensing flutter rate of second spray equipment above chip, the speed regulator is for adjusting second spray
Flutter rate of the device above chip.
The present invention also provides a kind of methods for improving etching uniformity, comprising the following steps:
Step S01: providing chip to be cleaned and be carried on chip carrier, and chip carrier is driven with default rotation speed
Afer rotates；
First spray equipment: being rotated from the position home and is gone up and down the predeterminated position to chip by step S02, so that institute
The chemical liquid for stating the ejection of the first spray equipment can cover the radius or diameter range of the chip simultaneously, meanwhile, close injection
Second control valve in hole opens the first control valve of the first inlet pipe, until the intracorporal chemical liquid of hollow cavity reaches default
Liquid level；
Step S03: opening the second control valve of spray-hole, so that the chemical liquid that the spray-hole sprays is covered on simultaneously
The wafer surface of rotation；
First spray equipment: being rotated from predeterminated position and is gone up and down go back to the position home by step S04, then by the second spray equipment
It rotates and goes up and down the predeterminated position to chip from the position home, open third control valve, from an end margin of chip to another
It moves reciprocatingly between one end margin and sprays chemical liquid, until completing the corrosion of wafer surface predetermined amount.
Preferably, described when the length of the first spray equipment is consistent with the radius of the chip in the step S02
One end of first spray equipment is aligned with the edge of the chip, and the other end is aligned with the center of circle of the chip；When described first
When the length of spray equipment is consistent with the diameter of the chip, one end of first spray equipment and an end edge of the chip
Edge alignment, the other end are aligned with another end margin of the chip.
Preferably, it in the step S04, above the second spray equipment chip after the chemical liquid of injection preset time, adjusts
The flutter rate of whole second spray equipment, continuation move reciprocatingly simultaneously from an end margin of chip between another end margin
Spray chemical liquid.
A kind of device and method improving etching uniformity provided by the invention, by the way that the first spray equipment is arranged,
Keep its length consistent with the radius of chip or diameter, it, can be in crystalline substance with the high-speed rotating state of chip when spraying chemical liquid
The instantaneous uniform fold chemical liquid in piece surface solves existing so that wafer surface is reacted with chemical liquid generation simultaneously everywhere
In technology chemical liquid rise specking at corrosion rate be higher than chip other everywhere the problem of, improve the uniform of the corrosion of chip
Property, further, during etching, also chip can be accurately controlled by adjusting the flutter rate of the second spray equipment
Corrosion rate further increases the erosion uniformity of chip.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural schematic diagram that the device preferred embodiment of etching uniformity is improved in the present invention.
Figure label is described as follows:
10, chip carrier, 20, chip, the 30, first spray arm, the 40, first spray equipment, the 41, first inlet pipe, 42,
First control valve, 43, spray-hole, the 44, second control valve, 45, liquid level sensor, the 50, second spray arm, the 60, second spray dress
It sets, the 61, second inlet pipe, 62, third control valve.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to implementation of the invention
Mode is described in further detail.Those skilled in the art can understand easily the present invention by content disclosed by this specification
Other advantages and effect.The present invention can also be embodied or applied by other different embodiments, this explanation
Every details in book can also based on different viewpoints and application, without departing from the spirit of the present invention carry out various modifications or
Change.
Above and other technical characteristic and beneficial effect, will in conjunction with the embodiments and attached drawing to it is proposed by the present invention have metal
The semiconductor devices and its manufacturing method of gate electrode are described in detail.Fig. 1 is that etching uniformity is improved in the present invention
The structural schematic diagram of device preferred embodiment.
Referring to FIG. 1, a kind of device for improving etching uniformity provided by the invention, including it is used for bearing wafer 20
Chip carrier 10, the first spray arm 30 and the first spray equipment 40, chip carrier 10 can drive the rotation of chip 20 to default
Rotation speed, chip carrier 10 include fixed mechanism and rotating mechanism, and chip 10 is fixed on fixed mechanism, rotating mechanism
Fixed mechanism is driven to do high speed rotary motion, the first spray equipment 40 is mounted on the first spray that it can be driven to rotate and/or go up and down
It drenches on arm 30.
In the present embodiment, the length of the first spray equipment 40 is consistent with the radius of chip 20 or diameter, the chemistry of injection
Medical fluid can have the hollow cavity for containing chemical liquid, be equipped in hollow cavity in the instantaneous uniform fold of wafer surface
For sensing the liquid level sensor 45 of chemical solution liquid level, liquid level sensor 45 has display lamp, when chemical solution reaches
When default liquid level, triggering display lamp is lighted.The upper surface of hollow cavity is connected to the first feed liquor for supplying chemical liquid
Pipeline 41, the first inlet pipe 41 are equipped with the first control valve 42 to control the circulation of chemical liquid, the lower surface of hollow cavity
Equipped with several equally distributed spray-holes 43 and the second control valve 44, the second control valve 44 controls opening for each spray-hole simultaneously
It closes, so that the chemical liquid that spray-hole 43 sprays covers 20 surface of chip simultaneously.
Specifically, the shape of the first spray equipment 40 includes but is not limited to cuboid, segment or cylindrical body, when the first spray
When the shape of shower device 40 is cuboid, the length of cuboid is consistent with the radius of chip or diameter；When the first spray equipment 40
Shape be segment when, the side length of segment and the radius of chip are consistent；When the shape of the first spray equipment 40 is cylindrical body
When, the diameter of cylindrical body and the diameter of chip are consistent.
Meanwhile the device for improving etching uniformity further includes the second spray arm 50 and the second spray equipment 60, the
Two spray equipments 60 are mounted on the second spray arm 50 that can drive its rotation and/or lifting, and the second spray equipment 60 is used for
One end margin of chip 20 to moving reciprocatingly between another end margin and spraying chemical liquid, use by the connection of the second spray equipment 60
In the third control in the second inlet pipe 61 of supply chemical liquid, the second inlet pipe 61 with control chemical liquid circulation
Valve 62 opens third control valve 62 when using the second spray equipment 60, and realization sprays while feed flow.
Etching rate is controlled in order to be more accurate, can be equipped with velocity sensor and speed tune on the second spray arm 50
Whole device (not shown), velocity sensor be used for sense the second spray equipment 60 on wafer 20 side flutter rate, speed
Adjuster be used for adjust the second spray equipment 60 on wafer 20 side flutter rate, specific flutter rate can be according to practical need
It is it is not limited here, accurate to control 20 corrosion rate of chip by adjusting the flutter rate of the second spray equipment 60 depending on asking,
Further increase the erosion uniformity of chip.
In addition, the present invention also provides a kind of methods for improving etching uniformity, comprising the following steps:
Step S01: providing chip 20 to be cleaned and be carried on chip carrier 10, and chip carrier 10 is with default rotation speed
Degree drives chip 20 to rotate.
Step S02: the first spray equipment 40 is rotated from the position home (i.e. initial position) and is gone up and down to 20 top of chip
Predeterminated position, the predeterminated position setting can guarantee the first spray equipment 40 spray chemical liquid can cover chip simultaneously
Radius or diameter range, meanwhile, the second control valve 44 of spray-hole 43 is closed, the first control valve of the first inlet pipe 41 is opened
42, until the intracorporal chemical liquid of hollow cavity reaches default liquid level, the display lamp of triggering liquid level sensor 45 is lighted, is closed
First control valve 42 of the first inlet pipe 41.
In this step, to the first spray equipment 40, square predeterminated position is further limited on wafer 20, when the first spray
When the length of shower device 40 is consistent with the radius of chip 20, one end of the first spray equipment 40 is aligned with the edge of chip 20, separately
One end is aligned with the center of circle of chip 20；When the length of the first spray equipment 40 is consistent with the diameter of chip 20, the first spray dress
It sets 40 one end to be aligned with an end margin of chip 20, the other end is aligned with another end margin of chip 20.
Step S03: opening the second control valve 44 of spray-hole 43, so that the chemical liquid that spray-hole 43 sprays covers simultaneously
On 20 surface of chip of rotation.
Step S04: the first spray equipment 40 is rotated from predeterminated position and is gone up and down go back to the position home, then the second spray is filled
It sets 60 to rotate and gone up and down to the predeterminated position of 20 top of chip from the position home, third control valve 62 is opened, from the one of chip 20
End margin between another end margin to moving reciprocatingly and spraying chemical liquid, until completing the corruption of 20 surface programming amount of chip
Erosion.
In this step, the second spray equipment 60 after the chemical liquid of side's injection preset time, can lead to first on wafer 20
The flutter rate that velocity sensor senses the second spray equipment is crossed, further according to actual demand, passes through speed regulator adjustment second
The flutter rate of spray equipment continues from an end margin of chip 20 to moving reciprocatingly between another end margin and spray chemistry
Medical fluid, accurately to control etching rate.
In conclusion a kind of device and method for improving etching uniformity provided by the invention, passes through setting first
Spray equipment keeps its length consistent with the radius of chip or diameter, when spraying chemical liquid, with the high-speed rotating shape of chip
State, so that wafer surface is reacted with chemical liquid generation simultaneously everywhere, can be solved in the instantaneous uniform fold chemical liquid of wafer surface
Determined in the prior art chemical liquid rise specking at corrosion rate be higher than chip other everywhere the problem of, improve the corruption of chip
The uniformity of erosion further, can also be by adjusting the flutter rate of the second spray equipment, accurately during etching
Etching rate is controlled, the erosion uniformity of chip is further increased.
Above-described to be merely a preferred embodiment of the present invention, the patent that the embodiment is not intended to limit the invention is protected
Range is protected, therefore all with the variation of equivalent structure made by specification and accompanying drawing content of the invention, similarly should be included in
In protection scope of the present invention.
Claims (9)
1. a kind of device for improving etching uniformity, including the chip carrier for bearing wafer, the chip carrier can
Drive afer rotates to default rotation speed, which is characterized in that it further include the first spray arm and the first spray equipment, described the
One spray equipment is mounted on the first spray arm that can drive its rotation and/or lifting；Wherein, the length of first spray equipment
Degree is consistent with the radius of the chip or diameter, can have in the instantaneous uniform fold chemical liquid of wafer surface for containing
The hollow cavity of chemical liquid, the upper surface of the hollow cavity are connected to the first inlet pipe for supplying chemical liquid, institute
The circulation that the first inlet pipe controls chemical liquid equipped with the first control valve is stated, if the lower surface of the hollow cavity is equipped with
Equally distributed spray-hole and the second control valve are done, second control valve controls the opening and closing of each spray-hole simultaneously, so that institute
Wafer surface described in the instantaneous uniform fold of chemical liquid of spray-hole ejection is stated, the erosion uniformity of chip is improved；
The device for improving etching uniformity further includes the second spray arm and the second spray equipment, second spray
Device is mounted on the second spray arm that can drive its rotation and/or lifting, and second spray equipment is used for the one of chip
End margin between another end margin to moving reciprocatingly and spray chemical liquid.
2. the device according to claim 1 for improving etching uniformity, which is characterized in that first spray equipment
Shape be cuboid, segment or cylindrical body, when the shape of first spray equipment be cuboid when, the cuboid
Length is consistent with the radius of the chip or diameter；When the shape of first spray equipment is segment, the segment
Side length it is consistent with the radius of the chip；When the shape of first spray equipment be cylindrical body when, the cylindrical body it is straight
Diameter is consistent with the diameter of the chip.
3. the device according to claim 2 for improving etching uniformity, which is characterized in that first spray equipment
Hollow cavity in be equipped with liquid level sensor for sensing chemical solution liquid level.
4. the device according to claim 3 for improving etching uniformity, which is characterized in that the level sensing utensil
There is display lamp, when chemical solution reaches default liquid level, the display lamp is lighted.
5. the device according to claim 1 for improving etching uniformity, which is characterized in that second spray equipment
It is connected to the second inlet pipe for supplying chemical liquid, there is the of control chemical liquid circulation in second inlet pipe
Three control valves.
6. the device according to claim 1 for improving etching uniformity, which is characterized in that on second spray arm
Equipped with velocity sensor and speed regulator, the velocity sensor is for sensing second spray equipment above chip
Flutter rate, the speed regulator is for adjusting flutter rate of second spray equipment above chip.
7. a kind of method for improving etching uniformity, which comprises the following steps:
Step S01: providing chip to be cleaned and be carried on chip carrier, and chip carrier drives chip with default rotation speed
Rotation；
First spray equipment: being rotated from the position home and is gone up and down the predeterminated position to chip by step S02, so that described
The chemical liquid that one spray equipment sprays can cover the radius or diameter range of the chip simultaneously, meanwhile, close spray-hole
Second control valve opens the first control valve of the first inlet pipe, until the intracorporal chemical liquid of hollow cavity reaches default liquid level
Highly；
Step S03: opening the second control valve of spray-hole, so that the instantaneous uniform fold of chemical liquid that the spray-hole sprays exists
The wafer surface of rotation improves the erosion uniformity of chip；
First spray equipment: being rotated from predeterminated position and is gone up and down go back to the position home by step S04, then by the second spray equipment from
The position home rotates and goes up and down the predeterminated position to chip, opens third control valve, from an end margin of chip to another
It moves reciprocatingly between end margin and sprays chemical liquid, until completing the corrosion of wafer surface predetermined amount.
8. the method according to claim 7 for improving etching uniformity, which is characterized in that in the step S02, when
When the length of first spray equipment is consistent with the radius of the chip, one end of first spray equipment and the side of the chip
Edge alignment, the other end are aligned with the center of circle of the chip；When the length of first spray equipment and the diameter one of the chip
When cause, one end of first spray equipment is aligned with an end margin of the chip, the other end of the other end and the chip
Edge alignment.
9. the method according to claim 7 for improving etching uniformity, which is characterized in that in the step S04, the
Above two spray equipment chips after the chemical liquid of injection preset time, the flutter rate of second spray equipment is adjusted, after
A continuous end margin from chip between another end margin to moving reciprocatingly and spray chemical liquid.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610101512.6A CN105552007B (en) | 2016-02-24 | 2016-02-24 | A kind of device and method improving etching uniformity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610101512.6A CN105552007B (en) | 2016-02-24 | 2016-02-24 | A kind of device and method improving etching uniformity |
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| CN105552007A CN105552007A (en) | 2016-05-04 |
| CN105552007B true CN105552007B (en) | 2019-05-10 |
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| CN201610101512.6A Active CN105552007B (en) | 2016-02-24 | 2016-02-24 | A kind of device and method improving etching uniformity |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111081585B (en) * | 2018-10-18 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Spray device and cleaning equipment |
| CN109647551A (en) * | 2018-12-26 | 2019-04-19 | 济南金域医学检验中心有限公司 | A kind of experiment reagent is automatically replenished method, system, device and controller |
| CN110473818A (en) * | 2019-09-25 | 2019-11-19 | 广东先导先进材料股份有限公司 | A kind of chip automatic corrosion sprinkling equipment |
| CN112103220B (en) * | 2020-11-09 | 2021-04-09 | 晶芯成(北京)科技有限公司 | Monitoring device and monitoring method for wafer cleaning position |
| CN112509946A (en) * | 2020-12-01 | 2021-03-16 | 宁波瑞曼特新材料有限公司 | Multifunctional wafer etching and cleaning device and use method |
| CN113471108B (en) * | 2021-07-06 | 2022-10-21 | 华海清科股份有限公司 | Vertical rotatory processing apparatus of wafer based on marangoni effect |
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| JP3559228B2 (en) * | 2000-08-07 | 2004-08-25 | 住友精密工業株式会社 | Rotary substrate processing equipment |
| CN101499412A (en) * | 2008-01-31 | 2009-08-05 | 大日本网屏制造株式会社 | Substrate treatment apparatus, and substrate treatment method |
| CN103928298A (en) * | 2013-01-15 | 2014-07-16 | 大日本网屏制造株式会社 | Substrate Processing Method And Substrate Processing Apparatus |
| CN205428885U (en) * | 2016-02-24 | 2016-08-03 | 北京七星华创电子股份有限公司 | Improve device that wafer corrodes homogeneity |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007115728A (en) * | 2005-10-18 | 2007-05-10 | Sumco Corp | Single wafer etching device and single wafer etching method |
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| JP3559228B2 (en) * | 2000-08-07 | 2004-08-25 | 住友精密工業株式会社 | Rotary substrate processing equipment |
| CN101499412A (en) * | 2008-01-31 | 2009-08-05 | 大日本网屏制造株式会社 | Substrate treatment apparatus, and substrate treatment method |
| CN103928298A (en) * | 2013-01-15 | 2014-07-16 | 大日本网屏制造株式会社 | Substrate Processing Method And Substrate Processing Apparatus |
| CN205428885U (en) * | 2016-02-24 | 2016-08-03 | 北京七星华创电子股份有限公司 | Improve device that wafer corrodes homogeneity |
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Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: BEIJING SEVENSTAR ELECTRONICS Co.,Ltd. |
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