JP3552172B2 - Conductor connection method for molded substrate - Google Patents

Conductor connection method for molded substrate Download PDF

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Publication number
JP3552172B2
JP3552172B2 JP15985594A JP15985594A JP3552172B2 JP 3552172 B2 JP3552172 B2 JP 3552172B2 JP 15985594 A JP15985594 A JP 15985594A JP 15985594 A JP15985594 A JP 15985594A JP 3552172 B2 JP3552172 B2 JP 3552172B2
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Prior art keywords
conductor
molded substrate
circuit
connection
electric wire
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JP15985594A
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JPH0832228A (en
Inventor
裕 榊原
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Yazaki Corp
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Yazaki Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Description

【０００１】
【産業上の利用分野】
本発明は、合成樹脂材の成形加工品に回路導体を一体的に形成して成る成形基板の回路導体と、電線あるいは他の基板の回路導体等とを電気的に接続する成形基板の導体接続方法に関する。
【０００２】
【従来の技術】
近年、電気機器の発達に伴いその配線構造の多様化、高機能化が進み、配線および部品配置の高密度化、軽量化、小型化等を図るため、部品および配線板等を収容する匡体と一体的に回路形成ができるいわゆる成形基板の利用が配慮されている。成形基板の製法としては、たとえば、特開昭６３−１２８１８１号公報に開示されている、プラスチック成形品の製法の提案もなされている。
【０００３】
このプラスチック成形品の製法は、図８に示すように、プラスチックの一次成形を行って、回路部分を突条ａで形成した一次成形基板ｂを成形し、この一次成形基板ｂの全体に対し、無電解メッキ用の触媒処理を施す。次に、図９に示すように、突条ａを残すようにして一次成形基板ｂを合成樹脂材で被覆する二次成形を行い、触媒処理の施された回路部分ｃを露出させた二次成形基板ｄを形成する。そして、二次成形基板ｄに対して、無電解メッキを施すことにより、図１０に示すように、触媒処理の施された回路部分（突条）ｃにメッキ銅を析出させて回路ｅを形成するようにしている。
【０００４】
このようにして形成された成形基板の回路と、他の成形基板の回路とを接続しようとする場合は、一般の回路基板、たとえばプリント回路板などと同様に端子やコネクタを介在させて接続を行ったり、回路部分にスルーホールを設けて、ピン等を介して半田付けする方法が考えられているのみである。
【０００５】
しかしながら、端子やコネクタを介在させて接続を行ったり、スルーホールを設けて半田付けを行うのであれば、全体の部品点数や、作業工程が増加し、複雑な工程を経て小型化、軽量化を図った成形基板の利点が減殺されてしまう問題点を有している。
【０００６】
【発明が解決しようとする課題】
本発明は、上記の問題点に着目してなされたもので、端子やコネクタ等の別部品を使用することなく、成形基板の回路導体と、電線あるいは他の基板の回路導体等とを電気的に接続することのできる成形基板の導体接続方法を提供することを課題とする。
【０００７】
【課題を解決するための手段】
前記の課題を達成するため、本発明の請求項１記載の成形基板の導体接続方法は、成形基板を構成する回路導体の所定の位置に、該成形基板を貫通する接続用孔を有する導体接続部を凹設し、該導体接続部は、円筒状凹面を有する凹陥部として形成され、該凹陥部の周壁と、該回路導体とを一体的に導通させた後に、該凹陥部に別の導体を配置し、該接続用孔を通じて半田付けまたは溶接を行うことにより、該成形基板の回路導体と、該別の導体とを接続することを特徴とする。
前記導体接続部に金属メッキ処理を施して、該導体接続部の前記周壁と、前記回路導体とを一体的に導通させることが好ましい（請求項２）。
【０００８】
前記成形基板の一端に電線抑止板を開閉自在に設け、前記導体接続部に載置した電線を、該電線抑止板で挟持して接続を行うようするとさらに好適である（請求項３）。
【００１１】
【作用】
本発明によれば、成形基板の回路導体に導体接続部を形成しているため、直接、導体接続部と電線などの他の導体とを半田付けあるいは溶接することにより、端子や、コネクタを介在させることなく接続することができる。
すなわち、請求項１に記載した発明の導体接続部の構造は、成形基板の一面に凹陥部を形成し、該凹陥部の底面から成形基板の他面に開口する接続用孔を有するため、半田付け、あるいは溶接が容易かつ確実に実施できる。
とくに、請求項２に記載したように、導体接続部の全面に金属メッキを施すことにより、半田付け、あるいは溶接を行う際に、成形基板の素材である合成樹脂材を過熱することなく接続が可能となる。溶接を行う場合は、金属メッキ層を厚く形成して溶融金属の量を多くすると好結果が得られる。
【００１３】
【実施例】
図１は、請求項１に記載した発明の実施例に係わる成形基板１を構成する回路導体２と、他の導体としての電線３とを接続する工程を示す斜視図である。
成形基板１は、合成樹脂材のいわゆる２ショット法による成形加工によって形成されたもので、その表面１ａには複数の回路導体２が所定の回路パターンに従って形成され、端部には導体接続部４が形成されている。導体接続部４を形成した成形基板１の一方の縁部１ｂには、電線抑止板５が可撓ヒンジ６を介して開閉自在に設けられている。
【００１４】
導体接続部４は、図２に示すように、電線３と密着するように円筒状凹面で形成された凹陥部７から成り、凹陥部７の底部には成形基板１を貫通し、成形基板１の裏面１ｃに拡開した接続用孔８が開設されている。凹陥部７および接続用孔８の周壁には、金属メッキ層９が施され、回路導体２と導通している。
成形基板１に回路導体２および導体接続部４を形成する方法としては、次のような作製方法を用いた。
【００１５】
すなわち、合成樹脂材の一次成形加工により、回路導体２および導体接続部４を形成する部分を突条に形成し、この突条を無電解メッキ用触媒処理した後、二次成形加工を行って、突条以外の部分を合成樹脂材で被覆し、次いで無電解メッキ処理を施すことによって前記突条の部分に金属を析出させ、回路導体２と導体接続部４とを金属メッキ層によって導通させている。
【００１６】
電線抑止板５には、導体接続部４の凹陥部７に対応して電線挟持部１０が凹設されており、図３に示すように、電線抑止板５を閉じて導体接続部４に載置した電線３を、電線挟持部１０で押圧して挟持するようにしている。
電線抑止板５の自由端部には、２本の係止爪１１が付設されており、電線抑止板５を完全に閉じた状態で、成形基板１の端部を把持して固定するようにしている。
【００１７】
成形基板１の導体接続部４と電線３とを接続するには、図３に示した状態で、接続用孔８から溶融半田を流し込んで電線３と導体接続部４とを接続するか、または、接続用孔８からレーザ光を照射して電線３と金属メッキ層９とを溶接して接続を行う。
【００１８】
図４は、参考として記載した一実施例に係わる成形基板１２と成形基板１３との、それぞれの回路導体相互を接続する工程を示す説明図である。
成形基板１２には、複数の回路導体１４が並行に形成されており、その端部に図５に示すような、すり鉢状の導体接続部１５が設けられている。導体接続部１５の底部には、接続用孔１６が成形基板１２を貫通して開設され、導体接続部１５の周壁には、金属メッキ層１７が形成されている。成形基板１２の両縁には、成形基板１３を把持して固定するための係止爪１８が付設されている。
【００１９】
成形基板１３には、成形基板１２の回路導体１４に対応して複数の回路導体１９が並設されている。
回路導体１４と回路導体１９とを接続するには、成形基板１２と成形基板１３とを導体接続部１５の位置で重ね合わせて係止爪１８で両者を係止した後、図５の矢印に示す方向から溶融半田を流し込んで半田付けを行うか、あるいはレーザ光を照射して金属メッキ層１７と回路導体１９とを溶接して行う。
上記実施例においては、成形基板１２の回路導体１４と接続される回路導体１９は、成形基板１３に形成されたものであるが、これに限らず、通常の絶縁基板に配設されるブスバーなどの金属板から成る回路導体であってもよい。
【００２０】
図６は、参考として記載した他の実施例に係わる成形基板２０の回路導体と成形基板２１の回路導体とを接続する工程を示す説明図である。
成形基板２０には、複数の回路導体２２が並行に形成されており、その端部には、図７に示すように、成形基板２０を貫通する円錐台状の導体接続孔２３が設けられている。導体接続孔２３は、回路導体２２が形成された面の径が小さく、その反対側の面の径が大きくなるように形成され、周壁には、金属メッキ層２４が形成されている。
【００２１】
成形基板２１には、複数の回路導体２５が形成されており、成形基板２０の導体接続孔２３に嵌入する円錐台状の接続用突部２６が設けられている。接続用突部２６の周壁には金属メッキ層２７が形成されている。また、成形基板２１の両縁には、成形基板２０を把持して固定するための係止爪２８が付設されている。
【００２２】
回路導体２２と回路導体２５とを接続するには、導体接続孔２３に接続用突部２６を嵌入し、成形基板２１の係止爪２８で成形基板２０を挟持して固定した後、図７の矢印に示す方向から溶融半田を流し込んで半田付けを行うか、あるいはレーザ光を照射して金属メッキ層２４、２７相互を溶接して行う。
【００２３】
上記の図６に示す実施例においては、成形基板２０と成形基板２１の回路導体相互を接続する場合を示したが、導体接続孔を設ける回路導体は、成形基板に形成された回路導体に限定されるものではなく、通常の絶縁基板に配設されるブスバーなどの金属板から成る回路導体であってもよい。
【００２４】
【発明の効果】
本発明によれば、成形基板の回路導体に導体接続部を形成しているため、直接、導体接続部と電線などの他の導体とを半田付けあるいは溶接することができ、接続のための端子や、コネクタを介在させる必要がなくなる。そのため、部品点数の削減による軽量化、小型化が達成されると共に製造コストも低減される。
また、一括して接続することが容易となるため、接続工程の生産性が著しく向上し、接続部が強化されると共に簡素化されるため、信頼性の高い接続が可能となるなどの多大な利点がある。
【図面の簡単な説明】
【図１】請求項１に記載した発明の実施例に係わる成形基板を構成する回路導体と、電線とを接続する工程を示す斜視図である。
【図２】図１の回路導体と導体接続部の長手方向の断面図である。
【図３】図１の導体接続部に電線を載置した状態を示す横断面図である。
【図４】参考として記載した一実施例に係わる成形基板の回路と他の成形基板の回路導体とを接続する工程を示す説明図である。
【図５】図４の導体接続部の横断面図である。
【図６】参考として記載した他の実施例に係わる成形基板の接続用突部および別の成形基板に形成した導体接続孔を示す斜視図である。
【図７】図６の接続用突部と導体接続孔を示す横断面図である。
【図８】従来の成形基板の製造工程を示す説明図である。
【図９】図８の次の工程を示す説明図である。
【図１０】図８の二次成形基板にメッキ処理を行って回路を形成した状態を示す説明図である。
【符号の説明】
１ 成形基板
２ 回路導体
３ 電線
４ 導体接続部
５ 電線抑止板
７ 凹陥部
８ 接続用孔
１２ 成形基板
１３ 成形基板
１５ 導体接続部
１９ 回路導体
２０ 成形基板
２１ 成形基板
２２ 回路導体
２３ 導体接続孔
２４ 金属メッキ層
２５ 回路導体
２６ 接続用突部
２７ 金属メッキ層[0001]
[Industrial applications]
The present invention relates to a conductor connection of a molded substrate for electrically connecting a circuit conductor of a molded substrate formed by integrally forming a circuit conductor to a molded product of a synthetic resin material, and an electric wire or a circuit conductor of another substrate. About the method.
[0002]
[Prior art]
In recent years, with the development of electrical equipment, its wiring structure has been diversified and its functions have been advanced. In order to achieve higher density, lighter weight and smaller size of wiring and parts arrangement, housings for housing parts and wiring boards etc. Use of a so-called molded substrate capable of forming a circuit integrally with the substrate is considered. As a method of manufacturing a molded substrate, for example, a method of manufacturing a plastic molded product disclosed in Japanese Patent Application Laid-Open No. 63-128181 has been proposed.
[0003]
As shown in FIG. 8, a method of manufacturing this plastic molded product is to perform primary molding of plastic to form a primary molded substrate b having a circuit portion formed by ridges a. A catalyst treatment for electroless plating is performed. Next, as shown in FIG. 9, the secondary molding is performed by covering the primary molded substrate b with a synthetic resin material so as to leave the ridge a, and exposing the circuit portion c subjected to the catalyst treatment. A molded substrate d is formed. Then, by subjecting the secondary molded substrate d to electroless plating, as shown in FIG. 10, a circuit e is formed by depositing plated copper on the circuit portion (protrusion) c subjected to the catalyst treatment. I am trying to do it.
[0004]
When it is intended to connect the circuit of the molded substrate formed in this way to the circuit of another molded substrate, the connection is established by interposing terminals and connectors like a general circuit substrate, for example, a printed circuit board. Only a method of soldering via a pin or the like by providing a through hole in a circuit part or performing a through hole is considered.
[0005]
However, if connections are made with terminals or connectors interposed or soldering is provided with through holes, the total number of components and work processes will increase, and miniaturization and weight reduction will be required through complicated processes. There is a problem that the advantage of the molded substrate is reduced.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above-mentioned problems, and electrically connects a circuit conductor of a molded substrate to a wire or a circuit conductor of another substrate without using separate components such as terminals and connectors. It is an object of the present invention to provide a method for connecting a conductor of a molded substrate, which can be connected to a conductor.
[0007]
[Means for Solving the Problems]
To achieve the above object, the conductor connection method of forming a substrate according to claim 1 Symbol placement of the present invention, the predetermined position of the circuit conductor constituting the molded substrate, a conductor having a connection hole penetrating molding substrate recessed connection portion, the conductor connecting portion is formed as a recess having a cylindrical concave, and the peripheral wall of the recess, after the said circuit conductor is integrally conducting another in the recess the conductors are arranged, by performing the soldering or welding through the connection hole, characterized in that it connected to the circuit conductor of the shaped substrate, and said another conductor.
It is subjected to metal plating on the conductor connection portion, and the peripheral wall of the conductor connecting portion, the circuit conductor and it is preferable to integrally conduct (claim 2).
[0008]
The provided wire inhibit plates at one end of the molded substrate openably, the electric wire placed on the conductor connecting portion, it is further preferable to to make a connection with nipped electric wire inhibit plates (claim 3).
[0011]
[Action]
According to the present invention, since the conductor connection portion is formed on the circuit conductor of the molded board, the terminal or connector is interposed by directly soldering or welding the conductor connection portion and another conductor such as an electric wire. It can be connected without letting it go.
That is, in the structure of the conductor connecting portion according to the first aspect of the present invention, since the concave portion is formed on one surface of the molded substrate and the connection hole is opened from the bottom surface of the concave portion to the other surface of the molded substrate, Attachment or welding can be easily and reliably performed.
In particular, as described in claim 2, by performing metal plating on the entire surface of the conductor connection portion, when performing soldering or welding, the connection can be performed without overheating the synthetic resin material that is the material of the molded substrate. It becomes possible. When performing welding, good results can be obtained by forming a thick metal plating layer and increasing the amount of molten metal.
[0013]
【Example】
FIG. 1 is a perspective view showing a step of connecting a circuit conductor 2 constituting a molded substrate 1 and an electric wire 3 as another conductor according to the first embodiment of the present invention.
The molded substrate 1 is formed by molding a synthetic resin material by a so-called two-shot method. A plurality of circuit conductors 2 are formed on a surface 1a of the molded substrate 1 in accordance with a predetermined circuit pattern. Is formed. On one edge 1b of the molded substrate 1 on which the conductor connection portion 4 is formed, an electric wire restraining plate 5 is provided via a flexible hinge 6 so as to be freely opened and closed.
[0014]
As shown in FIG. 2, the conductor connection portion 4 includes a concave portion 7 formed by a cylindrical concave surface so as to be in close contact with the electric wire 3, and penetrates the molded substrate 1 at the bottom of the concave portion 7. A connection hole 8 is formed on the back surface 1c of the base member. A metal plating layer 9 is provided on the peripheral wall of the concave portion 7 and the connection hole 8, and is electrically connected to the circuit conductor 2.
As a method for forming the circuit conductor 2 and the conductor connection portion 4 on the molded substrate 1, the following manufacturing method was used.
[0015]
That is, a portion forming the circuit conductor 2 and the conductor connection portion 4 is formed into a ridge by primary molding of a synthetic resin material, and the ridge is subjected to a catalyst treatment for electroless plating, and then subjected to secondary molding. Then, a portion other than the ridge is covered with a synthetic resin material, and then subjected to an electroless plating treatment to deposit a metal on the ridge portion, thereby making the circuit conductor 2 and the conductor connection portion 4 conductive with a metal plating layer. ing.
[0016]
The electric wire holding plate 5 is provided with an electric wire holding portion 10 corresponding to the recessed portion 7 of the conductor connecting portion 4. As shown in FIG. 3, the electric wire suppressing plate 5 is closed and mounted on the conductor connecting portion 4. The placed electric wire 3 is pressed and held by the electric wire holding portion 10.
Two locking claws 11 are attached to the free end of the wire restraining plate 5 so that the wire restraining plate 5 is completely closed and the end of the molded substrate 1 is gripped and fixed. ing.
[0017]
In order to connect the conductor connecting portion 4 of the molded substrate 1 and the electric wire 3, in a state shown in FIG. 3, molten solder is poured from the connecting hole 8 to connect the electric wire 3 and the conductor connecting portion 4, or Then, the electric wire 3 and the metal plating layer 9 are welded by irradiating a laser beam from the connection hole 8 to make a connection.
[0018]
FIG. 4 is an explanatory view showing a step of connecting respective circuit conductors of the molded substrate 12 and the molded substrate 13 according to the embodiment described as a reference .
A plurality of circuit conductors 14 are formed in parallel on the molded substrate 12, and a mortar-shaped conductor connection portion 15 as shown in FIG. 5 is provided at an end thereof. A connection hole 16 is formed at the bottom of the conductor connection portion 15 so as to penetrate the molded substrate 12, and a metal plating layer 17 is formed on a peripheral wall of the conductor connection portion 15. Locking claws 18 for gripping and fixing the molded substrate 13 are attached to both edges of the molded substrate 12.
[0019]
A plurality of circuit conductors 19 are provided on the molded substrate 13 in parallel with the circuit conductors 14 of the molded substrate 12.
In order to connect the circuit conductor 14 and the circuit conductor 19, the molded substrate 12 and the molded substrate 13 are overlapped at the position of the conductor connection portion 15, and the two are locked by the locking claws 18. The soldering may be performed by pouring molten solder from the direction shown, or by welding the metal plating layer 17 and the circuit conductor 19 by irradiating a laser beam.
In the above SL embodiment, circuit conductors 19 to be connected to the circuit conductor 14 of the molded substrate 12, but one formed in the molded substrate 13 is not limited thereto, are disposed normal insulating substrate busbar A circuit conductor made of a metal plate such as the above may be used.
[0020]
FIG. 6 is an explanatory view showing a step of connecting the circuit conductor of the molded substrate 20 and the circuit conductor of the molded substrate 21 according to another embodiment described for reference .
A plurality of circuit conductors 22 are formed in parallel on the molded substrate 20, and a truncated-cone-shaped conductor connection hole 23 penetrating the molded substrate 20 is provided at an end portion thereof, as shown in FIG. 7. I have. The conductor connection hole 23 is formed such that the diameter of the surface on which the circuit conductor 22 is formed is small and the diameter of the surface on the opposite side is large, and a metal plating layer 24 is formed on the peripheral wall.
[0021]
A plurality of circuit conductors 25 are formed on the molded substrate 21, and a truncated-cone-shaped connecting projection 26 that fits into the conductor connection hole 23 of the molded substrate 20 is provided. A metal plating layer 27 is formed on the peripheral wall of the connection projection 26. In addition, locking claws 28 for gripping and fixing the molded substrate 20 are attached to both edges of the molded substrate 21.
[0022]
In order to connect the circuit conductor 22 and the circuit conductor 25, a connecting projection 26 is fitted into the conductor connection hole 23, and the molded substrate 20 is clamped and fixed by the locking claws 28 of the molded substrate 21. The soldering is performed by pouring molten solder from the direction indicated by the arrow, or by welding the metal plating layers 24 and 27 by irradiating a laser beam.
[0023]
In the embodiment shown in FIG. 6, the case where the circuit conductors of the molded substrate 20 and the molded substrate 21 are connected to each other has been described, but the circuit conductor provided with the conductor connection hole is limited to the circuit conductor formed on the molded substrate. However, a circuit conductor formed of a metal plate such as a bus bar provided on a normal insulating substrate may be used.
[0024]
【The invention's effect】
According to the present invention, since the conductor connection portion is formed on the circuit conductor of the molded substrate, the conductor connection portion and another conductor such as an electric wire can be directly soldered or welded, and the terminal for connection can be obtained. Also, there is no need to interpose a connector. Therefore, the weight and size can be reduced by reducing the number of parts, and the manufacturing cost can be reduced.
In addition, since it is easy to make a batch connection, the productivity of the connection process is remarkably improved, and the connection portion is strengthened and simplified, so that a highly reliable connection becomes possible. There are advantages.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a step of connecting a circuit conductor and a wire constituting a molded board according to an embodiment of the present invention.
FIG. 2 is a longitudinal sectional view of a circuit conductor and a conductor connection part of FIG. 1;
FIG. 3 is a cross-sectional view showing a state where an electric wire is placed on the conductor connection part of FIG. 1;
FIG. 4 is an explanatory view showing a step of connecting a circuit of a molded substrate and a circuit conductor of another molded substrate according to one embodiment described for reference .
FIG. 5 is a cross-sectional view of the conductor connection part of FIG.
FIG. 6 is a perspective view showing connection protrusions of a molded substrate and conductor connection holes formed in another molded substrate according to another embodiment described for reference .
FIG. 7 is a cross-sectional view showing a connection protrusion and a conductor connection hole of FIG. 6;
FIG. 8 is an explanatory view showing a conventional manufacturing process of a molded substrate.
FIG. 9 is an explanatory view showing a step subsequent to FIG. 8;
FIG. 10 is an explanatory view showing a state where a circuit is formed by performing a plating process on the secondary molded substrate of FIG. 8;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Molded board 2 Circuit conductor 3 Electric wire 4 Conductor connection part 5 Wire suppression plate 7 Depression 8 Connection hole 12 Molded substrate 13 Molded substrate 15 Conductor connection part 19 Circuit conductor 20 Molded substrate 21 Molded substrate 22 Circuit conductor 23 Conductor connection hole 24 Metal plating layer 25 Circuit conductor 26 Connection protrusion 27 Metal plating layer

Claims (3)

成形基板を構成する回路導体の所定の位置に、該成形基板を貫通する接続用孔を有する導体接続部を凹設し、該導体接続部は、円筒状凹面を有する凹陥部として形成され、該凹陥部の周壁と、該回路導体とを一体的に導通させた後に、該凹陥部に別の導体を配置し、該接続用孔を通じて半田付けまたは溶接を行うことにより、該成形基板の回路導体と、該別の導体とを接続することを特徴とする成形基板の導体接続方法。At a predetermined position of a circuit conductor constituting the molded substrate, a conductor connection portion having a connection hole penetrating the molded substrate is recessed, and the conductor connection portion is formed as a concave portion having a cylindrical concave surface. After electrically connecting the peripheral wall of the recess and the circuit conductor integrally, another conductor is arranged in the recess, and soldering or welding is performed through the connection hole, so that the circuit conductor of the molded board is formed. And the another conductor. 前記導体接続部に金属メッキ処理を施して、該導体接続部の前記周壁と、前記回路導体とを一体的に導通させたことを特徴とする請求項１記載の成形基板の導体接続方法。2. The method according to claim 1, wherein the conductor connecting portion is subjected to a metal plating process so that the peripheral wall of the conductor connecting portion and the circuit conductor are integrally conducted. 前記成形基板の一端に電線抑止板を開閉自在に設け、前記導体接続部に載置した電線を、該電線抑止板で挟持して接続を行うことを特徴とする請求項１又は２記載の成形基板の導体接続方法。The molding according to claim 1 or 2, wherein an electric wire restraining plate is provided at one end of the molded substrate so as to be openable and closable, and the electric wire placed on the conductor connection portion is sandwiched by the electric wire suppressing plate for connection. How to connect the conductors on the board.
JP15985594A 1994-07-12 1994-07-12 Conductor connection method for molded substrate Expired - Fee Related JP3552172B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15985594A JP3552172B2 (en) 1994-07-12 1994-07-12 Conductor connection method for molded substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15985594A JP3552172B2 (en) 1994-07-12 1994-07-12 Conductor connection method for molded substrate

Publications (2)

Publication Number Publication Date
JPH0832228A JPH0832228A (en) 1996-02-02
JP3552172B2 true JP3552172B2 (en) 2004-08-11

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Country Status (1)

Country Link
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19640058C2 (en) * 1996-09-30 1999-06-10 Heraeus Sensor Nite Gmbh Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use
DE19717882C2 (en) * 1997-04-28 2002-05-23 Cherry Mikroschalter Gmbh Circuit carrier in the form of an injection molded plastic connector (MID)
FR2832287A1 (en) * 2001-11-09 2003-05-16 Nexans PRINTED CIRCUIT CARRIER WITH INTEGRATED CONNECTIONS AND METHOD FOR MANUFACTURING SUCH A CARRIER
JP4673191B2 (en) * 2005-11-15 2011-04-20 富士通コンポーネント株式会社 Cable connector

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