JP3426574B2 - Surface mount component and method of manufacturing the same - Google Patents

Surface mount component and method of manufacturing the same

Info

Publication number
JP3426574B2
JP3426574B2 JP2000279804A JP2000279804A JP3426574B2 JP 3426574 B2 JP3426574 B2 JP 3426574B2 JP 2000279804 A JP2000279804 A JP 2000279804A JP 2000279804 A JP2000279804 A JP 2000279804A JP 3426574 B2 JP3426574 B2 JP 3426574B2
Authority
JP
Japan
Prior art keywords
lead frame
chip
external
lead
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000279804A
Other languages
Japanese (ja)
Other versions
JP2001118868A (en
Inventor
清 石井
盛夫 山口
Original Assignee
協和化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19810997A external-priority patent/JP3165078B2/en
Application filed by 協和化成株式会社 filed Critical 協和化成株式会社
Priority to JP2000279804A priority Critical patent/JP3426574B2/en
Publication of JP2001118868A publication Critical patent/JP2001118868A/en
Application granted granted Critical
Publication of JP3426574B2 publication Critical patent/JP3426574B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、リードフレームに
電子部品のチップを装着して樹脂製パッケージ内へ封入
すると共に、このリードフレームの外部リードを前記樹
脂製パッケージの底面へ添装させて基板実装面とした表
面実装部品及びその製造方法に関し、例えば発光ダイオ
ード（以下、ＬＥＤという）等の光半導体素子，その他
の半導体素子，抵抗やコンデンサ等の電子部品に適用さ
れる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting a chip of an electronic component on a lead frame and encapsulating the chip in a resin package, and attaching external leads of the lead frame to the bottom surface of the resin package to attach a substrate. The surface mount component used as the mounting surface and the manufacturing method thereof are applied to, for example, optical semiconductor elements such as light emitting diodes (hereinafter referred to as LEDs), other semiconductor elements, and electronic components such as resistors and capacitors.

【０００２】[0002]

【従来の技術】電子部品の実装形態としては、例えば図
１（ａ）で示す挿入部品１Ａ或いは図１（ｂ）で示す表
面実装部品１Ｂなどがあり、いずれの場合にもリードフ
レーム２に電子部品のチップ３を装着すると共に、この
チップ３とリードフレーム２の外部リード４の一端側と
をボンディングワイヤ５を介して接続した状態で合成樹
脂製のパッケージ６内へ封入するが、前者の場合には外
部リード４をＬ字状に折り曲げた状態で他端側をパッケ
ージ６から離れた位置に突出させ、その端部をスルーホ
ール７へ挿入してプリント基板８の裏面側で半田接合す
る構成を有し、後者の場合は外部リード４をコ字状に折
り曲げた状態で他端側をパッケージ６の側面から底面に
沿って添装させ、その底面片を基板実装面としてプリン
ト基板８上に当接して半田接合する構成を有する。2. Description of the Related Art As a mounting form of electronic parts, there are, for example, an insert part 1A shown in FIG. 1A or a surface mount part 1B shown in FIG. While mounting the chip 3 of the component and enclosing the chip 3 and one end side of the external lead 4 of the lead frame 2 via the bonding wire 5 in the package 6 made of synthetic resin, in the former case In the configuration, the external lead 4 is bent in an L-shape and the other end is projected to a position apart from the package 6, and the end is inserted into the through hole 7 and solder-bonded on the back surface side of the printed circuit board 8. In the latter case, the other end side is attached along the bottom surface from the side surface of the package 6 in a state where the external lead 4 is bent in a U shape, and the bottom surface piece is mounted on the printed board 8 as a board mounting surface. Abut It has a structure that solder joint Te.

【０００３】両者を対比すると、後者の表面実装部品１
Ｂの場合には前者の挿入部品１Ａより、外部リード４が
突出しない分だけ装着する面積が少なくて小型軽量化を
図ることができること、外部リード４をスルーホールへ
挿入しないので、実装が容易で生産性の向上を図ること
ができること、取扱中に外部リード４が外力を受けてパ
ッケージ６との間に間隙を生ずることが少ないので、外
部リード４を介して内部に作用する熱や水分によるパッ
ケージクラック及び内部腐食を低減できること、等の有
利さがあって近年になって特に多用されているが、この
表面実装部品１Ｂの場合にも次に述べるような、解決を
必要とする課題が残されていた。Comparing the two, the latter surface mount component 1
In the case of B, the mounting area is smaller than that of the former insertion component 1A by the amount that the external lead 4 does not project, and the size and weight can be reduced. Since the external lead 4 is not inserted into the through hole, mounting is easy. Since the productivity can be improved and the external lead 4 is less likely to receive an external force during handling to cause a gap between the external lead 4 and the package 6, the package due to heat or moisture acting inside through the external lead 4 can be used. It has been particularly frequently used in recent years because it has advantages such as being able to reduce cracks and internal corrosion, but in the case of this surface mount component 1B, there still remains a problem to be solved as described below. Was there.

【０００４】[0004]

【発明が解決しようとする課題】即ち、従来の表面実装
部品１Ｂにおける前記外部リード４は、仮想線で示すよ
うに一端側をパッケージ６内に埋設した直状のものを後
でコ字状に折り曲げ加工していたので、この折り曲げ加
工時に外部リード４が外力を受けてパッケージ６との間
に間隙を生じさせたり、折り曲げ部分が湾曲状になって
パッケージ６から突出する厚みにばらつきを生じ易く、
基板実装面をプリント基板８上へ水平に載置した状態で
半田接合することが困難になる恐れもある。That is, the external lead 4 in the conventional surface mount component 1B is a straight one whose one end side is embedded in the package 6 as shown by an imaginary line, and is then formed into a U-shape. Since the bending process is performed, the external lead 4 receives an external force during this bending process to form a gap between the external lead 4 and the package 6, or the bent portion is curved so that the thickness protruding from the package 6 is likely to vary. ,
There is a possibility that it may be difficult to perform solder bonding with the board mounting surface placed horizontally on the printed board 8.

【０００５】従って、外部リード４とパッケージ６との
間に間隙を生じると、挿入部品１Ａの場合と同様に外部
リード４を介して内部に作用する熱や水分によるパッケ
ージクラック及び内部腐食を発生する恐れもあること、
水平に載置されないと接合強度が低下すると共に、この
電子部品が特にＬＥＤ等の光半導体素子の場合には、光
軸がずれた状態で装着されて所望の性能が得られなくな
る恐れもある。Therefore, when a gap is created between the external lead 4 and the package 6, package cracks and internal corrosion are generated by heat and moisture acting inside via the external lead 4 as in the case of the insert part 1A. There are fears,
If it is not placed horizontally, the bonding strength will decrease, and if this electronic component is an optical semiconductor element such as an LED in particular, it may be mounted with the optical axis deviated and desired performance may not be obtained.

【０００６】そこで本発明では、前記したような従来技
術の課題を解決するために、従来の表面実装部品以上に
外力の影響を受けないようにパッケージに対して外部リ
ードを含むリードフレームの取付構造並びに製造方法を
改善すると共に、この改善によってプリント基板面に対
してパッケージを水平状態で確実に装着することが可能
となり、而も従来品より小型化することを可能とした表
面実装部品及びその製造方法を提供する。Therefore, in the present invention, in order to solve the above-mentioned problems of the prior art, a lead frame mounting structure including external leads is attached to a package so as not to be affected by external force more than conventional surface mount components. In addition, the manufacturing method has been improved, and by this improvement, the package can be surely mounted in the horizontal state on the printed circuit board surface, and the surface mounting component and the manufacturing thereof can be made smaller than conventional products. Provide a way.

【０００７】[0007]

【課題を解決するための手段】本発明は、リードフレー
ムに電子部品のチップを装着して樹脂製パッケージ内へ
封入すると共に、このリードフレームの外部リードを前
記樹脂製パッケージの底面に設けて基板実装面とした表
面実装部品において、断面コ字状に予め折り曲げ加工し
た外部リード内に、射出成形した封止樹脂材が充填さ
れ、この封止樹脂材中に外部リードを埋設した態様で、
リードフレームが樹脂製パッケージと一体成形されると
共に、外部リードの底面片と側面片が樹脂製パッケージ
の底面と側面に対して略面一な状態で露出している表面
実装部品（請求項１）である。According to the present invention, a chip of an electronic component is mounted on a lead frame and enclosed in a resin package, and external leads of the lead frame are provided on the bottom surface of the resin package to form a substrate. In the surface-mounted component used as the mounting surface, the external lead pre-bent into a U-shaped cross section is filled with the injection-molded sealing resin material, and the external lead is embedded in the sealing resin material.
The lead frame is integrally molded with the resin package, and the bottom surface piece and the side surface piece of the external lead are exposed so as to be substantially flush with the bottom surface and the side surface of the resin package (claim 1). Is.

【０００８】この表面実装部品では、予め外部リードが
折り曲げ加工された状態でパッケージに装着され、従来
例の表面実装部品のように後で折り曲げ加工する必要が
ないので、従来例の表面実装部品の課題であった折り曲
げその他の取扱中における外力でパッケージと外部リー
ドの界面に間隙を生じさせたり、封入した電子部品のチ
ップに外力が作用することが解消されると共に、外部リ
ード及び間隙を介して内部に作用する機械的な応力や熱
及び水分によるパッケージクラック及び内部腐食の発生
等を著しく軽減できる。In this surface mount component, the external leads are preliminarily bent and mounted in the package, and it is not necessary to perform the subsequent bending process unlike the surface mount component of the conventional example. Problems such as bending and other external forces during handling that create a gap at the interface between the package and the external leads, and external forces acting on the encapsulated chip of the electronic component are eliminated. It is possible to remarkably reduce the occurrence of package cracks and internal corrosion due to mechanical stress acting on the inside, heat and moisture.

【０００９】また、基板実装面である外部リードの底面
片は、水平度が保持されてプリント基板上の配線ライン
に対して水平状態で半田接合されるので、安定した接合
強度で表面実装されると共に、特に前記電子部品のチッ
プが、前記リードフレームのパット部に発光チップがマ
ウントされる光半導体チップであって、このチップ実装
面を前記底面片で形成した基板実装面と平行にした場合
（請求項２）には、基板実装面を平坦にした状態で、チ
ップ実装面に対して光軸を直角に配置できるので、光軸
がずれる課題も解消されて所望の性能を得ることができ
る。Further, the bottom surface piece of the external lead, which is the board mounting surface, is soldered in a horizontal state to the wiring line on the printed circuit board while maintaining the levelness, so that it is surface-mounted with stable bonding strength. Together with the electronic component chip
Light emitting chip on the pad part of the lead frame.
This is an optical semiconductor chip that can be mounted
When the surface is parallel to the board mounting surface formed by the bottom piece (Claim 2), the optical axis can be arranged at a right angle to the chip mounting surface with the board mounting surface flat. The problem of axis misalignment can be solved and desired performance can be obtained.

【００１０】次に、本発明による表面実装部品の製造方
法では、リードフレームに電子部品のチップを装着して
樹脂製パッケージ内へ封入すると共に、このリードフレ
ームの外部リードを前記樹脂製パッケージの底面に設け
て基板実装面とした表面実装部品の製造方法において、
前記リードフレームはパット部を含むチップ実装面に連
続させた外部リードを断面コ字状に折り曲げ加工し、こ
のリードフレームはチップ実装面を下型内に設けたコア
ブロックの載置面に当接させた状態で下型に装着すると
共に、基板実装面である外部リードの底面片と側面片に
型締めした上型の内面を当接させ、上型の中央に設けた
樹脂注入孔から封止樹脂材を注入し、その射出圧力によ
って前記リードフレームのチップ実装面をコアブロック
の載置面に圧接させ、且つ前記基板実装面を上型の内面
に圧接させながら、前記外部リード内に封止樹脂材を充
填し、この封止樹脂材中に外部リードを埋設させ、外部
リードの底面片と側面片が樹脂製パッケージの底面と側
面に対して略面一な状態で露出する態様で、リードフレ
ームを樹脂製パッケージと一体成形させている（請求項
３）。Next, in the method of manufacturing a surface mount component according to the present invention, a chip of an electronic component is mounted on a lead frame and enclosed in a resin package, and the outer leads of this lead frame are placed on the bottom surface of the resin package. In the method of manufacturing the surface mount component that is provided on the
The lead frame is formed by bending an external lead continuous to the chip mounting surface including the pad portion into a U-shaped cross section, and the lead frame contacts the chip mounting surface to the mounting surface of the core block provided in the lower die. While mounting it in the lower mold, the bottom surface piece of the external lead, which is the board mounting surface, and the side surface piece are brought into contact with the inner surface of the clamped upper mold, and sealed from the resin injection hole provided in the center of the upper mold. A resin material is injected, and the injection pressure of the resin material causes the chip mounting surface of the lead frame to come into pressure contact with the mounting surface of the core block, and the substrate mounting surface to come into pressure contact with the inner surface of the upper mold, while sealing in the external lead. the resin material was filled, the outer leads is embedded in the sealing resin material, the bottom piece and the side pieces of the outer leads of the resin package bottom and side
The lead frame is integrally formed with the resin package in such a manner that the lead frame is exposed in a state of being substantially flush with the surface (claim 3).

【００１１】この製造方法によると、コアブロックの載
置面及び上型の内面にそれぞれ圧接したリードフレーム
のチップ実装面と基板実装面は、封止樹脂材の流入に起
因するバリや皮膜の発生のない平坦な金属露出面にする
ことができるので、チップの実装並びにプリント基板へ
の実装を容易且つ確実強固に行うことができると共に、
特に実装部品が本実施形態のＬＥＤのような光半導体素
子の場合には、双方の実装面が平坦になると光軸を一定
方向へ正しく設定できる。According to this manufacturing method, the chip mounting surface and the substrate mounting surface of the lead frame, which are in pressure contact with the mounting surface of the core block and the inner surface of the upper mold, respectively, generate burrs and films due to the inflow of the sealing resin material. Since it is possible to make a flat metal exposed surface that does not have, it is possible to easily and securely mount the chip and the printed board, and
In particular, when the mounting component is an optical semiconductor element such as the LED of this embodiment, the optical axis can be correctly set in a fixed direction when both mounting surfaces are flat.

【００１２】特に、この製造方法において前記外部リー
ドの底面片を予め上向き傾斜状に折り曲げ加工してお
き、この底面片を型締めした上型の押圧で水平状に折り
曲げ変形させ、上型の内面に対する当該底面片の圧接力
を増強させると、封止樹脂材の流入をより確実に阻止す
ることができるので、一段とバリや皮膜の発生のない平
坦な金属露出面にすることができ、比較的粒度の細か封
止樹脂材の使用にも適応することができる。In particular, in this manufacturing method, the bottom piece of the external lead is previously bent in an upwardly inclined shape, and the bottom piece is bent and deformed horizontally by pressing the upper die, and the inner surface of the upper die is then deformed. By increasing the pressure contact force of the bottom piece with respect to the, it is possible to more reliably prevent the inflow of the sealing resin material, it is possible to make a flat metal exposed surface without further burrs and film formation, relatively It can also be applied to the use of a sealing resin material having a fine grain size.

【００１３】[0013]

【発明の実施の形態】以下、本発明の表面実装部品及び
その製造方法に付いて、表面実装する電子部品としてＬ
ＥＤに適用した好適な実施形態に基づき、添付した図２
〜６の図面を参照しながら詳しく説明するが、図２は本
発明が適用されたＬＥＤの平面図を示し、図３は図２の
ＩＩＩ−ＩＩＩ線に沿った断面図を示し、図４はリード
フレームを形成する導体基板の要部で（ａ）は平面図を
（ｂ）は（ａ）のＩＶ−ＩＶ線に沿った断面図を示し、
図５は樹脂成形の工程説明図で（ａ）は型開き状態にお
ける成型金型の縦断面図を、（ｂ）は型締め状態におけ
る成型金型の縦断面図を、（ｃ）は平面からみた樹脂材
の流動状態説明図を示し、図６は成型された樹脂製パッ
ケージで（ａ）は一部を破断した平面図を、（ｂ）は
（ａ）のＶＩ−ＶＩ線に沿った断面図を示す。BEST MODE FOR CARRYING OUT THE INVENTION A surface mount component and a method of manufacturing the same according to the present invention will be described below as an electronic component for surface mount
2 of the accompanying drawings based on the preferred embodiment applied to an ED.
2 to 6 will be described in detail, FIG. 2 is a plan view of an LED to which the present invention is applied, FIG. 3 is a sectional view taken along line III-III of FIG. 2, and FIG. (A) is a plan view and (b) is a cross-sectional view taken along the line IV-IV of (a), which is a main part of a conductive substrate forming a lead frame.
5A and 5B are process explanatory views of the resin molding, FIG. 5A is a vertical sectional view of the molding die in a mold open state, FIG. 5B is a vertical sectional view of the molding die in a clamped state, and FIG. 6A and 6B are explanatory views of the flow state of the resin material as seen, FIG. 6A is a plan view in which a part is broken, and FIG. 6B is a cross-sectional view taken along line VI-VI of FIG. The figure is shown.

【００１４】図２及び図３で示すように、表面実装部品
であるＬＥＤ１０は特に赤（Ｒ），緑（Ｇ），青（Ｂ）
の各発光部を１つの樹脂製パッケージ１１内へ収容させ
たものであり、パッケージ１１は方形状で中央の上部側
に円形溝による開口部１２を設けて有底枠状に形成さ
れ、開口部１２の底面にはパッケージ１１と一体成型さ
れたリードフレーム１３の一部がチップ実装面として露
出されており、各パット部１４，１５，１６にはダイボ
ンディングされた３色の発光チップ１７ａ，１７ｂ，１
７ｃがそれぞれマウントされると共に、各発光チップ１
７ａ，１７ｂ，１７ｃの電極の一方はボンディングワイ
ヤ１８を介してアース電極となる共通エリア部１９に結
線され、これらを被覆する透明なエポキシ樹脂材等の被
覆材２０が開口部１２に充填され、開口部１２の内周面
はテーパを設けて鏡面処理を施して反射面１２ａを形成
している。As shown in FIGS. 2 and 3, the LED 10 which is a surface mount component is particularly red (R), green (G) and blue (B).
Each of the light emitting parts is housed in one resin package 11, and the package 11 is formed in a bottomed frame shape by providing an opening 12 formed by a circular groove on the upper side of the center in a square shape. A part of the lead frame 13 integrally molded with the package 11 is exposed as a chip mounting surface on the bottom surface of the chip 12, and the pad parts 14, 15 and 16 are die-bonded to the three color light emitting chips 17a and 17b. , 1
7c are mounted, and each light emitting chip 1
One of the electrodes 7a, 17b, 17c is connected to a common area portion 19 serving as a ground electrode via a bonding wire 18, and a covering material 20 such as a transparent epoxy resin material for covering these is filled in the opening 12. The inner peripheral surface of the opening 12 is tapered and mirror-finished to form a reflecting surface 12a.

【００１５】リードフレーム１３は、各パット部１４，
１５，１６から連続する外部リード２１，２２，２３
と、共通エリア部１９に連続する外部リード２１，２
２，２３，２４を備え、各外部リードは断面コ字状に折
り曲げ形成された側面片２１ａ，２２ａ，２３ａ，２４
ａと底面片２１ｂ，２２ｂ，２３ｂ，２４ｂをそれぞれ
有し、この側面片はパッケージ１１の側面と底面片はパ
ッケージ１１の底面とそれぞれ略面一（同一平面か僅か
に突出する）な状態で一体形成され、この底面片２１
ｂ，２２ｂ，２３ｂ，２４ｂがプリント基板２５上の配
線ライン（図示せず）に半田接合される基板実装面とな
る。The lead frame 13 includes the pad portions 14,
External leads 21, 22, 23 continuous from 15, 16
And the external leads 21 and 2 continuous with the common area portion 19.
2, 23, 24, and each external lead is a side piece 21a, 22a, 23a, 24 formed by bending in a U-shaped cross section.
a and a bottom piece 21b, 22b, 23b, 24b. The side piece and the bottom piece of the package 11 are substantially flush with each other (in the same plane or slightly protruding). Formed, this bottom piece 21
b, 22b, 23b, and 24b serve as a board mounting surface to be soldered to a wiring line (not shown) on the printed board 25.

【００１６】以上の表面実装部品（ＬＥＤ１０）では、
予め断面Ｌ字状に折り曲げ加工されたリードフレーム１
３の外部リード２１，２２，２３，２４が、パッケージ
１１の側面及び底面とそれぞれ略面一な状態で（但し、
側面片は必ずしも略面一でなくとも良い）パッケージ１
１と一体成型されているので、成型後に外部リードを折
り曲げ加工する図１（ｂ）の表面実装部品１Ｂに比べる
と、折り曲げその他の取扱中における外力でパッケージ
と外部リードの界面に間隙を生じさせたり、封入した電
子部品のチップに外力が作用することがないので、外部
リード及び間隙を介して内部に作用する機械的な応力や
熱及び水分によるパッケージクラック及び内部腐食の発
生等を著しく軽減できる。In the above surface mount component (LED10),
Lead frame 1 that has been previously bent into an L-shaped cross section
The external leads 21, 22, 23, and 24 of 3 are substantially flush with the side surface and the bottom surface of the package 11 (however,
Side piece does not necessarily have to be substantially flush) Package 1
Since it is integrally molded with 1, the external leads are bent and processed, and therefore, a gap is generated at the interface between the package and the external leads due to external force during bending or other handling compared to the surface mount component 1B shown in FIG. 1 (b). In addition, since external force does not act on the encapsulated electronic component chip, it is possible to remarkably reduce the occurrence of package cracks and internal corrosion due to mechanical stress and heat and moisture acting inside through external leads and gaps. .

【００１７】また基板実装面である外部リードの底面片
は、水平度が保持されてプリント基板上の配線ラインに
対して水平状態で半田接合されるので、安定した接合強
度で表面実装されると共に、電子部品が特にＬＥＤ等の
光半導体素子の場合には、光軸がずれた状態で装着され
て所望の性能が得られなくなる課題も解消できる。Further, since the bottom surface piece of the external lead, which is the board mounting surface, is soldered in a horizontal state while maintaining the levelness and in a horizontal state with respect to the wiring line on the printed circuit board, it is surface-mounted with stable bonding strength. When the electronic component is an optical semiconductor element such as an LED, in particular, it is possible to solve the problem that the optical element is mounted with the optical axis deviated and desired performance cannot be obtained.

【００１８】前記表面実装部品（ＬＥＤ１０）を製造す
る際には、まずリン青銅などの銅合金その他公知の導電
性金属板を用いて打抜き及び折り曲げ加工し、且つ銀そ
の他の導電性メッキを施して図４で示す導体基板２６を
製作するが、この導体基板２６は１ユニットを構成する
リードフレーム１３のパターンが方形状のフレーム板２
７内に配置されると共に、フレーム板２７を介して多数
のユニットが連鎖状に連結された状態でリードフレーム
１３が製作され、チップ実装面を構成するリードフレー
ム１３の各パット部１４，１５，１６と共通エリア部１
９は連結片２８を介してフレーム板２７に連結支持され
ている。In manufacturing the surface mount component (LED 10), first, a copper alloy such as phosphor bronze or other known conductive metal plate is used for punching and bending, and silver or other conductive plating is applied. The conductor board 26 shown in FIG. 4 is manufactured. The conductor board 26 has a frame plate 2 in which the pattern of the lead frame 13 constituting one unit is a square.
7, the lead frame 13 is manufactured in a state in which a large number of units are connected in a chain via the frame plate 27, and the pad portions 14, 15, of the lead frame 13 constituting the chip mounting surface are manufactured. 16 and common area 1
9 is connected and supported by the frame plate 27 via a connecting piece 28.

【００１９】前記表面実装部品のパッケージ１１を射出
成型する成型金型は、図５（ａ）のように上下対向状に
配置された上型２９と下型３０を備え、下型３０内には
リードフレーム１３を載置するコアブロック３１が装着
され、図５（ｂ）のように型締めによって上型２９と下
型３０及びコアブロック３１の間に形成されたキャビテ
ィ３２，３３内へ、上型２９の中央に設けた樹脂注入孔
３４から封止樹脂材Ｍを充填し、この封止樹脂材Ｍ中に
外部リードを含むリードフレーム１３を埋設させ、図５
（ｃ）のようにリードフレーム１３がパッケージ１１と
一体成型されるものである。The molding die for injection-molding the package 11 of the surface mount component includes an upper die 29 and a lower die 30 which are vertically opposed to each other as shown in FIG. The core block 31 on which the lead frame 13 is mounted is mounted, and as shown in FIG. 5B, the mold is clamped into the cavities 32 and 33 formed between the upper mold 29, the lower mold 30, and the core block 31. 5 is filled with the sealing resin material M from the resin injection hole 34 provided in the center of the mold 29, and the lead frame 13 including the external leads is embedded in the sealing resin material M, and FIG.
As shown in (c), the lead frame 13 is integrally molded with the package 11.

【００２０】上型２９及び下型３０には、折り曲げ加工
された外部リードを含むリードフレーム１３を嵌合し得
るように横幅をリードフレーム１３と整合させた凹嵌部
２９ａ，３０ｂを設けると共に、下型３０の凹嵌部３０
ｂ内には外周面にテーパ部３１ａを形成したコアブロッ
ク３１を設け、このコアブロック３１の載置面３１ｂに
は外部リードの底面片２１ｂ，２２ｂ，２３ｂ，２４ｂ
を上型２９側に向け、各パット部１４，１５，１６及び
共通エリア部１９の表面を当接させた状態でリードフレ
ーム１３を載置し、その裏面側が金型分割面Ｐ．Ｌと一
致するようにリードフレーム１３の板厚分だけ低くコア
ブロック３１の載置面３１ｂの高さが設定されている。The upper mold 29 and the lower mold 30 are provided with concave fitting portions 29a and 30b whose lateral widths are aligned with the lead frame 13 so that the lead frame 13 including the bent external leads can be fitted thereto. Recessed fitting portion 30 of lower mold 30
A core block 31 having an outer peripheral surface formed with a tapered portion 31a is provided in b, and a bottom surface piece 21b, 22b, 23b, 24b of an external lead is provided on a mounting surface 31b of the core block 31.
To the upper die 29 side, the lead frame 13 is placed with the surfaces of the pad portions 14, 15, 16 and the common area portion 19 in contact with each other. The height of the mounting surface 31b of the core block 31 is set lower by the thickness of the lead frame 13 so as to match L.

【００２１】従って、型締めするとチップ実装面即ちリ
ードフレーム１３は各パット部１４，１５，１６及び共
通エリア部１９の表面がコアブロック３１の載置面３１
ｂに当接し、基板実装面即ち外部リードの各底面片２１
ｂ，２２ｂ，２３ｂ，２４ｂの表面が上型２９の角部内
面に当接した状態で、コアブロック３１を含む下型３０
と上型２９の間に狭持され、リードフレーム１３の一方
側に方形状のキャビティ３２が他方側に円環状のキャビ
ティ３３がそれぞれ形成され、キャビティ３２，３３間
は各パット部１４，１５，１６及び共通エリア部１９の
間に存在する空隙部３５を介して相互に連通されてい
る。Accordingly, when the die is clamped, the chip mounting surface, that is, the lead frame 13, the surfaces of the pad portions 14, 15, 16 and the common area portion 19 are placed on the mounting surface 31 of the core block 31.
a bottom surface piece 21 of the board mounting surface, that is, each of the external leads.
Lower mold 30 including core block 31 in a state where the surfaces of b, 22b, 23b, and 24b are in contact with the corner inner surface of upper mold 29.
Between the upper mold 29 and the upper mold 29, a rectangular cavity 32 is formed on one side of the lead frame 13, and an annular cavity 33 is formed on the other side of the lead frame 13. 16 and the common area portion 19 are communicated with each other through a gap portion 35 existing between them.

【００２２】この型締め状態の成型金型に対し、封止樹
脂材Ｍとして例えば液晶ポリマー（ＬＣＰ）やポリエー
テルニトリル（ＰＥＮ）などの耐熱性熱可塑性樹脂を、
樹脂注入孔３４を介してキャビティ内へ加圧状態で注入
すると、金型の中央から放射状に分散した射出樹脂材ｍ
がキャビティ内へ均等に充填され、図６で示すように外
部リードを含むリードフレーム１３を埋設した一体のパ
ッケージ１１が成型されるが、その際に射出樹脂材ｍの
射出圧力が外部リードを含むリードフレーム１３の内面
側に作用するので、この射出圧力よって各パット部１
４，１５，１６及び共通エリア部１９の表面側（チップ
実装面）はコアブロック３１の載置面３１ｂへ、外部リ
ードの底面片２１ｂ，２２ｂ，２３ｂ，２４ｂの表面側
（基板実装面）は上型２９の角部内面にそれぞれ圧接さ
れ、各実装面に侵入して付着しようとする射出樹脂材ｍ
の流動を阻止する。A heat-resistant thermoplastic resin such as a liquid crystal polymer (LCP) or polyether nitrile (PEN) is used as the sealing resin material M for the molding die in this clamped state.
When injected under pressure into the cavity through the resin injection hole 34, the injection resin material m dispersed radially from the center of the mold.
6 is evenly filled into the cavity, and as shown in FIG. 6, the integrated package 11 in which the lead frame 13 including the external leads is embedded is molded. At that time, the injection pressure of the injection resin material m includes the external leads. Since it acts on the inner surface side of the lead frame 13, this pad pressure 1
4, 15 and 16 and the front surface side (chip mounting surface) of the common area 19 are placed on the mounting surface 31b of the core block 31, and the bottom surface pieces 21b, 22b, 23b and 24b of the external leads are mounted on the front surface side (board mounting surface). The injection resin material m that is pressed against the inner surface of the corner of the upper mold 29 and tries to invade and adhere to each mounting surface.
Prevent the flow of.

【００２３】このようにしてパッケージ１１内へリード
フレーム１３を埋設させると、電子部品のチップ即ち発
光チップ１７ａ，１７ｂ，１７ｃがマウントされるチッ
プ実装面及び、プリント基板２５にマウントされる基板
実装面即ち各底面片は、封止樹脂材の流入によるバリや
皮膜の発生のない平坦な金属露出面にすることができる
ので、チップの実装並びにプリント基板への実装を容易
且つ確実強固に行うことができると共に、特に実装部品
が本実施形態のＬＥＤのような光半導体素子の場合に
は、双方の実装面が平坦になると光軸を一定方向へ正し
く設定できる。By embedding the lead frame 13 in the package 11 in this way, the chip mounting surface on which the chips of the electronic parts, that is, the light emitting chips 17a, 17b, 17c are mounted and the mounting surface on the printed circuit board 25 are mounted. That is, since each bottom piece can be a flat metal exposed surface without burr or film formation due to the inflow of the sealing resin material, chip mounting and mounting on a printed circuit board can be performed easily and securely. In addition, especially when the mounting component is an optical semiconductor element such as the LED of this embodiment, the optical axis can be correctly set in a fixed direction when both mounting surfaces are flat.

【００２４】また図４の導体基板２６を製作する際に、
図５（ａ）で示すように外部リードの各底面片２１ｂ，
２２ｂ，２３ｂ，２４ｂを、例えば５〜１０度程度の角
度で予め上向き傾斜状に折り曲げ加工しておくと、この
底面片が型締めした際に上型２９によって水平状に折り
曲げ変形されるので、前記圧接力が一段と増強されて基
板実装面に侵入しようとする射出樹脂材ｍの流動阻止に
効果を発揮する。When manufacturing the conductor substrate 26 shown in FIG.
As shown in FIG. 5A, each bottom piece 21b of the external lead,
If 22b, 23b, and 24b are previously bent and bent at an angle of, for example, about 5 to 10 degrees, the bottom piece is bent and deformed horizontally by the upper mold 29 when the mold is clamped. The pressure contact force is further enhanced to effectively prevent the injection resin material m from flowing into the board mounting surface.

【００２５】尚、図６のように断面コ字状に折り曲げ加
工された外部リードを含むリードフレーム１３と一体成
型したパッケージ１１には、チップ実装面に対して電子
部品に応じた必要なチップの実装並びに表面被覆を行
い、連結片２８を切断して連結支持されていたフレーム
板２７から分離させ、本実施形態の場合には図２及び図
３で示すようなＬＥＤ１１に仕上げる。As shown in FIG. 6, the package 11 integrally molded with the lead frame 13 including the external leads which are bent into a U-shaped cross section has the required chip size corresponding to the electronic component with respect to the chip mounting surface. After mounting and surface coating, the connecting piece 28 is cut and separated from the frame plate 27 that is connected and supported, and in the case of this embodiment, the LED 11 as shown in FIGS. 2 and 3 is finished.

【図面の簡単な説明】[Brief description of drawings]

【図１】従来技術による電子部品の実装形態で、（ａ）
はスルーホールによる挿入部品を、（ｂ）は表面実装部
品を、それぞれ示す。FIG. 1 is a mounting form of an electronic component according to the related art, (a)
Shows an insertion part by a through hole and (b) shows a surface mount part.

【図２】本発明の表面実装部品が適用されたＬＥＤの平
面図を示す。FIG. 2 shows a plan view of an LED to which the surface mount component of the present invention is applied.

【図３】図２のＩＩＩ−ＩＩＩ線に沿った断面図を示
す。FIG. 3 shows a cross-sectional view taken along the line III-III in FIG.

【図４】本発明の表面実装部品に使用するリードフレー
ムを形成する導体基板の要部で（ａ）は平面図を（ｂ）
は（ａ）のＩＶ−ＩＶ線に沿った断面図を示す。FIG. 4 is a main part of a conductive substrate forming a lead frame used for the surface mount component of the present invention, in which (a) is a plan view.
Shows a sectional view taken along line IV-IV of (a).

【図５】樹脂成形の工程説明図で（ａ）は型開き状態に
おける成型金型の縦断面図を、（ｂ）は型締め状態にお
ける成型金型の縦断面図を、（ｃ）は平面からみた樹脂
材の流動状態説明図を示す。5A and 5B are process explanatory views of resin molding, in which FIG. 5A is a vertical sectional view of a molding die in a mold open state, FIG. 5B is a vertical sectional view of the molding die in a mold clamping state, and FIG. The flow state explanatory drawing of the resin material seen from FIG.

【図６】成型された樹脂製パッケージで（ａ）は一部を
破断した平面図を、（ｂ）は（ａ）のＶＩ−ＶＩ線に沿
った断面図を示す。FIG. 6A is a plan view of a molded resin package with a part broken away, and FIG. 6B is a sectional view taken along line VI-VI of FIG. 6A.

【符号の説明】[Explanation of symbols]

１１ パッケージ １２ 開口部 １３ リードフレーム １４，１５，１６ パット部 １７ａ，１７ｂ，１７ｃ 発光チップ １８ ボンディングワイヤ １９ 共通エリア部 ２０ 被覆材 ２１，２２，２３，２４ 外部リード ２１ａ，２２ａ，２３ａ，２４ａ 側面片 ２１ｂ，２２ｂ，２３ｂ，２４ｂ 底面片 ２５ プリント基板 ２６ 導体基板 ２７ フレーム板 ２８ 連結片 ２９ 上型 ２９ａ 凹嵌部 ３０ 下型 ３０ａ 凹嵌部 ３１ コアブロック ３１ａ テーパ部 ３１ｂ 載置面 ３２，３３ キャビティ ３４ 樹脂注入孔 ３５ 空隙部 11 packages 12 openings 13 lead frame 14,15,16 Pat part 17a, 17b, 17c Light emitting chip 18 Bonding wire 19 Common area section 20 coating 21,22,23,24 External lead 21a, 22a, 23a, 24a Side piece 21b, 22b, 23b, 24b Bottom piece 25 printed circuit board 26 Conductor board 27 frame plates 28 Connecting piece 29 Upper mold 29a concave fitting portion 30 Lower mold 30a concave fitting portion 31 core blocks 31a taper part 31b Mounting surface 32,33 cavity 34 Resin injection hole 35 void

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭64−82555（ＪＰ，Ａ) 特開 平３−280566（ＪＰ，Ａ) 特開 平１−286342（ＪＰ，Ａ) 特開 平８−78561（ＪＰ，Ａ) 実開 平１−58907（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/56 G09F 9/33 H01L 23/50 H01L 33/00 ─────────────────────────────────────────────────── ───Continued from the front page (56) References JP 64-82555 (JP, A) JP 3-280566 (JP, A) JP 1-286342 (JP, A) JP 8- 78561 (JP, A) Actual Kaihei 1-58907 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/56 G09F 9/33 H01L 23/50 H01L 33/00

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 リードフレームに電子部品のチップを装
着して樹脂製パッケージ内へ封入すると共に、このリー
ドフレームの外部リードを前記樹脂製パッケージの底面
に設けて基板実装面とした表面実装部品において、 断面コ字状に予め折り曲げ加工した外部リード内に、射
出成形した封止樹脂材が充填され、この封止樹脂材中に
外部リードを埋設した態様で、リードフレームが樹脂製
パッケージと一体成形されると共に、外部リードの底面
片と側面片が樹脂製パッケージの底面と側面に対して略
面一な状態で露出していることを特徴とした表面実装部
品。1. A surface mount component in which a chip of an electronic component is mounted on a lead frame and enclosed in a resin package, and external leads of the lead frame are provided on the bottom surface of the resin package to serve as a board mounting surface. , The lead frame is integrally molded with the resin package in such a manner that the injection-molded encapsulation resin material is filled in the external lead that has been bent in advance in a U-shaped cross section, and the external lead is embedded in the encapsulation resin material. And the bottom of the external leads
A surface mount component in which one piece and a side surface are exposed in a state of being substantially flush with the bottom surface and the side surface of the resin package. 【請求項２】 前記電子部品のチップは、前記リードフ
レームのパット部に発光チップがマウントされる光半導
体チップであって、このチップ実装面を前記底面片で形
成した基板実装面と平行にした請求項１に記載した表面
実装部品。2. The chip of the electronic component is the lead frame.
An optical semiconductor chip in which a light emitting chip is mounted on the pad part of a ram, and the chip mounting surface is formed by the bottom piece.
The surface mount component according to claim 1, wherein the surface mount component is parallel to the formed board mount surface . 【請求項３】 リードフレームに電子部品のチップを装
着して樹脂製パッケージ内へ封入すると共に、このリー
ドフレームの外部リードを前記樹脂製パッケージの底面
に設けて基板実装面とした表面実装部品の製造方法にお
いて、 前記リードフレームはパット部を含むチップ実装面に連
続させた外部リードを断面コ字状に折り曲げ加工し、こ
のリードフレームはチップ実装面を下型内に設けたコア
ブロックの載置面に当接させた状態で下型に装着すると
共に、基板実装面である外部リードの底面片と側面片に
型締めした上型の内面を当接させ、上型の中央に設けた
樹脂注入孔から封止樹脂材を注入し、その射出圧力によ
って前記リードフレームのチップ実装面をコアブロック
の載置面に圧接させ、且つ前記基板実装面を上型の内面
に圧接させながら、前記外部リード内に封止樹脂材を充
填し、この封止樹脂材中に外部リードを埋設させ、外部
リードの底面片と側面片が樹脂製パッケージの底面と側
面に対して略面一な状態で露出する態様で、リードフレ
ームを樹脂製パッケージと一体成形させることを特徴と
した表面実装部品の製造方法。3. A surface mount component for mounting a chip of an electronic component on a lead frame, encapsulating the chip in a resin package, and providing an external lead of the lead frame on a bottom surface of the resin package as a board mounting surface. In the manufacturing method, the lead frame is formed by bending an external lead continuous to a chip mounting surface including a pad portion into a U-shaped cross section, and the lead frame is mounted on a core block whose chip mounting surface is provided in a lower mold. It is mounted on the lower mold while it is in contact with the surface, and the bottom surface piece of the external lead, which is the board mounting surface, and the side surface piece are brought into contact with the inner surface of the clamped upper mold, and resin injection is provided in the center of the upper mold. The sealing resin material is injected from the hole, and the injection pressure of the sealing resin material causes the chip mounting surface of the lead frame to be in pressure contact with the mounting surface of the core block, and the substrate mounting surface to be in pressure contact with the inner surface of the upper die. Reluctant, wherein the sealing resin material is filled in the external within the lead, the external lead is embedded in the sealing resin material, the bottom surface and the side of the bottom piece and side piece of the outer leads resin package
A method for manufacturing a surface mount component, characterized in that a lead frame is integrally molded with a resin package in such a manner that the lead frame is exposed in a state substantially flush with the surface.
JP2000279804A 1997-07-24 2000-09-14 Surface mount component and method of manufacturing the same Expired - Lifetime JP3426574B2 (en)

Priority Applications (1)

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JP2000279804A JP3426574B2 (en) 1997-07-24 2000-09-14 Surface mount component and method of manufacturing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19810997A JP3165078B2 (en) 1997-07-24 1997-07-24 Method for manufacturing surface mount components
JP2000279804A JP3426574B2 (en) 1997-07-24 2000-09-14 Surface mount component and method of manufacturing the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP19810997A Division JP3165078B2 (en) 1997-07-24 1997-07-24 Method for manufacturing surface mount components

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JP3426574B2 true JP3426574B2 (en) 2003-07-14

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JP4367414B2 (en) 2004-02-09 2009-11-18 株式会社村田製作所 Component built-in module and manufacturing method thereof
TW200824142A (en) * 2006-11-22 2008-06-01 Lighthouse Technology Co Ltd High power diode holder and thereof package is described
KR101365622B1 (en) * 2007-11-29 2014-02-24 서울반도체 주식회사 Anti moisture led package
EP2325898A4 (en) * 2008-08-26 2013-12-25 Dingguo Pan A led multi-chip bonding die and a light stripe holding the bonding die
JP5778999B2 (en) * 2010-08-06 2015-09-16 日亜化学工業株式会社 Light emitting device and image display unit
CN102506337B (en) * 2011-10-28 2014-01-08 杭州柏年光电标饰有限公司 LED (light-emitting diode) SMD (surface mount device) light string
CN106549010A (en) * 2017-01-12 2017-03-29 东莞市春瑞电子科技有限公司 Three-color LED display unit and its production method
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