JP3338937B2 - Polishing method and polishing apparatus - Google Patents
Polishing method and polishing apparatusInfo
- Publication number
- JP3338937B2 JP3338937B2 JP8581591A JP8581591A JP3338937B2 JP 3338937 B2 JP3338937 B2 JP 3338937B2 JP 8581591 A JP8581591 A JP 8581591A JP 8581591 A JP8581591 A JP 8581591A JP 3338937 B2 JP3338937 B2 JP 3338937B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- polishing
- plate
- surface plate
- polishing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Feeding Of Workpieces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manipulator (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ワークとしてのフォト
マスクブランク用ガラス基板の主表面を研磨する研磨方
法および研磨装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method and a polishing apparatus for polishing a main surface of a glass substrate for a photomask blank as a work.
【０００２】[0002]
【従来の技術】従来、フォトマスクブランク用ガラス基
板やセラミックス等の板状物を研磨加工する加工機に使
用されるロボットハンドとしては図８（ａ）〜（ｄ）に
示すように構成されたものが知られている。すなわち、
このロボットハンド１は、開閉自在な２つの把持部材
２、３で定盤５上のガラス基板４を把持するもので、各
把持部材２、３はフレーム６の両側に接近離間自在に対
向して配置され、その基部に設けた支軸７、８がフレー
ムに内蔵された、例えば特開平１−２２２８８２号公報
等に開示された駆動装置によって動作されるように構成
されており、接近時に各把持部材２、３の先端部内側面
に対設されたつかみ爪９、１０が定盤５の表面に密接し
た状態でガラス基板４の互いに対向する１組の側面近傍
の周縁部を把持する。各つかみ爪９、１０の内側面には
ワーク把持部としてのＶ字状の凹部１１、１２がそれぞ
れ水平方向に形成され、ガラス基板４の把持動作は該凹
部１１、１２の下側斜面１１ａ、１２ａによりガラス基
板４を定盤５からすくい上げる形で行なわれる。なお、
１４はフレーム６を作業範囲内の任意の位置に移動させ
るロボットハンド１のアームである。2. Description of the Related Art Conventionally, a robot hand used for a processing machine for polishing a glass substrate for a photomask blank or a plate-like material such as ceramics is configured as shown in FIGS. 8 (a) to 8 (d). Things are known. That is,
This robot hand 1 holds a glass substrate 4 on a surface plate 5 with two openable and closable gripping members 2, 3. The supporting shafts 7 and 8 provided at the bases thereof are arranged so as to be operated by a driving device disclosed in, for example, Japanese Patent Application Laid- Open No. 1-222882 incorporated in a frame. The gripping claws 9, 10 provided on the inner surfaces of the distal ends of the members 2, 3 grip peripheral edges of the glass substrate 4 in the vicinity of a pair of opposing side surfaces of the glass substrate 4 in close contact with the surface of the surface plate 5. V-shaped concave portions 11 and 12 as a workpiece gripping portion are formed in the inner surface of each of the gripping claws 9 and 10 in the horizontal direction, respectively. The gripping operation of the glass substrate 4 is performed by lower slopes 11a of the concave portions 11 and 12; 12a, the glass substrate 4 is scooped up from the surface plate 5. In addition,
Reference numeral 14 denotes an arm of the robot hand 1 for moving the frame 6 to an arbitrary position within the working range.
【０００３】以上の構成により不図示の制御装置に指令
をインプットしておくことにより、ロボットハンド１は
この指令に基づいて動作し、つかみ爪９、１０によりガ
ラス基板４の周縁部を把持し、該ガラス基板４を定盤５
から上方に離間搬送したり、またはガラス基板４を定盤
５上に載置することができる。By inputting a command to a control device (not shown) according to the above configuration, the robot hand 1 operates based on the command, and grips the periphery of the glass substrate 4 with the gripping claws 9 and 10. Place the glass substrate 4 on the surface plate 5
, Or the glass substrate 4 can be placed on the surface plate 5.
【０００４】[0004]
【発明が解決しようとする課題】ところで、ガラス基板
４を特に高精度に研磨した後は、ガラス基板４における
研磨済面との間に、研磨の際供給される研磨液が流入
し、この研磨液の表面張力の影響によりガラス基板４と
定盤５とが強固に密着している。このような状態で定盤
５上に載置されたガラス基板４をつかみ爪９、１０で把
持しようとすると、つかみ爪９、１０の各々の先端部が
ガラス基板４と定盤５との間に挿入され難くなり、結果
としてロボットハンド１によりガラス基板４の把持をし
損じる回数が多くなるという問題があった。また、ガラ
ス基板４と定盤５との密着力に抗して把持力を、支軸
７、８の駆動装置のパワーアップにより得ようとする
と、ガラス基板４を損傷させるという新たな問題を生じ
る。After the glass substrate 4 is polished with high precision, a polishing liquid supplied during polishing flows between the polished surface of the glass substrate 4 and the polishing liquid. The glass substrate 4 and the platen 5 are firmly adhered to each other due to the influence of the surface tension of the liquid. In such a state, when trying to grip the glass substrate 4 placed on the surface plate 5 with the grip claws 9, 10, the tip of each of the grip claws 9, 10 is located between the glass substrate 4 and the surface plate 5. And the number of times that the robot hand 1 fails to grasp the glass substrate 4 is increased. Further, if it is attempted to obtain a gripping force against the adhesion between the glass substrate 4 and the surface plate 5 by increasing the power of the driving device of the support shafts 7 and 8, a new problem that the glass substrate 4 is damaged occurs. .
【０００５】したがって、本発明は上記したような従来
の問題点に鑑みてなされたもので、その目的とするとこ
ろは、比較的簡単な構成で定盤上のフォトマスクブラン
ク用ガラス基板を損傷することなく適確に把持すること
ができるようにした研磨方法および研磨装置を提供する
ことにある。Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and has as its object to damage a glass substrate for a photomask blank on a surface plate with a relatively simple structure. It is an object of the present invention to provide a polishing method and a polishing apparatus capable of holding a workpiece accurately without using the same.
【０００６】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するためになされたもので、その第１の発明は、定盤上
にフォトマスクブランク用のガラス基板を載置し、研磨
液をガラス基板表面に供給して定盤を回転駆動すること
によりガラス基板の表面を研磨加工する研磨方法におい
て、前記ガラス基板の表面を研磨した後、前記ガラス基
板と前記定盤との間に研磨液が介在している側の前記ガ
ラス基板の表面と定盤表面との間にガラス基板を挟持す
るワーク把持部を挿入して前記ガラス基板を定盤から離
間させる際、前記研磨液の表面張力により密着している
前記ガラス基板と前記定盤との密着力を低減するよう
に、面取り面が施された前記ガラス基板側面の下端部近
傍に向かって流体を噴出することを特徴とする。第２の
発明は、上記第１の発明において、前記ガラス基板と前
記定盤との間に介在する研磨液を部分的に除去するよう
にガラス基板側面の下端部近傍に向かって流体を噴出す
ることを特徴とする。第３の発明は、上記第１の発明に
おいて、前記ガラス基板に定盤から離間する方向に力を
付与するようにガラス基板側面の下端部近傍に向かって
流体を噴出することを特徴とする。第４の発明は上記第
１〜第３の発明のうちいずれか１つにおいて、前記ガラ
ス基板は、方形の板状体であって、該板状体の少なくと
も定盤側の稜線には面取り面が施されたガラス基板から
なり、前記定盤表面と前記ガラス基板の面取り面とのな
す角に対し、鋭角のつかみ爪のワーク把持部を前記ガラ
ス基板と定盤との間に研磨液が介在している側の前記ガ
ラス基板の表面と定盤表面との間に挿入してガラス基板
を把持することを特徴とする。第５の発明は上記第４の
発明において、前記ワーク把持部が略Ｖ字状の凹部から
なり、この凹部はガラス基板の下側端縁に設けられた面
取り面と実質的に平行な第１傾斜面と、ガラス基板の上
側端縁に設けられた面取り面と実質的に平行な第２傾斜
面と、つかみ爪の下面のガラス基板側縁と前記第１傾斜
面とを直接または間接的に接続し前記下面に対する傾斜
角が前記第１傾斜面より鋭角である第３傾斜面とを備え
ていることを特徴とする。第６の発明は上記第１〜第５
のうちのいずれか１つの発明の研磨方法を実施するため
の研磨装置であって、前記ガラス基板と前記定盤との間
に研磨液が介在している側のガラス基板の表面と定盤表
面との間に挿入してガラス基板を挟持するワーク把持部
と、研磨液の表面張力により密着しているガラス基板と
定盤との密着力を低減すべくガラス基板側面の下端部近
傍に向かって流体を噴出する噴出手段とを有することを
特徴とする。Means for Solving the Problems The present invention has been made to achieve the above object, and a first invention is to place a glass substrate for a photomask blank on a surface plate and to apply a polishing liquid. In the polishing method of polishing the surface of the glass substrate by supplying the glass substrate surface and rotating the surface plate, the polishing liquid is polished between the glass substrate and the surface plate after polishing the surface of the glass substrate. When inserting the work gripping portion that holds the glass substrate between the surface of the glass substrate and the surface of the surface plate on the side where the glass substrate is interposed, and separating the glass substrate from the surface plate, by the surface tension of the polishing liquid A fluid is ejected toward a vicinity of a lower end portion of a side surface of the glass substrate having a chamfered surface so as to reduce an adhesive force between the glass substrate and the surface plate that are in close contact with each other. In a second aspect based on the first aspect, the fluid is jetted toward the vicinity of the lower end of the side surface of the glass substrate so as to partially remove the polishing liquid interposed between the glass substrate and the surface plate. It is characterized by the following. A third invention is characterized in that, in the first invention, a fluid is ejected toward a vicinity of a lower end portion of a side surface of the glass substrate so as to apply a force to the glass substrate in a direction away from the surface plate. The fourth invention is the fourth invention.
In any one of the first to third inventions , the glass substrate is a rectangular plate-like body, and at least a ridge line on the side of the platen of the plate-like body is chamfered. The angle between the surface of the surface plate and the chamfered surface of the glass substrate is such that the workpiece gripping portion of the gripper having an acute angle is the glass on the side where the polishing liquid is interposed between the glass substrate and the surface plate. It is characterized in that it is inserted between the surface of the substrate and the surface of the surface plate to hold the glass substrate. The fifth invention is the fourth invention.
In the present invention , the work gripping part comprises a substantially V-shaped concave part, the concave part having a first inclined surface substantially parallel to a chamfered surface provided at a lower edge of the glass substrate, and an upper end of the glass substrate. A second inclined surface substantially parallel to the chamfered surface provided at the edge, and a glass substrate side edge of the lower surface of the gripper and the first inclined surface are directly or indirectly connected to each other, and the inclination angle with respect to the lower surface is A third inclined surface having an acute angle with respect to the first inclined surface. The sixth invention is directed to the first to fifth embodiments.
A polishing apparatus for carrying out the polishing method according to any one of the above aspects, wherein the surface of the glass substrate and the surface of the surface plate on the side where a polishing liquid is interposed between the glass substrate and the surface plate Between the workpiece holding portion that sandwiches the glass substrate by inserting it between the glass substrate and the lower end of the glass substrate side surface in order to reduce the adhesive force between the glass substrate and the surface plate that are in close contact with each other due to the surface tension of the polishing liquid. And a jetting means for jetting a fluid.
【０００７】[0007]
【作用】本発明においては、ガラス基板側面の下端部近
傍に向かって流体を噴出することで、ガラス基板と定盤
との密着力を低減することができる。例えば、流体とし
て気体を用いた場合、ガラス基板と定盤との間に介在す
る研磨液を部分的に除去し、この結果、表面張力が低減
するので、ガラス基板と定盤との密着力が低減する。ま
た、流体として液体を用いた場合、ガラス基板に定盤か
ら離間する方向に力を付与することができ、ガラス基板
と定盤との密着力が低減する。第１および第２の傾斜面
は、ガラス基板の上下側端縁に設けられた面取り面に密
接し把持する。第３傾斜面はつかみ爪の下面に対する傾
斜角が第１傾斜面より鋭角で、下面と共にエッジを形成
し、ガラス基板と定盤との間に容易に挿入される。In the present invention, by ejecting the fluid toward the vicinity of the lower end of the side surface of the glass substrate, the adhesion between the glass substrate and the surface plate can be reduced. For example, when a gas is used as the fluid, the polishing liquid interposed between the glass substrate and the surface plate is partially removed, and as a result, the surface tension is reduced. Reduce. When a liquid is used as the fluid, a force can be applied to the glass substrate in a direction away from the surface plate, and the adhesion between the glass substrate and the surface plate is reduced. The first and second inclined surfaces are in close contact with and be gripped by chamfered surfaces provided at upper and lower edges of the glass substrate. The third inclined surface has a more inclined angle with respect to the lower surface of the gripping claw than the first inclined surface, forms an edge with the lower surface, and is easily inserted between the glass substrate and the surface plate.
【０００８】[0008]
【実施例】以下、本発明を図面に示す実施例に基づいて
詳細に説明する。図１（ａ）、（ｂ）は本発明に係る研
磨方法および研磨装置の一実施例を示す非把持時の正面
図および一部破断側面図、図２は把持直前の正面図、図
３は把持した状態の正面図、図４は要部拡大図、図５は
ノズルの斜視図である。なお、図中図８と同一構成部品
のものに対しては同一符号を以て示し、その説明を省略
する。これらの図において、本発明の特徴は、ガラス基
板４の裏面と定盤５の表面との間につかみ爪９、１０を
挿入し易くするため、噴出手段２３、２４を各つかみ爪
９、１０に対応して配設し、これによりガラス基板４の
互いに対向する側面４ａ、４ｂの下端部と定盤５の表面
とのなす角部２１（図４参照）に向けて圧縮空気（圧力
３〜４Ｋｇ／ｃｍ2 ）２２を噴出させるようにしたこと
にある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIGS. 1A and 1B are a front view and a partially cutaway side view of a polishing method and a polishing apparatus according to an embodiment of the present invention when not gripping, FIG. 2 is a front view just before gripping, and FIG. FIG. 4 is an enlarged view of a main part in a gripped state, FIG. 4 is a perspective view of a nozzle, and FIG. In the drawing, the same components as those in FIG. 8 are denoted by the same reference numerals, and description thereof will be omitted. In these figures, the feature of the present invention is that the ejecting means 23 and 24 are used to easily insert the grasping claws 9 and 10 between the back surface of the glass substrate 4 and the surface of the surface plate 5. In this way, compressed air (pressure 3 to 3) is directed toward a corner 21 (see FIG. 4) formed between the lower end of the side surface 4 a, 4 b of the glass substrate 4 and the surface of the surface plate 5. 4 kg / cm 2 ) 22 is ejected.
【０００９】前記各噴出手段２３、２４は、先端にガラ
ス基板４の下端部と定盤５の表面とのなす角部２１に向
けて圧縮空気２２を噴出する扁平なノズル２５が設けら
れたパイプ２６、一端が不図示のコンプレッサに接続さ
れたチューブ２７、チューブ２７と前記パイプ２６を接
続する中継部材２８、エルボ２９およびニップル３０、
３１等で構成されている。パイプ２６は銅製で、直径５
ｍｍ程度とされる。パイプ２６の基端部はエルボ２９に
ニップル３１を介して接続されている。エルボ２９は水
平面内においてＬ字状に屈曲しており、基端部を把持部
材２、３の上面に配設された中継部材２８の外側面に接
続されている。中継部材２８の上面には、一端を不図示
のコンプレッサに接続されたチューブ２７の他端がニッ
プル３０を介して接続されている。そして、中継部材２
８の内部にはチューブ２７から送られてきた圧縮空気２
２をエルボ２９に導く流路が形成されている。Each of the jetting means 23 and 24 has a pipe provided with a flat nozzle 25 for jetting compressed air 22 toward a corner 21 formed between the lower end of the glass substrate 4 and the surface of the platen 5 at the end. 26, a tube 27 having one end connected to a compressor (not shown), a relay member 28 connecting the tube 27 and the pipe 26, an elbow 29 and a nipple 30,
31 and the like. The pipe 26 is made of copper and has a diameter of 5
mm. The base end of the pipe 26 is connected to an elbow 29 via a nipple 31. The elbow 29 is bent in an L-shape in a horizontal plane, and has a base end connected to the outer surface of the relay member 28 provided on the upper surfaces of the gripping members 2 and 3. The other end of the tube 27 having one end connected to a compressor (not shown) is connected to the upper surface of the relay member 28 via a nipple 30. And the relay member 2
8 contains compressed air 2 sent from the tube 27.
A flow path for guiding 2 to the elbow 29 is formed.
【００１０】フレーム６は図１（ｂ）に示すようにアー
ム１４の下端部に設けたスプライン軸３５に上下動自在
に連結され、またこのスプライン軸３５には前記フレー
ム６を下方に付勢する反力吸収手段としての圧縮コイル
バネ３６が弾装されている。スプライン軸３５は前記フ
レーム６の一端部に配設されたＴ字型部材の軸受孔３７
に相対摺動自在に嵌合され、下端には抜け防止用の鍔３
８が一体に設けられている。その他の構成は図８に示し
た従来構造と略同様である。As shown in FIG. 1B, the frame 6 is vertically movably connected to a spline shaft 35 provided at the lower end of the arm 14, and the frame 6 is urged downward by the spline shaft 35. A compression coil spring 36 as a reaction force absorbing means is elastically mounted. The spline shaft 35 is provided with a bearing hole 37 of a T-shaped member disposed at one end of the frame 6.
Slidably fitted to the lower end, and a flange 3 at the lower end for preventing slippage.
8 are provided integrally. Other configurations are substantially the same as the conventional structure shown in FIG.
【００１１】本実施例において、フォトマスクブランク
用のガラス基板４はガラス、石英等によって方形の板状
体に形成され、外形が１２．７ｃｍ角、厚みが２．２ｍ
ｍで、すべての稜線には０．６ｍｍ程度の面取り面（図
４参照）３９ａ、３９ｂが４５°の傾斜角度をもって施
されている。In this embodiment, a glass substrate 4 for a photomask blank is formed into a rectangular plate-like body of glass, quartz, or the like, and has an outer shape of 12.7 cm square and a thickness of 2.2 m.
m, all ridges are provided with chamfers 39a, 39b of about 0.6 mm (see FIG. 4) at an inclination angle of 45 °.
【００１２】次に、本発明による研磨方法および研磨装
置を説明する。ガラス基板４の研磨は定盤５の表面上に
ガラス基板４を配置し、酸化アルミナ等の粉末を溶質と
する研磨液を供給しながら基板裏面を研磨し、最大粗さ
２ミクロン程度の鏡面に仕上げる。したがって、研磨後
の状態においてはガラス基板４の裏面と定盤５の表面と
の間には研磨液が入り込んでいるため、表面張力の影響
によりガラス基板４と定盤５とは密着している。Next, a polishing method and a polishing apparatus according to the present invention will be described. Polishing of the glass substrate 4 is performed by disposing the glass substrate 4 on the surface of the platen 5 and polishing the back surface of the substrate while supplying a polishing solution containing a powder of alumina oxide or the like as a solute, to a mirror surface having a maximum roughness of about 2 microns. Finish. Therefore, in the state after polishing, since the polishing liquid has entered between the back surface of the glass substrate 4 and the surface of the platen 5, the glass substrate 4 and the platen 5 are in close contact with each other due to the influence of the surface tension. .
【００１３】次に、ガラス基板４をロボットハンドで把
持するため、アーム１４を図１の状態から下降させてつ
かみ爪９、１０の下面を定盤５の表面に当接させる。図
２はこの当接した状態を示す。この時、つかみ爪９、１
０からガラス基板４の端部までの距離ｄは５ｍｍ程度で
ある。具体的に述べると、アーム１４の下降量は把持部
材２、３の初期位置から定盤５までの距離Ｌより若干
（２〜３ｍｍ程度）大きく設定されているので、アーム
１４が所定ストローク下降すると、つかみ爪９、１０は
定盤５の表面に押し付けられ、この時の反力はフレーム
６がスプライン３５に沿って上昇し圧縮コイルバネ３６
を圧縮することで吸収される。Next, in order to hold the glass substrate 4 with a robot hand, the arm 14 is lowered from the state shown in FIG. 1 to bring the lower surfaces of the gripping claws 9 and 10 into contact with the surface of the surface plate 5. FIG. 2 shows this contact state. At this time, grip claws 9, 1
The distance d from 0 to the end of the glass substrate 4 is about 5 mm. More specifically, since the descending amount of the arm 14 is set to be slightly larger (about 2 to 3 mm) than the distance L from the initial position of the gripping members 2 and 3 to the surface plate 5, when the arm 14 descends by a predetermined stroke. , The gripping claws 9, 10 are pressed against the surface of the platen 5, and the reaction force at this time is such that the frame 6 rises along the spline 35 and the compression coil spring 36
Is absorbed by compressing.
【００１４】次に、この押圧状態で把持部材２、３をフ
レーム内蔵のエアシリンダ等の駆動装置によって内側に
移動させると共に、図４に示すようにコンプレッサから
供給される圧縮空気２２を各噴出手段２３、２４のノズ
ル２５からガラス基板４の側面４ａ、４ｂと定盤５との
なす角部２１に向けて噴出させる。すると、ガラス基板
４の周縁部と定盤５との間の一部研磨液が部分的に除去
されて表面張力が低減する。この結果、ガラス基板４と
定盤５との密着力が低減するので、つかみ爪９、１０の
先端部をガラス基板４の裏面と定盤５の表面との間に容
易に挿入することができ、所定ストローク内側に移動す
ることで、図３に示すようにつかみ爪９、１０のＶ字状
凹部１１、１２がガラス基板４を把持する。しかる後、
ロボットハンドは制御部からの指令に基づき把持したガ
ラス基板４を定盤５から所定の位置へ移動させる。Next, in this pressed state, the gripping members 2 and 3 are moved inward by a driving device such as an air cylinder built in the frame, and compressed air 22 supplied from a compressor is supplied to each ejection means as shown in FIG. The nozzles 23, 24 are ejected toward the corners 21 between the side surfaces 4 a, 4 b of the glass substrate 4 and the platen 5. Then, a part of the polishing liquid between the peripheral portion of the glass substrate 4 and the surface plate 5 is partially removed, and the surface tension is reduced. As a result, the adhesion between the glass substrate 4 and the surface plate 5 is reduced, so that the tips of the gripping claws 9 and 10 can be easily inserted between the back surface of the glass substrate 4 and the surface of the surface plate 5. 3, the V-shaped concave portions 11 and 12 of the gripping claws 9 and 10 grip the glass substrate 4 as shown in FIG. After a while
The robot hand moves the grasped glass substrate 4 from the surface plate 5 to a predetermined position based on a command from the control unit.
【００１５】なお、上記実施例は噴出手段２３、２４か
ら噴出する流体として圧縮空気２２を用いたが、これに
限らず水などの液体あるいは気体と液体との混合流体で
あってもよい。また、本実施例は噴出手段２３、２４の
パイプ２６をつかみ爪９、１０の前方にその先端、すな
わちノズル２５部が位置するように配置したが、つかみ
爪９、１０の後方でもよいし、更につかみ爪９、１０の
内部に流路を形成し、ノズルをつかみ爪９、１０のＶ字
状凹部１１、１２に開口させてもよい。更にまた、本実
施例はつかみ爪９、１０が定盤５に当接した時に噴出手
段２３、２４から圧縮空気２２が噴出するように空気を
制御したが、例えばつかみ爪９、１０が定盤５の表面上
を摺動して基板４に接する少し前または接した時に圧縮
空気が噴出するようにしてもよい。また、噴出する流体
はガラス基板４と定盤５とのなす角部２１に必ずしも向
かう必要はなく、例えば流体と定盤５の表面に当たって
しかる後、前記角部２１に向かうようにしてガラス基板
４と定盤との密着力を低減させるようにしてもよい。In the above embodiment, the compressed air 22 is used as the fluid ejected from the ejection means 23 and 24. However, the invention is not limited to this, and a fluid such as water or a mixed fluid of a gas and a liquid may be used. Further, in this embodiment, the pipes 26 of the jetting means 23 and 24 are disposed so that the tip thereof, that is, the nozzle 25 is located in front of the grasping claws 9 and 10, but may be behind the grasping claws 9 and 10, Further, a flow path may be formed inside the grasping claws 9, 10, and the nozzle may be opened in the V-shaped concave portions 11, 12 of the grasping claws 9, 10. Furthermore, in the present embodiment, the air is controlled so that the compressed air 22 is blown out from the jetting means 23 and 24 when the gripping claws 9 and 10 come into contact with the surface plate 5. The compressed air may be ejected slightly before or just before the slide 5 comes into contact with the substrate 4 by sliding on the surface. In addition, the fluid to be ejected does not necessarily need to go to the corner 21 formed between the glass substrate 4 and the surface plate 5. For example, after the fluid hits the surface of the surface plate 5 with the fluid, the glass substrate 4 You may make it reduce the adhesive force of a surface plate.
【００１６】図６はつかみ爪の他の実施例を示す斜視図
である。この実施例はガラス基板４の裏面と定盤表面と
の間につかみ爪９（爪１０も同様）を挿入し易くするた
め、つかみ爪９に４つの斜面、すなわちガラス基板４の
下側端縁に設けられた面取り面３９ａと平行な第１下側
斜面（第１傾斜面）５０と、ガラス基板４の上側端縁に
設けられた面取り面３９ｂと平行で前記第１下側斜面５
０と直交する第１上側斜面（第２傾斜面）５１と、つか
み爪９の下面５２の基板側端縁５２ａと前記第１下側斜
面５０とを接続し前記下面５１に対する傾斜角Θが前記
第１下側斜面５０の傾斜角度α（４５°）より鋭角
（例：３０°）で、前記下面５２と共にエッジ５３を形
成する第２下側斜面（第３傾斜面）５４と、つかみ爪９
の上面５５の基板側端縁５６ａと前記第１上側斜面５１
とを接続し前記上面５５に対する傾斜角βが前記第１上
側斜面５１の傾斜角度γ（４５°）より鋭角（３０°）
で、前記上面５５と共にエッジ５７を形成する第２上側
斜面（第４傾斜面）５８とからなる略Ｖ字状の凹部１１
を設けたものである。なお、つかみ爪９の材質として
は、ポリエステル・エーテル・ケトン等の樹脂が使用さ
れる。FIG. 6 is a perspective view showing another embodiment of the gripping claws. In this embodiment, in order to make it easy to insert the gripper 9 (also the nail 10) between the back surface of the glass substrate 4 and the surface of the surface plate, the gripper 9 has four slopes, that is, the lower edge of the glass substrate 4. A first lower slope (first slope) 50 parallel to the chamfered surface 39a provided on the glass substrate 4 and the first lower slope 5 parallel to the chamfered surface 39b provided on the upper edge of the glass substrate 4.
A first upper inclined surface (second inclined surface) 51 orthogonal to 0, a substrate-side edge 52a of the lower surface 52 of the gripper 9 and the first lower inclined surface 50 are connected to each other, and the inclination angle 下面 with respect to the lower surface 51 is set to the aforementioned value. A second lower slope (third slope) 54 that forms an edge 53 with the lower surface 52 at an acute angle (eg, 30 °) from the tilt angle α (45 °) of the first lower slope 50;
Edge 56a of the upper surface 55 of the first side and the first upper slope 51
And the inclination angle β with respect to the upper surface 55 is more acute (30 °) than the inclination angle γ (45 °) of the first upper slope 51.
A substantially V-shaped recess 11 comprising a second upper inclined surface (fourth inclined surface) 58 forming an edge 57 together with the upper surface 55.
Is provided. In addition, as the material of the gripping claws 9, a resin such as polyester, ether, or ketone is used.
【００１７】このような構成においては、つかみ爪９の
下側エッジ部５３をガラス基板４と定盤の間により一層
容易に進入させることができ、ガラス基板４の保持が確
実である。In such a configuration, the lower edge portion 53 of the gripper 9 can be more easily inserted between the glass substrate 4 and the surface plate, and the glass substrate 4 is reliably held.
【００１８】図７はつかみ爪のさらに他の実施例を示す
側面図である。この実施例は図６に示した第２上側斜面
５８を省略し、第１下側斜面（第１傾斜面）５０、第２
下側斜面（第３傾斜面）５４および第１上側斜面（第２
傾斜面）５１とで略Ｖ字状の凹部１１を形成し、下側エ
ッジ部５３を上側エッジ部５７より前方へ延在させたも
のである。FIG. 7 is a side view showing still another embodiment of the gripping claws. In this embodiment, the second upper slope 58 shown in FIG. 6 is omitted, and the first lower slope (first slope) 50 and the second lower slope 58 are omitted.
The lower slope (third slope) 54 and the first upper slope (second slope)
A substantially V-shaped recess 11 is formed with the inclined surface 51, and the lower edge 53 extends forward from the upper edge 57.
【００１９】このような構成においても上記実施例と同
様、つかみ爪９の下側エッジ部５３をガラス基板４と定
盤の間に容易に進入させることができ、ガラス基板４を
確実に把持することができるものである。In such a configuration, similarly to the above embodiment, the lower edge portion 53 of the gripper 9 can easily enter between the glass substrate 4 and the surface plate, and the glass substrate 4 is securely gripped. Is what you can do.
【００２０】[0020]
【発明の効果】以上説明したように本発明に係る研磨方
法および研磨装置は、ワーク把持部によって定盤上のガ
ラス基板を把持する際、噴出出段によって流体をガラス
基板に向けて噴出し、ガラス基板と定盤との密着力を低
減させるようにしたので、ワーク把持部によってガラス
基板を容易に且つ確実に把持することができ、また把持
するための力を大きくする必要がないため、ガラス基板
の損傷を防止することができる。また、つかみ爪のワー
ク把持部を、ガラス基板の上下側端縁に設けられた面取
り面に密接する第１および第２傾斜面と、つかみ爪の下
面に対する傾斜角が第１傾斜面より鋭角で、下面と共に
エッジを形成する第３傾斜面とからなる略Ｖ字状の凹部
で構成したので、ガラス基板と定盤との間につかみ爪を
容易に挿入することができ、ガラス基板の把持が確実で
ある。As described above, in the polishing method and the polishing apparatus according to the present invention, when the glass substrate on the surface plate is gripped by the work gripper, the fluid is jetted toward the glass substrate by the jetting stage. Since the adhesive force between the glass substrate and the surface plate is reduced, the glass substrate can be easily and reliably gripped by the work gripper, and it is not necessary to increase the gripping force. The substrate can be prevented from being damaged. Further, the work gripping portion of the gripping claw is provided with first and second inclined surfaces that are in close contact with the chamfered surfaces provided at the upper and lower edges of the glass substrate, and the inclination angle of the gripping claw with respect to the lower surface is more acute than the first inclined surface. , And the lower surface and the third inclined surface forming an edge, so as to form a substantially V-shaped concave portion, so that a grasping claw can be easily inserted between the glass substrate and the platen, and the glass substrate can be gripped. It is certain.
【図１】 （ａ）、（ｂ）は本発明に係る研磨方法およ
び研磨装置の一実施例を示す非把持時の正面図および一
部破断側面図である。FIGS. 1 (a) and 1 (b) are a front view and a partially cutaway side view of a polishing method and a polishing apparatus according to an embodiment of the present invention when not gripping.
【図２】 把持直前の正面図である。FIG. 2 is a front view immediately before gripping.
【図３】 把持した状態の正面図である。FIG. 3 is a front view of a gripped state.
【図４】 要部拡大図である。FIG. 4 is an enlarged view of a main part.
【図５】 ノズルの斜視図である。FIG. 5 is a perspective view of a nozzle.
【図６】 つかみ爪の他の実施例を示す斜視図である。FIG. 6 is a perspective view showing another embodiment of the gripping claws.
【図７】 つかみ爪のさらに他の実施例を示す斜視図で
ある。FIG. 7 is a perspective view showing still another embodiment of the gripping claws.
【図８】（ａ）〜（ｄ）は従来のロボットハンドを示す
平面図、側面図、把持状態の正面図および把持直前の正
面図である。8 (a) to 8 (d) are a plan view, a side view, a front view of a holding state, and a front view immediately before holding, showing a conventional robot hand.
１…ロボットハンド、 ２、３…把持部材、４…ガラス
基板、４ａ、４ｂ…側面、５…定盤、６…フレーム、
９、１０…つかみ爪、１１、１２…凹部、２２…圧縮空
気、２３、２４…噴出手段、２５…ノズル、３９ａ、３
９ｂ…面取り面、５０…第１下側斜面（第１傾斜面）、
５１…第１上側斜面（第２傾斜面）、５２…下面、５３
…エッジ、５４…第２下側斜面（第３傾斜面）、５７…
エッジ、５８…第２上側斜面（第４傾斜面）。DESCRIPTION OF SYMBOLS 1 ... Robot hand 2, 3 ... Grasping member, 4 ... Glass substrate, 4a, 4b ... Side surface, 5 ... Surface plate, 6 ... Frame
9, 10 ... gripping claws, 11, 12 ... concave parts, 22 ... compressed air, 23, 24 ... jetting means, 25 ... nozzles, 39a, 3
9b: chamfer surface, 50: first lower slope (first slope),
51: first upper slope (second slope), 52: lower face, 53
... edge, 54 ... second lower slope (third slope), 57 ...
Edge, 58... Second upper slope (fourth slope).
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−109688（ＪＰ，Ａ) 特開 昭62−295840（ＪＰ，Ａ) 実開 昭58−93493（ＪＰ，Ｕ) 実開 昭59−124091（ＪＰ，Ｕ) 実開 昭62−134245（ＪＰ，Ｕ) 実開 昭62−128632（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-109688 (JP, A) JP-A-62-295840 (JP, A) Fully open 1983-93493 (JP, U) Really open 1984 124091 (JP, U) Japanese Utility Model Showa 62-134245 (JP, U) Japanese Utility Model Showa 62-128632 (JP, U)
Claims (6)
ス基板を載置し、研磨液をこのガラス基板の表面に供給
して定盤を回転駆動することにより前記ガラス基板の表
面を研磨加工する研磨方法において、 前記ガラス基板の表面を研磨した後、前記ガラス基板と
前記定盤との間に研磨液が介在している側の前記ガラス
基板の表面と定盤表面との間にガラス基板を挟持するワ
ーク把持部を挿入して前記ガラス基板を定盤から離間さ
せる際、 前記研磨液の表面張力により密着している前記ガラス基
板と前記定盤との密着力を低減するように、面取り面が
施された前記ガラス基板側面の下端部近傍に向かって流
体を噴出することを特徴とする研磨方法。1. A glass substrate for a photomask blank is placed on a surface plate, a polishing liquid is supplied to the surface of the glass substrate, and the surface surface of the glass substrate is polished by rotating the surface plate. In the polishing method, after polishing the surface of the glass substrate, a glass substrate between the surface of the glass substrate and the surface of the surface plate on the side where a polishing liquid is interposed between the glass substrate and the surface plate. When inserting the work holding portion to be sandwiched and separating the glass substrate from the surface plate, a chamfered surface so as to reduce the adhesion force between the glass substrate and the surface plate that are in close contact with each other due to the surface tension of the polishing liquid. But
Polishing method characterized by ejecting a fluid towards the lower end vicinity of the glass substrate side was subjected.
分的に除去するようにガラス基板側面の下端部近傍に向
かって流体を噴出することを特徴とする研磨方法。2. The polishing method according to claim 1, wherein a fluid is jetted toward a vicinity of a lower end portion of a side surface of the glass substrate so as to partially remove a polishing liquid interposed between the glass substrate and the surface plate. Polishing method characterized by performing.
ようにガラス基板側面の下端部近傍に向かって流体を噴
出することを特徴とする研磨方法。3. The polishing method according to claim 1, wherein a fluid is ejected toward a vicinity of a lower end portion of a side surface of the glass substrate so as to apply a force to the glass substrate in a direction away from the surface plate. Polishing method.
載の研磨方法において、 前記ガラス基板は、方形の板状体であって、該板状体の
少なくとも定盤側の稜線には面取り面が施されたガラス
基板からなり、前記定盤表面と前記ガラス基板の面取り
面とのなす角に対し、鋭角のつかみ爪のワーク把持部を
前記ガラス基板と定盤との間に研磨液が介在している側
の前記ガラス基板の表面と定盤表面との間に挿入してガ
ラス基板を把持することを特徴とする研磨方法。4. The polishing method according to any one of claims 1 to 3 , wherein the glass substrate is a rectangular plate, and at least a ridge line on the side of the platen of the plate. Is made of a glass substrate having a chamfered surface, and a workpiece gripping portion of an acute gripping claw is polished between the glass substrate and the surface plate with respect to an angle formed between the surface of the surface plate and the chamfered surface of the glass substrate. A polishing method comprising: inserting between a surface of the glass substrate on a side where a liquid is interposed and a surface of a surface plate to grip the glass substrate.
はガラス基板の下側端縁に設けられた面取り面と実質的
に平行な第１傾斜面と、ガラス基板の上側端縁に設けら
れた面取り面と実質的に平行な第２傾斜面と、つかみ爪
の下面のガラス基板側縁と前記第１傾斜面とを直接また
は間接的に接続し前記下面に対する傾斜角が前記第１傾
斜面より鋭角である第３傾斜面とを備えていることを特
徴とする研磨方法。5. The polishing method according to claim 4, wherein the workpiece gripping portion comprises a substantially V-shaped concave portion, and the concave portion is substantially parallel to a chamfered surface provided on a lower edge of the glass substrate. A first inclined surface, a second inclined surface substantially parallel to a chamfered surface provided at an upper edge of the glass substrate, and a glass substrate side edge of a lower surface of a gripper and the first inclined surface being directly or indirectly connected to each other. And a third inclined surface having an inclined angle with respect to the lower surface that is more acute than the first inclined surface.
載の研磨方法を実施するための研磨装置であって、 前記ガラス基板と前記定盤との間に研磨液が介在してい
る側のガラス基板の表面と定盤表面との間に挿入してガ
ラス基板を挟持するワーク把持部と、研磨液の表面張力
により密着しているガラス基板と定盤との密着力を低減
すべくガラス基板側面の下端部近傍に向かって流体を噴
出する噴出手段とを有することを特徴とする研磨装置。6. A polishing apparatus for carrying out the polishing method according to any one of claims 1 to 5, the polishing liquid is interposed between the glass substrate and the surface plate The work gripper that holds the glass substrate by inserting it between the surface of the glass substrate and the surface of the surface plate, and reduces the adhesion between the glass substrate and the surface plate that are in close contact due to the surface tension of the polishing liquid A polishing device for discharging a fluid toward a vicinity of a lower end portion of a side surface of the glass substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8581591A JP3338937B2 (en) | 1990-03-29 | 1991-03-27 | Polishing method and polishing apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2-78886 | 1990-03-29 | ||
| JP7888690 | 1990-03-29 | ||
| JP8581591A JP3338937B2 (en) | 1990-03-29 | 1991-03-27 | Polishing method and polishing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04223886A JPH04223886A (en) | 1992-08-13 |
| JP3338937B2 true JP3338937B2 (en) | 2002-10-28 |
Family
ID=26419948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8581591A Expired - Lifetime JP3338937B2 (en) | 1990-03-29 | 1991-03-27 | Polishing method and polishing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3338937B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5582313B2 (en) * | 2011-06-28 | 2014-09-03 | 株式会社安川電機 | Robot system |
| JP2013193130A (en) * | 2012-03-15 | 2013-09-30 | Seiko Epson Corp | Robot hand, robot device, and method of driving the robot hand |
| CN110461552B (en) | 2017-04-03 | 2023-05-23 | 索尼公司 | Manipulator device, production device and production method for electronic equipment |
-
1991
- 1991-03-27 JP JP8581591A patent/JP3338937B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04223886A (en) | 1992-08-13 |
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