JP3338937B2 - Polishing method and polishing apparatus - Google Patents
Polishing method and polishing apparatusInfo
- Publication number
- JP3338937B2 JP3338937B2 JP8581591A JP8581591A JP3338937B2 JP 3338937 B2 JP3338937 B2 JP 3338937B2 JP 8581591 A JP8581591 A JP 8581591A JP 8581591 A JP8581591 A JP 8581591A JP 3338937 B2 JP3338937 B2 JP 3338937B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- polishing
- plate
- surface plate
- polishing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Feeding Of Workpieces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manipulator (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、ワークとしてのフォト
マスクブランク用ガラス基板の主表面を研磨する研磨方
法および研磨装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method and a polishing apparatus for polishing a main surface of a glass substrate for a photomask blank as a work.
【0002】[0002]
【従来の技術】従来、フォトマスクブランク用ガラス基
板やセラミックス等の板状物を研磨加工する加工機に使
用されるロボットハンドとしては図8(a)〜(d)に
示すように構成されたものが知られている。すなわち、
このロボットハンド1は、開閉自在な2つの把持部材
2、3で定盤5上のガラス基板4を把持するもので、各
把持部材2、3はフレーム6の両側に接近離間自在に対
向して配置され、その基部に設けた支軸7、8がフレー
ムに内蔵された、例えば特開平1−222882号公報
等に開示された駆動装置によって動作されるように構成
されており、接近時に各把持部材2、3の先端部内側面
に対設されたつかみ爪9、10が定盤5の表面に密接し
た状態でガラス基板4の互いに対向する1組の側面近傍
の周縁部を把持する。各つかみ爪9、10の内側面には
ワーク把持部としてのV字状の凹部11、12がそれぞ
れ水平方向に形成され、ガラス基板4の把持動作は該凹
部11、12の下側斜面11a、12aによりガラス基
板4を定盤5からすくい上げる形で行なわれる。なお、
14はフレーム6を作業範囲内の任意の位置に移動させ
るロボットハンド1のアームである。2. Description of the Related Art Conventionally, a robot hand used for a processing machine for polishing a glass substrate for a photomask blank or a plate-like material such as ceramics is configured as shown in FIGS. 8 (a) to 8 (d). Things are known. That is,
This robot hand 1 holds a glass substrate 4 on a surface plate 5 with two openable and closable gripping members 2, 3. The supporting shafts 7 and 8 provided at the bases thereof are arranged so as to be operated by a driving device disclosed in, for example, Japanese Patent Application Laid- Open No. 1-222882 incorporated in a frame. The gripping claws 9, 10 provided on the inner surfaces of the distal ends of the members 2, 3 grip peripheral edges of the glass substrate 4 in the vicinity of a pair of opposing side surfaces of the glass substrate 4 in close contact with the surface of the surface plate 5. V-shaped concave portions 11 and 12 as a workpiece gripping portion are formed in the inner surface of each of the gripping claws 9 and 10 in the horizontal direction, respectively. The gripping operation of the glass substrate 4 is performed by lower slopes 11a of the concave portions 11 and 12; 12a, the glass substrate 4 is scooped up from the surface plate 5. In addition,
Reference numeral 14 denotes an arm of the robot hand 1 for moving the frame 6 to an arbitrary position within the working range.
【0003】以上の構成により不図示の制御装置に指令
をインプットしておくことにより、ロボットハンド1は
この指令に基づいて動作し、つかみ爪9、10によりガ
ラス基板4の周縁部を把持し、該ガラス基板4を定盤5
から上方に離間搬送したり、またはガラス基板4を定盤
5上に載置することができる。By inputting a command to a control device (not shown) according to the above configuration, the robot hand 1 operates based on the command, and grips the periphery of the glass substrate 4 with the gripping claws 9 and 10. Place the glass substrate 4 on the surface plate 5
, Or the glass substrate 4 can be placed on the surface plate 5.
【0004】[0004]
【発明が解決しようとする課題】ところで、ガラス基板
4を特に高精度に研磨した後は、ガラス基板4における
研磨済面との間に、研磨の際供給される研磨液が流入
し、この研磨液の表面張力の影響によりガラス基板4と
定盤5とが強固に密着している。このような状態で定盤
5上に載置されたガラス基板4をつかみ爪9、10で把
持しようとすると、つかみ爪9、10の各々の先端部が
ガラス基板4と定盤5との間に挿入され難くなり、結果
としてロボットハンド1によりガラス基板4の把持をし
損じる回数が多くなるという問題があった。また、ガラ
ス基板4と定盤5との密着力に抗して把持力を、支軸
7、8の駆動装置のパワーアップにより得ようとする
と、ガラス基板4を損傷させるという新たな問題を生じ
る。After the glass substrate 4 is polished with high precision, a polishing liquid supplied during polishing flows between the polished surface of the glass substrate 4 and the polishing liquid. The glass substrate 4 and the platen 5 are firmly adhered to each other due to the influence of the surface tension of the liquid. In such a state, when trying to grip the glass substrate 4 placed on the surface plate 5 with the grip claws 9, 10, the tip of each of the grip claws 9, 10 is located between the glass substrate 4 and the surface plate 5. And the number of times that the robot hand 1 fails to grasp the glass substrate 4 is increased. Further, if it is attempted to obtain a gripping force against the adhesion between the glass substrate 4 and the surface plate 5 by increasing the power of the driving device of the support shafts 7 and 8, a new problem that the glass substrate 4 is damaged occurs. .
【0005】したがって、本発明は上記したような従来
の問題点に鑑みてなされたもので、その目的とするとこ
ろは、比較的簡単な構成で定盤上のフォトマスクブラン
ク用ガラス基板を損傷することなく適確に把持すること
ができるようにした研磨方法および研磨装置を提供する
ことにある。Accordingly, the present invention has been made in view of the above-mentioned conventional problems, and has as its object to damage a glass substrate for a photomask blank on a surface plate with a relatively simple structure. It is an object of the present invention to provide a polishing method and a polishing apparatus capable of holding a workpiece accurately without using the same.
【0006】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するためになされたもので、その第1の発明は、定盤上
にフォトマスクブランク用のガラス基板を載置し、研磨
液をガラス基板表面に供給して定盤を回転駆動すること
によりガラス基板の表面を研磨加工する研磨方法におい
て、前記ガラス基板の表面を研磨した後、前記ガラス基
板と前記定盤との間に研磨液が介在している側の前記ガ
ラス基板の表面と定盤表面との間にガラス基板を挟持す
るワーク把持部を挿入して前記ガラス基板を定盤から離
間させる際、前記研磨液の表面張力により密着している
前記ガラス基板と前記定盤との密着力を低減するよう
に、面取り面が施された前記ガラス基板側面の下端部近
傍に向かって流体を噴出することを特徴とする。第2の
発明は、上記第1の発明において、前記ガラス基板と前
記定盤との間に介在する研磨液を部分的に除去するよう
にガラス基板側面の下端部近傍に向かって流体を噴出す
ることを特徴とする。第3の発明は、上記第1の発明に
おいて、前記ガラス基板に定盤から離間する方向に力を
付与するようにガラス基板側面の下端部近傍に向かって
流体を噴出することを特徴とする。第4の発明は上記第
1〜第3の発明のうちいずれか1つにおいて、前記ガラ
ス基板は、方形の板状体であって、該板状体の少なくと
も定盤側の稜線には面取り面が施されたガラス基板から
なり、前記定盤表面と前記ガラス基板の面取り面とのな
す角に対し、鋭角のつかみ爪のワーク把持部を前記ガラ
ス基板と定盤との間に研磨液が介在している側の前記ガ
ラス基板の表面と定盤表面との間に挿入してガラス基板
を把持することを特徴とする。第5の発明は上記第4の
発明において、前記ワーク把持部が略V字状の凹部から
なり、この凹部はガラス基板の下側端縁に設けられた面
取り面と実質的に平行な第1傾斜面と、ガラス基板の上
側端縁に設けられた面取り面と実質的に平行な第2傾斜
面と、つかみ爪の下面のガラス基板側縁と前記第1傾斜
面とを直接または間接的に接続し前記下面に対する傾斜
角が前記第1傾斜面より鋭角である第3傾斜面とを備え
ていることを特徴とする。第6の発明は上記第1〜第5
のうちのいずれか1つの発明の研磨方法を実施するため
の研磨装置であって、前記ガラス基板と前記定盤との間
に研磨液が介在している側のガラス基板の表面と定盤表
面との間に挿入してガラス基板を挟持するワーク把持部
と、研磨液の表面張力により密着しているガラス基板と
定盤との密着力を低減すべくガラス基板側面の下端部近
傍に向かって流体を噴出する噴出手段とを有することを
特徴とする。Means for Solving the Problems The present invention has been made to achieve the above object, and a first invention is to place a glass substrate for a photomask blank on a surface plate and to apply a polishing liquid. In the polishing method of polishing the surface of the glass substrate by supplying the glass substrate surface and rotating the surface plate, the polishing liquid is polished between the glass substrate and the surface plate after polishing the surface of the glass substrate. When inserting the work gripping portion that holds the glass substrate between the surface of the glass substrate and the surface of the surface plate on the side where the glass substrate is interposed, and separating the glass substrate from the surface plate, by the surface tension of the polishing liquid A fluid is ejected toward a vicinity of a lower end portion of a side surface of the glass substrate having a chamfered surface so as to reduce an adhesive force between the glass substrate and the surface plate that are in close contact with each other. In a second aspect based on the first aspect, the fluid is jetted toward the vicinity of the lower end of the side surface of the glass substrate so as to partially remove the polishing liquid interposed between the glass substrate and the surface plate. It is characterized by the following. A third invention is characterized in that, in the first invention, a fluid is ejected toward a vicinity of a lower end portion of a side surface of the glass substrate so as to apply a force to the glass substrate in a direction away from the surface plate. The fourth invention is the fourth invention.
In any one of the first to third inventions , the glass substrate is a rectangular plate-like body, and at least a ridge line on the side of the platen of the plate-like body is chamfered. The angle between the surface of the surface plate and the chamfered surface of the glass substrate is such that the workpiece gripping portion of the gripper having an acute angle is the glass on the side where the polishing liquid is interposed between the glass substrate and the surface plate. It is characterized in that it is inserted between the surface of the substrate and the surface of the surface plate to hold the glass substrate. The fifth invention is the fourth invention.
In the present invention , the work gripping part comprises a substantially V-shaped concave part, the concave part having a first inclined surface substantially parallel to a chamfered surface provided at a lower edge of the glass substrate, and an upper end of the glass substrate. A second inclined surface substantially parallel to the chamfered surface provided at the edge, and a glass substrate side edge of the lower surface of the gripper and the first inclined surface are directly or indirectly connected to each other, and the inclination angle with respect to the lower surface is A third inclined surface having an acute angle with respect to the first inclined surface. The sixth invention is directed to the first to fifth embodiments.
A polishing apparatus for carrying out the polishing method according to any one of the above aspects, wherein the surface of the glass substrate and the surface of the surface plate on the side where a polishing liquid is interposed between the glass substrate and the surface plate Between the workpiece holding portion that sandwiches the glass substrate by inserting it between the glass substrate and the lower end of the glass substrate side surface in order to reduce the adhesive force between the glass substrate and the surface plate that are in close contact with each other due to the surface tension of the polishing liquid. And a jetting means for jetting a fluid.
【0007】[0007]
【作用】本発明においては、ガラス基板側面の下端部近
傍に向かって流体を噴出することで、ガラス基板と定盤
との密着力を低減することができる。例えば、流体とし
て気体を用いた場合、ガラス基板と定盤との間に介在す
る研磨液を部分的に除去し、この結果、表面張力が低減
するので、ガラス基板と定盤との密着力が低減する。ま
た、流体として液体を用いた場合、ガラス基板に定盤か
ら離間する方向に力を付与することができ、ガラス基板
と定盤との密着力が低減する。第1および第2の傾斜面
は、ガラス基板の上下側端縁に設けられた面取り面に密
接し把持する。第3傾斜面はつかみ爪の下面に対する傾
斜角が第1傾斜面より鋭角で、下面と共にエッジを形成
し、ガラス基板と定盤との間に容易に挿入される。In the present invention, by ejecting the fluid toward the vicinity of the lower end of the side surface of the glass substrate, the adhesion between the glass substrate and the surface plate can be reduced. For example, when a gas is used as the fluid, the polishing liquid interposed between the glass substrate and the surface plate is partially removed, and as a result, the surface tension is reduced. Reduce. When a liquid is used as the fluid, a force can be applied to the glass substrate in a direction away from the surface plate, and the adhesion between the glass substrate and the surface plate is reduced. The first and second inclined surfaces are in close contact with and be gripped by chamfered surfaces provided at upper and lower edges of the glass substrate. The third inclined surface has a more inclined angle with respect to the lower surface of the gripping claw than the first inclined surface, forms an edge with the lower surface, and is easily inserted between the glass substrate and the surface plate.
【0008】[0008]
【実施例】以下、本発明を図面に示す実施例に基づいて
詳細に説明する。図1(a)、(b)は本発明に係る研
磨方法および研磨装置の一実施例を示す非把持時の正面
図および一部破断側面図、図2は把持直前の正面図、図
3は把持した状態の正面図、図4は要部拡大図、図5は
ノズルの斜視図である。なお、図中図8と同一構成部品
のものに対しては同一符号を以て示し、その説明を省略
する。これらの図において、本発明の特徴は、ガラス基
板4の裏面と定盤5の表面との間につかみ爪9、10を
挿入し易くするため、噴出手段23、24を各つかみ爪
9、10に対応して配設し、これによりガラス基板4の
互いに対向する側面4a、4bの下端部と定盤5の表面
とのなす角部21(図4参照)に向けて圧縮空気(圧力
3〜4Kg/cm2 )22を噴出させるようにしたこと
にある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. FIGS. 1A and 1B are a front view and a partially cutaway side view of a polishing method and a polishing apparatus according to an embodiment of the present invention when not gripping, FIG. 2 is a front view just before gripping, and FIG. FIG. 4 is an enlarged view of a main part in a gripped state, FIG. 4 is a perspective view of a nozzle, and FIG. In the drawing, the same components as those in FIG. 8 are denoted by the same reference numerals, and description thereof will be omitted. In these figures, the feature of the present invention is that the ejecting means 23 and 24 are used to easily insert the grasping claws 9 and 10 between the back surface of the glass substrate 4 and the surface of the surface plate 5. In this way, compressed air (pressure 3 to 3) is directed toward a corner 21 (see FIG. 4) formed between the lower end of the side surface 4 a, 4 b of the glass substrate 4 and the surface of the surface plate 5. 4 kg / cm 2 ) 22 is ejected.
【0009】前記各噴出手段23、24は、先端にガラ
ス基板4の下端部と定盤5の表面とのなす角部21に向
けて圧縮空気22を噴出する扁平なノズル25が設けら
れたパイプ26、一端が不図示のコンプレッサに接続さ
れたチューブ27、チューブ27と前記パイプ26を接
続する中継部材28、エルボ29およびニップル30、
31等で構成されている。パイプ26は銅製で、直径5
mm程度とされる。パイプ26の基端部はエルボ29に
ニップル31を介して接続されている。エルボ29は水
平面内においてL字状に屈曲しており、基端部を把持部
材2、3の上面に配設された中継部材28の外側面に接
続されている。中継部材28の上面には、一端を不図示
のコンプレッサに接続されたチューブ27の他端がニッ
プル30を介して接続されている。そして、中継部材2
8の内部にはチューブ27から送られてきた圧縮空気2
2をエルボ29に導く流路が形成されている。Each of the jetting means 23 and 24 has a pipe provided with a flat nozzle 25 for jetting compressed air 22 toward a corner 21 formed between the lower end of the glass substrate 4 and the surface of the platen 5 at the end. 26, a tube 27 having one end connected to a compressor (not shown), a relay member 28 connecting the tube 27 and the pipe 26, an elbow 29 and a nipple 30,
31 and the like. The pipe 26 is made of copper and has a diameter of 5
mm. The base end of the pipe 26 is connected to an elbow 29 via a nipple 31. The elbow 29 is bent in an L-shape in a horizontal plane, and has a base end connected to the outer surface of the relay member 28 provided on the upper surfaces of the gripping members 2 and 3. The other end of the tube 27 having one end connected to a compressor (not shown) is connected to the upper surface of the relay member 28 via a nipple 30. And the relay member 2
8 contains compressed air 2 sent from the tube 27.
A flow path for guiding 2 to the elbow 29 is formed.
【0010】フレーム6は図1(b)に示すようにアー
ム14の下端部に設けたスプライン軸35に上下動自在
に連結され、またこのスプライン軸35には前記フレー
ム6を下方に付勢する反力吸収手段としての圧縮コイル
バネ36が弾装されている。スプライン軸35は前記フ
レーム6の一端部に配設されたT字型部材の軸受孔37
に相対摺動自在に嵌合され、下端には抜け防止用の鍔3
8が一体に設けられている。その他の構成は図8に示し
た従来構造と略同様である。As shown in FIG. 1B, the frame 6 is vertically movably connected to a spline shaft 35 provided at the lower end of the arm 14, and the frame 6 is urged downward by the spline shaft 35. A compression coil spring 36 as a reaction force absorbing means is elastically mounted. The spline shaft 35 is provided with a bearing hole 37 of a T-shaped member disposed at one end of the frame 6.
Slidably fitted to the lower end, and a flange 3 at the lower end for preventing slippage.
8 are provided integrally. Other configurations are substantially the same as the conventional structure shown in FIG.
【0011】本実施例において、フォトマスクブランク
用のガラス基板4はガラス、石英等によって方形の板状
体に形成され、外形が12.7cm角、厚みが2.2m
mで、すべての稜線には0.6mm程度の面取り面(図
4参照)39a、39bが45°の傾斜角度をもって施
されている。In this embodiment, a glass substrate 4 for a photomask blank is formed into a rectangular plate-like body of glass, quartz, or the like, and has an outer shape of 12.7 cm square and a thickness of 2.2 m.
m, all ridges are provided with chamfers 39a, 39b of about 0.6 mm (see FIG. 4) at an inclination angle of 45 °.
【0012】次に、本発明による研磨方法および研磨装
置を説明する。ガラス基板4の研磨は定盤5の表面上に
ガラス基板4を配置し、酸化アルミナ等の粉末を溶質と
する研磨液を供給しながら基板裏面を研磨し、最大粗さ
2ミクロン程度の鏡面に仕上げる。したがって、研磨後
の状態においてはガラス基板4の裏面と定盤5の表面と
の間には研磨液が入り込んでいるため、表面張力の影響
によりガラス基板4と定盤5とは密着している。Next, a polishing method and a polishing apparatus according to the present invention will be described. Polishing of the glass substrate 4 is performed by disposing the glass substrate 4 on the surface of the platen 5 and polishing the back surface of the substrate while supplying a polishing solution containing a powder of alumina oxide or the like as a solute, to a mirror surface having a maximum roughness of about 2 microns. Finish. Therefore, in the state after polishing, since the polishing liquid has entered between the back surface of the glass substrate 4 and the surface of the platen 5, the glass substrate 4 and the platen 5 are in close contact with each other due to the influence of the surface tension. .
【0013】次に、ガラス基板4をロボットハンドで把
持するため、アーム14を図1の状態から下降させてつ
かみ爪9、10の下面を定盤5の表面に当接させる。図
2はこの当接した状態を示す。この時、つかみ爪9、1
0からガラス基板4の端部までの距離dは5mm程度で
ある。具体的に述べると、アーム14の下降量は把持部
材2、3の初期位置から定盤5までの距離Lより若干
(2〜3mm程度)大きく設定されているので、アーム
14が所定ストローク下降すると、つかみ爪9、10は
定盤5の表面に押し付けられ、この時の反力はフレーム
6がスプライン35に沿って上昇し圧縮コイルバネ36
を圧縮することで吸収される。Next, in order to hold the glass substrate 4 with a robot hand, the arm 14 is lowered from the state shown in FIG. 1 to bring the lower surfaces of the gripping claws 9 and 10 into contact with the surface of the surface plate 5. FIG. 2 shows this contact state. At this time, grip claws 9, 1
The distance d from 0 to the end of the glass substrate 4 is about 5 mm. More specifically, since the descending amount of the arm 14 is set to be slightly larger (about 2 to 3 mm) than the distance L from the initial position of the gripping members 2 and 3 to the surface plate 5, when the arm 14 descends by a predetermined stroke. , The gripping claws 9, 10 are pressed against the surface of the platen 5, and the reaction force at this time is such that the frame 6 rises along the spline 35 and the compression coil spring 36
Is absorbed by compressing.
【0014】次に、この押圧状態で把持部材2、3をフ
レーム内蔵のエアシリンダ等の駆動装置によって内側に
移動させると共に、図4に示すようにコンプレッサから
供給される圧縮空気22を各噴出手段23、24のノズ
ル25からガラス基板4の側面4a、4bと定盤5との
なす角部21に向けて噴出させる。すると、ガラス基板
4の周縁部と定盤5との間の一部研磨液が部分的に除去
されて表面張力が低減する。この結果、ガラス基板4と
定盤5との密着力が低減するので、つかみ爪9、10の
先端部をガラス基板4の裏面と定盤5の表面との間に容
易に挿入することができ、所定ストローク内側に移動す
ることで、図3に示すようにつかみ爪9、10のV字状
凹部11、12がガラス基板4を把持する。しかる後、
ロボットハンドは制御部からの指令に基づき把持したガ
ラス基板4を定盤5から所定の位置へ移動させる。Next, in this pressed state, the gripping members 2 and 3 are moved inward by a driving device such as an air cylinder built in the frame, and compressed air 22 supplied from a compressor is supplied to each ejection means as shown in FIG. The nozzles 23, 24 are ejected toward the corners 21 between the side surfaces 4 a, 4 b of the glass substrate 4 and the platen 5. Then, a part of the polishing liquid between the peripheral portion of the glass substrate 4 and the surface plate 5 is partially removed, and the surface tension is reduced. As a result, the adhesion between the glass substrate 4 and the surface plate 5 is reduced, so that the tips of the gripping claws 9 and 10 can be easily inserted between the back surface of the glass substrate 4 and the surface of the surface plate 5. 3, the V-shaped concave portions 11 and 12 of the gripping claws 9 and 10 grip the glass substrate 4 as shown in FIG. After a while
The robot hand moves the grasped glass substrate 4 from the surface plate 5 to a predetermined position based on a command from the control unit.
【0015】なお、上記実施例は噴出手段23、24か
ら噴出する流体として圧縮空気22を用いたが、これに
限らず水などの液体あるいは気体と液体との混合流体で
あってもよい。また、本実施例は噴出手段23、24の
パイプ26をつかみ爪9、10の前方にその先端、すな
わちノズル25部が位置するように配置したが、つかみ
爪9、10の後方でもよいし、更につかみ爪9、10の
内部に流路を形成し、ノズルをつかみ爪9、10のV字
状凹部11、12に開口させてもよい。更にまた、本実
施例はつかみ爪9、10が定盤5に当接した時に噴出手
段23、24から圧縮空気22が噴出するように空気を
制御したが、例えばつかみ爪9、10が定盤5の表面上
を摺動して基板4に接する少し前または接した時に圧縮
空気が噴出するようにしてもよい。また、噴出する流体
はガラス基板4と定盤5とのなす角部21に必ずしも向
かう必要はなく、例えば流体と定盤5の表面に当たって
しかる後、前記角部21に向かうようにしてガラス基板
4と定盤との密着力を低減させるようにしてもよい。In the above embodiment, the compressed air 22 is used as the fluid ejected from the ejection means 23 and 24. However, the invention is not limited to this, and a fluid such as water or a mixed fluid of a gas and a liquid may be used. Further, in this embodiment, the pipes 26 of the jetting means 23 and 24 are disposed so that the tip thereof, that is, the nozzle 25 is located in front of the grasping claws 9 and 10, but may be behind the grasping claws 9 and 10, Further, a flow path may be formed inside the grasping claws 9, 10, and the nozzle may be opened in the V-shaped concave portions 11, 12 of the grasping claws 9, 10. Furthermore, in the present embodiment, the air is controlled so that the compressed air 22 is blown out from the jetting means 23 and 24 when the gripping claws 9 and 10 come into contact with the surface plate 5. The compressed air may be ejected slightly before or just before the slide 5 comes into contact with the substrate 4 by sliding on the surface. In addition, the fluid to be ejected does not necessarily need to go to the corner 21 formed between the glass substrate 4 and the surface plate 5. For example, after the fluid hits the surface of the surface plate 5 with the fluid, the glass substrate 4 You may make it reduce the adhesive force of a surface plate.
【0016】図6はつかみ爪の他の実施例を示す斜視図
である。この実施例はガラス基板4の裏面と定盤表面と
の間につかみ爪9(爪10も同様)を挿入し易くするた
め、つかみ爪9に4つの斜面、すなわちガラス基板4の
下側端縁に設けられた面取り面39aと平行な第1下側
斜面(第1傾斜面)50と、ガラス基板4の上側端縁に
設けられた面取り面39bと平行で前記第1下側斜面5
0と直交する第1上側斜面(第2傾斜面)51と、つか
み爪9の下面52の基板側端縁52aと前記第1下側斜
面50とを接続し前記下面51に対する傾斜角Θが前記
第1下側斜面50の傾斜角度α(45°)より鋭角
(例:30°)で、前記下面52と共にエッジ53を形
成する第2下側斜面(第3傾斜面)54と、つかみ爪9
の上面55の基板側端縁56aと前記第1上側斜面51
とを接続し前記上面55に対する傾斜角βが前記第1上
側斜面51の傾斜角度γ(45°)より鋭角(30°)
で、前記上面55と共にエッジ57を形成する第2上側
斜面(第4傾斜面)58とからなる略V字状の凹部11
を設けたものである。なお、つかみ爪9の材質として
は、ポリエステル・エーテル・ケトン等の樹脂が使用さ
れる。FIG. 6 is a perspective view showing another embodiment of the gripping claws. In this embodiment, in order to make it easy to insert the gripper 9 (also the nail 10) between the back surface of the glass substrate 4 and the surface of the surface plate, the gripper 9 has four slopes, that is, the lower edge of the glass substrate 4. A first lower slope (first slope) 50 parallel to the chamfered surface 39a provided on the glass substrate 4 and the first lower slope 5 parallel to the chamfered surface 39b provided on the upper edge of the glass substrate 4.
A first upper inclined surface (second inclined surface) 51 orthogonal to 0, a substrate-side edge 52a of the lower surface 52 of the gripper 9 and the first lower inclined surface 50 are connected to each other, and the inclination angle 下面 with respect to the lower surface 51 is set to the aforementioned value. A second lower slope (third slope) 54 that forms an edge 53 with the lower surface 52 at an acute angle (eg, 30 °) from the tilt angle α (45 °) of the first lower slope 50;
Edge 56a of the upper surface 55 of the first side and the first upper slope 51
And the inclination angle β with respect to the upper surface 55 is more acute (30 °) than the inclination angle γ (45 °) of the first upper slope 51.
A substantially V-shaped recess 11 comprising a second upper inclined surface (fourth inclined surface) 58 forming an edge 57 together with the upper surface 55.
Is provided. In addition, as the material of the gripping claws 9, a resin such as polyester, ether, or ketone is used.
【0017】このような構成においては、つかみ爪9の
下側エッジ部53をガラス基板4と定盤の間により一層
容易に進入させることができ、ガラス基板4の保持が確
実である。In such a configuration, the lower edge portion 53 of the gripper 9 can be more easily inserted between the glass substrate 4 and the surface plate, and the glass substrate 4 is reliably held.
【0018】図7はつかみ爪のさらに他の実施例を示す
側面図である。この実施例は図6に示した第2上側斜面
58を省略し、第1下側斜面(第1傾斜面)50、第2
下側斜面(第3傾斜面)54および第1上側斜面(第2
傾斜面)51とで略V字状の凹部11を形成し、下側エ
ッジ部53を上側エッジ部57より前方へ延在させたも
のである。FIG. 7 is a side view showing still another embodiment of the gripping claws. In this embodiment, the second upper slope 58 shown in FIG. 6 is omitted, and the first lower slope (first slope) 50 and the second lower slope 58 are omitted.
The lower slope (third slope) 54 and the first upper slope (second slope)
A substantially V-shaped recess 11 is formed with the inclined surface 51, and the lower edge 53 extends forward from the upper edge 57.
【0019】このような構成においても上記実施例と同
様、つかみ爪9の下側エッジ部53をガラス基板4と定
盤の間に容易に進入させることができ、ガラス基板4を
確実に把持することができるものである。In such a configuration, similarly to the above embodiment, the lower edge portion 53 of the gripper 9 can easily enter between the glass substrate 4 and the surface plate, and the glass substrate 4 is securely gripped. Is what you can do.
【0020】[0020]
【発明の効果】以上説明したように本発明に係る研磨方
法および研磨装置は、ワーク把持部によって定盤上のガ
ラス基板を把持する際、噴出出段によって流体をガラス
基板に向けて噴出し、ガラス基板と定盤との密着力を低
減させるようにしたので、ワーク把持部によってガラス
基板を容易に且つ確実に把持することができ、また把持
するための力を大きくする必要がないため、ガラス基板
の損傷を防止することができる。また、つかみ爪のワー
ク把持部を、ガラス基板の上下側端縁に設けられた面取
り面に密接する第1および第2傾斜面と、つかみ爪の下
面に対する傾斜角が第1傾斜面より鋭角で、下面と共に
エッジを形成する第3傾斜面とからなる略V字状の凹部
で構成したので、ガラス基板と定盤との間につかみ爪を
容易に挿入することができ、ガラス基板の把持が確実で
ある。As described above, in the polishing method and the polishing apparatus according to the present invention, when the glass substrate on the surface plate is gripped by the work gripper, the fluid is jetted toward the glass substrate by the jetting stage. Since the adhesive force between the glass substrate and the surface plate is reduced, the glass substrate can be easily and reliably gripped by the work gripper, and it is not necessary to increase the gripping force. The substrate can be prevented from being damaged. Further, the work gripping portion of the gripping claw is provided with first and second inclined surfaces that are in close contact with the chamfered surfaces provided at the upper and lower edges of the glass substrate, and the inclination angle of the gripping claw with respect to the lower surface is more acute than the first inclined surface. , And the lower surface and the third inclined surface forming an edge, so as to form a substantially V-shaped concave portion, so that a grasping claw can be easily inserted between the glass substrate and the platen, and the glass substrate can be gripped. It is certain.
【図1】 (a)、(b)は本発明に係る研磨方法およ
び研磨装置の一実施例を示す非把持時の正面図および一
部破断側面図である。FIGS. 1 (a) and 1 (b) are a front view and a partially cutaway side view of a polishing method and a polishing apparatus according to an embodiment of the present invention when not gripping.
【図2】 把持直前の正面図である。FIG. 2 is a front view immediately before gripping.
【図3】 把持した状態の正面図である。FIG. 3 is a front view of a gripped state.
【図4】 要部拡大図である。FIG. 4 is an enlarged view of a main part.
【図5】 ノズルの斜視図である。FIG. 5 is a perspective view of a nozzle.
【図6】 つかみ爪の他の実施例を示す斜視図である。FIG. 6 is a perspective view showing another embodiment of the gripping claws.
【図7】 つかみ爪のさらに他の実施例を示す斜視図で
ある。FIG. 7 is a perspective view showing still another embodiment of the gripping claws.
【図8】(a)〜(d)は従来のロボットハンドを示す
平面図、側面図、把持状態の正面図および把持直前の正
面図である。8 (a) to 8 (d) are a plan view, a side view, a front view of a holding state, and a front view immediately before holding, showing a conventional robot hand.
1…ロボットハンド、 2、3…把持部材、4…ガラス
基板、4a、4b…側面、5…定盤、6…フレーム、
9、10…つかみ爪、11、12…凹部、22…圧縮空
気、23、24…噴出手段、25…ノズル、39a、3
9b…面取り面、50…第1下側斜面(第1傾斜面)、
51…第1上側斜面(第2傾斜面)、52…下面、53
…エッジ、54…第2下側斜面(第3傾斜面)、57…
エッジ、58…第2上側斜面(第4傾斜面)。DESCRIPTION OF SYMBOLS 1 ... Robot hand 2, 3 ... Grasping member, 4 ... Glass substrate, 4a, 4b ... Side surface, 5 ... Surface plate, 6 ... Frame
9, 10 ... gripping claws, 11, 12 ... concave parts, 22 ... compressed air, 23, 24 ... jetting means, 25 ... nozzles, 39a, 3
9b: chamfer surface, 50: first lower slope (first slope),
51: first upper slope (second slope), 52: lower face, 53
... edge, 54 ... second lower slope (third slope), 57 ...
Edge, 58... Second upper slope (fourth slope).
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−109688(JP,A) 特開 昭62−295840(JP,A) 実開 昭58−93493(JP,U) 実開 昭59−124091(JP,U) 実開 昭62−134245(JP,U) 実開 昭62−128632(JP,U) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-109688 (JP, A) JP-A-62-295840 (JP, A) Fully open 1983-93493 (JP, U) Really open 1984 124091 (JP, U) Japanese Utility Model Showa 62-134245 (JP, U) Japanese Utility Model Showa 62-128632 (JP, U)
Claims (6)
ス基板を載置し、研磨液をこのガラス基板の表面に供給
して定盤を回転駆動することにより前記ガラス基板の表
面を研磨加工する研磨方法において、 前記ガラス基板の表面を研磨した後、前記ガラス基板と
前記定盤との間に研磨液が介在している側の前記ガラス
基板の表面と定盤表面との間にガラス基板を挟持するワ
ーク把持部を挿入して前記ガラス基板を定盤から離間さ
せる際、 前記研磨液の表面張力により密着している前記ガラス基
板と前記定盤との密着力を低減するように、面取り面が
施された前記ガラス基板側面の下端部近傍に向かって流
体を噴出することを特徴とする研磨方法。1. A glass substrate for a photomask blank is placed on a surface plate, a polishing liquid is supplied to the surface of the glass substrate, and the surface surface of the glass substrate is polished by rotating the surface plate. In the polishing method, after polishing the surface of the glass substrate, a glass substrate between the surface of the glass substrate and the surface of the surface plate on the side where a polishing liquid is interposed between the glass substrate and the surface plate. When inserting the work holding portion to be sandwiched and separating the glass substrate from the surface plate, a chamfered surface so as to reduce the adhesion force between the glass substrate and the surface plate that are in close contact with each other due to the surface tension of the polishing liquid. But
Polishing method characterized by ejecting a fluid towards the lower end vicinity of the glass substrate side was subjected.
分的に除去するようにガラス基板側面の下端部近傍に向
かって流体を噴出することを特徴とする研磨方法。2. The polishing method according to claim 1, wherein a fluid is jetted toward a vicinity of a lower end portion of a side surface of the glass substrate so as to partially remove a polishing liquid interposed between the glass substrate and the surface plate. Polishing method characterized by performing.
ようにガラス基板側面の下端部近傍に向かって流体を噴
出することを特徴とする研磨方法。3. The polishing method according to claim 1, wherein a fluid is ejected toward a vicinity of a lower end portion of a side surface of the glass substrate so as to apply a force to the glass substrate in a direction away from the surface plate. Polishing method.
載の研磨方法において、 前記ガラス基板は、方形の板状体であって、該板状体の
少なくとも定盤側の稜線には面取り面が施されたガラス
基板からなり、前記定盤表面と前記ガラス基板の面取り
面とのなす角に対し、鋭角のつかみ爪のワーク把持部を
前記ガラス基板と定盤との間に研磨液が介在している側
の前記ガラス基板の表面と定盤表面との間に挿入してガ
ラス基板を把持することを特徴とする研磨方法。4. The polishing method according to any one of claims 1 to 3 , wherein the glass substrate is a rectangular plate, and at least a ridge line on the side of the platen of the plate. Is made of a glass substrate having a chamfered surface, and a workpiece gripping portion of an acute gripping claw is polished between the glass substrate and the surface plate with respect to an angle formed between the surface of the surface plate and the chamfered surface of the glass substrate. A polishing method comprising: inserting between a surface of the glass substrate on a side where a liquid is interposed and a surface of a surface plate to grip the glass substrate.
はガラス基板の下側端縁に設けられた面取り面と実質的
に平行な第1傾斜面と、ガラス基板の上側端縁に設けら
れた面取り面と実質的に平行な第2傾斜面と、つかみ爪
の下面のガラス基板側縁と前記第1傾斜面とを直接また
は間接的に接続し前記下面に対する傾斜角が前記第1傾
斜面より鋭角である第3傾斜面とを備えていることを特
徴とする研磨方法。5. The polishing method according to claim 4, wherein the workpiece gripping portion comprises a substantially V-shaped concave portion, and the concave portion is substantially parallel to a chamfered surface provided on a lower edge of the glass substrate. A first inclined surface, a second inclined surface substantially parallel to a chamfered surface provided at an upper edge of the glass substrate, and a glass substrate side edge of a lower surface of a gripper and the first inclined surface being directly or indirectly connected to each other. And a third inclined surface having an inclined angle with respect to the lower surface that is more acute than the first inclined surface.
載の研磨方法を実施するための研磨装置であって、 前記ガラス基板と前記定盤との間に研磨液が介在してい
る側のガラス基板の表面と定盤表面との間に挿入してガ
ラス基板を挟持するワーク把持部と、研磨液の表面張力
により密着しているガラス基板と定盤との密着力を低減
すべくガラス基板側面の下端部近傍に向かって流体を噴
出する噴出手段とを有することを特徴とする研磨装置。6. A polishing apparatus for carrying out the polishing method according to any one of claims 1 to 5, the polishing liquid is interposed between the glass substrate and the surface plate The work gripper that holds the glass substrate by inserting it between the surface of the glass substrate and the surface of the surface plate, and reduces the adhesion between the glass substrate and the surface plate that are in close contact due to the surface tension of the polishing liquid A polishing device for discharging a fluid toward a vicinity of a lower end portion of a side surface of the glass substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8581591A JP3338937B2 (en) | 1990-03-29 | 1991-03-27 | Polishing method and polishing apparatus |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-78886 | 1990-03-29 | ||
JP7888690 | 1990-03-29 | ||
JP8581591A JP3338937B2 (en) | 1990-03-29 | 1991-03-27 | Polishing method and polishing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04223886A JPH04223886A (en) | 1992-08-13 |
JP3338937B2 true JP3338937B2 (en) | 2002-10-28 |
Family
ID=26419948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8581591A Expired - Lifetime JP3338937B2 (en) | 1990-03-29 | 1991-03-27 | Polishing method and polishing apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3338937B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5582313B2 (en) * | 2011-06-28 | 2014-09-03 | 株式会社安川電機 | Robot system |
JP2013193130A (en) * | 2012-03-15 | 2013-09-30 | Seiko Epson Corp | Robot hand, robot device, and method of driving the robot hand |
CN110461552B (en) | 2017-04-03 | 2023-05-23 | 索尼公司 | Manipulator device, production device and production method for electronic equipment |
-
1991
- 1991-03-27 JP JP8581591A patent/JP3338937B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH04223886A (en) | 1992-08-13 |
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