JP3199408B2 - Liquid crystal panel mounting method, liquid crystal panel mounting structure, and liquid crystal panel mounting structure manufacturing method - Google Patents
Liquid crystal panel mounting method, liquid crystal panel mounting structure, and liquid crystal panel mounting structure manufacturing methodInfo
- Publication number
- JP3199408B2 JP3199408B2 JP26007191A JP26007191A JP3199408B2 JP 3199408 B2 JP3199408 B2 JP 3199408B2 JP 26007191 A JP26007191 A JP 26007191A JP 26007191 A JP26007191 A JP 26007191A JP 3199408 B2 JP3199408 B2 JP 3199408B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- adhesive
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶パネルの実装構造
に係わり、さらに詳しくは、液晶パネルの接続構造の改
良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a liquid crystal panel, and more particularly to an improvement in a connection structure of a liquid crystal panel.
【０００２】[0002]
【従来の技術】液晶パネルをフレキシブル回路基板を用
いて実装するにあたっては多くの方式があるが、その１
つに異方性導電接着剤や異方性導電フイルムなどの接着
剤を用いた実装方法がある。2. Description of the Related Art There are many methods for mounting a liquid crystal panel using a flexible circuit board.
There is a mounting method using an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film.
【０００３】図３は異方性導電接着剤や異方性導電フイ
ルムなどの接着剤を用いての実装方式を説明するために
要部を拡大して示した模式図であり、従来のフレキシブ
ル回路基板と液晶パネルの接続方法は図３の如き構造で
ある。１１は液晶パネル、１２は液晶パネル１１を駆動
する電極の導出端子、１３はフレキシブル回路基板の如
き絶縁材料からなる基板、１４はフレキシブル回路基板
１３上の回路パターン、１５は液晶パネル１１上の導出
端子１２とフレキシブル回路基板１３上の回路パターン
１４の一部を接続させるための異方性導電接着剤や異方
性導電フイルムなどの接着剤である。FIG. 3 is an enlarged schematic view of a main part for explaining a mounting method using an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film. The connection method between the substrate and the liquid crystal panel has a structure as shown in FIG. 11 is a liquid crystal panel, 12 is a lead terminal of an electrode for driving the liquid crystal panel 11, 13 is a board made of an insulating material such as a flexible circuit board, 14 is a circuit pattern on the flexible circuit board 13, and 15 is a lead on the liquid crystal panel 11. An adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film for connecting the terminal 12 and a part of the circuit pattern 14 on the flexible circuit board 13.
【０００４】次に、図３のように実装した液晶パネルの
実装方法を説明する。まず、接着剤に導電粒子または導
電樹脂を混入して異方性導電接着剤や異方性導電フイル
ムなどの接着剤１５とし、塗布、印刷、載置などの手法
により液晶パネル１１上の各導出端子１２上、またはフ
レキシブル回路基板１３上の回路パターン１４の一部に
異方性導電接着剤や異方性導電フイルムなどの接着剤の
皮膜を形成する。ついで、フレキシブル回路基板１３上
の回路パターン１４を液晶パネル１１上の各導出端子１
２と対向させて当接する。この状態で液晶パネル１１と
フレキシブル回路基板１３とを適当な条件で接着する。
これによりフレキシブル回路基板１３は液晶パネル１１
に取り付けられ、接着部は異方性導電接着剤や異方性導
電フイルムなどの接着剤により気密に封止される。この
とき、フレキシブル回路基板１３上の回路パターン１４
と液晶パネル１１上の各導出端子１２は、両者の間に介
在する異方性導電接着剤や異方性導電フイルムなどの接
着剤１５中の導電粒子または導電樹脂によって接続す
る。Next, a method of mounting a liquid crystal panel mounted as shown in FIG. 3 will be described. First, an adhesive 15 such as an anisotropic conductive adhesive or an anisotropic conductive film is prepared by mixing conductive particles or a conductive resin into the adhesive, and each of the adhesives is printed on the liquid crystal panel 11 by a method such as coating, printing, and placing. An adhesive film such as an anisotropic conductive adhesive or an anisotropic conductive film is formed on the terminal 12 or on a part of the circuit pattern 14 on the flexible circuit board 13. Next, the circuit pattern 14 on the flexible circuit board 13 is connected to each lead-out terminal 1 on the liquid crystal panel 11.
2 so as to face it. In this state, the liquid crystal panel 11 and the flexible circuit board 13 are bonded under appropriate conditions.
Thereby, the flexible circuit board 13 is connected to the liquid crystal panel 11.
The adhesive portion is hermetically sealed with an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film. At this time, the circuit pattern 14 on the flexible circuit board 13
And the respective lead-out terminals 12 on the liquid crystal panel 11 are connected by conductive particles or conductive resin in an adhesive 15 such as an anisotropic conductive adhesive or an anisotropic conductive film interposed therebetween.
【０００５】[0005]
【発明が解決しようとする課題】上記従来技術のような
液晶パネルの実装構造は、半田を使用せずにフレキシブ
ル回路基板を簡単に液晶パネルに接続し、かつ導通でき
るという特徴を有するが、しかしながら技術的にこれか
らますます軽薄短小になって行く上で、フレキシブル回
路基板と液晶パネルとの間で大きな接着強度が得られな
くなってくるという問題点を有している。The mounting structure of the liquid crystal panel as in the above-mentioned prior art has a feature that the flexible circuit board can be easily connected to the liquid crystal panel without using solder, and conduction can be achieved. Technically, there is a problem that it becomes impossible to obtain a large adhesive strength between the flexible circuit board and the liquid crystal panel as it becomes lighter and thinner.
【０００６】そこで本発明は、かかる従来技術の欠陥を
解決すべくなされたもので、フレキシブル回路基板と液
晶パネルとを、異方性導電接着剤や異方性導電フイルム
などの接着剤を用いて接続する際の実装構造を変えるこ
とによって接着強度を向上させることを目的としたもの
である。Accordingly, the present invention has been made to solve the above-mentioned deficiencies of the prior art, and a flexible circuit board and a liquid crystal panel are bonded using an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film. The purpose is to improve the bonding strength by changing the mounting structure at the time of connection.
【０００７】[0007]
【課題を解決するための手段】本発明の液晶パネルの実
装方法は、異方性導電接着剤または異方性導電フィルム
からなる接着剤を用いて、液晶パネルの導出端子と、フ
レキシブル回路基板の回路パターンと、を接続する接続
工程を有する液晶パネルの実装方法であって、前記接続
工程は、前記回路パターンの延出方向において、前記導
出端子と前記回路パターンとの接続幅を０．２〜２．５
ｍｍとなるように、且つ、前記接着剤が前記液晶パネル
の側面から０．１〜１．５ｍｍはみ出すように、前記液
晶パネルと前記フレキシブル回路基板とを位置合わせし
た後、接続させることを含み、前記液晶パネルと前記フ
レキシブル回路基板とが接続された接着部に隣接する前
記液晶パネルの側面部において、前記液晶パネルと前記
フレキシブル回路基板との接続後に前記接着剤が凹状か
らなるフィレットを形成することを特徴とする。また、
この液晶パネルの実装方法において、上方から下方に向
かって前記フレキシブル回路基板、前記接着剤、前記液
晶パネルの順になるように配置するとともに、前記導出
端子と前記回路パターンとを接続する工程では、加熱及
び加圧が一括して行われるツールが用いられ、前記加熱
及び加圧は、前記上方に位置する前記フレキシブル回路
基板の上面側から行われてなることを特徴とする。ま
た、本発明における液晶パネルの実装構造は、上記方法
のいずれかに記載の液晶パネルの実装方法を用いて液晶
パネルとフレキシブル回路基板とが接続されてなること
を特徴とする。また、本発明における液晶パネルの実装
構造の製造方法は、異方性導電接着剤または異方性導電
フィルムからなる接着剤を用いて、液晶パネルの導出端
子と、フレキシブル回路基板の回路パターンと、を接続
する接続工程を有する液晶パネルの実装構造の製造方法
であって、前記接続工程は、前記回路パターンの延出方
向において、前記導出端子と前記回路パターンとの接続
幅を０．２〜２．５ｍｍとなるように、且つ、前記接着
剤が前記液晶パネルの側面から０．１〜１．５ｍｍはみ
出すように、前記液晶パネルと前記フレキシブル回路基
板とを位置合わせした後、接続させることを含み、前記
液晶パネルと前記フレキシブル回路基板とが接続された
接着部に隣接する前記液晶パネルの側面部において、前
記液晶パネルと前記フレキシブル回路基板との接続後に
前記接着剤が凹状からなるフィレットを形成することを
特徴とする。また、この液晶パネルの実装構造の製造方
法において、上方から下方に向かって前記フレキシブル
回路基板、前記接着剤、前記液晶パネルの順になるよう
に配置するとともに、前記導出端子と前記回路パターン
とを接続する工程では、加熱及び加圧が一括して行われ
るツールが用いられ、前記加熱及び加圧は、前記上方に
位置する前記フレキシブル回路基板の上面側から行われ
てなることを特徴とする。The method of mounting a liquid crystal panel according to the present invention uses an anisotropic conductive adhesive or an adhesive made of an anisotropic conductive film to connect a lead-out terminal of the liquid crystal panel to a flexible circuit board. A method of mounting a liquid crystal panel having a connection step of connecting a circuit pattern to a circuit pattern, wherein the connection step sets a connection width between the lead terminal and the circuit pattern to 0.2 to 0.2 in a direction in which the circuit pattern extends. 2.5
mm, and so that the adhesive protrudes from the side surface of the liquid crystal panel by 0.1 to 1.5 mm, after aligning the liquid crystal panel and the flexible circuit board, and then connecting. Forming a fillet in which the adhesive has a concave shape after the connection between the liquid crystal panel and the flexible circuit board, on a side surface of the liquid crystal panel adjacent to the bonding section where the liquid crystal panel and the flexible circuit board are connected. It is characterized by. Also,
In this method of mounting a liquid crystal panel, the step of arranging the flexible circuit board, the adhesive, and the liquid crystal panel in this order from above to below and connecting the lead-out terminal and the circuit pattern includes heating. And a tool in which pressurization and pressurization are performed collectively, and the heating and pressurization are performed from the upper surface side of the flexible circuit board located above. Further, a liquid crystal panel mounting structure according to the present invention is characterized in that the liquid crystal panel and the flexible circuit board are connected using the liquid crystal panel mounting method described in any of the above methods. Further, the method of manufacturing the mounting structure of the liquid crystal panel according to the present invention, using an anisotropic conductive adhesive or an adhesive made of an anisotropic conductive film, a lead terminal of the liquid crystal panel, a circuit pattern of a flexible circuit board, A mounting method of a liquid crystal panel having a connecting step of connecting the lead terminal and the circuit pattern in the extending direction of the circuit pattern by 0.2 to 2 in the extending direction of the circuit pattern. The liquid crystal panel and the flexible circuit board are aligned and then connected to each other so as to be 0.5 mm and the adhesive protrudes from the side surface of the liquid crystal panel by 0.1 to 1.5 mm. The liquid crystal panel and the flexible board are provided on a side surface of the liquid crystal panel adjacent to an adhesive portion where the liquid crystal panel and the flexible circuit board are connected. Said adhesive after connection to the road substrate and forming a fillet consisting of a concave. In the method for manufacturing a mounting structure of a liquid crystal panel, the flexible circuit board, the adhesive, and the liquid crystal panel are arranged in this order from above to below, and the lead terminals and the circuit pattern are connected. The step of performing is performed by using a tool in which heating and pressing are performed collectively, and the heating and pressing are performed from the upper surface side of the flexible circuit board positioned above.
【０００８】[0008]
【作用】上記のように構成された本発明の液晶パネルの
実装構造によって、フレキシブル回路基板と液晶パネル
上の導出端子との間の異方性導電接着剤や異方性導電フ
イルムなどの接着剤が接続のために接着されることによ
って導通する。この時、接続幅よりも長く配置した異方
性導電接着剤や異方性導電フイルムなどの接着剤が回路
パターンより伝達された熱によって流れ、フレキシブル
回路基板と液晶パネルとの接続部の液晶パネルの側面に
溜まって硬化する。そのため、フレキシブル回路基板と
液晶パネルとの接着強度が向上する。According to the mounting structure of the liquid crystal panel of the present invention configured as described above, an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film between the flexible circuit board and the lead-out terminal on the liquid crystal panel. Are electrically connected by being bonded for connection. At this time, an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film arranged longer than the connection width flows due to the heat transmitted from the circuit pattern, and the liquid crystal panel at the connection between the flexible circuit board and the liquid crystal panel. It accumulates on the sides of the and hardens. Therefore, the adhesive strength between the flexible circuit board and the liquid crystal panel is improved.
【０００９】[0009]
【実施例】以下本発明について実施例に基づいて詳細に
説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on embodiments.
【００１０】図１（ａ）、図１（ｂ）は、本発明の液晶
パネルの実装過程及びその状態を示した図である。図１
（ａ）において、１は液晶パネル、２は液晶パネル１を
駆動する電極の導出端子、３はフレキシブル回路基板の
如きベース部材が絶縁材料からなる基板、４はフレキシ
ブル回路基板３におけるベース部材上に形成された回路
パターン、５ａは液晶パネル１の導出端子２とフレキシ
ブル回路基板３の回路パターン４の一部を接続させるた
めの接続部材であり、特に異方性導電接着剤や異方性導
電フィルムなどの接着剤が用いられる。６は加熱及び加
圧が一括して行われるツールである。この図１（ａ）の
液晶パネル１とフレキシブル回路基板３とをツール６を
用いて適当な条件で加熱加圧して接着した後の状態を図
１（ｂ）に示した。５ｂは接着後の接続部材の状態を表
す。特に本例では、異方性導電接着剤や異方性導電フィ
ルムなどの接着剤である。図１（ｂ）に示すように、接
着剤５ｂは液晶パネルの導出端子のある面及び側面の二
面に位置する。FIGS. 1A and 1B are views showing a mounting process and a state of the liquid crystal panel of the present invention. FIG.
1A, reference numeral 1 denotes a liquid crystal panel, 2 denotes a lead-out terminal of an electrode for driving the liquid crystal panel 1, 3 denotes a substrate such as a flexible circuit board whose base member is made of an insulating material, and 4 denotes a substrate on the base member of the flexible circuit board 3. The formed circuit pattern 5a is a connecting member for connecting the lead-out terminal 2 of the liquid crystal panel 1 and a part of the circuit pattern 4 of the flexible circuit board 3, and particularly an anisotropic conductive adhesive or an anisotropic conductive film. An adhesive such as is used. Reference numeral 6 denotes a tool in which heating and pressing are performed at once. FIG. 1B shows a state after the liquid crystal panel 1 and the flexible circuit board 3 in FIG. 1A are bonded by heating and pressing under appropriate conditions using a tool 6. 5b shows the state of the connection member after bonding. In particular, in this example, the adhesive is an anisotropic conductive adhesive or an anisotropic conductive film. As shown in FIG. 1B, the adhesive 5b is located on two surfaces of the liquid crystal panel, namely, the surface with the lead-out terminals and the side surface.
【００１１】このような実装構造にしたことにより、本
発明では図１（ａ）の液晶パネル１とフレキシブル回路
基板３とを異方性導電接着剤や異方性導電フイルムなど
の接着剤５を用いて１８０℃・４５ｋｇ／ｃｍ2程度の
ツール６の条件で加熱加圧すると、異方性導電接着剤や
異方性導電フイルムなどの接着剤５ａが図１（ｂ）の異
方性導電接着剤や異方性導電フイルムなどの接着剤５ｂ
のように回路パターン４より伝達されたツール６の熱に
よって軟らかくなって流れ、フレキシブル回路基板と液
晶パネルとの接続部の液晶パネルの側面に溜まり硬化す
る。そのため、従来の実装構造のものと比べて導出端子
２と回路パターン４との接続部分の面積は変えずに、本
発明の実装構造によって異方性導電接着剤や異方性導電
フイルムなどの接着剤５ｂと液晶パネル１及びフレキシ
ブル回路基板３との接着面積が、異方性導電接着剤や異
方性導電フイルムなどの接着剤５ｂの溜まりの分だけ増
加するため、フレキシブル回路基板３を液晶パネル１に
確実に接着することができ、かつ接着強度を向上させる
ことができる。With such a mounting structure, in the present invention, the liquid crystal panel 1 and the flexible circuit board 3 shown in FIG. 1A are bonded to each other with an adhesive 5 such as an anisotropic conductive adhesive or an anisotropic conductive film. When heated and pressed under the condition of a tool 6 of about 180 ° C. and about 45 kg / cm 2 , the adhesive 5a such as an anisotropic conductive adhesive or an anisotropic conductive film is bonded to the anisotropic conductive adhesive shown in FIG. 5b such as an adhesive or anisotropic conductive film
As described above, the tool 6 is softened and flows by the heat of the tool 6 transmitted from the circuit pattern 4, and is collected and hardened on the side surface of the liquid crystal panel at the connection portion between the flexible circuit board and the liquid crystal panel. Therefore, the area of the connection portion between the lead terminal 2 and the circuit pattern 4 does not change as compared with the conventional mounting structure, and the mounting structure of the present invention allows the bonding of an anisotropic conductive adhesive or an anisotropic conductive film. The adhesive area between the agent 5b and the liquid crystal panel 1 and the flexible circuit board 3 is increased by the pool of the adhesive 5b such as an anisotropic conductive adhesive or an anisotropic conductive film. 1 can be securely bonded, and the bonding strength can be improved.
【００１２】本発明の発明者は異方性導電接着剤や異方
性導電フイルムなどの接着剤５を用いてフレキシブル回
路基板３を本発明の実装構造を持つ液晶パネル１の側面
から０．２〜２．５ｍｍの幅で接着後、フレキシブル回
路基板３を液晶パネル１に対して９０度上方向への引き
はがし試験を行い、その時の強度を測定するという方法
で数々の実験、研究を重ねた結果、図２に示すように、
使用する異方性導電接着剤や異方性導電フイルムなどの
接着剤５をフレキシブル回路基板３と液晶パネル１との
接続幅よりも大きく、かつ接続する液晶パネル１の側面
よりも０．１〜１．５ｍｍ長く配置すれば、従来の実装
構造を持った液晶パネルを用いて９０度上方向への引き
はがし試験を行った場合には２００〜４００ｇ／ｃｍ2
程度であったものを、４００〜１０００ｇ／ｃｍ2程度
に向上させることができることが明らかになった。The inventor of the present invention uses the adhesive 5 such as an anisotropic conductive adhesive or an anisotropic conductive film to move the flexible circuit board 3 from the side of the liquid crystal panel 1 having the mounting structure of the present invention to 0.2. After bonding with a width of up to 2.5 mm, the flexible circuit board 3 was peeled upward by 90 degrees with respect to the liquid crystal panel 1 and a test was conducted, and a number of experiments and studies were repeated by measuring the strength at that time. As a result, as shown in FIG.
The adhesive 5 such as an anisotropic conductive adhesive or an anisotropic conductive film to be used is larger than the connection width between the flexible circuit board 3 and the liquid crystal panel 1 and 0.1 to 0.1 to the side of the liquid crystal panel 1 to be connected. If it is arranged to be 1.5 mm longer, 200-400 g / cm 2 when a 90 ° upward peel test is performed using a liquid crystal panel having a conventional mounting structure.
It was found that what was about can be improved to about 400 to 1000 g / cm 2 .
【００１３】尚、ここに挙げた実施例はあくまでも一実
施例にすぎない。The embodiment described here is merely an example.
【００１４】[0014]
【発明の効果】本発明によれば、ガラスあるいは樹脂な
どの基板を用いて液晶層を保持する液晶パネルにおい
て、ガラスあるいは樹脂などの基板の少なくとも一辺に
は液晶パネルを駆動する電極の導出端子が多数配列され
ており、液晶パネルの外側から導出端子へ駆動信号を入
力する回路パターンを有したフレキシブル回路基板を有
し、導出端子とフレキシブル回路基板の回路パターンの
一部とを異方性導電接着剤や異方性導電フイルムなどの
接着剤を用いて接続する接続構造において、接続幅が
０．２〜２．５ｍｍの接続構造の時、異方性導電接着剤
や異方性導電フイルムなどの接着剤を接続幅よりも大き
く、かつ接続する液晶パネルの側面よりも０．１〜１．
５ｍｍ長く配置したことを特徴とする液晶パネルの実装
構造にしたことにより、接続幅よりも長く配置した異方
性導電接着剤や異方性導電フイルムなどの接着剤が、回
路パターンを伝達てきたツールの熱によって流れ、フレ
キシブル回路基板と液晶パネルとの接続部の液晶パネル
の側面に溜まって硬化する。この異方性導電接着剤や異
方性導電フイルムなどの接着剤の溜まりによって接続部
にかかる応力を他に分散させることができ、また従来の
実装構造のものよりも導通部分を覆う異方性導電接着剤
や異方性導電フイルムなどの接着剤が多くなるために、
大気中の水分や有機物などの汚染物質から保護すること
ができる。このようにフレキシブル回路基板と液晶パネ
ルとの接着強度が向上するため長期にわたる接続信頼性
を保持でき、かつ本発明の実装構造によって従来の実装
構造よりも狭い接続幅で、従来の実装構造と同等または
それ以上の接着強度を得ることができ、実装面積を小さ
くする効果を有する。According to the present invention, in a liquid crystal panel which holds a liquid crystal layer using a substrate made of glass or resin, at least one side of the substrate made of glass or resin has lead-out terminals of electrodes for driving the liquid crystal panel. A flexible circuit board with a large number of arrays and a circuit pattern for inputting drive signals from outside the liquid crystal panel to the lead terminals has anisotropic conductive bonding between the lead terminals and a part of the circuit pattern of the flexible circuit board. In a connection structure that uses an adhesive such as an adhesive or an anisotropic conductive film, when the connection width is 0.2 to 2.5 mm, a connection structure such as an anisotropic conductive adhesive or an anisotropic conductive film is used. The adhesive is larger than the connection width and 0.1-1.
By adopting a liquid crystal panel mounting structure characterized by being placed 5 mm longer, an adhesive such as an anisotropic conductive adhesive or an anisotropic conductive film disposed longer than the connection width has transmitted the circuit pattern. It flows due to the heat of the tool and collects and hardens on the side of the liquid crystal panel at the connection between the flexible circuit board and the liquid crystal panel. The accumulation of the adhesive such as anisotropic conductive adhesive or anisotropic conductive film can disperse the stress applied to the connection part to other parts, and anisotropic covering the conductive part more than that of the conventional mounting structure. Because the amount of adhesives such as conductive adhesives and anisotropic conductive films increases,
It can protect from contaminants such as atmospheric moisture and organic matter. As described above, the bonding strength between the flexible circuit board and the liquid crystal panel is improved, so that long-term connection reliability can be maintained, and the mounting structure of the present invention has a narrower connection width than the conventional mounting structure and is equivalent to the conventional mounting structure. Alternatively, a higher bonding strength can be obtained, which has an effect of reducing the mounting area.
【図１】本発明の液晶パネルの実装過程を示した断面
図。FIG. 1 is a sectional view showing a mounting process of a liquid crystal panel of the present invention.
【図２】接着剤幅と９０度上方向への引きはがし強度と
の関係を示す線図。FIG. 2 is a diagram showing a relationship between an adhesive width and a 90-degree upward peel strength.
【図３】従来の液晶パネルの実装構造を示した断面図。FIG. 3 is a cross-sectional view showing a mounting structure of a conventional liquid crystal panel.
１，１１ 液晶パネル ２，１２ 導出端子 ３，１３ フレキシブル回路基板 ４，１４ 回路パターン ５，１５ 異方性導電接着剤または異方性導電フイルム
などの接着剤 ６，１６ 加熱加圧用ツール ７，１７ 液晶層 ８，１８ 偏光板1,11 Liquid crystal panel 2,12 Outgoing terminal 3,13 Flexible circuit board 4,14 Circuit pattern 5,15 Anisotropic conductive adhesive or adhesive such as anisotropic conductive film 6,16 Heating and pressing tool 7,17 Liquid crystal layer 8,18 polarizing plate
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭64−10221（ＪＰ，Ａ) 特開 昭63−284591（ＪＰ，Ａ) 特開 平３−150531（ＪＰ，Ａ) 特開 平２−294072（ＪＰ，Ａ) 特開 昭61−167925（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-64-10221 (JP, A) JP-A-63-284591 (JP, A) JP-A-3-150531 (JP, A) JP-A-2- 294072 (JP, A) JP-A-61-167925 (JP, A)
Claims (5)
ルムからなる接着剤を用いて、液晶パネルの導出端子
と、フレキシブル回路基板の回路パターンと、を接続す
る接続工程を有する液晶パネルの実装方法であって、 前記接続工程は、前記回路パターンの延出方向におい
て、前記導出端子と前記回路パターンとの接続幅を０．
２〜２．５ｍｍとなるように、且つ、前記接着剤が前記
液晶パネルの側面から０．１〜１．５ｍｍはみ出すよう
に、前記液晶パネルと前記フレキシブル回路基板とを位
置合わせした後、接続させることを含み、 前記液晶パネルと前記フレキシブル回路基板とが接続さ
れた接着部に隣接する前記液晶パネルの側面部におい
て、前記液晶パネルと前記フレキシブル回路基板との接
続後に前記接着剤が凹状からなるフィレットを形成する
ことを特徴とする液晶パネルの実装方法。1. A liquid crystal panel having a connection step of connecting a lead terminal of a liquid crystal panel and a circuit pattern of a flexible circuit board using an anisotropic conductive adhesive or an adhesive made of an anisotropic conductive film. In the mounting method, the connecting step may include setting a connection width between the lead terminal and the circuit pattern to 0. 0 in a direction in which the circuit pattern extends.
The liquid crystal panel and the flexible circuit board are aligned and connected to each other so that the thickness is 2 to 2.5 mm and the adhesive protrudes from the side surface of the liquid crystal panel by 0.1 to 1.5 mm. In a side surface portion of the liquid crystal panel adjacent to an adhesive portion where the liquid crystal panel and the flexible circuit board are connected, a fillet in which the adhesive has a concave shape after the connection between the liquid crystal panel and the flexible circuit board Forming a liquid crystal panel.
において、 上方から下方に向かって前記フレキシブル回路基板、前
記接着剤、前記液晶パネルの順になるように配置すると
ともに、 前記導出端子と前記回路パターンとを接続する工程で
は、加熱及び加圧が一括して行われるツールが用いら
れ、 前記加熱及び加圧は、前記上方に位置する前記フレキシ
ブル回路基板の上面側から行われてなることを特徴とす
る液晶パネルの実装方法。2. The method for mounting a liquid crystal panel according to claim 1, wherein the flexible circuit board, the adhesive, and the liquid crystal panel are arranged in this order from top to bottom, and the lead-out terminal and the liquid crystal panel are arranged in this order. In the step of connecting the circuit pattern, a tool is used in which heating and pressing are performed collectively, and the heating and pressing are performed from the upper surface side of the flexible circuit board located above. Characteristic liquid crystal panel mounting method.
ルの実装方法を用いて液晶パネルとフレキシブル回路基
板とが接続されてなることを特徴とする液晶パネルの実
装構造。3. A liquid crystal panel mounting structure, wherein the liquid crystal panel and a flexible circuit board are connected by using the liquid crystal panel mounting method according to claim 1.
ルムからなる接着剤を用いて、液晶パネルの導出端子
と、フレキシブル回路基板の回路パターンと、を接続す
る接続工程を有する液晶パネルの実装構造の製造方法で
あって、 前記接続工程は、前記回路パターンの延出方向におい
て、前記導出端子と前記回路パターンとの接続幅を０．
２〜２．５ｍｍとなるように、且つ、前記接着剤が前記
液晶パネルの側面から０．１〜１．５ｍｍはみ出すよう
に、前記液晶パネルと前記フレキシブル回路基板とを位
置合わせした後、接続させることを含み、 前記液晶パネルと前記フレキシブル回路基板とが接続さ
れた接着部に隣接する前記液晶パネルの側面部におい
て、前記液晶パネルと前記フレキシブル回路基板との接
続後に前記接着剤が凹状からなるフィレットを形成する
ことを特徴とする液晶パネルの実装構造の製造方法。4. A liquid crystal panel having a connection step of connecting a lead terminal of a liquid crystal panel and a circuit pattern of a flexible circuit board using an anisotropic conductive adhesive or an adhesive made of an anisotropic conductive film. In the method for manufacturing a mounting structure, the connecting step may include setting a connection width between the lead-out terminal and the circuit pattern to 0.1 in a direction in which the circuit pattern extends.
The liquid crystal panel and the flexible circuit board are aligned and connected to each other so that the thickness is 2 to 2.5 mm and the adhesive protrudes from the side surface of the liquid crystal panel by 0.1 to 1.5 mm. In a side surface portion of the liquid crystal panel adjacent to an adhesive portion where the liquid crystal panel and the flexible circuit board are connected, a fillet in which the adhesive has a concave shape after the connection between the liquid crystal panel and the flexible circuit board Forming a liquid crystal panel mounting structure.
の製造方法において、 上方から下方に向かって前記フレキシブル回路基板、前
記接着剤、前記液晶パネルの順になるように配置すると
ともに、 前記導出端子と前記回路パターンとを接続する工程で
は、加熱及び加圧が一括して行われるツールが用いら
れ、 前記加熱及び加圧は、前記上方に位置する前記フレキシ
ブル回路基板の上面側から行われてなることを特徴とす
る液晶パネルの実装構造の製造方法。5. The method of manufacturing a liquid crystal panel mounting structure according to claim 4, wherein the flexible circuit board, the adhesive, and the liquid crystal panel are arranged in this order from top to bottom, and the lead-out is performed. In the step of connecting the terminal and the circuit pattern, a tool in which heating and pressurization are performed collectively is used, and the heating and pressurization are performed from the upper surface side of the flexible circuit board positioned above. A method of manufacturing a liquid crystal panel mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26007191A JP3199408B2 (en) | 1991-10-08 | 1991-10-08 | Liquid crystal panel mounting method, liquid crystal panel mounting structure, and liquid crystal panel mounting structure manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26007191A JP3199408B2 (en) | 1991-10-08 | 1991-10-08 | Liquid crystal panel mounting method, liquid crystal panel mounting structure, and liquid crystal panel mounting structure manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05100238A JPH05100238A (en) | 1993-04-23 |
| JP3199408B2 true JP3199408B2 (en) | 2001-08-20 |
Family
ID=17342904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26007191A Expired - Fee Related JP3199408B2 (en) | 1991-10-08 | 1991-10-08 | Liquid crystal panel mounting method, liquid crystal panel mounting structure, and liquid crystal panel mounting structure manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3199408B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148731A (en) * | 1995-11-17 | 1997-06-06 | Fujitsu Ltd | Method for manufacturing construction for connection between wiring boards |
| KR100666137B1 (en) * | 1998-10-20 | 2007-06-04 | 삼성전자주식회사 | Tiled liquid crystal display device and heat seal mounting method |
| JP3763747B2 (en) * | 2000-05-31 | 2006-04-05 | シャープ株式会社 | Mounting apparatus and mounting method |
| JP2003091015A (en) * | 2001-09-18 | 2003-03-28 | Matsushita Electric Ind Co Ltd | Liquid crystal display device and method for manufacturing the same |
-
1991
- 1991-10-08 JP JP26007191A patent/JP3199408B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05100238A (en) | 1993-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5311341A (en) | Connection structure between a tab film and a liquid crystal panel | |
| US5016986A (en) | Display device having an improvement in insulating between conductors connected to electronic components | |
| JP3491415B2 (en) | Manufacturing method of liquid crystal display device | |
| JP2598152B2 (en) | Touch panel | |
| US4842373A (en) | Connecting structure for connecting a liquid crystal display and a flexible flat cable | |
| JPH09281520A (en) | Method for connecting circuit board, liquid crystal display device and electronic apparatus | |
| JP3199408B2 (en) | Liquid crystal panel mounting method, liquid crystal panel mounting structure, and liquid crystal panel mounting structure manufacturing method | |
| JPH08146451A (en) | Apparatus for producing circuit device | |
| JPH0572545A (en) | Mounting structure of liquid crystal panel | |
| JPH10112584A (en) | Connecting method for circuit board, connecting structure for circuit board, and liquid crystal device using the structure | |
| JPH0641266Y2 (en) | LCD panel structure | |
| JPH06130408A (en) | Liquid crystal display device | |
| JPH058831B2 (en) | ||
| JPH0945964A (en) | Chip mount led element and production thereof | |
| JP2667744B2 (en) | Display device electrode connection method | |
| JPH0277019A (en) | Electrooptical device and conductive connecting method | |
| JPS62126665A (en) | Sensor device | |
| JPH09120080A (en) | Liquid crystal panel structure | |
| JPS62195137A (en) | Semiconductor device | |
| JPS60133430A (en) | Connecting method of terminal of liquid crystal display element | |
| JPH10319419A (en) | Liquid crystal display device | |
| JPH04280036A (en) | Flat type display | |
| JP3325317B2 (en) | Semiconductor device used for COG type liquid crystal module | |
| JPH02160217A (en) | Juncture of liquid crystal display device | |
| US20030011108A1 (en) | Assembly display modules |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090615 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100615 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |