JPH09120080A - Liquid crystal panel structure - Google Patents
Liquid crystal panel structureInfo
- Publication number
- JPH09120080A JPH09120080A JP8263392A JP26339296A JPH09120080A JP H09120080 A JPH09120080 A JP H09120080A JP 8263392 A JP8263392 A JP 8263392A JP 26339296 A JP26339296 A JP 26339296A JP H09120080 A JPH09120080 A JP H09120080A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal panel
- circuit pattern
- electrode terminals
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶パネルの電極
端子に外部駆動回路を直接あるいは間接に接続する実装
手段に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting means for directly or indirectly connecting an external drive circuit to electrode terminals of a liquid crystal panel.
【０００２】〔発明の概要〕本発明の液晶パネル構造
は、液晶パネル上に電極端子、回路基板上に回路パター
ンを有し、該電極端子と前記回路パターンを接続する際
の接続構造に関するもので、前記回路基板上には回路パ
ターンに加えダミーの回路パターンが少なくとも１個以
上形成され、前記ダミーの回路パターンの形成される位
置は前記回路パターンの外側であり、かつ該ダミーの回
路パターンは該電極端子に接続されないという構成によ
り、接続実装の信頼性を向上させたものである。SUMMARY OF THE INVENTION A liquid crystal panel structure of the present invention relates to a connection structure for connecting an electrode terminal on a liquid crystal panel and a circuit pattern on a circuit board, and connecting the electrode terminal and the circuit pattern. In addition to the circuit pattern, at least one dummy circuit pattern is formed on the circuit board, the position where the dummy circuit pattern is formed is outside the circuit pattern, and the dummy circuit pattern is The structure of not being connected to the electrode terminals improves the reliability of connection mounting.
【０００３】[0003]
【従来の技術】従来の液晶パネル構造は図２の如きであ
った。すなわち図２において、２２は下パネルガラス、
２３はＩＴＯによる電極端子、２４はフレキシブル回路
基板、２５は銅箔よりなる回路パターン、２６は導電性
接着剤を示す。図２は従来の液晶パネルをフレキシブル
回路基板にて実装した液晶パネル構造の実装部要部断面
構造であるが、フレキシブル回路基板の回路パターンの
数と、ＩＴＯによる電極端子の数は全く一致している。2. Description of the Related Art A conventional liquid crystal panel structure is as shown in FIG. That is, in FIG. 2, 22 is a lower panel glass,
Reference numeral 23 is an electrode terminal made of ITO, 24 is a flexible circuit board, 25 is a circuit pattern made of copper foil, and 26 is a conductive adhesive. FIG. 2 shows a cross-sectional structure of a mounting portion of a liquid crystal panel structure in which a conventional liquid crystal panel is mounted on a flexible circuit board. The number of circuit patterns on the flexible circuit board and the number of electrode terminals made of ITO are completely the same. There is.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来の液晶パ
ネル構造は幾多の問題点を有するものであった。However, the conventional liquid crystal panel structure has many problems.
【０００５】まず、図２より明らかなように、ＩＴＯに
よる電極端子２３とフレキシブル回路基板２４は導電性
接着剤にて接続されており電極端子２３とフレキシブル
回路基板の回路パターン２５の数は同じであった。導電
性接着剤は接着剤の中に金属粉等の導電性物質を混在さ
せたもので、被接合物間に挟持し、加熱，加圧する事に
よる被接合物を強固に接合せしめると同時に、必要な部
品を導通せしめる。ところが、前記する加熱，加圧は各
部位均一である必要がある。それは導電性接着剤は数十
ミクロンオーダーの薄い膜であるが故に加熱，加圧が不
均一だと接合が不均一になり部分的に導通が不完全にな
る為である。一般には加熱，加圧を均一にする為、加
熱，加圧機のへッド部分に薄いシリコンゴムを貼り付け
ていた。しかし、薄いシリコンゴムをへッド部分に貼り
付けても、加圧時のシリコンゴムの圧縮あるいは伸びの
関係で、電極端子とフレキシブル回路基板の接合の最外
端付近は加圧の不均一が生じやすく、この最外端付近で
接合の不完全あるいは導通の不完全が生じやすいもので
あった。First, as is apparent from FIG. 2, the electrode terminals 23 made of ITO and the flexible circuit board 24 are connected by a conductive adhesive, and the number of the electrode terminals 23 and the circuit patterns 25 of the flexible circuit board are the same. there were. The conductive adhesive is a mixture of a conductive substance such as metal powder in the adhesive. It can be sandwiched between the objects to be bonded, and the objects to be bonded can be strongly bonded by heating and pressing, and at the same time necessary. Electrical components. However, the heating and pressurizing described above need to be uniform at each site. This is because the conductive adhesive is a thin film of the order of several tens of microns, so if the heating and pressing are not uniform, the bonding will be uneven and the conduction will be partially incomplete. Generally, in order to make the heating and pressing uniform, a thin silicone rubber is attached to the head of the heating and pressing machine. However, even if a thin silicone rubber is attached to the head part, due to the compression or expansion of the silicone rubber when pressure is applied, uneven pressure may be applied near the outermost end of the joint between the electrode terminal and the flexible circuit board. It tends to occur, and incomplete bonding or incomplete conduction is likely to occur near this outermost end.
【０００６】また、従来の液晶パネル構造では液晶パネ
ルの電極端子と回路基板上の回路パターンとを導電性接
着剤を用い、加圧によって接合する際、接合の中央部か
ら最外端に向かって接着剤を排除する力が生じる。従っ
て最外端の接着剤層の厚みは厚くなり、かつ回路パター
ンにも歪みが生じるため導通が不完全となる。Further, in the conventional liquid crystal panel structure, when the electrode terminals of the liquid crystal panel and the circuit pattern on the circuit board are bonded by pressure using a conductive adhesive, the central part of the bonding is moved toward the outermost end. A force is generated to remove the adhesive. Therefore, the thickness of the adhesive layer at the outermost end is increased, and the circuit pattern is also distorted, resulting in incomplete conduction.
【０００７】そこで、本発明は、従来のこのような欠点
を解決し、液晶パネルの接続実装の信頼性を向上させる
事を目的とする。[0007] Therefore, an object of the present invention is to solve the above-mentioned conventional drawbacks and improve the reliability of connection mounting of a liquid crystal panel.
【０００８】[0008]
【課題を解決するための手段】本発明の液晶パネル構造
は、一対の基板間に液晶が挟持された液晶パネルと、前
記液晶パネルと接続された回路基板とからなり、該液晶
パネルの一方の基板の端部には複数の電極端子が形成さ
れ、該回路基板には回路パターンが形成され、該回路パ
ターンは該複数の電極端子に対応して形成され、該回路
パターンは該複数の電極端子と導電性接着剤を介して接
続してなる液晶パネル構造において、該回路基板上には
該回路パターンに加えダミーの回路パターンが少なくと
も１個以上形成され、該ダミーの回路パターンの形成さ
れる位置は該回路パターンの外側であり、かつ該ダミー
の回路パターンは該電極端子に接続されないことを特徴
とするものである。The liquid crystal panel structure of the present invention comprises a liquid crystal panel in which liquid crystal is sandwiched between a pair of substrates, and a circuit board connected to the liquid crystal panel. A plurality of electrode terminals are formed on an end portion of the substrate, a circuit pattern is formed on the circuit board, the circuit pattern is formed corresponding to the plurality of electrode terminals, and the circuit pattern is formed by the plurality of electrode terminals. In the liquid crystal panel structure that is connected to the circuit board via a conductive adhesive, at least one dummy circuit pattern is formed on the circuit board in addition to the circuit pattern, and the position where the dummy circuit pattern is formed. Is outside the circuit pattern, and the dummy circuit pattern is not connected to the electrode terminal.
【０００９】[0009]
【発明の実施の形態】以下に本発明の実施例を図面を用
いて説明する。図１ａ、図１ｂはそれぞれ本発明の実施
例における要部断面図、要部平面図を示すものである。
図１ａにおいて、２は下パネルガラス、３はＩＴＯによ
る電極端子、４はフレキシブル回路基板、５は銅箔より
なる回路パターン、６は導電性接着剤を示す。Embodiments of the present invention will be described below with reference to the drawings. 1a and 1b are a sectional view and a plan view of a main portion of an embodiment of the present invention, respectively.
In FIG. 1a, 2 is a lower panel glass, 3 is an electrode terminal made of ITO, 4 is a flexible circuit board, 5 is a circuit pattern made of copper foil, and 6 is a conductive adhesive.
【００１０】図１ａ、図１ｂより明らかなように、本発
明による液晶パネル構造は、液晶パネルとフレキシブル
回路基板の接合部において、銅箔よりなる回路パターン
の数がＩＴＯによる電極端子の数より多い。図１ａに示
す導電性接着剤は金属粉等の導電性物質が接着剤の中に
混入されており、フレキシブル基板の銅箔のある部分は
銅箔のない部分より銅箔の厚み分だけ多く圧縮され、圧
縮量が多いと隣り合う導電性接着剤中の導電性物質が連
鎖状に接続し導通が形成されるが、銅箔のない部分は圧
縮量が少ない為、隣り合う導電性物質が連鎖状に接触し
あわされず導通が形成されない。そのため、導通を必要
とする部位の圧縮量及び圧力は均一である必要がある。
この圧力を均一にする為、接合機のへッドに薄いシリコ
ンゴムを貼り付ける事が多いが、ヘッドで圧力を加える
時、シリコンゴムの圧縮量はへッドの長い部分にわたっ
てほぼ均一となるが、フレキシブル基板の最外辺周辺は
部分的な境界条件が異なる為シリコンゴムの圧縮形態が
他の部分と異なるようになる。従って、電極端子とフレ
キシブル回路基板の接合の最外端付近は導通の不完全が
生じやすい。従って本発明では必要とする電極端子と回
路パターンの接続の外側に電気的導通としては不用な回
路パタ一ンを配し、上記する最外端付の導通の不完全を
前記不用な回路パターン内に生じせしめるようにし、電
気的接続を必要とする回路パターンは液晶パネルの電極
端子との導通接続の信頼性を確保できるようにしたもの
である。As is clear from FIGS. 1a and 1b, in the liquid crystal panel structure according to the present invention, the number of circuit patterns made of copper foil is larger than the number of electrode terminals made of ITO at the joint between the liquid crystal panel and the flexible circuit board. . In the conductive adhesive shown in FIG. 1a, a conductive substance such as metal powder is mixed in the adhesive, and the portion of the flexible substrate with the copper foil is compressed more by the thickness of the copper foil than the portion without the copper foil. If the amount of compression is large, the conductive substances in the adjacent conductive adhesives are connected in a chain to form conduction, but in the part without the copper foil the amount of compression is small, so the adjacent conductive substances are linked. They do not touch each other and do not form conduction. Therefore, the amount of compression and the pressure of the portion that requires conduction need to be uniform.
In order to make this pressure uniform, a thin silicone rubber is often attached to the head of the bonding machine, but when pressure is applied by the head, the amount of compression of the silicone rubber becomes almost uniform over the long part of the head. However, since the boundary conditions are partially different around the outermost side of the flexible substrate, the compression mode of the silicon rubber differs from that of the other parts. Therefore, incomplete conduction is likely to occur near the outermost end of the joint between the electrode terminal and the flexible circuit board. Therefore, in the present invention, a circuit pattern which is unnecessary for electrical conduction is arranged outside the required connection between the electrode terminal and the circuit pattern, and the incomplete conduction with the outermost end described above is set in the unnecessary circuit pattern. The circuit pattern requiring electrical connection is designed to ensure the reliability of conductive connection with the electrode terminals of the liquid crystal panel.
【００１１】[0011]
【発明の効果】以上の如く、本願発明の液晶パネル構造
は、一対の基板間に液晶が挟待された液晶パネルと、前
記液晶パネルと接続された回路基板とからなり、該液晶
パネルの一方の基板の端部には複数の電極端子が形成さ
れ、該回路基板には回路パターンが形成され、該回路パ
ターンは該複数の電極端子に対応して形成され、該回路
パターンは該複数の電極端子と導電性接着剤を介して接
続してなる液晶パネル構造において、該回路基板上には
該回路パターンに加えダミーの回路パターンが少なくと
も１個以上形成され、該ダミーの回路パターンの形成さ
れる位置は該回路パターンの外側であり、かつ該ダミー
の回路パターンは該電極端子に接続されないことを特徴
とするから、従来液晶パネルの電極端子と外部の回路基
板を接合する際、その接合の最外端付近には加圧の不均
一が生じる上、接合の中央部から最外端に向かって接着
剤を排除するカが加わるため、接着剤の厚みの不均一と
回路パターンの歪みとにより、接合の最外端付近では導
電性接着剤の上下方向の導通の不完全が生じ易いという
問題点を有していたのであるが、その導通不完全を電気
的接続に奇与しない回路パターンのところに生じさせる
ようにしたため、電気的接続に用いる回路パターンと液
晶パネル上の電極端子との間では導通が完全になる。こ
のように従来の問題点を解決し、液晶パネルの電極端子
と外部の回路基板の導通接続の信頼性を高めることがで
きる、という顕著な効果を奏するものである。As described above, the liquid crystal panel structure of the present invention comprises a liquid crystal panel in which liquid crystal is sandwiched between a pair of substrates, and a circuit board connected to the liquid crystal panel. A plurality of electrode terminals are formed on the ends of the substrate, a circuit pattern is formed on the circuit board, the circuit pattern is formed corresponding to the plurality of electrode terminals, and the circuit pattern is formed on the plurality of electrodes. In a liquid crystal panel structure in which terminals are connected through a conductive adhesive, at least one dummy circuit pattern is formed on the circuit board in addition to the circuit pattern, and the dummy circuit pattern is formed. Since the position is outside the circuit pattern, and the dummy circuit pattern is not connected to the electrode terminal, when the electrode terminal of the conventional liquid crystal panel and the external circuit board are joined, In addition to uneven pressure being applied near the outermost edge of the joint, a force is added to remove the adhesive from the center of the joint toward the outermost edge. Although there is a problem that the conductive adhesive tends to cause incomplete vertical conduction in the vicinity of the outermost end of the joint due to the distortion, the incomplete conduction does not give rise to electrical connection. Since it is generated at the circuit pattern, electrical continuity is established between the circuit pattern used for electrical connection and the electrode terminals on the liquid crystal panel. In this way, the conventional problems can be solved, and the remarkable effect that the reliability of the conductive connection between the electrode terminals of the liquid crystal panel and the external circuit board can be improved.
【図１】（ａ），（ｂ）は本発明による液晶パネル構造
の一例要部断面図。1A and 1B are cross-sectional views of an essential part of an example of a liquid crystal panel structure according to the present invention.
【図２】従来の液晶パネル構造の要部断面図。FIG. 2 is a sectional view of a main part of a conventional liquid crystal panel structure.
２，２２・・・下パネルガラス ３，２３・・・電極端子 ４，２４・・・フレキシブル回路基板 ５，２５・・・回路パターン ６，２６・・・導電性接着剤 2, 22 ... Lower panel glass 3, 23 ... Electrode terminal 4, 24 ... Flexible circuit board 5, 25 ... Circuit pattern 6, 26 ... Conductive adhesive
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１１月５日[Submission date] November 5, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００８[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００８】[0008]
【課題を解決するための手段】一対の基板間に液晶が挟
持された液晶パネルと、該液晶パネルと接続されたフレ
キシブル回路基板とからなり、該液晶パネルの一方の基
板の端部には複数の電極端子が形成され、該フレキシブ
ル回路基板には回路パターンが形成され、該回路パター
ンは該複数の電極端子に対応して形成され、該回路パタ
ーンは該複数の電極端子と導電性接着剤を介して接続し
てなる液晶パネル構造において、該フレキシブル回路基
板に形成された該回路パターンに加え該回路パターンと
ほぼ同一形状を有するダミーの回路パターンが複数形成
され、該ダミーの回路パターンの形成される位置は該回
路パターンの外側であり、かつ該ダミーの回路パターン
は該電極端子に接続されないことを特徴とする。A liquid crystal panel in which a liquid crystal is sandwiched between a pair of substrates and a frame connected to the liquid crystal panel.
Consists of a Kishiburu circuit board, a plurality of electrode terminals is formed at the end of one substrate of the liquid crystal panel, the Furekishibu
A liquid crystal panel in which a circuit pattern is formed on a circuit board , the circuit pattern is formed corresponding to the plurality of electrode terminals, and the circuit pattern is connected to the plurality of electrode terminals via a conductive adhesive. In the structure, the flexible circuit board
In addition to the circuit pattern formed on the plate,
Multiple dummy circuit patterns with almost the same shape are formed
The position where the dummy circuit pattern is formed is outside the circuit pattern, and the dummy circuit pattern is not connected to the electrode terminal.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１１[Correction target item name] 0011
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１１】[0011]
【発明の効果】以上の如く、本願発明の液晶パネル構造
は、一対の基板間に液晶が挟持された液晶パネルと、該
液晶パネルと接続されたフレキシブル回路基板とからな
り、該液晶パネルの一方の基板の端部には複数の電極端
子が形成され、該フレキシブル回路基板には回路パター
ンが形成され、該回路パターンは該複数の電極端子に対
応して形成され、該回路パターンは該複数の電極端子と
導電性接着剤を介して接続してなる液晶パネル構造にお
いて、該フレキシブル回路基板に形成された該回路パタ
ーンに加え該回路パターンとほぼ同一形状を有するダミ
ーの回路パターンが複数形成され、該ダミーの回路パタ
ーンの形成される位置は該回路パターンの外側であり、
かつ該ダミーの回路パターンは該電極端子に接続されな
いことを特徴とするから、従来液晶パネルの電極端子と
外部の回路基板を接合する際、その接合の最外端付近に
生じる上、接合の中央部から最外端に向かって接着剤を
排除する力が加わるため、接着剤の厚みの不均一と回路
パターンの歪みとにより、接合の最外端付近では導電性
接着剤の上下方向の導通の不完全が生じ易いという問題
点を有していたのであるが、その生じるであろう導通不
完全を電気的接続に寄与しない複数のダミーパターンの
ところに生じさせるようにしたため、従来の問題点を解
決し信頼性の高い液晶パネル構造を得ることができる。 As described above, the liquid crystal panel structure of the present invention comprises a liquid crystal panel in which liquid crystal is sandwiched between a pair of substrates, and a flexible circuit board connected to the liquid crystal panel. A plurality of electrode terminals are formed on the ends of the substrate , a circuit pattern is formed on the flexible circuit board , the circuit pattern is formed corresponding to the plurality of electrode terminals, and the circuit pattern is formed on the plurality of electrode terminals. In a liquid crystal panel structure which is connected to electrode terminals through a conductive adhesive, the circuit pattern formed on the flexible circuit board
In addition to the core, a dummy having almost the same shape as the circuit pattern
A plurality of circuit patterns are formed, and the position where the dummy circuit pattern is formed is outside the circuit pattern,
Moreover, since the dummy circuit pattern is not connected to the electrode terminal, when the electrode terminal of the conventional liquid crystal panel and the external circuit board are joined, the dummy circuit pattern is generated near the outermost end of the joint and the center of the joint is formed. Since a force to remove the adhesive is applied from the portion toward the outermost end, unevenness in the thickness of the adhesive and distortion of the circuit pattern cause vertical conduction of the conductive adhesive near the outermost end of the joint. There was a problem that imperfections were likely to occur, but the conduction failure that might occur would occur.
Of multiple dummy patterns that do not fully contribute to electrical connection
Since it was made to occur here, the conventional problem is solved.
It is possible to obtain a highly reliable liquid crystal panel structure.
Claims (1)
ルと、該液晶パネルと接続された回路基板とからなり、
該液晶パネルの一方の基板の端部には複数の電極端子が
形成され、該回路基板には回路パターンが形成され、該
回路パターンは該複数の電極端子に対応して形成され、
該回路パターンは該複数の電極端子と導電性接着剤を介
して接続してなる液晶パネル構造において、 該回路基板上には該回路パターンに加えダミーの回路パ
ターンが少なくとも１個以上形成され、該ダミーの回路
パターンの形成される位置は該回路パターンの外側であ
り、かつ該ダミーの回路パターンは該電極端子に接続さ
れないことを特徴とする液晶パネル構造。1. A liquid crystal panel in which liquid crystal is sandwiched between a pair of substrates, and a circuit board connected to the liquid crystal panel,
A plurality of electrode terminals are formed on an end portion of one substrate of the liquid crystal panel, a circuit pattern is formed on the circuit board, and the circuit pattern is formed corresponding to the plurality of electrode terminals,
In the liquid crystal panel structure in which the circuit pattern is connected to the plurality of electrode terminals via a conductive adhesive, at least one dummy circuit pattern is formed on the circuit board in addition to the circuit pattern. A liquid crystal panel structure, wherein a position where the dummy circuit pattern is formed is outside the circuit pattern, and the dummy circuit pattern is not connected to the electrode terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8263392A JPH09120080A (en) | 1996-10-03 | 1996-10-03 | Liquid crystal panel structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8263392A JPH09120080A (en) | 1996-10-03 | 1996-10-03 | Liquid crystal panel structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09120080A true JPH09120080A (en) | 1997-05-06 |
Family
ID=17388863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8263392A Pending JPH09120080A (en) | 1996-10-03 | 1996-10-03 | Liquid crystal panel structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09120080A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100454516B1 (en) * | 2000-10-25 | 2004-11-05 | 세이코 엡슨 가부시키가이샤 | Wiring substrate, display device, and electronic equipment |
| CN100435180C (en) * | 2002-03-22 | 2008-11-19 | 夏普株式会社 | Circuit board connection structure, method of forming, circuit board connection structure and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536881A (en) * | 1976-07-09 | 1978-01-21 | Hitachi Ltd | Flexible printed board having connecting terminal for connecting by multiple soldering connection method |
| JPS60129729A (en) * | 1983-12-16 | 1985-07-11 | Seiko Instr & Electronics Ltd | Liquid crystal display device |
| JPS60156767U (en) * | 1984-03-26 | 1985-10-18 | 富士通テン株式会社 | Printed circuit board wiring pattern structure |
| JPS60218628A (en) * | 1984-04-13 | 1985-11-01 | Sharp Corp | Connecting method of liquid crystal display element electrode |
| JPS6220396A (en) * | 1985-07-19 | 1987-01-28 | キヤノン株式会社 | Electronic equipment |
| JPH0530373Y2 (en) * | 1985-08-30 | 1993-08-03 |
-
1996
- 1996-10-03 JP JP8263392A patent/JPH09120080A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS536881A (en) * | 1976-07-09 | 1978-01-21 | Hitachi Ltd | Flexible printed board having connecting terminal for connecting by multiple soldering connection method |
| JPS60129729A (en) * | 1983-12-16 | 1985-07-11 | Seiko Instr & Electronics Ltd | Liquid crystal display device |
| JPS60156767U (en) * | 1984-03-26 | 1985-10-18 | 富士通テン株式会社 | Printed circuit board wiring pattern structure |
| JPS60218628A (en) * | 1984-04-13 | 1985-11-01 | Sharp Corp | Connecting method of liquid crystal display element electrode |
| JPS6220396A (en) * | 1985-07-19 | 1987-01-28 | キヤノン株式会社 | Electronic equipment |
| JPH0530373Y2 (en) * | 1985-08-30 | 1993-08-03 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100454516B1 (en) * | 2000-10-25 | 2004-11-05 | 세이코 엡슨 가부시키가이샤 | Wiring substrate, display device, and electronic equipment |
| CN100435180C (en) * | 2002-03-22 | 2008-11-19 | 夏普株式会社 | Circuit board connection structure, method of forming, circuit board connection structure and display device |
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