JP3145882U - Circuit board measurement jig - Google Patents

Circuit board measurement jig Download PDF

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JP3145882U
JP3145882U JP2008005639U JP2008005639U JP3145882U JP 3145882 U JP3145882 U JP 3145882U JP 2008005639 U JP2008005639 U JP 2008005639U JP 2008005639 U JP2008005639 U JP 2008005639U JP 3145882 U JP3145882 U JP 3145882U
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circuit board
hole
bottom plate
conductor
spring
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綵茱 葉
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綵茱 葉
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)

Abstract

【課題】導線の脱落を防止可能で、測定の正確さが向上できる回路基板測定ジグの底板構造を提供する。
【解決手段】底板４の導線穴４１内に膠８を設けることによって導線１を導線穴４１に挿入してから熱風で固化させて緊密に底板４に固着し、導線１の導線芯１１の頂端を底板４と平面になるように研磨してプローブを挿入したバネの底端と直接接触させる。導線１の外膠層の耐熱度を考慮して、ブロクの上熱風源の温度を下熱風源より低くして、膠が過熱して導線を害さないようにコントロールしておく。
【選択図】図４ＡA bottom plate structure of a circuit board measurement jig capable of preventing a lead wire from dropping and improving measurement accuracy is provided.
By providing a glue 8 in a conductor hole 41 of a bottom plate 4, the conductor 1 is inserted into the conductor hole 41 and then solidified with hot air to be firmly fixed to the bottom plate 4 so that the top end of the conductor core 11 of the conductor 1 is provided. Is polished so as to be flat with the bottom plate 4 and brought into direct contact with the bottom end of the spring into which the probe is inserted. Considering the heat resistance of the outer glue layer of the conductor 1, the temperature of the upper hot air source of the block is made lower than that of the lower hot air source so as to prevent the glue from overheating and harming the conductor.
[Selection] Figure 4A

Description

本考案は、一種の回路基板測定ジグに関し、特に、一種の底板の導線穴の中に膠が設けてあるため、導線をその導線穴に挿入してから熱風で固化することにより、緊密に該底板に固定できてその脱落が防止でき、そして該導線の導線芯の頂端を底板と平面になるように研磨してプローブのあるバネの底端と直接接触させることにより、その測定の正確さが向上する一方、製造コスト及び仕事時間を減少させる回路基板測定ジグに関する。   The present invention relates to a kind of circuit board measurement jig, and in particular, since glue is provided in a lead hole of a kind of bottom plate, the lead wire is inserted into the lead hole and then solidified with hot air so that the The accuracy of the measurement can be improved by polishing the top end of the conductor core so that it is flat with the bottom plate and making direct contact with the bottom end of the spring with the probe. The present invention relates to circuit board measurement jigs that improve manufacturing costs and work time while improving.

従来のプリント回路基板測定では、通常、専用のジグを用いて測定して正常或いは短絡現象の有無を確認する。この種の従来からよく利用されている測定方法については、その導線が底板を貫通してからバネの底端に引っ掛けられるか或いは溶接されるものであるため、時間と人力がかかるだけではなく、導線が弛んで脱落しやすいために測定の正確さに影響を与える。従来の回路基板測定ジグは、図１に示すように、主として、複数個の導線Ｃを底板Ａの導線穴Ａ１を貫通して設けて、導線Ｃの一端を回路基板測定設備に接続し、もう一端の露出した導線芯をバネＤと溶接し、測定対象回路基板Ｆを載せるためにピンボードＢを底板Ａの上に置く。ピンボードＢの上には測定対象回路基板Ｆにある測定ポイントの位置に合わせて対応し合うピンホールＢ１が設けてあり、バネＤをピンホールＢ１の中に挿入して設け、プローブＧの下端をバネＤの頂端に被せて設けて、上端を定位板Ｅの定位穴Ｅ１から貫通させて回路基板Ｆの測定ポイントと接触させるものである。回路基板ＦをピンボードＢの上に載せると、プローブＧは回路基板Ｆの重量を受けて下へ押えられてピンホールＢ１内に沈んでいき、バネＤの弾力によって回路基板Ｆの測定ポイントに当たるため、テストシグナルがプローブ、バネ及び導線を経由して測定設備まで伝導され、回路基板の回路測定を行う。回路基板ＥをピンボードＢから移すとプローブＦの頂端はバネＤの弾力によって元の位置に戻る。   In the conventional printed circuit board measurement, the presence or absence of a normal or short circuit phenomenon is usually confirmed by measuring using a dedicated jig. For this type of measurement method that has been widely used in the past, not only time and manpower are required, because the lead wire passes through the bottom plate and is then hooked or welded to the bottom end of the spring. The accuracy of the measurement is affected by the fact that the lead wire is loose and easily falls off. As shown in FIG. 1, the conventional circuit board measurement jig mainly has a plurality of conductive wires C penetrating through the conductive hole A1 of the bottom plate A, and one end of the conductive wire C is connected to the circuit board measurement equipment. The exposed conductor core at one end is welded to the spring D, and the pin board B is placed on the bottom plate A in order to place the circuit board F to be measured. A pinhole B1 corresponding to the position of the measurement point on the circuit board F to be measured is provided on the pinboard B, and a spring D is provided by being inserted into the pinhole B1. Is provided so as to cover the top end of the spring D, and the upper end is penetrated from the localization hole E1 of the localization plate E and brought into contact with the measurement point of the circuit board F. When the circuit board F is placed on the pin board B, the probe G receives the weight of the circuit board F, is pressed down and sinks into the pinhole B1, and hits the measurement point of the circuit board F by the elasticity of the spring D. Therefore, the test signal is conducted to the measuring equipment through the probe, the spring and the lead wire, and the circuit measurement of the circuit board is performed. When the circuit board E is moved from the pin board B, the top end of the probe F is returned to the original position by the elasticity of the spring D.

しかしながら、このような従来の回路基板測定ジグでは、使用するとき、通常次のような欠点が生じる。（１）導線とバネの底端との溶接点の寸法は導線の脱落を防止するために必ず底板の導線穴より大きくするので該溶接点の寸法によってピンホールの寸法に影響をもたらす。つまり其々のピンホールの間は密集させることができず、回路基板の過密した測定ポイントに合わせ難くなる。その点について目下の解決方法としては、一般的には多層のピンボードを利用して傾斜させて形成することで過密した回路基板測定ポイントを探知して測定する。このような方法では、該傾斜したプローブが回路基板と接触するとき、傾斜が生じやすいため、測定の精密さに影響を与えるほか、プローブと其々のピンボードのピンホールとの間にも摩擦ポイントになるため、プローブの抵抗が増えたり壊れて変形したりする。（２）導線とバネの寸法は極めて小さいため、手作業による溶接では時間および人力がかかり、また溶接の不良によって測定結果にも影響をもたらす。   However, such conventional circuit board measurement jigs usually have the following disadvantages when used. (1) Since the size of the welding point between the conducting wire and the bottom end of the spring is necessarily larger than the conducting hole of the bottom plate in order to prevent the conducting wire from dropping off, the size of the welding point affects the size of the pinhole. In other words, the pinholes cannot be densely packed, and it becomes difficult to match the measurement points on the circuit board. In this regard, the current solution is to detect and measure overcrowded circuit board measurement points by forming a slant using a multi-layer pin board. In such a method, when the tilted probe comes into contact with the circuit board, tilting is likely to occur, which affects measurement accuracy and also causes friction between the probe and the pinhole of each pin board. Because it becomes a point, the resistance of the probe increases or breaks and deforms. (2) Since the dimensions of the lead wire and the spring are extremely small, manual welding takes time and manpower, and measurement results are also affected by poor welding.

上記のような従来利用される回路基板測定ジグの欠点を改善するため、近年、図２に示す回路基板測定ジグが提案され、それは主としてピン受台Ｈ、底板Ｉ、上プローブ定位板Ｊ、下プローブ定位板Ｋ及び弾性布Ｌからなる。その中において、ピン受台Ｈ及び底板Ｉの上には回路基板Ｐの上にある測定ポイントと対応するピンホールＨ１及び導線穴Ｉ１が設けてあり、そして上プローブ定位板Ｊ、下プローブ定位板Ｋ及び弾性布Ｌの上には回路基板Ｐの上にある測定ポイントと対応する定位穴Ｊ１、Ｋ１、Ｌ１が設けられている。ピン受台ＨのピンホールＨ１内にバネＭがあり、導線Ｎの一端は露出の導線芯になり、プレスで外径が導線穴Ｉ１より大きいＴ型導線ヘッドＮ１にプレスしてバネＭの底端に引っ掛かるようにし、導線Ｎのもう一端は底板の導線穴Ｉ１を貫通して測定設備に接続される。プローブＯは其々ピンホール内のバネＭの頂端に取り付けられ、その上端は上プローブ定位板Ｊ、下プローブ定位板Ｋ及び弾性布Ｌにあるガイドとして使われる定位穴Ｊ１、Ｋ１、Ｌ１を貫通して回路基板Ｐにある測定ポイントと接触する。   In order to remedy the drawbacks of the circuit board measurement jigs conventionally used as described above, a circuit board measurement jig shown in FIG. 2 has been proposed in recent years, which mainly includes a pin cradle H, a bottom plate I, an upper probe localization plate J, a lower It consists of a probe localization plate K and an elastic cloth L. Among them, a pin hole H1 and a lead hole I1 corresponding to a measurement point on the circuit board P are provided on the pin cradle H and the bottom plate I, and an upper probe localization plate J and a lower probe localization plate are provided. On K and the elastic cloth L, stereotaxic holes J1, K1, and L1 corresponding to the measurement points on the circuit board P are provided. There is a spring M in the pin hole H1 of the pin cradle H, one end of the conducting wire N becomes an exposed conducting wire core, and the bottom of the spring M is pressed by pressing on the T-type conducting head N1 whose outer diameter is larger than the conducting wire hole I1. The other end of the conducting wire N is connected to the measuring equipment through the conducting wire hole I1 of the bottom plate. The probe O is attached to the top end of the spring M in the pinhole, and the upper end passes through the positioning holes J1, K1, and L1 used as guides in the upper probe positioning plate J, the lower probe positioning plate K, and the elastic cloth L. Then, it comes into contact with a measurement point on the circuit board P.

この種の回路基板測定ジグでは、導線とバネの底端とを手作業により溶接するのにかかる時間と人力の浪費及び溶接不良による測定結果への影響などの欠点は解決できるが、依然として次のような欠点がある。（１）導線は極めて小さいため、その一端の導線芯をＴ型導線ヘッドにプレスするとき、誤差或いは変形がよく発生するため、バネ底端に引っ掛かる導線は弛んで脱落しやすいことによって測定結果に影響をもたらす。（２）脱落しないように該導線のＴ型導線ヘッドの外径を導線穴より大きくしなければならないため、ピンホールの寸法は依然として制限されるのでその種の回路基板測定ジグでは測定ポイントが密集しすぎる回路基板を測定することができない。   This type of circuit board measurement jig can solve the shortcomings such as manual welding of the conductor and the bottom end of the spring, the waste of manpower, and the influence on the measurement result due to poor welding, but still the following There are some disadvantages. (1) Since the conducting wire is very small, when one end of the conducting wire core is pressed onto the T-type conducting head, errors or deformation often occur. Therefore, the conducting wire caught on the bottom end of the spring is loosened and easily falls off. Has an impact. (2) Since the outer diameter of the T-shaped lead head of the lead wire must be larger than the lead wire hole so as not to drop off, the pinhole size is still limited, so that the measurement points are dense in this type of circuit board measurement jig. Too much circuit board cannot be measured.

本考案は、従来使われている回路基板測定ジグの底板構造では依然として改善すべき欠点が多くあることを痛感したため、長年以来該製品の設計製造に従事して積み重ねた経験によって絶えずにその改良を重ねて考えてやっとより使用者のニーズに合う回路基板測定装置の底板構造を設計した。
本考案の目的は、一種の底板の導線穴内に膠を設けることによって導線を該導線穴に挿入してから熱風で固化させて緊密に該底板に固着してその脱落を防止することができ、且該導線の導線芯の頂端を底板と平面になるように研磨してプローブを挿入したバネの底端と直接接触させることにより、測定の正確さが向上できる回路基板測定ジグを提供することにある。
本考案のもう一つの目的とは、一種の導線を底板に固定させることによってバネと直接に接触でき、他に溶接による固定が要らず、有効に製造コスト及び工作時間が低下でき、同時にバネ及びプローブをより小さい寸法に製造できるため、密集する測定ポイントのある回路基板を測定することができる回路基板測定ジグを提供することにある。 Since the present invention realized that there are still many drawbacks to be improved in the base plate structure of the circuit board measurement jig used in the past, the improvement has been constantly made by the experience of designing and manufacturing the product since many years. The bottom plate structure of the circuit board measuring device that finally meets the user's needs was designed after repeated considerations.
The purpose of the present invention is to provide a glue in the lead hole of a kind of bottom plate, insert the lead wire into the lead hole and then solidify with hot air to tightly adhere to the bottom plate and prevent its falling off, And providing a circuit board measurement jig capable of improving measurement accuracy by polishing the top end of the conductor core of the conductor to be flat with the bottom plate and directly contacting the bottom end of the spring into which the probe is inserted. is there.
Another object of the present invention is to directly contact the spring by fixing a kind of conducting wire to the bottom plate, and no other fixing by welding is required, and the manufacturing cost and working time can be effectively reduced, and at the same time, the spring and It is an object of the present invention to provide a circuit board measurement jig capable of measuring a circuit board having dense measurement points because a probe can be manufactured to a smaller size.

上記目的を達成するため、本考案に係る回路基板測定ジグは、回路基板にある測定対象線路の位置に合わせて予め少なくとも一つの対応し合うピンホールが開けてある一つのピンボードと、前記ピンボード上にある前記ピンホールと対応する定位穴が開けてあり、前記ピンボードの上を覆う一つの弾性布と、前記ピンボード上にある前記ピンホールと対応する定位穴が開けてあり、前記ピンボード及び前記弾性布の上方に固着される少なくとも一つの定位板と、前記ピンボード上にある其々の前記ピンホールの中に取り付けてある少なくとも一つのバネと、前記ピンホール内にある前記バネの頂端に取り付けられ、前記弾性布及び前記定位板の上にある定位穴を貫通して前記回路基板にある測定ポイントと接触する少なくとも一つのプローブと、前記ピンボードの下側に固定され、前記ピンボードの前記ピンホールと対応し合う導線穴が開けてあり、前記導線穴とは一つの導線部及び芯部を有する一つの底板と、一端は露出した導電芯になり、前記底板の前記導線穴に挿入されて前記バネと接触可能であり、もう一端は回路基板測定設備まで接続される少なくとも一つの導線と、を備え、前記導線の前記導線芯は前記導線穴の前記芯部と同じ或いはややより長い長さにカットされ、倒置される前記底板の表面に膠を塗って更に前記導線穴に滲ませ、前記導線芯のある前記導線の一端を前記導線穴内に満遍なく塗られた前記膠のある前記導線部及び前記芯部に挿入し、熱風によって前記膠を固化させ、前記導線を前記底板に固着させ、また前記導線芯のカット面は前記底板と一致する平面まで研磨されて前記プローブが挿入してある前記バネの底端と直接接触可能である。   In order to achieve the above object, a circuit board measurement jig according to the present invention includes a pin board in which at least one corresponding pinhole is opened in advance according to the position of a measurement target line on the circuit board, and the pin A stereotaxic hole corresponding to the pinhole on the board is opened, one elastic cloth covering the pinboard, and a stereotaxic hole corresponding to the pinhole on the pinboard are opened, At least one stereotaxic plate secured above the pinboard and the elastic cloth, at least one spring mounted in each of the pinholes on the pinboard, and the pinhole in the pinhole At least one probe attached to a top end of a spring and passing through a stereotaxic hole on the elastic cloth and the stereotaxic plate to contact a measurement point on the circuit board A lead hole fixed to the lower side of the pin board and corresponding to the pin hole of the pin board, wherein the lead hole is one bottom plate having one lead portion and a core portion, and one end is At least one conducting wire that is an exposed conducting core, is inserted into the conducting hole in the bottom plate and is contactable with the spring, and the other end is connected to a circuit board measuring facility, and the conducting wire of the conducting wire The core is cut to a length equal to or slightly longer than the core portion of the conductor hole, glued to the surface of the bottom plate to be inverted, and further blotted into the conductor hole, one end of the conductor having the conductor core Is inserted into the conductor portion and the core portion with the glue uniformly applied in the conductor hole, the glue is solidified by hot air, the conductor wire is fixed to the bottom plate, and the cut surface of the conductor core is Matches the bottom plate The probe is polished to a surface can be in direct contact with the bottom end of the spring it has been inserted.

以下、本発明の実施の形態を図面に基づいて説明する。
（一実施形態）
本考案の一実施形態による回路基板測定ジグを図３〜図５に示す。回路基板測定ジグは、主として数個の導線１、数個のプローブ２、数個のバネ３、一つのピンボード５、一つの底板４、一つの弾性布６、上定位板７、及び下定位板７’からなる。ピンボード５は、回路基板９の上にある測定ポイントの位置に合わせて予め数個の対応し合うピンホール５１を開けて設け、また底板４、上定位板７、下定位板７’及び弾性布６の上には其々ピンボード５のピンホール５１と対応する導線穴４１及び定位穴７１、７１’、６１を開けて設け、下定位板７’及び底板４は其々ピンボード５の上下側に固着され、弾性布６は下定位板７’を覆って、且ピンボード５、上定位板７、下定位板７’及び弾性布６の表面及び開けて設ける貫通孔の周り縁には皆絶縁層が塗布してある。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(One embodiment)
A circuit board measurement jig according to an embodiment of the present invention is shown in FIGS. The circuit board measuring jig is mainly composed of several conductors 1, several probes 2, several springs 3, one pin board 5, one bottom plate 4, one elastic cloth 6, upper localization plate 7, and lower localization plate It consists of a plate 7 '. The pin board 5 is provided by opening several corresponding pin holes 51 in advance according to the position of the measurement point on the circuit board 9, and is provided with a bottom plate 4, an upper localization plate 7, a lower localization plate 7 ′ and an elastic plate. Conductive hole 41 and localization holes 71, 71 ′, 61 corresponding to the pinhole 51 of the pin board 5 are provided on the cloth 6, and the lower localization plate 7 ′ and the bottom plate 4 are respectively provided on the pin board 5. The elastic cloth 6 is fixed to the upper and lower sides, and the elastic cloth 6 covers the lower stereotaxic plate 7 'and on the surface of the pin board 5, the upper stereotaxic board 7, the lower stereotaxic board 7' and the elastic cloth 6 and the peripheral edge of the open through-hole. All have an insulating layer applied.

図４（Ａ）、（Ｂ）に示すように、底板４にある導線穴４１には、一つの導線部４１１及び一つの芯部４１２がある。導線１の一端は先ず回路基板測定設備に接続しておいて、もう一端の露出した導線芯１１は導線穴の芯部４１２と同じか、ややより長い長さにカットしておく。それから底板４を倒置し、その表面に適当な粘度のある膠８を塗布して、膠８が底板４の導線穴４１に滲んだら導線芯１１のある導線１の一端を上から下へと底板４の導線穴４１に挿入する。導線１及び導線芯１１を其々導線穴４１内にある膠８を十分に塗った導線部４１１及び芯部４１２に挿入し、導線１の挿入を完成した底板４を上下に熱風源のある図示しないブロワの中に入れる。膠８が固化したら、導線１が底板４に固着される。導線１の外膠層の耐熱度を考慮して、ブロワの上熱風源の温度を下熱風源より低くして、膠が過熱して導線を害しないようにコントロールする。適当なサンドペーパー或いはその他のツールで導線芯１１のカット面を研磨し、その表面の膠を研ぎ除き、また導線芯１１のカット面を底板４と平面になるように研磨する。   As shown in FIGS. 4A and 4B, the conductor hole 41 in the bottom plate 4 has one conductor part 411 and one core part 412. One end of the conducting wire 1 is first connected to the circuit board measuring equipment, and the conducting wire core 11 exposed at the other end is cut to the same length as the core portion 412 of the conducting wire hole or slightly longer. Then, the bottom plate 4 is turned upside down and glue 8 having an appropriate viscosity is applied to the surface. When the glue 8 oozes into the conductor hole 41 of the bottom plate 4, one end of the conductor 1 with the conductor core 11 is moved from the top to the bottom. 4 lead wire holes 41 are inserted. The conducting wire 1 and the conducting wire core 11 are inserted into the conducting wire portion 411 and the core portion 412 sufficiently coated with the glue 8 in the conducting wire hole 41, respectively, and the bottom plate 4 which has completed the insertion of the conducting wire 1 is shown with a hot air source up and down. Do not put in the blower. When the glue 8 is solidified, the conductive wire 1 is fixed to the bottom plate 4. Considering the heat resistance of the outer glue layer of the conductor 1, the temperature of the upper hot air source of the blower is set lower than that of the lower hot air source so as to prevent the glue from overheating and harming the conductor. The cut surface of the conductor core 11 is polished with a suitable sandpaper or other tool, the glue on the surface is sharpened, and the cut surface of the conductor core 11 is polished to be flat with the bottom plate 4.

図５に示すように、バネ３を其々ピンボード５の上にある其々のピンホール５１内に取り付ける。バネ３の底端は、導線１の挿入が完了しピンボード５の下側の底板４内に固定された導電芯１１の頂端と接触する。プローブ２は其々バネ３の頂端に置かれ、上定位板７、下定位板７’及び弾性布６の定位穴７１、７１’、６１を貫通して回路基板の上にある測定ポイントと接触する。また弾性布６にはプローブ２を保持する作用があり、それによってプローブ２がピンホール５１から落ちるのを防止でき、そして上定位板７、下定位板７’及び弾性布６の定位穴７１、７１’、６１にはプローブ２をガイドする機能がある。   As shown in FIG. 5, the spring 3 is attached in each pinhole 51 on the pinboard 5. The bottom end of the spring 3 comes into contact with the top end of the conductive core 11 fixed in the bottom plate 4 on the lower side of the pin board 5 after the insertion of the conducting wire 1 is completed. The probes 2 are respectively placed on the top ends of the springs 3 and pass through the upper localization plate 7, the lower localization plate 7 'and the localization holes 71, 71', 61 of the elastic cloth 6 and contact the measurement points on the circuit board. To do. Further, the elastic cloth 6 has an action of holding the probe 2, thereby preventing the probe 2 from falling from the pinhole 51, and the upper localization plate 7, the lower localization plate 7 ′ and the localization hole 71 of the elastic fabric 6, 71 ′ and 61 have a function of guiding the probe 2.

測定対象回路基板を回路基板測定ジグに置いたら、プローブ２の頂端は回路基板９の重量を受けて下へ沈み、バネ３の弾力によって回路基板９にある測定ポイントと接触する。これにより、測定シグナルがプローブ２、バネ３及び導線１を経由して測定設備まで伝導して読み取りを行う。回路基板９をピンボード５から移すと、プローブ２の頂端は、バネ３の弾力によって元の位置まで復帰できる。   When the circuit board to be measured is placed on the circuit board measurement jig, the top end of the probe 2 receives the weight of the circuit board 9 and sinks downward, and contacts the measurement point on the circuit board 9 by the elasticity of the spring 3. As a result, the measurement signal is conducted through the probe 2, the spring 3, and the lead wire 1 to the measurement equipment for reading. When the circuit board 9 is moved from the pin board 5, the top end of the probe 2 can be returned to the original position by the elasticity of the spring 3.

（考案の効果）
本考案の回路基板測定ジグの長所は、以下の通りである。（１）導線を底板にある膠を含んだ導線穴に挿入してから熱風で固化させて定位させるので、導線が脱落することが防止できるほか、導線の導線芯はバネと確実に接触できるため、回路基板測定の正確さが高められる。（２）導線を底板に固定して、当該導線の導線芯はバネと直接接触できるため、バネとの溶接が不要になるので、ピンボードの上にあるピンホールの外径は制限されなくなり、即ちバネ及びプローブはより小さい寸法に製造でき、回路基板にあるより密集する測定ポイントが測定できる。（３）導線とバネとの溶接によって時間と人力がかかり、また脱落しやすくなるために測定の正確さに影響をもたらすという欠点が改善でき、また導線の一端を予め回路基板測定設備に接続しておいてから導線挿入の固定と組立を行うことができるため、組立の仕事時間及び手間が簡易化できる。 (Effect of device)
The advantages of the circuit board measuring jig of the present invention are as follows. (1) Since the lead wire is inserted into the lead wire hole containing glue on the bottom plate and then solidified with hot air and fixed, the lead wire can be prevented from falling off, and the lead wire core can be securely in contact with the spring. The accuracy of circuit board measurement is increased. (2) Since the lead wire can be directly contacted with the spring by fixing the lead wire to the bottom plate, welding with the spring becomes unnecessary, so the outer diameter of the pinhole on the pin board is not limited, That is, the springs and probes can be manufactured to smaller dimensions, and more dense measurement points on the circuit board can be measured. (3) It takes time and manpower to weld the lead wire and the spring, and it is easy to drop off, so it can improve the measurement accuracy, and one end of the lead wire is connected to the circuit board measuring equipment in advance. Since it is possible to fix and assemble the lead wire insertion after assembling, assembly work time and labor can be simplified.

従来の回路基板測定ジグを示す分解斜視図である。It is a disassembled perspective view which shows the conventional circuit board measurement jig. 従来の回路基板測定ジグを示す断面図である。It is sectional drawing which shows the conventional circuit board measurement jig. 本考案の一実施形態による回路基板測定ジグを示す分解斜視図である。1 is an exploded perspective view showing a circuit board measurement jig according to an embodiment of the present invention. 本考案の一実施形態による回路基板測定ジグにおける導線と底板との組立て状態を示す部分断面図である。It is a fragmentary sectional view which shows the assembly state of the conducting wire and bottom plate in the circuit board measurement jig by one Embodiment of this invention. 本考案の一実施形態による回路基板測定ジグにおける導線と底板との組立て状態を示す部分断面図である。It is a fragmentary sectional view which shows the assembly state of the conducting wire and bottom plate in the circuit board measurement jig by one Embodiment of this invention. 本考案の一実施形態による回路基板測定ジグを示す断面図である。It is sectional drawing which shows the circuit board measurement jig by one Embodiment of this invention.

符号の説明Explanation of symbols

１：導線、１１：導電芯、２：プローブ、３：バネ、４：底板、４１：導線穴、４１１：導線部、４１２：芯部、５：ピンボード、５１：ピンホール、６：弾性布、６１：定位穴、７：上定位板、７’：下定位板、７１、７１’：定位穴、８：膠、９：回路基板   1: Conductor, 11: Conductive core, 2: Probe, 3: Spring, 4: Bottom plate, 41: Conductor hole, 411: Conductor part, 412: Core part, 5: Pin board, 51: Pin hole, 6: Elastic cloth 61: stereotaxic hole, 7: upper stereotaxic plate, 7 ': bottom stereotaxic plate, 71, 71': stereotaxic hole, 8: glue, 9: circuit board

Claims (1)

回路基板にある測定対象線路の位置に合わせて予め少なくとも一つの対応し合うピンホールが開けてある一つのピンボードと、
前記ピンボード上にある前記ピンホールと対応する定位穴が開けてあり、前記ピンボードの上を覆う一つの弾性布と、
前記ピンボード上にある前記ピンホールと対応する定位穴が開けてあり、前記ピンボード及び前記弾性布の上方に固着される少なくとも一つの定位板と、
前記ピンボード上にある其々の前記ピンホールの中に取り付けてある少なくとも一つのバネと、
前記ピンホール内にある前記バネの頂端に取り付けられ、前記弾性布及び前記定位板の上にある前記定位穴を貫通して前記回路基板にある測定ポイントと接触する少なくとも一つのプローブと、
前記ピンボードの下側に固定され、前記ピンボードの前記ピンホールと対応し合う導線穴が開けてあり、前記導線穴は一つの導線部及び芯部を有する一つの底板と、
一端は露出した導電芯になり、前記底板の前記導線穴に挿入されて前記バネと接触可能であり、もう一端は回路基板測定設備まで接続される少なくとも一つの導線と、
を備える回路基板測定ジグであって、
前記導線の前記導線芯は前記導線穴の前記芯部と同じか或いはややより長い長さにカットされ、倒置される前記底板の表面に膠を塗って更に前記導線穴に滲ませ、前記導線芯のある前記導線の一端を前記導線穴内に満遍なく塗られた前記膠のある前記導線部及び前記芯部に挿入し、熱風によって前記膠を固化させ、前記導線を前記底板に固着させ、また前記導線芯のカット面を前記底板と一致する平面まで研磨して前記プローブが挿入してある前記バネの底端と直接接触可能であることを特徴とする回路基板測定ジグ。 One pin board in which at least one corresponding pinhole is opened in advance according to the position of the measurement target line on the circuit board;
A stereotactic hole corresponding to the pinhole on the pinboard is opened, and one elastic cloth covering the pinboard;
There is a stereotaxic hole corresponding to the pinhole on the pinboard, and at least one stereotaxic plate fixed above the pinboard and the elastic cloth,
At least one spring mounted in each of the pinholes on the pinboard;
At least one probe attached to the top end of the spring in the pinhole, passing through the stereotactic hole on the elastic fabric and the stereotaxic plate, and contacting a measurement point on the circuit board;
A conductive wire hole fixed to the lower side of the pin board and corresponding to the pin hole of the pin board, wherein the conductive wire hole has a single conductive wire portion and a single bottom plate;
One end is an exposed conductive core, is inserted into the conductor hole of the bottom plate and can contact the spring, and the other end is at least one conductor connected to the circuit board measurement facility,
A circuit board measurement jig comprising:
The conducting wire core of the conducting wire is cut to a length that is the same as or slightly longer than the core portion of the conducting wire hole, and the surface of the bottom plate to be inverted is glued and further immersed in the conducting wire hole. One end of the conductive wire is inserted into the conductive wire portion and the core portion with the glue uniformly applied in the conductive wire hole, the glue is solidified by hot air, the conductive wire is fixed to the bottom plate, and the conductive wire A circuit board measurement jig characterized in that a cut surface of a core is polished to a plane coinciding with the bottom plate and can directly contact a bottom end of the spring into which the probe is inserted.
JP2008005639U 2007-10-22 2008-08-12 Circuit board measurement jig Expired - Fee Related JP3145882U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110231724A (en) * 2019-04-29 2019-09-13 苏州日和科技有限公司 Liquid crystal display lights detecting probe seat jacking apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5530124B2 (en) * 2009-07-03 2014-06-25 株式会社日本マイクロニクス Integrated circuit testing equipment
KR101306049B1 (en) * 2011-10-14 2013-09-09 (주)다솔이엔지 Four point probe
KR102016427B1 (en) * 2013-09-10 2019-09-02 삼성전자주식회사 Pogo pin and probe card including the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110231724A (en) * 2019-04-29 2019-09-13 苏州日和科技有限公司 Liquid crystal display lights detecting probe seat jacking apparatus
CN110231724B (en) * 2019-04-29 2024-05-24 苏州日和科技有限公司 Probe seat jacking device for liquid crystal display lighting test

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