JP3090756B2 - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JP3090756B2 JP3090756B2 JP04026702A JP2670292A JP3090756B2 JP 3090756 B2 JP3090756 B2 JP 3090756B2 JP 04026702 A JP04026702 A JP 04026702A JP 2670292 A JP2670292 A JP 2670292A JP 3090756 B2 JP3090756 B2 JP 3090756B2
- Authority
- JP
- Japan
- Prior art keywords
- core
- electrode plate
- electrode
- chip inductor
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Insulating Of Coils (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、コアの鍔部の両端面に
巻回胴部に巻回形成した導線の両端の引き出し線を接続
する一対の電極板を備えたチップインダクタに関するも
のである。The present invention relates, on both end surfaces of the flange portion of the core
Connect the lead wires at both ends of the conductor wire wound around the winding body
And a chip inductor having a pair of electrode plates .
【0002】[0002]
【従来の技術】従来のチップインダクタ17は、図10に
示すように、フェライトなどのコア18の両端鍔部19に絶
縁性接着剤20にて半田メッキ銅線などのリード線21を接
着し(a)、ポリウレタン被覆電線などの導線22をコア
18の巻回胴部23に巻回し、この導線22の引き出し線24を
直接コア18の両端鍔部19に接着されたリード線21に巻回
し半田25にて接続し(b)、このリード線21をフープ状
に加工された電極板26に搭載して、その電極板26とリー
ド線21とをレーザにて半田付けし、この半田25付け部分
より先端のリード線21を切り落とした後(c)、このコ
ア18と導線22とをモールド絶縁体27で覆い(d)、電極
板26のモールド絶縁体27から露出した部分を折り曲げた
構造が採られている(e)。2. Description of the Related Art In a conventional chip inductor 17, as shown in FIG. 10, a lead wire 21 such as a solder-plated copper wire is bonded to a flange 19 at both ends of a core 18 such as a ferrite by an insulating adhesive 20 (see FIG. 10). a), core conductors 22 such as a polyurethane covered wire
18 wound once barrel 23 wound in, connect the lead wire 24 of the wire 22 <br/> at lead wire 21 wound once solder 25 adhered to both end flange portion 19 of the straight Secco A 18 and (b), the equipped with a lead wire 21 to the electrode plate 26 which is processed into a hoop, soldered and its electrode plate 26 and the rie <br/> lead wire 21 by a laser, the solder 25 After the lead wire 21 at the tip is cut off from the attached portion (c), the core 18 and the conductive wire 22 are covered with a mold insulator 27 (d), and the portion of the electrode plate 26 exposed from the mold insulator 27 is bent. (E).
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の構造のチップインダクタ17では、フープ状に加工し
た電極板26および半田メッキ銅線などのリード線21が必
要であり、さらに、電極板26と半田メッキ銅線などのリ
ード線21をレーザによって半田付けする工程があり、材
料費がかさむと同時に非効率的である。そのうえ、リー
ド線21と電極板26をレーザによって半田付けする際の熱
ストレスが、導線22のレアショートの原因となり、歩留
まりが悪くなる。さらに、半田25付け後のリード線21の
先端部分は切り落とし破棄されるので不経済である。ま
た、フェライトなどのコア18、半田メッキ銅線などのリ
ード線21、ポリウレタン被覆電線などの導線22を、フー
プ状に加工した電極板26に搭載する工程およびレーザに
よるリード線21と電極板26の半田付け工程、また、不要
となったリード線21の切り落とし工程の設備が大型とな
る。さらに、導線22と電極板26との結線に半田メッキ銅
線などのリード線21を介するため、チップインダクタ17
の小型化に制約を受ける。However, the chip inductor 17 having the above-mentioned conventional structure requires an electrode plate 26 formed into a hoop shape and a lead wire 21 such as a solder-plated copper wire. There is a step of soldering the lead wire 21 such as a solder-plated copper wire with a laser, which increases the material cost and is inefficient. Moreover, the thermal stress at the time of soldering the rie <br/> lead wire 21 and the electrode plate 26 by the laser, cause short circuit of the conductors 22, the yield is deteriorated. Moreover, it is uneconomical since the distal end portion of the lead wire 21 after the solder 25 with is discarded cut off. The core 18, such as ferrite, lead 21, such as solder-plated copper wire, a wire 22 such as a polyurethane covered wire, hoop to processed steps and laser <br/> by azure over mounted to the electrode plate 26 The equipment for the step of soldering the lead wire 21 and the electrode plate 26 and the step of cutting off the unnecessary lead wire 21 becomes large. Furthermore, since the connection between the conductive wire 22 and the electrode plate 26 is made via the lead wire 21 such as a solder-plated copper wire, the chip inductor 17
Is limited by miniaturization.
【0004】本発明は、上記の問題点に鑑み、効率よく
経済的に製造でき省エネルギー対策にも効果的な小型の
チップインダクタを提供することを目的とする。[0004] The present onset Akira has been made in view of the above problems, efficiently
It shall be the object of providing an effective small <br/> chip inductor also can Energy Conservation measures economically manufactured.
【0005】[0005]
【課題を解決するための手段】請求項1に記載のチップ
インダクタは、巻回胴部の両端にそれぞれ鍔部を形成し
た断面が略H状のコアと、このコアの巻回胴部に巻回形
成された導線と、前記コアの鍔部の両端面に耐熱性絶縁
接着剤にてそれぞれ接着された一対の電極板と、前記コ
アと共に前記導線を前記電極板の一部を露出させて覆う
モールド絶縁体とを備え、前記電極板は、前記コアの端
面に接着される接着部と、この接着部に折線を介して連
続し前記モールド絶縁体の内部から外部に先端側の一部
が露出する電極部と、この電極部の基端に設けられ両側
縁に前記折線に亘って傾斜して切り込みが設けられて前
記コアの鍔部の端面に向けて幅狭に形成され前記導線の
両端の引き出し線が巻回されて半田にて接続される巻回
部とを具備したものである。Chip inductor mounting serial to claim 1 SUMMARY OF THE INVENTION comprises a winding barrel core, respectively cross-section to form a flange portion at both ends is substantially H-shaped, and the winding body of the core and winding the formed conductor, and the pair of electrode plates which are respectively attached by heat-resistant insulating adhesive on both end surfaces of the flange portion of the core, and the conductive wire is exposed a part of the electrode plate with the core and a mold insulator, the electrode plate through a bonding portion to be bonded to the end <br/> face of the core, the fold line to the bonded portion communicating covering
Portion of the distal end or internal et outer portion of connection teeth the mold insulator
Is exposed at the base of this electrode and both sides
A notch is provided at the edge, which is inclined along the fold line.
Is formed narrower toward the end face of the flange portion of the serial core winding the lead wire at both ends of the conductive wire is connected is wound by soldering
Part .
【0006】請求項2に記載のチップインダクタは、請
求項1に記載のチップインダクタにおいて、電極板の巻
回部は、切り込みの縁に折り返し部が折り返し形成され
たものである。[0006] The chip inductor of the mounting come to claim 2, 請
In the chip inductor according to Motomeko 1, winding <br/> times of conductive plates are those folded portion was be folded formed <br/> the edge of the notch.
【0007】請求項3に記載のチップインダクタは、請
求項1または2に記載のチップインダクタにおいて、電
極板の接着部は、1ないし複数の切り込み部が切り込み
形成されたものである。[0007] serial mounting of the chip inductor in claim 3, 請
3. The chip inductor according to claim 1, wherein one or a plurality of cut portions are formed in the bonded portion of the electrode plate.
【0008】請求項4に記載のチップインダクタは、請
求項1ないし3のいずれか一に記載のチップインダクタ
において、コアの鍔部は、端面に耐熱性断熱接着剤にて
電極板が接着される凹弧状面部を有したものである。[0008] Chip inductor mounting serial to claim 4, 請
The chip inductor according to any one of claims 1 to 3,
In the flange portion of the core is one in which the electrode plates in heat resistance insulation adhesive has have a concave arc-like surface that will be bonded to the end surface.
【0009】[0009]
【作用】請求項1に記載のチップインダクタは、導線を
巻回胴部に巻回したコアの鍔部の両端面に絶縁性接着剤
にて接着部が接着される電極板の電極部の基端に、両側
縁に接着部との折線に亘って傾斜して切り込みを設けて
コアの端面に向けて幅狭で導線の両端の引き出し線が巻
回されて半田にて接続される巻回部を設けることによ
り、巻回される導線の引き出し線がコアの端面に沿って
近接した定位置に巻回される。[Action] chip inductor mounting serial to claim 1, the conductor
Both end surfaces of the flange portion of the core by winding the base end of the electrode portion of the electrode plate bonding portion is bonded by insulation adhesive to the winding drum portion, both sides
Make a notch at the edge over the fold line with the adhesive
The lead wires at both ends of the conductor are wound narrow toward the end face of the core.
To Rukoto provided with a wound portion that is connected by soldering is wound
Ri, Ru is wound in place of the lead lines of conducting wire wound around the adjacent along the end face of the core.
【0010】請求項2に記載のチップインダクタは、請
求項1に記載のチップインダクタにおいて、電極板の電
極部に形成した巻回部に切り込みの縁に折り返し部を形
成することによって、巻回された導線の引き出し線を巻
回部に巻回する際、巻回される導線が電極板の切り込み
の縁で切断されたり傷付けられることがない。[0010] Ji Ppuindakuta according to claim 2,請
In the chip inductor according to claim 1, the lead wire of the wound conductive wire is wound around the winding portion by forming a folded portion at the edge of the cut in the winding portion formed on the electrode portion of the electrode plate. When the conductor is wound, the cut in the electrode plate
Not cut or scratched at the edges of
【0011】請求項3に記載のチップインダクタは、請
求項1または2に記載のチップインダクタにおいて、電
極板の接着部に1ないし複数の切り込み部を切り込み形
成したので、コアの両端の鍔部と電極板との接着強度が
向上し、歩留まりが向上する。[0011] Ji Ppuindakuta according to claim 3, 請
In the chip inductor according to Motomeko 1 or 2, since the forms <br/> shaped cuts 1 or a plurality of cut portions in the bonding portion of the electrode plate, the adhesion strength between the flange portions at both ends of the core and the electrode plate And yield is improved.
【0012】請求項4に記載のチップインダクタは、請
求項1ないし3のいずれか一に記載のチップインダクタ
において、コアの鍔部の端面に電極板を耐熱性絶縁接着
剤にて接着する凹弧状面部を形成したため、コアの鍔部
の端面に設けられる接着剤の層厚および電極板の接着部
の板厚を凹弧状面部内に配設することでさらに小型化す
る。[0012] Ji Ppuindakuta according to claim 4, 請
The chip inductor according to any one of claims 1 to 3,
Heat-resistant insulation bonding of the electrode plate to the end face of the core flange
Since the formation of the concave arc-shaped surface for bonding with adhesive, more compact by arranging the thickness of the adhesive portion of the core end face on the layer thickness and the electrode plate of the adhesive provided in the flange portion of the inside concave arcuate surface Ru be <br/>.
【0013】[0013]
【実施例】以下、本発明の一実施例のチップインダクタ
を説明するための前提となる技術の構成を図1ないし図
5を参照して説明する。 BRIEF DESCRIPTION assumptions become technology configurations for illustrating a chip inductor of an embodiment of the present invention with reference to FIGS.
【0014】コア1は、フェライトにて巻回胴部2とこ
の巻回胴部2の両端に一体に形成した鍔部3とにて断面
が略H字形状に成型されている。このコア1と巻回胴部
2にポリウレタン被覆電線などの導線4を巻回する。ま
た、5は電極板で、コア1の鍔部3の両端面に耐熱性絶
縁接着剤6にて接着される接着部7と、この接着部7の
端部から略直角に折り曲げ折線を介して接着部7に連続
する電極部8を有し略L字形状に形成されている。ま
た、9はモールド絶縁体で、コア1を電極板5の電極部
8の先端側の一部を露出させて覆う。そして、この電極
板5のモールド絶縁体9から露出された電極部8をモー
ルド絶縁体9の外周に沿って折り曲げ、このモールド絶
縁体9の表面に表示インクおよび絶縁塗料などの表示部
10を焼き付け形成する。The core 1 is formed in a substantially H-shaped cross section by a winding body 2 made of ferrite and flanges 3 integrally formed at both ends of the winding body 2. A conductor 4 such as a polyurethane-coated electric wire is wound around the core 1 and the winding body 2. Further, 5 in the electrode plate, and the adhesive portion 7 which is bonded to both end surfaces of the flange portion 3 of the core 1 in the heat-resistant insulating adhesive agent 6, via a substantially right angle bend polygonal line from the end portion of the bonding portion 7 To the adhesive 7
And has a substantially L-shape. Further, 9 is molded insulator covering exposes a portion of the distal end of the electrode portion 8 of the core 1 collector plate 5. Then, the electrode portion 8 exposed from the mold insulator 9 of the electrode plate 5 is bent along the outer periphery of the mold insulator 9, and the display portion such as display ink and insulating paint is formed on the surface of the mold insulator 9.
Bake 10 to form.
【0015】なお、図3に鎖線で示すように、電極板5
の接着部7をコア1の鍔部3の端面略全面に接着すれ
ば、接着面積が拡大される。[0015] Incidentally, as shown by the chain line in FIG. 3, conductive plate 5
If adhesive bonding portion 7 of the end face substantially the entire surface of the flange portion 3 of the core 1, the adhesive area is enlarged.
【0016】次に、上記前提となる技術の構成のチップ
インダクタの製造方法を図5について説明する。Next, a description will be given of a method of manufacturing a chip inductor having the configuration based on the above-mentioned premise with reference to FIG.
【0017】まず、電極板5の接着部7を、電極部8が
略平行で一平面上に位置するように、コア1の両端鍔部
3の端面に耐熱性絶縁接着剤6にて接着する(a)。ポ
リウレタン被覆電線などの導線4をコア1の巻回胴部2
に巻回し、導線4の両端の引き出し線11を電極板5の電
極部8の鍔部3端面に近い基部に巻回し、半田12にて接
続固定する(b)。 Firstly, bonding the bonding portion 7 of the electrode plates 5, so that the electrode portions 8 are positioned on a plane substantially parallel to the end surface of both end flange portion 3 of the core 1 in the heat-resistant insulating adhesive 6 (A). Winding barrel portion 2 of the lead wire 4 core 1 such as a polyurethane coated wire
Turn wound, wound the base close to the flange portion 3 the end face of the electrode portion 8 of the lead line 11 the conductive plate 5 at both ends of the guide line 4 is connected fixed with solder 12 (b).
【0018】さらに、半田12で接続した工程後のコア1
とそのコア1に巻回形成した導線4およびコア1の両端
に接着された電極板5と導線4の引き出し線11の接続部
分を含めて、コア1を電極板5の電極部8の一部を露出
させてモールド絶縁体9で被覆する(c)。そして、表
示インクや絶縁塗料などを焼き付けて表示部10を形成す
る。次いで、電極板5の電極部8の露出部分をモールド
絶縁体9の周面に沿って折り曲げる(d)。 Furthermore, after the step of connecting at Handa 12 Core 1
And including a connecting portion of the extraction line 11 of the winding forming the conductor 4 and is bonded to both ends of the core 1 electrodeposition plate 5 and the guide line 4 on the core 1, the electrostatic electrode plate core 1 5 A part of the electrode part 8 is exposed and covered with a mold insulator 9 (c). Then, the display unit 10 is formed by baking display ink, insulating paint, or the like. Then, the exposed portion of the electrode portion 8 of the conductive plate 5 bent along the peripheral surface of the mold insulating body 9 (d).
【0019】次に、上記前提となる技術の構成の作用を
説明する。[0019] to the next, a description will be given of the operation of the configuration of the technologies that are the premise.
【0020】電極板5が半田メッキ銅線などのリード線
とフープ状に加工された電極板を兼ねて、経済的に製造
でき、半田付けする工程を減少できると共に、製造工程
などが省略できる。さらに、電極板5に導線4からの引
き出し線11を直接巻回して半田12付けされるため、この
電極板5と引き出し線11の接続が確実である。The electrode plate 5 can be manufactured economically by using a lead wire such as a solder-plated copper wire and an electrode plate processed in a hoop shape, so that the number of soldering steps can be reduced and the manufacturing steps can be omitted. Further, since the solder 12 with a lead line 11 by turning directly wound from wire 4 to electrostatic electrode plate 5, it is a reliable connection of the electrode plate 5 and the lead wire 11.
【0021】次に、本発明の一実施例を図6ないし図9
を参照して説明する。Next, an embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG.
【0022】電極板5の電極部8のコア1の鍔部3端面
側に位置する基部に向って幅が狭くなるように両側縁を
テーパ状となるように傾斜状に折線に亘って切り込ん
で、導線4の引き出し線11を巻回する巻回部13を形成す
る。この構成により、導線4がコア1の鍔部3に接近し
て定位置に巻回できる。The electrodes 8 of the electrode plate 5 are cut along the fold line in such a manner that both side edges are tapered so that the width decreases toward the base located on the end face side of the flange 3 of the core 1 of the core 1. , to form a winding portion 13 for winding the lead wire 11 of the conductor 4
You. With this configuration , the conductor 4 can be wound at a fixed position by approaching the flange 3 of the core 1.
【0023】次に、本発明の他の実施例を図7を参照し
て説明する。図7に示すように、切り込み部14を折り返
して導線4の引き出し線11を巻回する巻回部13を形成す
る。この構成により、この引き出し線11が切り込みの縁
であるエッジ部により切断および損傷することを防止で
きる。 Next , another embodiment of the present invention will be described with reference to FIG.
Will be explained. As shown in FIG. 7, the cut portion 14 is folded to form a winding portion 13 for winding the lead wire 11 of the conductor 4 .
You. Edge of this configuration, the lead line 11 is cut
Can be prevented from being cut and damaged Ri by the edge portion is.
【0024】次に、本発明の他の実施例を図8を参照し
て説明する。図8に示すように、電極板5の接着部7に
1ないし複数個の切り込み部15を形成する。この構成に
より、接着部7の接着外周線が拡大し、接着効果を高め
ることができる。 Next , another embodiment of the present invention will be described with reference to FIG.
Will be explained. As shown in FIG. 8, one or a plurality of cut portions 15 are formed in the bonding portion 7 of the electrode plate 5 . In this configuration
Thereby , the bonding outer peripheral line of the bonding portion 7 is enlarged, and the bonding effect can be enhanced.
【0025】次に、本発明の他の実施例を図9を参照し
て説明する。図9に示すように、コア1の鍔部3の端面
に略円錐状の凹弧状面16を形成し、この凹弧状面16に沿
って曲面状とした電極板5の接着部7を断熱性絶縁接着
剤6にて接着する。この構成により、この電極板5の接
着部7と耐熱性絶縁接着剤6との厚み分を小型化でき
る。 Next , another embodiment of the present invention will be described with reference to FIG.
Will be explained. As shown in FIG. 9, a substantially conical concave surface 16 is formed on the end surface of the flange portion 3 of the core 1, and the bonding portion 7 of the electrode plate 5 having a curved surface along the concave surface 16 is made of a heat insulating material. Adhesion is performed with an insulating adhesive 6 . This configuration can be miniaturized thickness of the adhesive portion 7 and heat-resistant insulating adhesive 6 of the electrode plate 5.
【0026】[0026]
【発明の効果】請求項1に記載の発明によれば、電極板
の電極部の基端に設けられ導線の引き出し線を巻回する
巻回部を、電極部の両側縁に接着部との折線に亘って傾
斜して切り込みを設けてコアの端面に向けて幅狭に形成
するため、導線の引き出し線をコアの端面に沿って近接
した定位置に巻回できると共に小型化できる。According to the invention described in claim 1 according to the present invention, the <br/> winding portion for winding the lead wire of the provided conductor to the proximal end of the electrode portion of the conductive plate, both side edges of the electrode portions At the bent line with the adhesive
Beveled notch and narrowed toward core end face
To reason, cut with miniaturization co If can be wound in close <br/> the position along the lead lines of the conductor on the end surface of the core.
【0027】請求項2に記載の発明によれば、請求項1
に記載のチップインダクタの効果に加え、電極板の巻回
部に切り込みの縁で折り返し部を折り返し形成したた
め、導線の引き出し線が電極板の切り込みの縁で切断さ
れたり傷付けられることなく巻回でき、歩留まりが向上
する。According to the invention described in claim 2 , according to claim 1
In addition to the effects of the chip Inductors described, for forming folded folded portion at the edge of the cut in the windings of the electrode plates, Ku wound such that the lead wire of the lead is scratched or cut at the cutting edges made of the electrode plate And yield is improved.
【0028】請求項3に記載の発明によれば、請求項1
または2に記載のチップインダクタの効果に加え、電極
板の接続部に1ないし複数の切り込み部を切り込み形成
するため、コアの鍔部と電極板の接着部との接着強度が
向上し、歩留まりが向上すると共に安定した品質が得ら
れる。According to the invention described in claim 3 , according to claim 1
Or in addition to the effect of the chip inductor described in 2,
To form cuts one or a plurality of cut portions in the connection portion of the plate, to improve the adhesive strength between the adhesive portion of the flange portion of the core and the electrode plate with a stable quality can be obtained in co the yield is improved.
【0029】請求項4に記載の発明によれば、請求項1
ないし3のいずれか一に記載のチップインダクタの効果
に加え、コアの鍔部の端面に凹弧状面部を形成するた
め、この凹弧状面内に接着剤の層厚および電極板の接着
部の板厚を配設することができ、さらに小型化できる。According to the invention described in claim 4 , according to claim 1 of the present invention,
The effect of the chip inductor according to any one of the above items 1 to 3
In addition, to form a concave arcuate surface portions on the end face of the flange portion of the core, it is possible to dispose the plate thickness of the adhesive portion of the layer thickness of the adhesive and the electrode plate into the concave arc-shaped plane, it is small in al Can be
【図1】本発明の一実施例を示すチップインダクタの縦
断正面図である。FIG. 1 is a vertical sectional front view of a chip inductor showing one embodiment of the present invention.
【図2】同上コアと電極板との斜視図である。FIG. 2 is a perspective view of the same core and an electrode plate.
【図3】同上の正面図である。FIG. 3 is a front view of the same.
【図4】同上チップインダクタの斜視図である。FIG. 4 is a perspective view of the same chip inductor.
【図5】(a)、(b)、(c)、(d)は、本発明の
チップインダクタの製造工程図である。FIGS. 5 (a), (b), (c), and (d) are manufacturing process diagrams of the chip inductor of the present invention.
【図6】本発明の他の実施例を示すチップインダクタの
コアと電極板との平面図である。FIG. 6 is a plan view of a core and an electrode plate of a chip inductor according to another embodiment of the present invention.
【図7】本発明の他の実施例を示すチップインダクタの
電極板の展開図である。FIG. 7 is a developed view of an electrode plate of a chip inductor according to another embodiment of the present invention.
【図8】本発明の他の実施例を示すチップインダクタの
コアと電極板との斜視図である。FIG. 8 is a perspective view of a core and an electrode plate of a chip inductor according to another embodiment of the present invention.
【図9】本発明の他の実施例を示すチップインダクタの
コアと電極板との一部を切りそいだ正面図である。FIG. 9 is a front view of a chip inductor according to another embodiment of the present invention, in which a part of a core and an electrode plate are cut away.
【図10】(a)、(b)、(c)、(d)、(e)
は、従来のチップインダクタの製造工程図である。FIG. 10 (a), (b), (c), (d), (e)
FIG. 2 is a manufacturing process diagram of a conventional chip inductor.
1 コア 2 巻回胴部 3 鍔部 4 導線 5 電極板 6 耐熱性絶縁接着剤 7 接着部 8 電極部 9 モールド絶縁体 11 引き出し線 12 半田 DESCRIPTION OF SYMBOLS 1 Core 2 Winding trunk part 3 Flange part 4 Conductor wire 5 Electrode plate 6 Heat resistant insulating adhesive 7 Adhesive part 8 Electrode part 9 Mold insulator 11 Lead wire 12 Solder
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−185906(JP,A) 特開 平1−223709(JP,A) 特開 昭60−214509(JP,A) 特開 昭58−166713(JP,A) 特開 昭64−46907(JP,A) 実開 平1−173916(JP,U) 実開 昭64−394(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01F 27/28,27/29 H01F 27/32,41/04 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-185906 (JP, A) JP-A-1-223709 (JP, A) JP-A-60-214509 (JP, A) JP-A 58-185 166713 (JP, A) JP-A-64-46907 (JP, A) JP-A-1-173916 (JP, U) JP-A-64-394 (JP, U) (58) Fields investigated (Int. 7 , DB name) H01F 27 / 28,27 / 29 H01F 27 / 32,41 / 04
Claims (4)
た断面が略H状のコアと、このコアの巻回胴部に巻回形
成された導線と、前記コアの鍔部の両端面に耐熱性絶縁
接着剤にてそれぞれ接着された一対の電極板と、前記コ
アと共に前記導線を前記電極板の一部を露出させて覆う
モールド絶縁体とを備え、 前記電極板は、前記コアの端面に接着される接着部と、
この接着部に折線を介して連続し前記モールド絶縁体の
内部から外部に先端側の一部が露出する電極部と、この
電極部の基端に設けられ両側縁に前記折線に亘って傾斜
して切り込みが設けられて前記コアの鍔部の端面に向け
て幅狭に形成され前記導線の両端の引き出し線が巻回さ
れて半田にて接続される巻回部とを具備したことを特徴
としたチップインダクタ。And 1. A winding barrel core, respectively cross-section to form a flange portion on both ends of the substantially H-shaped, and the wound formed conducting wire winding barrel portion of the core, both ends of the flange portion of said core comprising a pair of electrode plates which are bonded respectively in the heat-resistant insulating adhesive surface and a mold insulator said conductive wire together with said core covering to expose part of the electrode plate, the electrode plate, the core A bonding portion bonded to the end face of the
An electrode portion which is partially exposed on the distal end side to <br/> inside or al outer portion of succession the mold insulator via fold lines to the adhesive portion, the
Provided at the base end of the electrode section and sloped on both sides along the fold line
And a notch is provided toward the end face of the flange of the core.
Width is formed to a narrow Te leading lines winding of both ends of said conductor
It is in chip inductors characterized by comprising a winding section connected by soldering.
返し部が折り返し形成されたことを特徴とした請求項1
に記載のチップインダクタ。Wherein windings of conductive electrode plate, according to claim <br/> return part folding the edge of the notch is characterized in that it is folded form 1
A chip inductor according to claim 1.
込み部が切り込み形成されたことを特徴とした請求項1
または2に記載のチップインダクタ。3. A conductive adhesive portion of the electrode plate, according to claim 1 characterized in that one or a plurality of cut portions are cut formed
Or the chip inductor according to 2 .
にて電極板が接着される凹弧状面部を有したことを特徴
とした請求項1ないし3のいずれか一に記載のチップイ
ンダクタ。 The flange portion of wherein core is according to any one of claims 1 to, characterized in that the electrode plates in heat resistance insulation adhesive has have a concave arc-like surface that will be bonded 3 to the end face Chip inductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04026702A JP3090756B2 (en) | 1992-02-13 | 1992-02-13 | Chip inductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04026702A JP3090756B2 (en) | 1992-02-13 | 1992-02-13 | Chip inductor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0722249A JPH0722249A (en) | 1995-01-24 |
JP3090756B2 true JP3090756B2 (en) | 2000-09-25 |
Family
ID=12200724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP04026702A Expired - Fee Related JP3090756B2 (en) | 1992-02-13 | 1992-02-13 | Chip inductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3090756B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4983389B2 (en) * | 2007-05-16 | 2012-07-25 | Tdk株式会社 | Coil parts |
JP4905324B2 (en) * | 2007-11-01 | 2012-03-28 | パナソニック株式会社 | Coil parts |
-
1992
- 1992-02-13 JP JP04026702A patent/JP3090756B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JPH0722249A (en) | 1995-01-24 |
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