JPH0618146B2 - Chip inductor manufacturing method - Google Patents
Chip inductor manufacturing methodInfo
- Publication number
- JPH0618146B2 JPH0618146B2 JP62229352A JP22935287A JPH0618146B2 JP H0618146 B2 JPH0618146 B2 JP H0618146B2 JP 62229352 A JP62229352 A JP 62229352A JP 22935287 A JP22935287 A JP 22935287A JP H0618146 B2 JPH0618146 B2 JP H0618146B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- lead wire
- lead
- shaped terminal
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、回路基板に表面実装可能な巻線形樹脂成形
タイプのチップインダクタを製造する方法に関するもの
である。更に詳しく述べると、インダクタ本体を複数本
並べて、それらの各リード線間にかけ渡されるようにテ
ープ状端子板を接続し、樹脂モールド後、前記テープ状
端子板を切断して樹脂外被に沿って折り曲げリード端子
を形成するチップインダクタの製造方法に関するもので
ある。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a wire-wound resin molded type chip inductor which can be surface-mounted on a circuit board. More specifically, a plurality of inductor bodies are arranged side by side, tape-shaped terminal plates are connected so as to be bridged between their respective lead wires, and after resin molding, the tape-shaped terminal plates are cut and cut along the resin jacket. The present invention relates to a method for manufacturing a chip inductor that forms a bent lead terminal.
回路基板に対して表面実装が可能なチップインダクタと
して、従来から様々な方式のものが開発されている。そ
の一つに巻線形の樹脂成形タイプがある。これは例え
ば、先端を潰して幅広部を形成したリード線をコアの両
端面に固着し、該リード線の基部に前記コアに巻き回し
た巻線端末を絡げて接続し、巻線したコアの部分を樹脂
外被で覆い、前記リード線を折り曲げて樹脂外被の底面
に幅広部を沿わせるように構成されている。Various types of chip inductors have been developed as surface mountable chip inductors for circuit boards. One of them is the winding type resin molding type. For example, a lead wire having a wide portion formed by crushing the tip is fixed to both end faces of the core, a winding terminal wound around the core is entwined and connected to the base portion of the lead wire, and the wound core is wound. Is covered with a resin jacket, and the lead wire is bent so that the wide portion extends along the bottom surface of the resin jacket.
しかしながら上記のようにリード線をプレスで潰して幅
広部を形成する構成では、薄く潰すために加工硬化によ
ってリード線が非常に脆くなる問題がある。一般にこの
種のリード線はかなり細いから、薄く潰しても半田付け
用のリード端子の面積を大きくできない欠点もある。こ
のため実際に回路基板の配線部に直接搭載した場合、接
続の信頼性の点で問題が多い。However, in the structure in which the wide portion is formed by crushing the lead wire by pressing as described above, there is a problem that the lead wire becomes extremely brittle due to work hardening because it is crushed thinly. Generally, since this kind of lead wire is quite thin, there is a drawback that the area of the lead terminal for soldering cannot be increased even if it is crushed thinly. Therefore, when actually mounted directly on the wiring portion of the circuit board, there are many problems in terms of connection reliability.
また実際にそれを製造する過程においては、リード線の
両端を紙テープ等で仮止めして搬送しているが、整列精
度が上がらず、そのため樹脂外被を形成するモールド工
程で歩留りが低下したり型締め時に噛み込みによる金型
の損傷等が生じ易い。Also, in the process of actually manufacturing it, both ends of the lead wire are temporarily fastened with paper tape or the like and transported, but the alignment accuracy does not improve, so the yield decreases in the molding process for forming the resin jacket. The mold is likely to be damaged due to biting when the mold is clamped.
この発明の目的は上記のような従来技術の欠点を解消
し、リード端子の形状と面積を自由に選定でき、そのた
め回路基板の配線部への半田付けの信頼性が高く、また
樹脂モールドの工程での作業性を高め歩留りを向上でき
ると共に金型の損傷を防ぐことができるチップインダク
タの製造方法を提供することにある。The object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, and to freely select the shape and area of the lead terminal, so that the reliability of soldering to the wiring portion of the circuit board is high, and the resin molding process It is an object of the present invention to provide a method for manufacturing a chip inductor capable of improving workability in a manufacturing process, improving yield, and preventing damage to a mold.
この発明は巻線形樹脂成形タイプのチップインダクタを
製造する方法であり、次の工程を含んでいる。The present invention is a method for manufacturing a wire wound resin molded type chip inductor, which includes the following steps.
まずコアに巻線を施し、該コアの両側に固着されてい
るリード線の基部に巻線端末を接続してインダクタ本体
を構成する。First, the core is wound, and the winding ends are connected to the bases of the lead wires fixed to both sides of the core to form the inductor body.
そしてそのインダクタ本体を複数本並列して各リード
線にかけ渡されるようにテープ状端子板を溶接またはロ
ウ付け等の手法により固着接続する。Then, a plurality of the inductor bodies are arranged in parallel and the tape-shaped terminal plates are fixedly connected by a technique such as welding or brazing so as to be laid over the respective lead wires.
そして巻線を施したコアの部分を合成樹脂でモールド
し樹脂外被を形成した後、 テープ状端子板を切断して一個一個に分離し、 それを前記樹脂外被に沿って折り曲げリード端子を形
成する。After molding the wound core part with synthetic resin to form a resin jacket, cut the tape-shaped terminal board into individual pieces and fold them along the resin jacket to form lead terminals. Form.
この発明は上記ののテープ状端子板を接続する点、並
びに樹脂モールド後にのようにそれを切断する点に大
きな特徴を有している。The present invention has a great feature in that the above-mentioned tape-shaped terminal plate is connected and that it is cut as after resin molding.
リード線および端子板の折り曲げは、リード線が内側に
くる向きで行う。この時、リード線が収まるように樹脂
外被に溝を形成しておくのがよい。Bend the lead wire and terminal board so that the lead wire is inside. At this time, it is preferable to form a groove in the resin jacket so that the lead wire can be accommodated.
この発明では、多数本並列された各リード線にかけ渡さ
れるようにテープ状端子板を接続しており、このテープ
状端子板がリード端子となる。従って半田付け部を任意
の形状にできると共にその面積を大きくできる。この
時、樹脂外被の底面のみならず側面の一部まで覆うよう
な形状にもでき、そうすることによって回路基板の配線
部に直接搭載する際の半田付け状態（半田上がり部）が
目視可能となる。またこのリード端子は従来技術と異な
って加工硬化が生じないから機械的強度も十分で信頼性
の高い接続が達成される。In the present invention, the tape-shaped terminal plate is connected so as to be bridged over a large number of the lead wires arranged in parallel, and the tape-shaped terminal plate serves as the lead terminal. Therefore, the soldering portion can be formed in any shape and its area can be increased. At this time, it is possible to form not only the bottom surface of the resin jacket but also a part of the side surface, so that the soldering state (solder rise part) when mounting directly on the wiring part of the circuit board can be visually confirmed. Becomes Further, unlike the prior art, work hardening does not occur in this lead terminal, so that a connection with sufficient mechanical strength and high reliability is achieved.
またこの発明ではリード線のコア寄りの部分をテープ状
の端子板で固着するため、インダクタ本体の整列精度が
向上し強固な結合状態を実現できる。このため樹脂外被
を設けるモールド工程での歩留りが向上し、また型締め
時の噛み込みによる金型の損傷を防止できる。Further, in the present invention, since the portion of the lead wire close to the core is fixed by the tape-shaped terminal plate, the alignment accuracy of the inductor body is improved, and a strong coupling state can be realized. For this reason, the yield in the molding step of providing the resin jacket is improved, and damage to the mold due to biting during mold clamping can be prevented.
このようにテープ状端子板は、製造工程中、特に樹脂モ
ールドの工程においては各インダクタ本体を正確な位置
関係で保持する作用を果たすと共に、切断後は実装に適
した形状と面積を持ったリード端子となる。In this way, the tape-shaped terminal plate has the function of holding each inductor body in a precise positional relationship during the manufacturing process, especially during the resin molding process, and after cutting, it has a shape and area suitable for mounting. It becomes a terminal.
第１図はこの発明に係るチップインダクタを製造する方
法の一例を示す工程説明図である。FIG. 1 is a process explanatory view showing an example of a method for manufacturing a chip inductor according to the present invention.
先ず同図Ａに示すように、両端にリード線１０を固着し
たコア１２に巻線１４を施し、その端末をそれぞれリー
ド線１０の基部に絡げて半田付けしてインダクタ本体１
６を構成する。ここで例えばコア１２はフェライト焼結
品等からなり、リード線１０として半田メッキした銅線
を用い、その端部をコア１２の端面に形成した穴に挿入
して接着する。巻線用の線材としては、ポリウレタン被
覆銅線等を用いる。First, as shown in FIG. 1A, a winding wire 14 is formed on a core 12 to which lead wires 10 are fixed at both ends, and the ends of the winding wires 14 are entwined with the base parts of the lead wires 10 and soldered to form the inductor body 1.
Make up 6. Here, for example, the core 12 is made of a ferrite sintered product or the like, a solder-plated copper wire is used as the lead wire 10, and an end portion thereof is inserted into a hole formed in the end surface of the core 12 and bonded. A polyurethane-coated copper wire or the like is used as the wire material for the winding.
次にこのようなインダクタ本体１６を所定の間隔で多数
本並列し（同図Ｂ参照）、各リード線１０の先端を紙テ
ープ１８等で仮止め固定する。その状態で各リード線１
０の中間部にかけ渡されるようにテープ状端子板２０を
載せ、スポット溶接あるいはロウ付け等により連結接続
する。テープ状端子板２０としては、例えば半田メッキ
した薄い銅板等が好適である。テープ状端子板２０とコ
ア１２の端面との間隔は最終製品の形状に応じて決めら
れる。その後仮想線で示されているように巻線１４を施
したコア１２の部分をエポキシやポリエステル等の合成
樹脂でモールドし樹脂外被２２を形成する。Next, a large number of such inductor bodies 16 are juxtaposed in parallel at a predetermined interval (see B in the same figure), and the leading ends of the lead wires 10 are temporarily fixed by paper tape 18 or the like. Each lead wire 1 in that state
The tape-shaped terminal plate 20 is placed so as to be laid over the middle portion of 0, and is connected and connected by spot welding or brazing. As the tape-shaped terminal plate 20, for example, a solder-plated thin copper plate or the like is suitable. The distance between the tape-shaped terminal plate 20 and the end surface of the core 12 is determined according to the shape of the final product. Thereafter, as shown by the phantom line, the portion of the core 12 on which the winding wire 14 is applied is molded with a synthetic resin such as epoxy or polyester to form a resin jacket 22.
そして同図Ｃに示すように、テープ状端子板２０を中間
部で切断すると共にリード線１０のテープ状端子板２０
からはみ出した部分を切断して一個一個に分離し、同図
Ｄに示すようにそれを樹脂外被２２に沿ってリード線が
内側に位置するように折り曲げリード端子２４を形成す
る。Then, as shown in FIG. 6C, the tape-shaped terminal plate 20 is cut at the intermediate portion and the tape-shaped terminal plate 20 of the lead wire 10 is cut.
The protruding portion is cut and separated into individual pieces, and as shown in FIG. 4D, bent lead terminals 24 are formed along the resin jacket 22 so that the lead wires are located inside.
第２図および第３図は最終製品の内部構造および外観を
示している。基本的な構成は前記製造工程について説明
した第１図Ｄと同様である。ただリード線１０は細いと
はいえ一定の線径を有するから実際には第２図および第
３図に示されているように、樹脂外被２２の形状に工夫
を施しリード線１０が沿う側面並びに底面の部分に溝３
０を設けてリード線１０がその内部に収まるようにした
り、端子板が配設される部分にそれと同等の深さの段部
３２を設けるとリード端子２４を極めてスマートに形成
できるし位置精度も良好となる。それ故、自動実装機に
よる回路基板配線部への直接搭載作業もスムーズに行な
える。2 and 3 show the internal structure and appearance of the final product. The basic structure is the same as that shown in FIG. 1D for the manufacturing process. However, since the lead wire 10 is thin but has a constant wire diameter, in reality, as shown in FIGS. 2 and 3, the side surface along which the lead wire 10 is provided by devising the shape of the resin jacket 22. And groove 3 on the bottom
0 is provided so that the lead wire 10 can be accommodated therein, or the step portion 32 having a depth equivalent to that is provided in the portion where the terminal plate is provided, the lead terminal 24 can be formed extremely smartly and the positional accuracy can be improved. It will be good. Therefore, the direct mounting work on the circuit board wiring portion by the automatic mounting machine can be smoothly performed.
特に上記実施例のように端子板を折り曲げて樹脂外被２
２の底部のみならず側部の一部も覆うような構成（符号
ａで示す部分）とすると、実際に回路基板の配線部に直
接搭載する際に半田付け状態（半田上がり部）を目視で
きるため信頼性の高い接続が可能となり望ましい。In particular, as in the above-mentioned embodiment, the terminal board is bent and the resin jacket 2
When the configuration is such that not only the bottom portion of 2 but also a part of the side portion is covered (the portion indicated by reference numeral a), the soldering state (solder rising portion) can be visually observed when actually mounted directly on the wiring portion of the circuit board. Therefore, highly reliable connection is possible, which is desirable.
以上この発明の好ましい実施例について詳述したが、こ
の発明は上記のような構成のみに限定されるものではな
い。上記の実施例ではリード線の両端部を紙テープ等に
より仮止めする構成であるが、インダクタ本体を治具等
に整列して保持できるようにしておけば、紙テープによ
る仮止めなしに直接テープ状端子板の接続により整列保
持することもできる。なおその場合リード線の長さを端
子板からはみ出さないように設定しておけば、後工程で
リード線を切断する必要もなくなる。Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described configurations. In the above embodiment, both ends of the lead wire are temporarily fixed with paper tape or the like, but if the inductor body can be aligned and held with a jig or the like, the tape-shaped terminal can be directly attached without temporary fixing with paper tape. It can also be held in line by connecting the plates. In that case, if the length of the lead wire is set so as not to protrude from the terminal plate, it is not necessary to cut the lead wire in a later step.
テープ状端子板は、単なる均等幅の金属板でなく、最終
的な端子形状に合わせて種々形状を変更することも可能
である。またリード線を極力直角に近い状態で容易に折
り曲げることができるように、折り曲げ部の個所でその
一部を潰したり、機械的強度が損なわれない程度に刻み
や切欠きを設けることも有効である。テープ状端子板と
リード線との接続は、電気抵抗を極力小さくすると共に
機械的な強度を保つために溶接又はロウ付けが望ましい
が、場合によってはかしめ等による機械的な接続も採用
可能である。更にリード線の断面が丸い場合、テープ状
端子板とリード線との接続を容易にし信頼性を高めるた
めには、リード線の接続個所を多少潰して偏平にするこ
とも有効である。The tape-shaped terminal plate is not simply a metal plate having a uniform width, but various shapes can be changed according to the final terminal shape. It is also effective to crush a part of the bent part at the bent part or to provide a notch or notch so that the mechanical strength is not impaired so that the lead wire can be bent easily in a state of being as close to a right angle as possible. is there. It is desirable to connect the tape-shaped terminal plate and the lead wire by welding or brazing in order to minimize electric resistance and maintain mechanical strength, but in some cases, mechanical connection such as caulking can also be adopted. . Further, in the case where the lead wire has a round cross section, it is also effective to flatten the connection portion of the lead wire by crushing it a little in order to facilitate the connection between the tape-shaped terminal plate and the lead wire and enhance the reliability.
〔発明の効果〕 この発明は前記のように巻線形の樹脂成形タイプのチッ
プインダクタの製造において、複数本並列したインダク
タ本体の各リード線にかけ渡されるようにテープ状端子
板を接続し、コア部分の樹脂モールドを行った後、テー
プ状端子板を切断して樹脂外被に沿って折り曲げてリー
ド端子を形成する方法であるから、リード線端子の形状
や面積を半田付けを行うのに適したものとすることがで
き、また樹脂外被の側部まで折り曲げることもできるか
ら半田付け状態を目視することもでき、信頼性の高い半
田付けを行なえるチップインダクタが得られる。[Effects of the Invention] In the present invention, as described above, in the manufacture of the wire-wound resin molding type chip inductor, the tape-shaped terminal plate is connected so as to be laid over each lead wire of the plurality of inductor bodies arranged in parallel, This is a method of forming the lead terminal by cutting the tape-shaped terminal board and bending it along the resin outer cover after performing the resin molding of the method. Therefore, it is suitable for soldering the shape and area of the lead wire terminal. In addition, since it can be bent to the side of the resin jacket, the soldering state can be visually checked, and a chip inductor capable of highly reliable soldering can be obtained.
またこの発明では、各リード線のコアに近い部分で金属
製のテープ状端子板がかけ渡されるように接続されてい
るから、インダクタ本体の整列精度が向上し強固な連結
状態を作ることができる。そのため樹脂外被を形成する
モールド工程での歩留りが向上し、型締め時に噛み込み
による金型の損傷を防ぐことができ、高精度で且つ効率
よくチップインダクタを製造することが可能となる。Further, according to the present invention, since the metal tape-shaped terminal plates are connected so as to be bridged in the portions close to the cores of the lead wires, the alignment accuracy of the inductor body is improved and a strong connection state can be created. . Therefore, the yield in the molding step of forming the resin jacket is improved, damage to the mold due to biting during mold clamping can be prevented, and the chip inductor can be manufactured with high accuracy and efficiency.
第１図Ａ〜Ｄはこの発明におけるチップインダクタ製造
工程の一例を示す説明図、第２図は本発明により得られ
るチップインダクタの内部構造の一例を示す斜視図、第
３図はその外観斜視図である。 １０……リード線、１２……コア、１４……巻線、１６
……インダクタ本体、２０……テープ状端子板、２２…
…樹脂外被、２４……リード端子。1A to 1D are explanatory views showing an example of a chip inductor manufacturing process in the present invention, FIG. 2 is a perspective view showing an example of an internal structure of a chip inductor obtained by the present invention, and FIG. 3 is an external perspective view thereof. Is. 10 ... Lead wire, 12 ... Core, 14 ... Winding wire, 16
...... Inductor body, 20 …… Tape-shaped terminal board, 22 ・ ・ ・
… Resin coating, 24… Lead terminals.
Claims (1)
れているリード線の端部に巻線端末を接続してインダク
タ本体とし、該インダクタ本体を複数本並列して各リー
ド線間にかけ渡されるようにテープ状端子板を接続し、
巻線を施したコアの部分を樹脂外被で覆った後、テープ
状端子板を切断して一個一個に分離し前記樹脂外被に沿
って折り曲げリード端子を形成することを特徴とするチ
ップインダクタの製造方法。1. A core is provided with a winding wire, a winding terminal is connected to the ends of lead wires fixed to both ends of the core to form an inductor body, and a plurality of the inductor bodies are arranged in parallel to each lead wire. Connect the tape-shaped terminal board so that it is spanned between
A chip inductor characterized in that after covering a wound core portion with a resin jacket, the tape-shaped terminal plate is cut into individual pieces and bent lead terminals are formed along the resin jacket. Manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62229352A JPH0618146B2 (en) | 1987-09-12 | 1987-09-12 | Chip inductor manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62229352A JPH0618146B2 (en) | 1987-09-12 | 1987-09-12 | Chip inductor manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6472517A JPS6472517A (en) | 1989-03-17 |
| JPH0618146B2 true JPH0618146B2 (en) | 1994-03-09 |
Family
ID=16890817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62229352A Expired - Lifetime JPH0618146B2 (en) | 1987-09-12 | 1987-09-12 | Chip inductor manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618146B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2797089B1 (en) * | 1999-07-29 | 2002-09-20 | Cit Alcatel | METHOD FOR OBTAINING A MODULE INCLUDING INDUCTIVE COILING AND CORRESPONDING MODULE |
| US7426780B2 (en) * | 2004-11-10 | 2008-09-23 | Enpirion, Inc. | Method of manufacturing a power module |
| JP6273483B2 (en) * | 2013-01-31 | 2018-02-07 | パナソニックＩｐマネジメント株式会社 | Coil parts |
| US9509217B2 (en) | 2015-04-20 | 2016-11-29 | Altera Corporation | Asymmetric power flow controller for a power converter and method of operating the same |
-
1987
- 1987-09-12 JP JP62229352A patent/JPH0618146B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6472517A (en) | 1989-03-17 |
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