JPH0722249A - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JPH0722249A JPH0722249A JP2670292A JP2670292A JPH0722249A JP H0722249 A JPH0722249 A JP H0722249A JP 2670292 A JP2670292 A JP 2670292A JP 2670292 A JP2670292 A JP 2670292A JP H0722249 A JPH0722249 A JP H0722249A
- Authority
- JP
- Japan
- Prior art keywords
- core
- electrode plate
- electrode
- chip inductor
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Insulating Of Coils (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、両端にフープ状のリー
ド線を設けたチップインダクタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip inductor having hoop-shaped lead wires at both ends.
【０００２】[0002]
【従来の技術】従来のチップインダクタ17は、図10に示
すように、フェライトなどのコア18の両端鍔部19に絶縁
性接着剤20にて半田メッキ銅線などのリード線21を接着
し（ａ）、ポリウレタン被覆電線などの導線22を前記コ
ア18の巻回胴部23に巻回し、この導線22の引き出し線24
を直接前記コア18の両端鍔部19に接着された前記リード
線21に巻回し半田25にて接続し（ｂ）、このリード線21
をフープ状に加工された電極板26に搭載して、その電極
板26と前記リード線21とをレーザにて半田付けし、この
半田25付け部分より先端のリード線21を切り落とした後
（ｃ）、このコア18と導線22とをモールド絶縁体27で覆
い（ｄ）、電極板26のモールド絶縁体27から露出した部
分を折り曲げた構造が採られている（ｅ）。2. Description of the Related Art In a conventional chip inductor 17, as shown in FIG. 10, a lead wire 21 such as a solder-plated copper wire is bonded to both end flanges 19 of a core 18 such as ferrite with an insulating adhesive 20 ( a), a conductive wire 22 such as a polyurethane-coated electric wire is wound around the winding body portion 23 of the core 18, and a lead wire 24 of the conductive wire 22 is provided.
Is directly wound around the lead wire 21 adhered to the flange portions 19 at both ends of the core 18 and connected by solder 25 (b).
Is mounted on an electrode plate 26 processed into a hoop shape, the electrode plate 26 and the lead wire 21 are soldered by a laser, and the lead wire 21 at the tip is cut off from the solder 25 soldered portion (c ), The core 18 and the conductive wire 22 are covered with a mold insulator 27 (d), and a portion of the electrode plate 26 exposed from the mold insulator 27 is bent (e).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の構造のチップインダクタ17では、フープ状に加工し
た電極板26および半田メッキ銅線などのリード線21が必
要であり、さらに、電極板26と半田メッキ銅線などのリ
ード線21をレーザによって半田付けする工程があり、材
料費がかさむと同時に非効率的である。そのうえ、前記
リード線21と電極板26をレーザによって半田付けする際
の熱ストレスが、導線22のレアショートの原因となり、
歩留まりが悪くなる。さらに、半田25付け後の前記リー
ド線21の先端部分は切り落とし破棄されるので不経済で
ある。また、フェライトなどのコア18、半田メッキ銅線
などのリード線21、ポリウレタン被覆電線などの導線22
を、フープ状に加工した電極板26に搭載する工程および
レーザによる前記リード線21と電極板26の半田付け工
程、また、不要となったリード線21の切り落とし工程の
設備が大型となる。さらに、導線22と電極板26との結線
に半田メッキ銅線などのリード線21を介するため、チッ
プインダクタ17の小型化に制約を受ける。However, in the above-described conventional chip inductor 17, the hoop-shaped electrode plate 26 and the lead wire 21 such as a solder-plated copper wire are required, and the electrode plate 26 and There is a step of soldering a lead wire 21 such as a solder-plated copper wire with a laser, which increases material cost and is inefficient. Moreover, thermal stress when soldering the lead wire 21 and the electrode plate 26 with a laser causes a rare short circuit of the conductive wire 22,
Yield deteriorates. Further, the tip portion of the lead wire 21 after soldering 25 is cut off and discarded, which is uneconomical. In addition, core 18 such as ferrite, lead wire 21 such as solder-plated copper wire, conductor wire 22 such as polyurethane coated electric wire 22
A large-scale facility is required for the step of mounting the above into the hoop-shaped electrode plate 26, the step of soldering the lead wire 21 and the electrode plate 26 with a laser, and the step of cutting off the unnecessary lead wire 21. Furthermore, since the lead wire 21 such as a solder-plated copper wire is interposed between the conductor wire 22 and the electrode plate 26, the miniaturization of the chip inductor 17 is restricted.
【０００４】本発明の目的は、上記の問題点を解決して
効率よく製造でき、しかも、省エネルギー対策にも効果
的で、経済的に製造できるチップインダクタを提供する
ことにある。It is an object of the present invention to provide a chip inductor which solves the above problems and can be manufactured efficiently, which is also effective in energy saving measures and which can be manufactured economically.
【０００５】[0005]
【課題を解決するための手段】請求項１に記載の本発明
のチップインダクタは、巻回胴部の両端にそれぞれ鍔部
を形成した断面が略Ｈ状のコアと、このコアの巻回胴部
に巻回形成した導線と、前記コアの両端鍔部の端面に耐
熱性絶縁接着剤にてそれぞれ接着した電極板と、前記コ
アと共に導線を前記電極板の一部を露出させて覆うモー
ルド絶縁体とを備え、前記電極板は、前記コア端面側に
接着される接着部と、前記モールド絶縁体内部からモー
ルド絶縁体外部に一部露出する電極部とを有する略Ｌ字
形状に形成され、前記導線の両端の引き出し線は、前記
各電極板にそれぞれ直接巻回して半田にて接続したこと
を特徴とするものである。A chip inductor according to the present invention as set forth in claim 1 has a core having a substantially H-shaped cross section in which collar portions are formed at both ends of the winding body, and the winding body of this core. Conductor wire wound around the core, an electrode plate adhered to the end faces of both end flanges of the core with a heat-resistant insulating adhesive, and a mold insulation covering the conductor wire with the core by exposing a part of the electrode plate. A body, and the electrode plate is formed in a substantially L-shape having an adhesive portion adhered to the core end surface side and an electrode portion partially exposed from the inside of the mold insulator to the outside of the mold insulator, The lead wires at both ends of the conducting wire are directly wound around the respective electrode plates and connected by soldering.
【０００６】請求項２に記載の本発明のチップインダク
タは、前記電極板の電極部は、前記コアの両端鍔部の端
面に向かい幅が狭くなる傾斜状の切り込みによって、前
記導線の引き出し線を巻回する巻回部を形成したことを
特徴とする請求項１に記載のものである。According to a second aspect of the present invention, in the chip inductor of the present invention, the electrode portion of the electrode plate is provided with a lead-out line of the lead wire by an inclining notch whose width narrows toward the end faces of the flange portions at both ends of the core. The winding part for winding is formed, The thing of Claim 1 characterized by the above-mentioned.
【０００７】請求項３に記載する本発明のチップインダ
クタは、前記電極板の電極部に形成した巻回部は、前記
コアの両端鍔部の端面に向かい幅が狭くなるように折り
返し部を形成したことを特徴とする請求項１に記載のも
のである。In the chip inductor of the present invention as set forth in claim 3, the winding portion formed on the electrode portion of the electrode plate has a folded portion such that the width becomes narrower toward the end faces of the flange portions at both ends of the core. It is what was described in Claim 1 characterized by the above.
【０００８】請求項４に記載の本発明のチップインダク
タは、前記コアの両端鍔部の端面側に接着される前記電
極板の接着部は、１ないし複数の切り込み部を形成した
ことを特徴とする請求項１に記載のものである。According to a fourth aspect of the present invention, in the chip inductor according to the present invention, one or a plurality of cut portions are formed in the adhesive portion of the electrode plate which is adhered to the end surfaces of the flange portions on both ends of the core. According to claim 1,
【０００９】請求項５に記載の本発明のチップインダク
タは、前記コアの両端鍔部の端面には、耐熱性断熱接着
剤にて電極板を接着させる凹弧状面部を形成したことを
特徴とする請求項１に記載のものである。According to a fifth aspect of the present invention, in the chip inductor of the present invention, a concave arc-shaped surface portion for adhering an electrode plate with a heat-resistant heat-insulating adhesive is formed on the end surfaces of the flange portions on both ends of the core. It is as described in claim 1.
【００１０】[0010]
【作用】請求項１に記載する発明のチップインダクタ
は、導線を巻回したコアの両端鍔部の端面に、絶縁性接
着剤にて接着した電極板の一部を露出させてモールド絶
縁体で被覆することによって、半田メッキ銅線などのリ
ード線が不要となり、半田メッキ銅線などのリード線を
絶縁性接着剤にて接着されたコアを電極板に搭載する工
程およびリード線と電極板をレーザによって半田付けす
る工程などが省略でき、経済的で効率よく製造できると
同時に、その半田付け工程が少なく、半田付けの際に発
生する熱ストレスがなくなり、レアショートが防止でき
て歩留まりが向上する。According to the chip inductor of the invention described in claim 1, a part of the electrode plate adhered by an insulating adhesive is exposed on the end faces of the flanges at both ends of the core around which the conductive wire is wound to form a molded insulator. By coating, lead wires such as solder-plated copper wires become unnecessary, and the process of mounting the core to which the lead wires such as solder-plated copper wires are bonded with an insulating adhesive on the electrode plate and the lead wires and electrode plate The process of soldering with a laser can be omitted, and at the same time, it can be manufactured economically and efficiently. At the same time, the number of soldering processes is small, the thermal stress generated during soldering is eliminated, rare short circuits can be prevented, and the yield is improved. .
【００１１】さらに、前記電極板に導線からの引き出し
線を直接巻回して半田付けされるため、この電極板と引
き出し線の接続が確実である。信頼性の高い安定したチ
ップインダクタが製造できる。Further, since the lead wire from the lead wire is directly wound around the electrode plate and soldered, the connection between the electrode plate and the lead wire is reliable. A highly reliable and stable chip inductor can be manufactured.
【００１２】また、チップインダクタの製造工程が簡略
化され、製造装置を安価に製造できる。Further, the manufacturing process of the chip inductor is simplified and the manufacturing apparatus can be manufactured at low cost.
【００１３】請求項２に記載の発明のチップインダクタ
は、電極板の電極部はコアに向かい幅が狭くなる切り込
みにて形成した巻回部を有する電極板を構成することに
よって、コイル状に巻回される導線の端を巻回部に巻回
する際、前記コアの端面に沿って近接して定位置に巻回
できる。In the chip inductor of the invention as defined in claim 2, the electrode portion of the electrode plate is wound in a coil shape by forming an electrode plate having a winding portion formed by a notch whose width narrows toward the core. When winding the end of the wound conductor wire around the winding portion, it can be wound in a fixed position close to the end face of the core.
【００１４】請求項３に記載の発明のチップインダクタ
電極板の電極部に形成した巻回部は、前記コアに向かい
幅が狭くなる折り返し部を形成することによって、巻回
された導線の引き出し線を巻回部に巻回する際、巻回さ
れる導線が電極板のエッジ部で切断されたり傷付けられ
ることがない。The winding portion formed on the electrode portion of the chip inductor electrode plate according to the third aspect of the present invention forms a turn-back portion having a narrow width toward the core to form a lead wire of the wound conductor wire. When the wire is wound around the winding portion, the wound conductive wire is not cut or damaged at the edge portion of the electrode plate.
【００１５】請求項４に記載の発明のチップインダクタ
は、コア両端鍔部の端面に耐熱性絶縁接着剤にて接着さ
れる電極板の接着部には、１ないし複数の切り込み部を
形成したので、前記コア両端の鍔部と電極板との接着強
度が向上し、歩留まりが向上する。In the chip inductor according to the fourth aspect of the present invention, one or a plurality of notches are formed in the adhesive portion of the electrode plate which is adhered to the end faces of the flange portions at both ends of the core with the heat-resistant insulating adhesive. The adhesive strength between the flanges at both ends of the core and the electrode plate is improved, and the yield is improved.
【００１６】請求項５に記載の発明のチップインダクタ
は、耐熱性絶縁接着剤にて電極板を接着させるコアの両
端鍔部の端面に、円錐状などの凹弧状面部を形成したた
め、前記コアの両端鍔部の端面に存する前記接着剤の層
厚および電極板に形成される接着部の板厚を前記凹弧状
面部内に配設することができ、チップインダクタをさら
に小型化できる。In the chip inductor of the present invention as defined in claim 5, since a conical or other concave arc-shaped surface portion is formed on the end surfaces of the flanges at both ends of the core to which the electrode plate is adhered with a heat resistant insulating adhesive, The layer thickness of the adhesive existing on the end faces of the flange portions on both ends and the plate thickness of the adhesive portion formed on the electrode plate can be arranged in the concave arc surface portion, and the chip inductor can be further downsized.
【００１７】[0017]
【実施例】本発明の一実施例のチップインダクタを図１
ないし図５について説明する。FIG. 1 shows a chip inductor according to an embodiment of the present invention.
5 to FIG.
【００１８】コア１は、フェライトにて巻回胴部２とこ
の巻回胴部２の両端に一体に形成した鍔部３とにて断面
が略Ｈ字形状に成型されている。このコア１と巻回胴部
２にポリウレタン被覆電線などの導線４を巻回する。ま
た、５は電極板で、前記コア１の鍔部３の両端面に耐熱
性絶縁接着剤６にて接着される接着部７とこの接着部７
の端部から略直角に折り曲げた電極部８を有し略Ｌ字形
状に形成されている。また、９はモールド絶縁体で、前
記コア１を前記電極板５の電極部８の一部を露出させて
覆う。そして、この電極板５のモールド絶縁体９から露
出された電極部８をモールド絶縁体９の外周に沿って折
り曲げ、このモールド絶縁体９の表面に表示インクおよ
び絶縁塗料などの表示部10を焼き付け形成する。The core 1 has a winding body 2 made of ferrite and a collar 3 integrally formed at both ends of the winding body 2 and is formed into a substantially H-shaped cross section. A conductor 4 such as a polyurethane-coated electric wire is wound around the core 1 and the winding body 2. Reference numeral 5 denotes an electrode plate, which is an adhesive portion 7 adhered to both end surfaces of the collar portion 3 of the core 1 with a heat-resistant insulating adhesive 6 and the adhesive portion 7.
It has an electrode portion 8 bent substantially at a right angle from the end portion thereof and is formed in a substantially L shape. A mold insulator 9 covers the core 1 by exposing a part of the electrode portion 8 of the electrode plate 5. Then, the electrode portion 8 of the electrode plate 5 exposed from the mold insulator 9 is bent along the outer periphery of the mold insulator 9, and the display portion 10 such as display ink and insulating paint is printed on the surface of the mold insulator 9. Form.
【００１９】なお、図３に鎖線で示すように、前記電極
板５の接着部７を前記コア１の鍔部３の端面略全面に接
着すれば、接着面積が拡大される。As shown by the chain line in FIG. 3, if the adhesive portion 7 of the electrode plate 5 is adhered to substantially the entire end surface of the collar portion 3 of the core 1, the adhesive area is enlarged.
【００２０】次に、上記実施例のチップインダクタの製
造方法を図５について説明する。Next, a method of manufacturing the chip inductor of the above embodiment will be described with reference to FIG.
【００２１】前記電極板５の接着部７を、電極部８が略
平行で一平面上に位置するように、前記コア１の両端鍔
部３の端面に耐熱性絶縁接着剤６にて接着する（ａ）。
ポリウレタン被覆電線などの導線４を前記コア１の巻回
胴部２に巻回し、前記導線４の両端の引き出し線11を前
記電極板５の電極部８の鍔部３端面に近い基部に巻回
し、半田12にて接続固定する（ｂ）。The adhesive portion 7 of the electrode plate 5 is adhered to the end faces of the flange portions 3 at both ends of the core 1 with a heat-resistant insulating adhesive 6 so that the electrode portions 8 are substantially parallel and located on one plane. (A).
A conducting wire 4 such as a polyurethane-coated electric wire is wound around the winding body portion 2 of the core 1, and the lead wires 11 at both ends of the conducting wire 4 are wound around a base portion of the electrode portion 8 of the electrode plate 5 near the end face of the collar portion 3. , Connect and fix with solder 12 (b).
【００２２】さらに、前記半田12で接続した工程後のコ
ア１とそのコア１に巻回形成した導線４および前記コア
１の両端に接着された前記電極板５と前記導線４の引き
出し線11の接続部分を含めて、前記コア１を前記電極板
５の電極部８の一部を露出させてモールド絶縁体９で被
覆する（ｃ）。そして、表示インクや絶縁塗料などを焼
き付けて表示部10を形成する。次いで、前記電極板５の
電極部８の露出部分をモールド絶縁体９の周面に沿って
折り曲げる（ｄ）。Further, the core 1 after the step of connecting with the solder 12, the conductive wire 4 wound around the core 1, the electrode plate 5 adhered to both ends of the core 1 and the lead wire 11 of the conductive wire 4. A part of the electrode portion 8 of the electrode plate 5 of the core 1 including the connecting portion is exposed and covered with a mold insulator 9 (c). Then, the display ink and the insulating paint are baked to form the display unit 10. Next, the exposed portion of the electrode portion 8 of the electrode plate 5 is bent along the peripheral surface of the mold insulator 9 (d).
【００２３】次いで、上記実施例の作用を説明する。Next, the operation of the above embodiment will be described.
【００２４】電極板５が半田メッキ銅線などのリード線
とフープ状に加工された電極板を兼ねて、経済的に製造
でき、半田付けする工程を減少できると共に、製造工程
などが省略できる。さらに、前記電極板５に導線４から
の引き出し線11を直接巻回して半田12付けされるため、
この電極板５と引き出し線11の接続が確実である。The electrode plate 5 also functions as a lead wire such as a solder-plated copper wire and an electrode plate processed into a hoop shape, which can be economically manufactured, the number of soldering steps can be reduced, and the manufacturing steps can be omitted. Furthermore, since the lead wire 11 from the lead wire 4 is directly wound around the electrode plate 5 and solder 12 is attached,
The connection between the electrode plate 5 and the lead wire 11 is reliable.
【００２５】次に、他の実施例を図６ないし図９につい
て説明する。Next, another embodiment will be described with reference to FIGS.
【００２６】電極板５の電極部８のコア１の鍔部３端面
側に位置する基部に向って幅が狭くなるように両側縁を
テーパ状となるように傾斜状に切り込んで、導線４の引
き出し線11を巻回する巻回部13を形成し、導線４がコア
１の鍔部３に接近して定位置に巻回できる。[0026] Both side edges of the electrode portion 8 of the electrode plate 5 are tapered so that the width thereof becomes narrower toward the base portion located on the end face side of the collar portion 3 of the core 1 and the conductor 4 is cut. A winding portion 13 for winding the lead wire 11 is formed so that the conducting wire 4 can be wound in a fixed position by approaching the flange portion 3 of the core 1.
【００２７】また、図７に示すように、切り込み部14を
折り返して導線４の引き出し線11を巻回する巻回部13を
形成し、この引き出し線11の切り込みエッジ部による切
断および損傷を防止できる。Further, as shown in FIG. 7, the cut portion 14 is folded back to form a winding portion 13 around which the lead wire 11 of the conducting wire 4 is wound to prevent cutting and damage by the cut edge portion of the lead wire 11. it can.
【００２８】また、図８に示すように、電極板５の接着
部７に１ないし複数個の切り込み部15を形成して、接着
外周線を拡大し、接着効果を高めることができる。Further, as shown in FIG. 8, one or a plurality of notches 15 are formed in the adhesive portion 7 of the electrode plate 5 to enlarge the adhesive peripheral line and enhance the adhesive effect.
【００２９】さらに、図９に示すように、コア１の鍔部
３の端面に略円錐状の凹弧状面16を形成し、この凹弧状
面16に沿って曲面状とした電極板５の電極部７を断熱性
絶縁接着剤６にて接着させ、この電極板５の接着部７と
耐熱性絶縁接着剤６の厚み分を小型化できる。Further, as shown in FIG. 9, a substantially conical concave arc surface 16 is formed on the end surface of the collar portion 3 of the core 1, and the electrode of the electrode plate 5 is curved along the concave arc surface 16. The portion 7 is adhered by the heat insulating insulating adhesive 6, and the thickness of the adhesive portion 7 of the electrode plate 5 and the heat resistant insulating adhesive 6 can be reduced.
【００３０】[0030]
【発明の効果】請求項１に記載する発明によれば、コア
の巻回胴部に導線を巻回し、この導線の両端の引き出し
線を前記コアの両端鍔部の端面に絶縁性接着剤で接着し
た電極板の電極部に半田付けし、モールド絶縁体で覆っ
て構成されることによって、電極板が電極を兼ね、従来
使用している半田メッキ銅線が不要となり、また、製造
の初期段階で絶縁性接着剤で接着された電極板は製造工
程中搬送用として用いられ、製造の最終工程でモールド
絶縁体の外周に沿って折り曲げられ電極となり、従来使
用しているリード線である半田メッキ銅線を切り落とし
て破棄されることがなくなり、材料費が節減できる。According to the invention described in claim 1, a conducting wire is wound around the winding body of the core, and the lead wires at both ends of the conducting wire are attached to the end faces of the flange portions at both ends of the core with an insulating adhesive. By soldering to the electrode part of the bonded electrode plate and covering it with a mold insulator, the electrode plate doubles as an electrode, and the solder-plated copper wire used in the past is no longer needed. The electrode plate adhered with an insulating adhesive is used for transportation during the manufacturing process, and is bent along the outer periphery of the mold insulator in the final process of the manufacturing process to become an electrode. Material cost can be reduced because the copper wire is not cut off and discarded.
【００３１】さらに、半田付け工程が少なくなり、装置
の消費電力が節電できると共に、半田付けの際に発生す
る熱ストレスがなくなり、レアショートが防止できて歩
留まりが良くなり、一個当たりのチップインダクタが安
価に製造できる。Furthermore, the number of soldering steps is reduced, the power consumption of the device can be saved, the thermal stress generated during soldering is eliminated, rare short circuits can be prevented, and the yield can be improved. It can be manufactured at low cost.
【００３２】また、前記電極板に導線の引き出し線を直
接巻回して半田付けされるため、この電極板と引き出し
線の接続が確実で、信頼性の高い安定したチップインダ
クタが製造できる。Further, since the lead wire of the lead wire is directly wound around the electrode plate and soldered, the connection between the electrode plate and the lead wire is reliable, and a highly reliable and stable chip inductor can be manufactured.
【００３３】また、フープ状に加工した電極板に、コイ
ルを巻回したコアを搭載する工程などの製造工程数が少
なくなり、単位時間当たりの製造量が増加し、チップイ
ンダクタが効率よく製造できる。そのうえ、製造装置を
小型化でき、製造装置を安価に製造することができる。Further, the number of manufacturing steps such as a step of mounting a coil-wound core on an electrode plate processed into a hoop shape is reduced, the production amount per unit time is increased, and the chip inductor can be efficiently produced. . Moreover, the manufacturing apparatus can be downsized, and the manufacturing apparatus can be manufactured at low cost.
【００３４】請求項２に記載する発明によれば、電極板
の電極部はコアに向かい幅が狭くなるように切り込みに
よる巻回部を形成したため、導線の引き出し線を巻回部
に巻回する際、前記コアの端面に沿って近接して定位置
に巻回できると共に、小型化の要求に対応できる。According to the second aspect of the present invention, the electrode portion of the electrode plate has the winding portion formed by cutting so that the width thereof becomes narrower toward the core. Therefore, the lead wire of the conducting wire is wound around the winding portion. At this time, the core can be wound in a fixed position in close proximity to the end face of the core, and a demand for miniaturization can be met.
【００３５】請求項３に記載する発明によれば、電極板
の電極部に形成した巻回部は、コアに向かい電極部の幅
が狭くなるように傾斜状に折り返し部を形成したため、
導線の引き出し線を巻回部に巻回する際、巻回される導
線が電極板のエッジで切断されたり傷付けられることな
く、前記コアの端面に沿って近接して定位置に巻回で
き、歩留まりが向上する。According to the third aspect of the present invention, the winding portion formed on the electrode portion of the electrode plate has the folded portion which is inclined so that the width of the electrode portion becomes narrower toward the core.
When winding the lead wire of the conductive wire around the winding portion, the wound conductive wire is not cut or scratched by the edge of the electrode plate, and can be wound in a fixed position in close proximity along the end face of the core, Yield improves.
【００３６】請求項４に記載する発明によれば、コアの
両端鍔部の端面に耐熱性絶縁接着剤にて接着される１な
いし複数の切り込みを有する接着部を形成する電極板を
構成することによって、前記鍔部と電極板との接着強度
が向上し、歩留まりが向上すると共に、安定した品質が
得られる。According to the invention described in claim 4, an electrode plate is formed which forms an adhesive part having one or a plurality of cuts adhered to the end faces of the flange parts at both ends of the core by a heat-resistant insulating adhesive. By this, the adhesive strength between the collar portion and the electrode plate is improved, the yield is improved, and stable quality is obtained.
【００３７】請求項５に記載する発明によれば、耐熱性
絶縁接着剤にて電極板を接着させるコアの両側鍔部の端
面に、凹弧状面部を形成し、この凹弧状面内に接着剤の
層厚および電極板の接着部の板厚を配設することがで
き、チップインダクタをさらに小型化できる。According to the invention described in claim 5, concave arc-shaped surface portions are formed on the end surfaces of the flange portions on both sides of the core to which the electrode plate is bonded with the heat-resistant insulating adhesive, and the adhesive agent is formed in the concave arc-shaped surfaces. It is possible to dispose the layer thickness of and the plate thickness of the bonding portion of the electrode plate, and the chip inductor can be further downsized.
【図１】本発明の一実施例を示すチップインダクタの縦
断正面図である。FIG. 1 is a vertical sectional front view of a chip inductor showing an embodiment of the present invention.
【図２】同上コアと電極板との斜視図である。FIG. 2 is a perspective view of the same core and electrode plate.
【図３】同上の正面図である。FIG. 3 is a front view of the above.
【図４】同上チップインダクタの斜視図である。FIG. 4 is a perspective view of the same chip inductor.
【図５】（ａ）、（ｂ）、（ｃ）、（ｄ）は、本発明の
チップインダクタの製造工程図である。5 (a), (b), (c), and (d) are manufacturing process diagrams of the chip inductor of the present invention.
【図６】本発明の他の実施例を示すチップインダクタの
コアと電極板との平面図である。FIG. 6 is a plan view of a core and an electrode plate of a chip inductor showing another embodiment of the present invention.
【図７】本発明の他の実施例を示すチップインダクタの
電極板の展開図である。FIG. 7 is a development view of an electrode plate of a chip inductor showing another embodiment of the present invention.
【図８】本発明の他の実施例を示すチップインダクタの
コアと電極板との斜視図である。FIG. 8 is a perspective view of a core and an electrode plate of a chip inductor showing another embodiment of the present invention.
【図９】本発明の他の実施例を示すチップインダクタの
コアと電極板との一部を切りそいだ正面図である。FIG. 9 is a front view in which a core and an electrode plate of a chip inductor according to another embodiment of the present invention are cut away.
【図１０】（ａ）、（ｂ）、（ｃ）、（ｄ）、（ｅ）
は、従来のチップインダクタの製造工程図である。10 (a), (b), (c), (d), (e).
FIG. 4 is a manufacturing process diagram of a conventional chip inductor.
１ コア ２ 巻回胴部 ３ 鍔部 ４ 導線 ５ 電極板 ６ 耐熱性絶縁接着剤 ７ 接着部 ８ 電極部 ９ モールド絶縁体 11 引き出し線 12 半田 1 Core 2 Winding Body 3 Collar 4 Conductor 5 Electrode Plate 6 Heat Resistant Insulating Adhesive 7 Adhesive 8 Electrode 9 Mold Insulator 11 Lead Wire 12 Solder
【手続補正書】[Procedure amendment]
【提出日】平成５年１０月６日[Submission date] October 6, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図５[Name of item to be corrected] Figure 5
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図５】 [Figure 5]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図１０[Name of item to be corrected] Fig. 10
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１０】 [Figure 10]
Claims (5)
た断面が略Ｈ状のコアと、このコアの巻回胴部に巻回形
成した導線と、前記コアの両端鍔部の端面に耐熱性絶縁
接着剤にてそれぞれ接着した電極板と、前記コアと共に
導線を前記電極板の一部を露出させて覆うモールド絶縁
体とを備え、 前記電極板は、前記コア端面側に接着される接着部と、
前記モールド絶縁体内部からモールド絶縁体外部に一部
露出する電極部とを有する略Ｌ字形状に形成され、 前記導線の両端の引き出し線は、前記各電極板にそれぞ
れ直接巻回して半田にて接続したことを特徴とするチッ
プインダクタ。1. A core having a substantially H-shaped cross section in which flanges are formed at both ends of a winding body, a conductor wire wound around the winding body of the core, and end faces of the flanges at both ends of the core. An electrode plate adhered to each other with a heat resistant insulating adhesive, and a mold insulator that covers the conductor wire together with the core by exposing a part of the electrode plate, and the electrode plate is adhered to the core end face side. Adhesive section,
The lead wire is formed in a substantially L shape having an electrode part that is partially exposed from the inside of the mold insulator to the outside of the mold insulator, and the lead wires at both ends of the lead wire are directly wound around the electrode plates and soldered. A chip inductor characterized by being connected.
鍔部の端面に向かい幅が狭くなる傾斜状の切り込みによ
って、前記導線の引き出し線を巻回する巻回部を形成し
たことを特徴とする請求項１に記載のチップインダク
タ。2. The electrode part of the electrode plate has a winding part for winding the lead wire of the conducting wire, which is formed by an inclined cut having a narrow width toward the end faces of the flange parts at both ends of the core. The chip inductor according to claim 1, which is characterized in that.
は、前記コアの両端鍔部の端面に向かい幅が狭くなるよ
うに折り返し部を形成したことを特徴とする請求項１に
記載のチップインダクタ。3. The winding portion formed on the electrode portion of the electrode plate has a folded portion formed so that the width becomes narrower toward the end faces of the flange portions at both ends of the core. Chip inductor.
る前記電極板の接着部は、１ないし複数の切り込み部を
形成したことを特徴とする請求項１に記載のチップイン
ダクタ。4. The chip inductor according to claim 1, wherein one or a plurality of cut portions are formed in the bonding portion of the electrode plate that is bonded to the end surface sides of the flange portions on both ends of the core.
断熱接着剤にて電極板を接着させる凹弧状面部を形成し
たことを特徴とする請求項１に記載のチップインダク
タ。5. The chip inductor according to claim 1, wherein a concave arc-shaped surface portion for adhering the electrode plate with a heat-resistant heat-insulating adhesive is formed on the end surfaces of the flange portions on both ends of the core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04026702A JP3090756B2 (en) | 1992-02-13 | 1992-02-13 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04026702A JP3090756B2 (en) | 1992-02-13 | 1992-02-13 | Chip inductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0722249A true JPH0722249A (en) | 1995-01-24 |
| JP3090756B2 JP3090756B2 (en) | 2000-09-25 |
Family
ID=12200724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04026702A Expired - Fee Related JP3090756B2 (en) | 1992-02-13 | 1992-02-13 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3090756B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288320A (en) * | 2007-05-16 | 2008-11-27 | Tdk Corp | Coil component |
| JP2009111314A (en) * | 2007-11-01 | 2009-05-21 | Panasonic Corp | Coil component |
-
1992
- 1992-02-13 JP JP04026702A patent/JP3090756B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288320A (en) * | 2007-05-16 | 2008-11-27 | Tdk Corp | Coil component |
| JP2009111314A (en) * | 2007-11-01 | 2009-05-21 | Panasonic Corp | Coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3090756B2 (en) | 2000-09-25 |
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