JP3089156B2 - Lead terminal connection device for ceramic heater - Google Patents
Lead terminal connection device for ceramic heaterInfo
- Publication number
- JP3089156B2 JP3089156B2 JP06053553A JP5355394A JP3089156B2 JP 3089156 B2 JP3089156 B2 JP 3089156B2 JP 06053553 A JP06053553 A JP 06053553A JP 5355394 A JP5355394 A JP 5355394A JP 3089156 B2 JP3089156 B2 JP 3089156B2
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- ceramic
- ceramic heater
- thermal stress
- metal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気暖房器に使用する
セラミックヒータにおいて、該セラミックヒータに設け
られた金属電極にリード端子を接続するセラミックヒー
タのリード端子接続装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic heater lead terminal connecting device for connecting a lead terminal to a metal electrode provided on a ceramic heater used in an electric heater.
【０００２】[0002]
【従来の技術】従来、セラミックヒータ２１に金属電極
２２を形成し、その金属電極２２にリード端子２３を接
続するには図６に示すように、セラミック基体表面に電
極となる金属電極２２を形成し、この金属電極２２に各
種のろう材２４を用いてリード端子２３をろう付けする
方法が一般的である。リード端子２３はセラミックヒー
タ２１に給電させる為、導電率の高い金属材料が使用さ
れるが、一般に金属材料はセラミックスに比べて熱膨張
率が大きい。そして、セラミックヒータ２１として使用
されるセラミック材料は、通電の繰り返しによる熱応力
に耐えうるよう熱膨張率の小さいものが選ばれる為に、
リード端子２３とセラミックヒータ２１との熱膨張率の
差は非常に大きくなる。セラミックスと金属の接合にお
いてはこの様な熱膨張率の違いにより発生する熱応力の
為、接合部で破壊されやすい。2. Description of the Related Art Conventionally, a metal electrode 22 is formed on a ceramic heater 21 and a lead terminal 23 is connected to the metal electrode 22 as shown in FIG. Then, a method of brazing the lead terminal 23 to the metal electrode 22 using various brazing materials 24 is generally used. For the lead terminals 23, a metal material having high conductivity is used to supply power to the ceramic heater 21, but generally, the metal material has a larger coefficient of thermal expansion than ceramics. The ceramic material used as the ceramic heater 21 is selected to have a small coefficient of thermal expansion so as to withstand the thermal stress caused by repeated energization.
The difference in the coefficient of thermal expansion between the lead terminal 23 and the ceramic heater 21 becomes very large. In the joining of ceramics and metal, they are easily broken at the joining portion due to the thermal stress generated by such a difference in the coefficient of thermal expansion.
【０００３】これを防止する方法として特開平３−５０
１６７号公報に記載されている様に、金属部品の反射側
表面に熱応力緩衝セラミック部品２５を接合することに
より、熱応力を緩和する方法が考えられている。As a method for preventing this, Japanese Patent Laid-Open Publication No. Hei 3-50
As described in Japanese Patent Application Publication No. 167, a method has been considered in which a thermal stress buffering ceramic component 25 is joined to the reflection side surface of a metal component to reduce thermal stress.
【０００４】[0004]
【発明が解決しようとする課題】しかし、熱応力緩衝セ
ラミック部品を接合する方法では、接合時にろう材が溶
けるまで両側から加熱しながら超音波振動を与えて接合
しているが、セラミックヒータ基材と熱応力緩衝セラミ
ックとの大きさが極端に差があり、熱容量が大きく違う
為、加熱時の温度管理が非常にシビアになる。However, in the method of joining thermal stress buffering ceramic parts, ultrasonic vibration is applied while heating from both sides until the brazing material is melted at the time of joining. There is an extreme difference between the size of the ceramic and the thermal stress buffer ceramic, and the heat capacity is greatly different, so that the temperature control during heating becomes very severe.
【０００５】また、セラミックヒータ基材と熱応力緩衝
セラミックとが温度差がついた状態で接合されると、リ
ード端子内に応力が発生する。この応力は、セラミック
基体あるいは熱応力緩衝セラミックに引っ張り応力とな
って残留されることになる。その為、冷却後すぐあるい
はセラミックヒータの通電の繰り返しにより、セラミッ
ク基体にクラックが発生したり、金属電極がセラミック
基体から剥離したり、熱応力緩衝セラミックが剥離した
り、低荷重で破断しリード端子がとれてしまうという問
題があった。Further, when the ceramic heater substrate and the thermal stress buffer ceramic are joined in a state where there is a temperature difference, stress is generated in the lead terminals. This stress remains as a tensile stress on the ceramic substrate or the thermal stress buffer ceramic. For this reason, immediately after cooling or by repetition of energization of the ceramic heater, cracks are generated in the ceramic base, metal electrodes are separated from the ceramic base, the thermal stress buffer ceramic is separated, or the lead terminal breaks at a low load and leads. There was a problem that it could be removed.
【０００６】また、リード端子の材質は応力緩和効果を
促進する為、アルミニウムなどの軟質金属を使用してい
るが、接合時の加熱温度が上がりすぎるとアルミニウム
組織が破壊され低荷重で破断しリード端子がとれてしま
う。この時リード端子がはずれると電気暖房器の構造部
材に接触し、器具のショートがおこったり、感電や火災
になるなどの問題があった。[0006] In addition, a soft metal such as aluminum is used for the material of the lead terminal in order to promote the stress relaxation effect. However, if the heating temperature at the time of joining is too high, the aluminum structure is destroyed and the lead is broken at a low load and the lead is broken. Terminals come off. At this time, if the lead terminal comes off, it comes into contact with the structural member of the electric heater, causing a short circuit of the appliance, an electric shock or a fire.
【０００７】また、リード端子は軟質金属を使用してい
る為、繰り返しの屈曲に弱く、リード端子にはリード線
がカシメられているのでリード線を引っ掛けると、リー
ド端子が曲がったり、とれてしまったりなどのアッセン
ブリーの輸送や、暖房器の組み立て生産性に問題があっ
た。Further, since the lead terminal is made of a soft metal, it is vulnerable to repeated bending. Since the lead terminal is crimped, the lead terminal may be bent or removed when the lead wire is hooked. There was a problem with the transportation of assemblies, such as rolling, and the productivity of assembling heaters.
【０００８】本発明は、セラミックヒータの金属電極に
リード端子の一方の面を接合するとともに他方の面に熱
応力緩衝セラミック若しくはセラミックヒータの材料と
熱膨張率が近似した金属部材を接合し、上記セラミック
ヒータと上記熱応力緩衝セラミック若しくは金属部材と
を挾持体ではさみ込み、上記リード端子の剥離をなくし
て器具のショート及び感電，火災を防止することを目的
とするものである。According to the present invention, one surface of a lead terminal is joined to a metal electrode of a ceramic heater, and a metal member having a thermal expansion coefficient similar to that of the material of the thermal stress buffer ceramic or ceramic heater is joined to the other surface. An object of the present invention is to sandwich a ceramic heater and the above-mentioned thermal stress buffer ceramic or metal member with a sandwiching body to prevent the lead terminals from peeling off and to prevent short-circuiting of equipment, electric shock and fire.
【０００９】[0009]
【課題を解決するための手段】上記の目的を達成するた
めに請求項１記載のセラミックヒータのリード線接続装
置は、リード端子の接合部を板状に形成し、該接合部の
一方の面をセラミックヒータの金属電極に接合するとと
もに他方の面に熱応力緩衝セラミック若しくは上記セラ
ミックヒータの材料と熱膨張率が近似した金属部材を接
合し、上記セラミックヒータと上記熱応力緩衝セラミッ
ク若しくは金属部材とを挾持体ではさみ込むことにより
上記リード端子が上記セラミックヒータの金属電極に接
続されている。According to a first aspect of the present invention, there is provided a lead wire connecting device for a ceramic heater, wherein a joining portion of a lead terminal is formed in a plate shape, and one surface of the joining portion is formed. To the metal electrode of the ceramic heater, and to the other surface, a thermal stress buffer ceramic or a metal member having a coefficient of thermal expansion similar to that of the ceramic heater material, and the ceramic heater and the thermal stress buffer ceramic or the metal member are joined together. The lead terminals are connected to the metal electrodes of the ceramic heater by being sandwiched between the holding members.
【００１０】また、請求項２記載のセラミックヒータの
リード端子接続装置は、上記熱応力緩衝セラミック若し
くは金属部材と上記リード端子とを同時にはさみ込んで
いる。そして、請求項３記載のセラミックヒータのリー
ド端子接続装置の上記挾持体は、その途中に切り込みを
設けて上記熱応力緩衝セラミック若しくは金属部材をは
さみ込む挾持片と上記リード端子をはさみ込む端子挾持
片とを形成し、上記熱応力緩衝セラミック若しくは金属
部材と上記リード端子とを個別にはさみ込んでいる。Further, in the lead terminal connecting device for a ceramic heater according to the present invention, the thermal stress buffer ceramic or metal member and the lead terminal are simultaneously sandwiched. The holding body of the lead terminal connecting device for a ceramic heater according to claim 3 is provided with a notch in the middle thereof to hold the thermal stress buffer ceramic or metal member, and the terminal holding piece to hold the lead terminal. Are formed, and the thermal stress buffer ceramic or metal member and the lead terminal are individually sandwiched.
【００１１】[0011]
【作用】この発明に従えば以下の通りに作用する。請求
項１においては接合時に両側から加熱しながら超音波振
動を与えているが、温度差がついて接合された状態でリ
ード端子の剥離があっても、板バネではさまれている
為、リード端子はセラミックヒータからははずれること
が無いので器具のショートや感電、火災を防止すること
ができる。According to the present invention, the operation is as follows. In claim 1, the ultrasonic vibration is applied while heating from both sides at the time of joining. However, even if the lead terminal is peeled off in the state of being joined due to a temperature difference, the lead terminal is sandwiched by a leaf spring. Since it does not come off from the ceramic heater, short-circuiting, electric shock and fire of the appliance can be prevented.
【００１２】請求項２においては、セラミックヒータか
らのリード端子がはずれるのを防止するとともに、ヒー
タの輸送時や組み立て時にリード線を引っ掛けた場合で
もリード端子の変形や破断を防止することができる。請
求項３においては、リード端子のはずれや変形，破断を
防止するとともに板バネ取付け後リード端子を曲げるこ
とにより、板バネの左右方向のズレや、脱落を防止する
ことができ、また、リード端子曲げ用の治具にもなり生
産性が向上する。According to the present invention, the lead terminals can be prevented from coming off from the ceramic heater, and the lead terminals can be prevented from being deformed or broken even when the lead wires are hooked during transportation or assembly of the heater. According to the third aspect, the lead terminal can be prevented from being displaced, deformed, or broken, and can be prevented from shifting or falling off in the left-right direction of the leaf spring by bending the lead terminal after attaching the leaf spring. It also becomes a jig for bending and improves productivity.
【００１３】[0013]
【実施例】本発明のセラミックヒータのリード端子接続
装置を図１〜図５とともに説明する。図１は本発明の請
求項１の一実施例の要部拡大斜視図、図２は本発明の請
求項１の一実施例の要部断面図、本発明のセラミックヒ
ータ全体は従来例においてセラミックヒータ全体を示す
図６を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A ceramic heater lead terminal connecting apparatus according to the present invention will be described with reference to FIGS. FIG. 1 is an enlarged perspective view of an essential part of one embodiment of the present invention, FIG. 2 is a cross-sectional view of an essential part of an embodiment of the present invention, and the entire ceramic heater of the present invention is a conventional ceramic heater. This will be described with reference to FIG. 6 showing the entire heater.
【００１４】これらの図において、セラミックヒータ１
は板状に成型された例えばＳｉＣの様な導電性セラミッ
クであり、その電極部の表面には金属電極２が形成され
ている。リード端子４の先端は板状に成形され金属電極
２に接合される。６は金属電極２とリード端子４とを接
合する為のろう材、７はリード端子４と熱応力緩衝セラ
ミック３若しくはセラミックヒータ１の材料と熱膨張率
が近似した金属部材３ａを接合する為のろう材である。
この場合、例えば、セラミックヒータ１のセラミック基
体がＳｉＣ系あるいはＳｉＣ−Ｓｉ3Ｎ4系復合セラミッ
ク材料である場合、金属部材３ａはＦｅ−Ｎｉ−Ｃｏ
系，Ｆｅ−Ｎｉ系合金、タングステンあるいはモリブデ
ンを使用することにより応力緩衝効果がある。In these figures, the ceramic heater 1
Is a conductive ceramic such as SiC molded into a plate shape, and a metal electrode 2 is formed on the surface of the electrode portion. The tip of the lead terminal 4 is formed into a plate shape and joined to the metal electrode 2. Reference numeral 6 denotes a brazing material for joining the metal electrode 2 and the lead terminal 4, and reference numeral 7 denotes a joint for joining the lead terminal 4 to the metal member 3 a having a similar thermal expansion coefficient to the material of the thermal stress buffer ceramic 3 or the ceramic heater 1. It is brazing material.
In this case, for example, when the ceramic substrate of the ceramic heater 1 is SiC-based or SiC-Si 3 N 4 Keifukugo ceramic material, a metal member 3a is Fe-Ni-Co
The use of an alloy, Fe—Ni alloy, tungsten or molybdenum has a stress buffering effect.
【００１５】そして、セラミックヒータ１と熱応力緩衝
セラミック３または金属部材３ａをはさみ込む方向へバ
ネ性を持った挾持体である板バネ５が設けられている。A leaf spring 5, which is a holding body having a spring property in a direction in which the ceramic heater 1 and the thermal stress buffer ceramic 3 or the metal member 3a are sandwiched, is provided.
【００１６】上記リード端子４の接合は、セラミックヒ
ータ１裏面側から加熱し、熱応力緩衝セラミック３若し
くは金属部材３ａの表面側から超音波振動しながら加熱
されたコテ（図示せず）にてろう材６、ろう材７を溶か
して金属電極２に接合する。The above-mentioned lead terminals 4 are joined by a heated iron (not shown) heated from the back side of the ceramic heater 1 and ultrasonically vibrated from the front side of the thermal stress buffer ceramic 3 or the metal member 3a. The material 6 and the brazing material 7 are melted and joined to the metal electrode 2.
【００１７】このとき、セラミックヒータ１と熱応力緩
衝セラミック３若しくは金属部材３ａの大きさに差が有
り、加熱の温度に差が付いた状態で接合されると、どち
らかに応力が残った形で残る。At this time, there is a difference in the size of the ceramic heater 1 and the thermal stress buffer ceramic 3 or the metal member 3a. Will remain.
【００１８】これを冷却したり、セラミックヒータ１の
通電の繰り返しにより、セラミック基体にクラックが発
生したり、等おこるが、板バネ５にてはさみ込んでいる
為、セラミックヒータ１への通電は停止するがリード端
子４がはずれて暖房器の構造部材（図示せず）に接触す
る様なことは無い。Although the ceramic substrate is cooled or the energization of the ceramic heater 1 is repeated, cracks occur in the ceramic base, etc., but the energization to the ceramic heater 1 is stopped because the ceramic substrate is sandwiched by the leaf spring 5. However, there is no possibility that the lead terminal 4 comes off and comes into contact with a structural member (not shown) of the heater.
【００１９】図３は本発明の請求項２の一実施例の要部
拡大斜視図でこの図において、リード端子４は請求項１
と同様にセラミックヒータ１へ接合されている。そし
て、板バネ５は熱応力緩衝セラミック３若しくは金属部
材３ａとセラミックヒータ１とをはさみ込む様に取り付
けられると同時にリード端子４を保護する様にセラミッ
クヒータ１端面付近まで伸ばされている。FIG. 3 is an enlarged perspective view of an essential part of a second embodiment of the present invention. In FIG.
In the same manner as described above. The leaf spring 5 is attached so as to sandwich the thermal stress buffering ceramic 3 or the metal member 3a and the ceramic heater 1 and extends to the vicinity of the end face of the ceramic heater 1 so as to protect the lead terminals 4.
【００２０】これによればリード端子４の脱落を防げる
とともにリード端子４にカシメられているリード線９を
輸送時や組み立て時に引っ掛けたとしても、リード端子
４の変形や、繰り返しによる破断を防止することができ
る。According to this, the lead terminal 4 can be prevented from falling off, and even if the lead wire 9 caulked to the lead terminal 4 is hooked during transportation or assembly, the lead terminal 4 is prevented from being deformed or broken due to repetition. be able to.
【００２１】図４は本発明の請求項３の一実施例の要部
拡大斜視図でこの図において、リード端子４は請求項１
と同様にセラミックヒータ１へ接合されている。そし
て、板バネ５は熱応力緩衝セラミック３若しくは金属部
材３ａとセラミックヒータ１とはさみ込む様に取り付け
られると同時に、板バネ５の中央付近には切り込み５ａ
を設け、リード端子４をはさみ込む端子挾持片５ｂと熱
応力緩衝セラミック３若しくは金属部材３ａをはさみ込
む挾持片５ｃとを形成し、上記リード端子４を端子挾持
片５ｂで、熱応力緩衝セラミック３若しくは金属部材３
ａを挾持片５ｃで夫々個別にはさみ込んでいる。FIG. 4 is an enlarged perspective view of a main part of a third embodiment of the present invention. In FIG.
In the same manner as described above. The leaf spring 5 is attached so as to sandwich the thermal stress buffer ceramic 3 or the metal member 3a and the ceramic heater 1, and at the same time, a cut 5a is formed near the center of the leaf spring 5.
To form a terminal holding piece 5b for holding the lead terminal 4 and a holding piece 5c for holding the thermal stress buffer ceramic 3 or the metal member 3a. The lead terminal 4 is connected to the thermal stress buffering ceramic 3 by the terminal holding piece 5b. Or metal member 3
a are individually sandwiched by the holding pieces 5c.
【００２２】これによれば、リード端子４の材質は接合
時の応力緩和を行う為、アルミなどの軟質金属を使用し
ているが加熱温度が高すぎるとアルミニウムの組織が破
壊され、低荷重で破断してしまうが、板バネ５によって
セラミックヒータ１とリード端子４をはさみ込んでいる
ので脱落することは無い。According to this, a soft metal such as aluminum is used for the material of the lead terminal 4 in order to relieve the stress at the time of joining. However, if the heating temperature is too high, the aluminum structure is destroyed, and the load is reduced with a low load. Although broken, the ceramic heater 1 and the lead terminal 4 are sandwiched by the leaf spring 5, so that they do not fall off.
【００２３】また、暖房機の構造上、リード線９をヒー
タ１面に対し垂直方向へ引き回す場合でも、図５の変形
実施例の様に、リード端子４を板バネ５より手で曲げる
ことができ、生産治具の変わりに使用することができ
る。このとき、板バネ５は熱応力緩衝セラミック３若し
くは金属部材３ａとリード端子４にはさまれる為、左，
右方向のズレは全く無くなり、輸送時においても、板バ
ネ５の脱落は少なくなる。Further, due to the structure of the heater, even when the lead wire 9 is routed in a direction perpendicular to the surface of the heater 1, the lead terminal 4 can be bent manually by the leaf spring 5 as in the modified embodiment of FIG. It can be used instead of a production jig. At this time, since the leaf spring 5 is sandwiched between the thermal stress buffer ceramic 3 or the metal member 3a and the lead terminal 4, the left and right
The displacement in the right direction is completely eliminated, and the leaf spring 5 is less likely to fall off during transportation.
【００２４】[0024]
【発明の効果】以上の様なリード端子構造を用いたこの
発明は以下の効果がある。The present invention using the above-described lead terminal structure has the following effects.
【００２５】請求項１においては、熱応力緩衝セラミッ
クや、リード端子の剥離または、セラミック基体にクラ
ックが発生してもリード端子はセラミックヒータから脱
落することはないので、ヒータへの通電は停止される
が、器具のショートや、感電、火災を防止することがで
きる。According to the first aspect of the present invention, the lead terminals do not fall off the ceramic heater even if the thermal stress buffer ceramic or the lead terminals are peeled off or cracks occur in the ceramic base. However, it can prevent short-circuiting of equipment, electric shock and fire.
【００２６】請求項２においては、ヒータの輸送時や器
具の組み立て時にリード線を引っ掛けた場合でもリード
端子の変形や破断を防止することができる。請求項３に
おいては、板バネ取り付け後リード端子を曲げることに
より、輸送時の板バネの左右方向のズレや脱落を防止す
ることができ、また、リード端子曲げ用の治具にもなり
生産性が向上する。According to the present invention, deformation and breakage of the lead terminal can be prevented even when the lead wire is hooked at the time of transporting the heater or assembling the equipment. According to the third aspect, by bending the lead terminal after the leaf spring is attached, it is possible to prevent the leaf spring from shifting or falling off in the left-right direction during transportation, and also to become a jig for bending the lead terminal, thereby improving productivity. Is improved.
【図１】本発明のセラミックヒータのリード端子接続装
置の請求項１にかかる一実施例を示す要部拡大斜視図で
ある。FIG. 1 is an enlarged perspective view of a main part of a ceramic heater lead terminal connecting device according to an embodiment of the present invention.
【図２】図１の断面図である。FIG. 2 is a sectional view of FIG.
【図３】本発明のセラミックヒータのリード端子接続装
置の請求項２にかかる一実施例を示す要部拡大斜視図で
ある。FIG. 3 is an enlarged perspective view showing a main part of a lead terminal connecting device for a ceramic heater according to an embodiment of the present invention;
【図４】本発明のセラミックヒータのリード端子接続装
置の請求項３にかかる一実施例を示す要部拡大斜視図で
ある。FIG. 4 is an enlarged perspective view of a main part showing a third embodiment of the lead terminal connecting device for a ceramic heater according to the present invention.
【図５】図４の変形例を示す要部拡大斜視図である。FIG. 5 is an enlarged perspective view of a main part showing a modification of FIG. 4;
【図６】従来のセラミックヒータ全体を示す斜視図であ
る。FIG. 6 is a perspective view showing an entire conventional ceramic heater.
１ セラミックヒータ ２ 金属電極 ３ 熱応力緩衝セラミック ３ａ 金属部材 ４ リード端子 ５ 板バネ DESCRIPTION OF SYMBOLS 1 Ceramic heater 2 Metal electrode 3 Thermal stress buffer ceramic 3a Metal member 4 Lead terminal 5 Leaf spring
Claims (3)
にリード端子の接合部を接続するセラミックヒータのリ
ード端子接続装置において、 上記リード端子の接合部を板状に形成し、該接合部の一
方の面を上記金属電極に接合するとともに他方の面に熱
応力緩衝セラミック若しくは上記セラミックヒータの材
料と熱膨張率が近似した金属部材を接合し、 上記セラミックヒータと上記熱応力緩衝セラミック若し
くは金属部材とを挾持体ではさみ込むことにより上記リ
ード端子が上記セラミックヒータの金属電極に接続され
ていることを特徴とするセラミックヒータのリード端子
接続装置。1. A lead terminal connecting device for a ceramic heater for connecting a joining portion of a lead terminal to a metal electrode provided on a ceramic heater, wherein the joining portion of the lead terminal is formed in a plate shape, and one of the joining portions is formed. A surface is joined to the metal electrode and a metal member having a coefficient of thermal expansion similar to that of the material of the thermal stress buffer ceramic or the ceramic heater is joined to the other surface, and the ceramic heater and the thermal stress buffer ceramic or the metal member are joined together. A lead terminal connecting device for a ceramic heater, wherein the lead terminal is connected to a metal electrode of the ceramic heater by being sandwiched between holding members.
ク若しくは金属部材と上記リード端子とを同時にはさみ
込むことを特徴とする請求項１記載のセラミックヒータ
のリード端子接続装置。2. The lead terminal connecting device for a ceramic heater according to claim 1, wherein said holding body sandwiches said thermal stress buffer ceramic or metal member and said lead terminal at the same time.
けて上記熱応力緩衝セラミック若しくは金属部材を挾持
する挾持片と上記リード端子をはさみ込む端子挾持片と
を形成し、上記熱応力緩衝セラミック若しくは金属部材
と上記リード端子とを個別にはさみ込むことを特徴とす
る請求項１記載のセラミックヒータのリード端子接続装
置。3. The holding body is provided with a notch in the middle thereof to form a holding piece for holding the thermal stress buffer ceramic or metal member and a terminal holding piece for holding the lead terminal. 2. The lead terminal connecting device for a ceramic heater according to claim 1, wherein the metal member and the lead terminal are individually inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06053553A JP3089156B2 (en) | 1994-03-24 | 1994-03-24 | Lead terminal connection device for ceramic heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06053553A JP3089156B2 (en) | 1994-03-24 | 1994-03-24 | Lead terminal connection device for ceramic heater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07263126A JPH07263126A (en) | 1995-10-13 |
| JP3089156B2 true JP3089156B2 (en) | 2000-09-18 |
Family
ID=12945997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06053553A Expired - Fee Related JP3089156B2 (en) | 1994-03-24 | 1994-03-24 | Lead terminal connection device for ceramic heater |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3089156B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6078028A (en) * | 1999-02-19 | 2000-06-20 | Saint-Gobain Industrial Ceramics, Inc. | Solderless ceramic igniter having a leadframe attachment |
| JP4733117B2 (en) | 2004-05-28 | 2011-07-27 | サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド | Ignition system |
| US20070188843A1 (en) * | 2006-02-10 | 2007-08-16 | Radiant Glass Industries, Llc | Heated glass panel system |
| GB2605629A (en) * | 2021-04-08 | 2022-10-12 | Dyson Technology Ltd | A heater |
-
1994
- 1994-03-24 JP JP06053553A patent/JP3089156B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07263126A (en) | 1995-10-13 |
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| Date | Code | Title | Description |
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| LAPS | Cancellation because of no payment of annual fees |