JP3065569B2 - Manufacturing method of printed circuit board - Google Patents
Manufacturing method of printed circuit boardInfo
- Publication number
- JP3065569B2 JP3065569B2 JP9250958A JP25095897A JP3065569B2 JP 3065569 B2 JP3065569 B2 JP 3065569B2 JP 9250958 A JP9250958 A JP 9250958A JP 25095897 A JP25095897 A JP 25095897A JP 3065569 B2 JP3065569 B2 JP 3065569B2
- Authority
- JP
- Japan
- Prior art keywords
- metal powder
- metal
- powder
- printed circuit
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は絶縁層を挟んだ回路
間の導通構造に改良を加えたプリント回路基板の製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed circuit board having an improved conduction structure between circuits sandwiching an insulating layer.
【０００２】[0002]
【従来の技術】プリント回路基板の表裏両面の銅箔パタ
ーン間の導通をとる方法としてメッキスルーホール法や
導電ペーストの埋め込み法が知られている。メッキスル
ーホールは、基板に形成した貫通孔の内周面に化学メッ
キ層を形成し、更にその上に必要に応じて電気メッキ層
を形成したものであり、メッキ層の厚さは１０〜１５μ
ｍ程度とされる。また、導電ペーストの埋め込み法は、
銀や銅の導電粒子を樹脂ペーストに練り込んでなる導電
ペーストを基板に形成した貫通孔内に充填するものであ
る。2. Description of the Related Art As a method of establishing conduction between copper foil patterns on both front and back surfaces of a printed circuit board, a plating through hole method and a method of embedding a conductive paste are known. The plating through hole is formed by forming a chemical plating layer on the inner peripheral surface of the through hole formed in the substrate, and further forming an electroplating layer thereon as necessary, and the thickness of the plating layer is 10 to 15 μm.
m. The method of embedding the conductive paste is as follows.
The conductive paste formed by kneading conductive particles of silver or copper into a resin paste is filled in the through holes formed in the substrate.
【０００３】[0003]
【発明が解決しようとする課題】メッキスルーホール法
では、貫通孔を小径化すると、貫通孔深部への電気メッ
キ層の付着量が減少するため、貫通孔内部のメッキ層が
薄くなるとともに表面の銅箔部分のメッキ層が厚くなる
という傾向を避け難い。このことは、銅箔がスルーホー
ル部分で局部的に厚くなることを意味するから、導体厚
さの均一化が必須である回路の微細化が困難になるとい
う問題がある。また、導電ペースト埋め込み法では、導
電ペースト中の導電粒子と基板表面の銅箔との接触に依
存して電気的導通が確保されるから、導電粒子の酸化や
接触力の低下に起因する経時劣化のおそれがあり、信頼
性に欠ける。In the plating through-hole method, when the diameter of the through hole is reduced, the amount of the electroplated layer deposited on the deep portion of the through hole decreases, so that the plating layer inside the through hole becomes thinner and the surface of the through hole becomes thinner. It is difficult to avoid the tendency that the plating layer of the copper foil portion becomes thick. This means that the copper foil is locally thickened in the through-hole portion, so that there is a problem that it is difficult to miniaturize a circuit in which it is essential to make the conductor thickness uniform. In addition, in the conductive paste embedding method, electrical conduction is ensured depending on the contact between the conductive particles in the conductive paste and the copper foil on the substrate surface. And may lack reliability.
【０００４】そこで、本発明は、回路の微細化が可能で
あり、しかも、導通の信頼性が高いプリント回路基板の
製造方法を提供することを目的とする。Accordingly, an object of the present invention is to provide a method of manufacturing a printed circuit board which can miniaturize a circuit and has high reliability of conduction.
【０００５】[0005]
【課題を解決するための手段】請求項１の発明は、硬質
の絶縁基板に形成した貫通孔を通して絶縁基板の両面の
回路を相互に接続する貫通導電路を備えたプリント回路
基板を製造する方法であって、絶縁基板に樹脂シートを
重ねて所要位置に樹脂シートと絶縁基板とに孔開けを行
い、それらの孔に金属粉体を充填して樹脂シートととも
にその金属粉体を圧縮することにより金属粉体を絶縁基
板の貫通孔内に充填し、ここに加圧ホーンから超音波振
動を与えることにより金属粉体を相互に固着させて貫通
導電路を形成するところに特徴を有する。Means for Solving the Problems The invention according to claim 1 is characterized in that
Through the through holes formed in the insulating substrate
Printed circuit with through conductive paths interconnecting circuits
A method of manufacturing a substrate, comprising: forming a resin sheet on an insulating substrate.
Drill holes in the resin sheet and insulating substrate at required positions
These holes are filled with metal powder and
Compress the metal powder into an insulating base
It is characterized in that metal powder is fixed to each other by applying ultrasonic vibration from a pressurized horn to fill the through hole of the plate and form a through conductive path.
【０００６】[0006]
【０００７】請求項２の発明は、請求項１のプリント回
路基板の製造方法において、加圧ホーンを絶縁層を挟む
ように対をなして設け、貫通孔内に充填された金属粉体
を両側から挟んで加圧して超音波振動を与えるところに
特徴を有する。[0007] According to a second aspect of the invention, in the method for manufacturing a printed circuit board according to claim 1, the pressure horn provided at an as-to sandwich the insulating layer, both sides of the metal powder filled in the through hole It has a feature in that ultrasonic vibration is applied by pressing and sandwiching from above.
【０００８】請求項３の発明は、請求項１または請求項
２の製造方法において、金属粉体として銅粉を使用し、
その表面には銅よりも低融点の金属をコーティングして
あるところに特徴を有する。[0008] The invention of claim 3 is claim 1 or claim 1.
In the production method 2 , copper powder is used as the metal powder,
It is characterized in that its surface is coated with a metal having a lower melting point than copper.
【０００９】[0009]
【発明の作用・効果】請求項１の発明によれば、貫通孔
に充填された金属粉体に超音波振動が与えられると、金
属粉体同士が擦れ合って摩擦熱によってその表面が溶融
し、金属同士が直接に接合して貫通孔内に一体化した金
属柱が貫通導電路として形成される。各金属粉体の表面
には酸化被膜が形成されている場合があるが、各金属粉
体が圧力を加えられて接触している状態で超音波振動が
与えられると、静圧と接触面による滑りによって接触路
の酸化被膜などが破壊・除去され、清浄な面どうしが擦
れ合い、弾性変形、塑性変形、さらには摩擦熱による温
度上昇が加わって接合面間に原子間引力が作用する程度
まで接近し、かつ、接合面積も増加して強固な接合状態
に至るのである。そして、この貫通導電路によって絶縁
層の表裏両面の回路間を接続することができるのであ
る。このように形成した貫通導電路によれば、スルーホ
ールの内周面に導通用のメッキ層を形成しなくてもよい
から、絶縁板表面の導体層の厚さが不均一になることを
防止でき、これにてその回路の微細化を可能にすること
ができる。しかも、金属粉体が直接に接合して貫通導電
路が形成されるから、導通の信頼性が高く、経時変化に
も強くなるという効果が得られる。According to the first aspect of the present invention, when ultrasonic vibration is applied to the metal powder filled in the through hole, the metal powders rub against each other and the surface thereof is melted by frictional heat. In addition, a metal pillar that is directly joined to metals and integrated into the through hole is formed as a through conductive path. Oxide film may be formed on the surface of each metal powder, but when ultrasonic vibration is applied while each metal powder is in contact with applying pressure, static pressure and contact surface To the extent that the oxide film on the contact path is destroyed and removed by slipping, clean surfaces rub against each other, elastic deformation, plastic deformation, and temperature rise due to frictional heat, causing an atomic attraction between the joint surfaces It comes close and the bonding area increases, leading to a strong bonding state. Then, the circuit on both the front and back surfaces of the insulating layer can be connected by the through conductive path. According to the through conductive path formed in this way, it is not necessary to form a conductive plating layer on the inner peripheral surface of the through hole, thereby preventing the thickness of the conductive layer on the surface of the insulating plate from becoming uneven. This makes it possible to miniaturize the circuit. In addition, since the through conductive path is formed by directly joining the metal powder, there is obtained an effect that the reliability of conduction is high and the resistance to aging is enhanced.
【００１０】また、絶縁層に重ねられた樹脂シートにも
孔が形成され、ここにも金属粉体が充填される。従っ
て、これを樹脂シートと共に圧縮すると、絶縁層の貫通
孔内に金属粉体が高密度で充填される。そこで、これに
超音波振動を与えると、金属粉体同士が効率的に結合
し、低抵抗の貫通導電路が形成される。 Also, holes are formed in the resin sheet superimposed on the insulating layer, and the metal powder is also filled here. Therefore, when this is compressed together with the resin sheet, the metal powder is densely filled in the through holes of the insulating layer. Then, when ultrasonic vibration is applied to this, the metal powders are efficiently coupled to each other, and a low-resistance through conductive path is formed.
【００１１】請求項２の発明によれば、貫通孔内に充填
された金属粉体に両側から超音波振動が与えられるか
ら、貫通導電路の形成作業が効率的になる。請求項３の
発明によれば、安価な銅粉体を使用できながら、表面に
低融点金属がコーティングされているから、金属粉体相
互の接合が円滑に行われる。また、コーティング金属と
して銀を使用すれば、銅粉体の酸化防止や低抵抗化に効
果的である。According to the second aspect of the present invention, since the ultrasonic vibration is applied to the metal powder filled in the through hole from both sides, the operation of forming the through conductive path becomes efficient. According to the third aspect of the present invention, since the low-melting-point metal is coated on the surface while inexpensive copper powder can be used, the bonding between the metal powders is performed smoothly. When silver is used as the coating metal, it is effective in preventing oxidation of copper powder and reducing the resistance.
【００１２】[0012]
［第１実施形態］以下、本発明の第１実施形態について
図１ないし図３を参照して説明する。図中、１０は例え
ば０．５mmの厚さのガラスエポキシからなる絶縁基板１
１の両面に銅箔１２を張り付けてなる銅張り積層板であ
り、その銅箔１２を所要のパターンでエッチングするこ
とにより電気回路が形成されている。この積層板１０の
両側には、同図（Ｂ）に示すように例えば厚さ０．１mm
の樹脂シート１３が更に積層され、（Ｃ）に示すように
積層板１０を貫通する導電路を形成するための貫通孔１
４が樹脂シート１３と共に形成される。[First Embodiment] Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. In the drawing, reference numeral 10 denotes an insulating substrate 1 made of glass epoxy having a thickness of, for example, 0.5 mm.
1 is a copper-clad laminate in which copper foils 12 are attached to both surfaces, and an electric circuit is formed by etching the copper foils 12 in a required pattern. On both sides of the laminated plate 10, for example, as shown in FIG.
Resin sheet 13 is further laminated, and as shown in (C), a through hole 1 for forming a conductive path penetrating the laminated plate 10 is formed.
4 are formed together with the resin sheet 13.
【００１３】ついで、上記貫通孔１４内には図１（Ｄ）
に示すように、金属粉体１５が充填される。この金属粉
体１５としては、例えば粒径が０．１〜１０μｍ程度の
銅ペースト用の銅粉体（比重８．９３）を使用する。銅
粉体は複数種の粒径のものを組み合わせると、密な充填
状態を得ることができる。この後、樹脂シート１３と共
に積層板１０を平面プレスして金属粉体１５の充填密度
を高め、樹脂シート１３を剥離して金属粉体１５に超音
波振動を与える。これには、図２に示すように、積層板
１０を金属板１６等の硬質板の上に置き、金属粉体１５
の充填部分にホーン１７を当てて例えば数十ｋｇの静圧
を加えた状態で縦の超音波振動を加える。すると、銅粉
体同士が擦れ合って摩擦熱によってその表面が溶融し、
銅粉体同士が直接に接合し、図３に示すように貫通孔１
４内に一体化した金属柱１８が貫通導電路として形成さ
れる。この貫通導電路（金属柱１８）によって絶縁基板
１１の表裏両面の銅箔回路１２間を接続することができ
るのである。なお、必要に応じて積層板１０を表裏反転
させて上述したと同様に超音波振動を与えるようにして
もよい。また、超音波振動は周波数が高いほど振動伝達
深さが浅くなり、周波数が低いほど大きなパワーを得や
すくなるから、必要なパワーや積層板１０の厚さに応じ
て適切な周波数を設定することができる。この実施形態
では、例えば２８ｋＨｚの振動が最も効果的であった。
本実施形態のようにして貫通導電路１８を形成すれば、
表裏回路の導通のための電気メッキ工程が不要であるか
ら、積層板１０の銅箔１２の厚さが不均一になることを
防止でき、これにて回路の微細化を可能にすることがで
きる。しかも、金属粉体１５が直接に接合して貫通導電
路１８が形成されるから、導通の信頼性が高く、経時変
化にも強くなるという効果が得られる。また、金属ペー
ストとは異なって樹脂組成物を含まないから、貫通導電
路１８の電気抵抗を低くすることができ、また、銅箔１
２との接続部分の物理的強度が高くなる。Next, FIG. 1D shows the inside of the through hole 14.
As shown in the figure, the metal powder 15 is filled. As the metal powder 15, for example, a copper powder for copper paste (specific gravity: 8.93) having a particle size of about 0.1 to 10 μm is used. A densely packed state can be obtained by combining a plurality of types of copper powder. Thereafter, the laminate 10 is planarly pressed together with the resin sheet 13 to increase the packing density of the metal powder 15, and the resin sheet 13 is peeled off to apply ultrasonic vibration to the metal powder 15. For this, as shown in FIG. 2, the laminated plate 10 is placed on a hard plate such as a metal plate 16 and a metal powder 15 is placed.
A horn 17 is applied to the filled portion, and a vertical ultrasonic vibration is applied with a static pressure of, for example, several tens kg. Then, the copper powders rub against each other and the surface melts due to frictional heat,
The copper powders are directly bonded to each other, and as shown in FIG.
The metal pillar 18 integrated in the 4 is formed as a through conductive path. This through conductive path (metal column 18) enables connection between the copper foil circuits 12 on both the front and back surfaces of the insulating substrate 11. Note that, if necessary, the laminated plate 10 may be turned upside down to apply ultrasonic vibration in the same manner as described above. In addition, the higher the frequency of the ultrasonic vibration, the shallower the vibration transmission depth, and the lower the frequency, the easier it is to obtain a large power. Can be. In this embodiment, for example, a vibration of 28 kHz was the most effective.
If the through conductive path 18 is formed as in the present embodiment,
Since an electroplating step for conducting the front and back circuits is not required, the thickness of the copper foil 12 of the laminate 10 can be prevented from being uneven, thereby enabling miniaturization of the circuit. . In addition, since the through-conducting path 18 is formed by directly joining the metal powders 15, the effect that the reliability of conduction is high and the resistance to aging is enhanced. Further, unlike the metal paste, since the resin composition does not contain the resin composition, the electric resistance of the through conductive path 18 can be reduced.
The physical strength of the connection portion with the second member 2 is increased.
【００１４】[0014]
【００１５】[0015]
【００１６】[0016]
【００１７】[0017]
【００１８】［他の実施形態］本発明は上記記述及び図
面によって説明した実施の形態に限定されるものではな
く、例えば次のような実施の形態も本発明の技術的範囲
に含まれ、さらに、下記以外にも要旨を逸脱しない範囲
内で種々変更して実施することができる。[Other Embodiments] The present invention is not limited to the embodiment described above with reference to the drawings. For example, the following embodiments are also included in the technical scope of the present invention. In addition to the following, various changes can be made without departing from the scope of the invention.
【００１９】（１） 前記実施形態では貫通孔１４の内
面にはメッキを施すことなく金属粉体を充填したが、貫
通孔１４の内周面に薄い無電解メッキを施すようにすれ
ば、金属粉体がそのメッキ層にも接触することになるか
ら、導通の信頼性向上及び電気抵抗の低減化に効果的で
ある。なお、メッキを行うとはいえ層厚が極めて薄い無
電解メッキであるから、第１実施形態の絶縁基板１１の
銅箔１２の厚さを不均一にするに至らず、回路の微細化
の妨げになるおそれはない。(1) In the above embodiment, the inner surface of the through hole 14 is filled with metal powder without plating, but if the inner peripheral surface of the through hole 14 is subjected to thin electroless plating, metal Since the powder comes into contact with the plating layer, it is effective for improving the reliability of conduction and reducing the electric resistance. Although the plating is performed, the thickness of the copper foil 12 of the insulating substrate 11 of the first embodiment is not made non-uniform because of the electroless plating of an extremely thin layer thickness, which prevents the miniaturization of the circuit. There is no risk of becoming.
【００２０】（２）上記各実施形態では金属粉体として
銅粉を使用したが、これに限らず、金、銀、パラジウ
ム、ニッケル、錫、鉛、或いはこれらの混合物、合金等
であってもよく、要は、超音波振動によって自己融着す
る導電性の金属粉体であればよい。また、銅粉体の表面
に、それより低融点の金属を予めコーティングしておい
たものを使用すると、金属粉体相互の接合が円滑に行わ
れる。また、コーティング金属として銀を使用すれば、
銅粉体の酸化防止や低抵抗化にとって一層効果的であ
る。また、金属粉体には、熱硬化性樹脂粉やガラス粉等
の有機質或いは無機質のフィラー粉体を少量添加しても
よい。(2) Although copper powder is used as the metal powder in each of the above embodiments, the present invention is not limited to this, and gold, silver, palladium, nickel, tin, lead, a mixture thereof, an alloy, or the like may be used. What is essential is that the conductive metal powder be self-fused by ultrasonic vibration. If a copper powder whose surface is coated with a metal having a lower melting point than that of the copper powder is used, bonding between the metal powders is performed smoothly. Also, if silver is used as the coating metal,
It is more effective for preventing oxidation of copper powder and reducing the resistance. Further, a small amount of organic or inorganic filler powder such as thermosetting resin powder or glass powder may be added to the metal powder.
【００２１】（３）上記各実施形態では、棒状の超音波
ホーンから金属粉体に超音波振動を加えるようにした
が、これに限らず、平面状の振動体によって多数箇所の
金属粉体に超音波振動を与えてもよく、或いは、超音波
振動が与えられたローラーを基板上を転動させることで
多数箇所の金属粉体に順次振動を与えるようにしてもよ
い。また、周波数や出力は貫通孔の深さや径寸法等に応
じて適宜設定することができるが、２０ｋＨｚ〜１００
ｋＨｚの範囲内が最も好ましいと思われる。(3) In each of the above embodiments, the ultrasonic vibration is applied to the metal powder from the rod-shaped ultrasonic horn. However, the present invention is not limited to this. Ultrasonic vibration may be applied, or a roller to which ultrasonic vibration is applied may be rolled on the substrate to sequentially apply vibrations to a large number of metal powders. Further, the frequency and the output can be appropriately set according to the depth and the diameter of the through-hole.
A range of kHz seems most preferred.
【００２２】（４）上記各実施形態では、貫通孔内に充
填した金属粉体に片側から超音波振動を加えるようにし
たが、これに限らず、両側から超音波ホーンを当てて位
相を整合させながら超音波振動を与えるようにしてもよ
い。(4) In each of the above embodiments, the ultrasonic vibration is applied from one side to the metal powder filled in the through-hole. However, the present invention is not limited to this. The ultrasonic vibration may be applied while the vibration is being made.
【００２３】[0023]
【００２４】（５）上記各実施形態では、回路パターン
の形成後に貫通導電路を形成するようにしたが、これに
限らず、回路パターンの形成前に絶縁層の貫通孔に金属
粉体を充填し、ここに超音波振動を与えることにより貫
通導電路を形成し、その後に、回路パターンを形成して
もよい。 (5) In each of the above embodiments, the through conductive path is formed after the formation of the circuit pattern. However, the present invention is not limited to this. The metal powder is filled in the through hole of the insulating layer before the formation of the circuit pattern. Then, a through-conducting path may be formed by applying ultrasonic vibration thereto, and then a circuit pattern may be formed.
【図１】本発明の第一実施形態に係る貫通導電路の形成
過程を示す断面図FIG. 1 is a cross-sectional view illustrating a process of forming a through conductive path according to a first embodiment of the present invention.
【図２】同じく積層板に超音波振動を加えるところを示
す側面図FIG. 2 is a side view showing a state where ultrasonic vibration is applied to the laminated plate.
【図３】同じく貫通導電路形成後の積層板を示す断面図FIG. 3 is a cross-sectional view showing the laminated plate after the formation of the through conductive paths.
【図４】他の実施形態の回路パターン形成過程を示す断
面図FIG. 4 is a sectional view showing a process of forming a circuit pattern according to another embodiment.
Claims (3)
て前記絶縁基板の両面の回路を相互に接続する貫通導電
路を備えたプリント回路基板を製造する方法であって、前記絶縁基板に樹脂シートを重ねて所要位置に前記樹脂
シートと絶縁基板とに孔開けを行い、それらの孔に金属
粉体を充填して前記樹脂シートとともにその金属粉体を
圧縮することにより金属粉体を前記絶縁基板の貫通孔内
に充填し、 ここに加圧ホーンから超音波振動を与えることにより前
記金属粉体を相互に固着させて前記貫通導電路を形成す
ることを特徴とするプリント回路基板の製造方法。1. A method of manufacturing a printed circuit board with through holes formed in the insulating board of hard through conductive paths for connecting the circuitry of both surfaces of the insulating base plate to each other, the insulating substrate Lay the resin sheet and place the resin
Drill holes in the sheet and insulating substrate, and insert metal
Filling the powder and the metal powder together with the resin sheet
By compressing the metal powder into the through hole of the insulating substrate
Method for manufacturing a printed circuit board and forming said through conductive paths by securing the metal powder to one another by providing filling, here the ultrasonic vibration from the pressure horn.
をなして設けられ、貫通孔内に充填された金属粉体を両
側から挟んで加圧して超音波振動を与えることを特徴と
する請求項１に記載のプリント回路基板の製造方法。 2. The pressurized horn is paired with the insulating layer interposed therebetween.
The metal powder filled in the through hole
It is characterized by applying ultrasonic vibration by sandwiching from the side and applying pressure
The method for manufacturing a printed circuit board according to claim 1.
よりも低融点の金属がコーティングされていることを特
徴とする請求項１または請求項２に記載のプリント回路
基板の製造方法。 3. The metal powder is copper powder, and the surface of the metal powder is copper powder.
Is coated with a lower melting point metal.
A printed circuit according to claim 1 or 2, wherein
Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9250958A JP3065569B2 (en) | 1997-09-16 | 1997-09-16 | Manufacturing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9250958A JP3065569B2 (en) | 1997-09-16 | 1997-09-16 | Manufacturing method of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1197841A JPH1197841A (en) | 1999-04-09 |
| JP3065569B2 true JP3065569B2 (en) | 2000-07-17 |
Family
ID=17215550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9250958A Expired - Lifetime JP3065569B2 (en) | 1997-09-16 | 1997-09-16 | Manufacturing method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3065569B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091117A (en) * | 2009-10-20 | 2011-05-06 | Freesia Makurosu Kk | Method for manufacturing electronic component mounting substrate and electronic component mounting substrate |
| US20200187365A1 (en) * | 2018-12-07 | 2020-06-11 | Interlog Corporation | Method for 3d-shaped multiple-layered electronics with ultrasonic voxel manufacturing |
-
1997
- 1997-09-16 JP JP9250958A patent/JP3065569B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1197841A (en) | 1999-04-09 |
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