JP3036640U - Insulation case for composite semiconductor devices - Google Patents
Insulation case for composite semiconductor devicesInfo
- Publication number
- JP3036640U JP3036640U JP1996010964U JP1096496U JP3036640U JP 3036640 U JP3036640 U JP 3036640U JP 1996010964 U JP1996010964 U JP 1996010964U JP 1096496 U JP1096496 U JP 1096496U JP 3036640 U JP3036640 U JP 3036640U
- Authority
- JP
- Japan
- Prior art keywords
- insulating case
- composite semiconductor
- external lead
- case
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【課題】 部品の共通化ができ、製造コストの低減に寄
与し得る複合半導体装置及びそれに使用する絶縁ケース
を提供する。
【解決手段】 絶縁ケース２０の内周部に、信号用外部
導出端子４０ａ，４０ｂの端子台２６をはめ込むための
端子台係止部２４を設けるとともに、絶縁ケース２０の
壁の外側あるいは内側に切り離し可能な端子台２６を一
体的に設ける。
(57) [Problem] To provide a composite semiconductor device capable of sharing parts and contributing to a reduction in manufacturing cost, and an insulating case used therefor. SOLUTION: A terminal block engaging portion 24 for fitting the terminal block 26 of the signal external lead-out terminals 40a, 40b is provided on the inner peripheral part of the insulating case 20, and is cut outside or inside the wall of the insulating case 20. A possible terminal block 26 is integrally provided.
Description
【０００１】[0001]
本考案は、複合半導体装置用絶縁ケースの構造に関し、特に絶縁ケースの外周 壁の反りの防止及び絶縁ケースへの封止用樹脂の注入の効率化を実現できる複合 半導体装置用絶縁ケースに係わる。 The present invention relates to a structure of an insulating case for a composite semiconductor device, and more particularly to an insulating case for a composite semiconductor device that can prevent warping of an outer peripheral wall of the insulating case and can efficiently inject a sealing resin into the insulating case.
【０００２】[0002]
この種の絶縁ケースを使用する従来の複合半導体装置の概略構造を図３及び図 ４を参照して説明する。 図において、複合半導体装置１はその底部に放熱板２を有し、この放熱板２上 に裏面が金属層、表面が導体層を有する絶縁基板３が半田固着されている。該絶 縁基板３の導体層上には半導体チップ４が半田固着され、該半導体チップ４上の 電極には外部導出端子５の下端部が半田固着されている。 一方、外部導出端子５の上端部は蓋体６に設けた端子挿通穴７を介して外部に 引き出されている。該端子挿通孔７に対向する位置には袋ナット収納穴８が形成 され、図示を省略した袋ナットを収納した後、前記外部導出端子５の上端を該袋 ナット収納穴８上に略直角に折曲げて、袋ナットが飛び出さないようにしてある 。 A schematic structure of a conventional composite semiconductor device using this type of insulating case will be described with reference to FIGS. 3 and 4. In the figure, a composite semiconductor device 1 has a heat radiating plate 2 at the bottom thereof, and an insulating substrate 3 having a metal layer on the back surface and a conductor layer on the front surface is soldered and fixed on the heat radiating plate 2. The semiconductor chip 4 is soldered and fixed on the conductor layer of the insulating substrate 3, and the lower end portion of the external lead-out terminal 5 is soldered and fixed to the electrode on the semiconductor chip 4. On the other hand, the upper end portion of the external lead-out terminal 5 is drawn out to the outside through a terminal insertion hole 7 provided in the lid body 6. A cap nut storage hole 8 is formed at a position facing the terminal insertion hole 7, and a cap nut (not shown) is stored therein. It is bent so that the cap nut does not pop out.
【０００３】 上記隣接する袋ナット収納穴８，８間には樹脂注入穴９が交互に設けられてい る。 上記放熱板２の外周には両端開口の絶縁ケース１０の一方の開口端が被せられ 、他方の開口端には上記の蓋体６により閉塞される。また、絶縁ケース１０の長 手方向の両端には取付穴１１が設けられている。 上記の絶縁ケース１０内には蓋体６の樹脂注入穴９を介して封止用樹脂１２が 充填され内部に収納された半導体チップ４等の回路構成部品が保護される構造と なっている。Resin injection holes 9 are alternately provided between the adjacent cap nut storage holes 8, 8. The outer periphery of the heat dissipation plate 2 is covered with one opening end of an insulating case 10 having openings at both ends, and the other opening end is closed by the lid body 6. Further, mounting holes 11 are provided at both ends of the insulating case 10 in the longitudinal direction. The insulating case 10 is filled with the sealing resin 12 through the resin injection hole 9 of the lid body 6 to protect the circuit components such as the semiconductor chip 4 housed inside.
【０００４】 次に、上記のように構成の複合半導体装置１の組立工程を説明する。 まず、あらかじめ絶縁基板３上に半導体チップ４を高温半田で固着しておく。 次に、蓋体６の端子挿通穴７に外部導出端子５を挿通し、該端子５を例えば図 ５に示すような構造により端子挿通穴７内に係止させる。 すなわち、板状の外部導出端子５には、その一部に切り込みを入れて一端を若 干立ち上げてなる係止部５ａが形成されている。この係止部５ａを有する外部導 出端子５を端子挿通穴７の一部をなす下方の角穴７ａ側から上方に向けて挿入し 、該係止部５ａの位置では外側に広がろうとするばね力に抗してさらに上方に挿 入することにより、角穴７ａを通過した段階で該係止部５ａが幅広の角穴７ｂ内 で広がり、段部７ｃと角穴７ｂの内壁により規制され、外部導出端子５が端子挿 通穴７内に係止される。Next, a process of assembling the composite semiconductor device 1 having the above-described configuration will be described. First, the semiconductor chip 4 is fixed to the insulating substrate 3 in advance by high temperature soldering. Next, the external lead-out terminal 5 is inserted into the terminal insertion hole 7 of the lid body 6, and the terminal 5 is locked in the terminal insertion hole 7 by the structure shown in FIG. 5, for example. That is, the plate-shaped external lead-out terminal 5 is provided with a locking portion 5a which is formed by cutting a part of the lead-out terminal 5 and raising one end of the terminal 5a. The external lead-out terminal 5 having this locking portion 5a is inserted upward from the lower square hole 7a side forming a part of the terminal insertion hole 7, and at the position of the locking portion 5a, it tries to spread outward. By inserting further upward against the spring force, the locking portion 5a spreads in the wide square hole 7b at the stage of passing through the square hole 7a and is regulated by the inner wall of the step portion 7c and the square hole 7b. The external lead-out terminal 5 is locked in the terminal insertion hole 7.
【０００５】 次いで、所定の治具を用いて、放熱板２、半導体チップ４が固着された絶縁基 板３、蓋体６に係止された外部導出端子５を図４に示すように順次積層し、熱板 上でそれぞれの部位に半田固着する。 次いで、半田固着時のフラックス等を洗浄液で洗い流した後、絶縁ケース１０ を放熱板２の外周に被せる。次いで、蓋体６の注入穴９から封止用樹脂１２を絶 縁ケース１０内に充填・硬化させる。 最後に、ナット収納穴８に図示を省略した袋ナットを入れた後、外部導出端子 ５の一端を該袋ナット上に略直角に折曲げて目的とする複合半導体装置１を完成 させる。Next, using a predetermined jig, the heat dissipation plate 2, the insulating base plate 3 to which the semiconductor chip 4 is fixed, and the external lead-out terminal 5 locked to the lid 6 are sequentially laminated as shown in FIG. Then, it is soldered to each part on the hot plate. Then, the flux or the like when the solder is fixed is washed away with a cleaning liquid, and then the insulating case 10 is covered on the outer periphery of the heat dissipation plate 2. Then, the sealing resin 12 is filled and cured in the insulating case 10 through the injection hole 9 of the lid 6. Finally, after inserting a cap nut (not shown) into the nut storage hole 8, one end of the external lead-out terminal 5 is bent at a substantially right angle on the cap nut to complete the desired composite semiconductor device 1.
【０００６】[0006]
従来の複合半導体装置は、上記のような構造の絶縁ケースを使用しているので 、次のような解決すべき課題があった。 絶縁ケース１０の寸法が大きくなると、該ケース１０を構成する外周壁自体 に反りが発生し、放熱板２の外周に合わせ難く作業能率が低下する。 封止用樹脂１２の充填が蓋体６の樹脂注入穴９から行うために、内部に均一 に充填するには複数箇所の樹脂注入穴９から注入しなければならない。このため 、上記同様に作業能率が低下する。 Since the conventional composite semiconductor device uses the insulating case having the above-mentioned structure, it has the following problems to be solved. When the size of the insulating case 10 is increased, the outer peripheral wall of the case 10 is warped, which makes it difficult to fit the outer peripheral surface of the heat dissipation plate 2 and the work efficiency is reduced. Since the sealing resin 12 is filled through the resin injection holes 9 of the lid body 6, it is necessary to inject through the resin injection holes 9 at a plurality of positions in order to uniformly fill the inside. Therefore, the work efficiency is reduced as in the above.
【０００７】[0007]
本考案は、上記のような課題を解決するためになされたもので、絶縁ケースの 薄い外周壁に反りが発生せず、スムーズに放熱板の外周に被冠することができ、 また、封止用樹脂の充填も容易に行うことができる複合半導体装置用絶縁ケース を提供することを目的とするものである。 The present invention has been made to solve the above problems, and the thin outer peripheral wall of the insulating case does not warp, so that the outer periphery of the heat sink can be smoothly covered, and the sealing It is an object of the present invention to provide an insulating case for a composite semiconductor device, which can be easily filled with a resin for use.
【０００８】[0008]
本考案の複合半導体装置用絶縁ケースは、放熱板上に半導体チップ等の各種電 子部品及び外部導出端子を搭載し、該放熱板の外周に両端開口の絶縁ケースを被 せ、該絶縁ケースの内側に封止用樹脂を充填する複合半導体装置用絶縁ケースに おいて、 該絶縁ケースの外周壁の内側に、外部導出端子支持部を一体的に成形するとと もに、該支持部の根元部分に洗浄液の排出孔を設けたことを特徴とするものであ る。 The insulating case for a composite semiconductor device of the present invention has various electronic parts such as a semiconductor chip and external lead-out terminals mounted on a heat dissipation plate, and the outer circumference of the heat dissipation plate is covered with an insulation case having openings at both ends. In an insulating case for a composite semiconductor device in which a sealing resin is filled inside, an external lead-out terminal supporting portion is integrally molded inside the outer peripheral wall of the insulating case, and a root portion of the supporting portion is formed. It is characterized in that a cleaning liquid discharge hole is provided in the.
【０００９】[0009]
以下に、本考案の実施の形態を図１及び図２を参照して詳細に説明する。 図において、１０は絶縁ケース全体を示し、この絶縁ケース１０の外周壁１０ ａの内側４面に外部導出端子支持部１２を形成する。この支持部１２を絶縁ケー ス１０の内周面に一定の間隔を隔てて全周に亘って配置する。 なお、この実施例では角部に４箇所、絶縁ケース１０の長手方向に合計６箇所 形成されている。また、上記の外部導出端子支持部１２には、端子挿入穴１３及 びナット収納穴１６が設けてある。さらに、各外部導出端子支持部１２の外周壁 に近接して後述する洗浄液を排出するための複数の排出孔１４が設けてある。 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2. In the figure, 10 indicates the entire insulating case, and the external lead-out terminal support portion 12 is formed on the inner four surfaces of the outer peripheral wall 10 a of the insulating case 10. The supporting portion 12 is arranged on the inner peripheral surface of the insulating case 10 at regular intervals over the entire circumference. In this embodiment, four corners are formed and a total of six corners are formed in the longitudinal direction of the insulating case 10. Further, the external lead-out terminal support portion 12 is provided with a terminal insertion hole 13 and a nut storage hole 16. Further, a plurality of drain holes 14 for draining a cleaning liquid, which will be described later, are provided near the outer peripheral wall of each external lead terminal support 12.
【００１０】 上記のように構成の絶縁ケース１０を使用した際の複合半導体装置の組立方法 は以下の通りである。 まず、図示しない絶縁基板上に半導体チップを半田固着するが、この工程は従 来と同じである。 また、同じく図示しない外部導出端子は、絶縁ケース１０の端子支持部１２に 設けてある端子挿通穴１３に挿入し、例えば図５に示したような構造により仮止 しておく。The method of assembling the composite semiconductor device when using the insulating case 10 having the above-described structure is as follows. First, a semiconductor chip is soldered and fixed onto an insulating substrate (not shown), but this step is the same as the conventional one. Similarly, the external lead-out terminal (not shown) is inserted into the terminal insertion hole 13 provided in the terminal support portion 12 of the insulating case 10 and temporarily fixed by the structure shown in FIG. 5, for example.
【００１１】 次いで、放熱板、半導体チップが搭載された絶縁基板を順次重ねた上に、外部 導出端子が係止された絶縁ケース１０を放熱板の外周に合わせて被せる。 なお、この時、絶縁ケース１０に図示を省略した位置決めピンが設けてあるの で、この位置決めピンにより絶縁基板を位置決めする。これにより外部導出端子 の下端部は半田固着されるべき所定の位置に自動的に合わせられる。 次いで、熱板上で加熱して各部を半田固着する。Next, the heat dissipation plate and the insulating substrate on which the semiconductor chip is mounted are sequentially stacked, and the insulating case 10 in which the external lead-out terminal is locked is put on the heat dissipation plate in accordance with the outer periphery thereof. At this time, since the insulating case 10 is provided with positioning pins (not shown), the insulating substrate is positioned by these positioning pins. As a result, the lower end portion of the external lead-out terminal is automatically aligned with a predetermined position to be soldered. Next, each part is soldered and fixed by heating on a hot plate.
【００１２】 次に、半田固着した部分のフラックスを洗浄するため、全体を洗浄液の中に浸 漬し、該フラクッスを洗い流す。その後、絶縁ケース１０全体を洗浄液の中から 取り出し、該ケース１０の上端開口部を下向きにして洗浄液を排出するが、外部 導出端子支持部１２の根元部分には複数の排出孔１４が設けられているので、絶 縁ケース１０の根元部分に洗浄液が溜ることなく、該排出孔１４を介して外部に 排出される。Next, in order to clean the flux of the portion to which the solder is fixed, the whole is soaked in a cleaning liquid and the flux is washed away. After that, the entire insulating case 10 is taken out of the cleaning liquid, and the cleaning liquid is discharged with the upper end opening of the case 10 facing downward. Therefore, the cleaning liquid is not collected at the root of the insulating case 10 and is discharged to the outside through the discharge hole 14.
【００１３】 次いで、絶縁ケース１０の内側に半導体チップ等の回路構成部品を保護するた めの封止用樹脂が充填される。この時、従来のように比較的小さな樹脂注入穴か らの注入ではなく、絶縁ケース１０の上端開口部１５の全体から封止用樹脂を一 度に注入することができるので、著しく作業能率を向上させることができる。 最後に、従来と同様にナット収納穴１６に袋ナット等を挿入後、外部導出端子 の端部を該収納穴１３上に略直角に折曲げ、目的とする複合半導体装置を完成さ せる。Next, the inside of the insulating case 10 is filled with a sealing resin for protecting circuit components such as a semiconductor chip. At this time, the sealing resin can be injected at one time from the entire upper end opening 15 of the insulating case 10 instead of the injection from the relatively small resin injection hole as in the conventional case. Can be improved. Finally, after inserting a cap nut or the like into the nut storage hole 16 as in the conventional case, the end portion of the external lead-out terminal is bent at a substantially right angle into the storage hole 13 to complete the desired composite semiconductor device.
【００１４】[0014]
【考案の効果】 本考案は以上のように、絶縁ケースの外周壁の内側に外部端子支持部を形成し たので、機械的強度が向上し、外周壁の反りが防止される。このため、放熱板外 周への挿入をスムーズに行うことができ、作業能率が向上する。また、絶縁ケー スの上端開口部を相対的に広く形成したので、絶縁ケース内部への封止用樹脂の 充填を効率的に、かつ、均一に行うことができる。さらに外部導出端子の根元部 分に排出孔を設けたので、該根元部分に溜り易いフラックス等の洗浄液も外部に 容易に排出することができる。As described above, according to the present invention, since the external terminal supporting portion is formed inside the outer peripheral wall of the insulating case, the mechanical strength is improved and the outer peripheral wall is prevented from warping. For this reason, the heat sink can be smoothly inserted into the outer circumference, and the work efficiency is improved. Further, since the upper end opening of the insulating case is formed to be relatively wide, it is possible to efficiently and uniformly fill the inside of the insulating case with the sealing resin. Further, since the discharge hole is provided at the root portion of the external lead-out terminal, the cleaning liquid such as flux that easily collects at the root portion can be easily discharged to the outside.
【図１】本考案の一実施例を示す複合半導体装置用絶縁
ケースの平面図である。FIG. 1 is a plan view of an insulating case for a composite semiconductor device according to an embodiment of the present invention.
【図２】図１におけるＡ−Ａ線に沿う断面図である。FIG. 2 is a sectional view taken along the line AA in FIG.
【図３】従来のこの種の絶縁ケースを使用した複合半導
体装置の平面図である。FIG. 3 is a plan view of a composite semiconductor device using a conventional insulating case of this type.
【図４】上記図３の複合半導体装置の中央縦断面図であ
る。4 is a central vertical cross-sectional view of the composite semiconductor device of FIG.
【図５】上記複合半導体装置における外部導出端子の端
子挿通穴への係止方法の１例を示す断面図である。FIG. 5 is a cross-sectional view showing an example of a method of locking the external lead-out terminal in the terminal insertion hole in the composite semiconductor device.
１０ 絶縁ケース １２ 外部導出端子支持部 １３ 端子挿通孔 １４ 排出孔 １５ 上端開口部 １６ ナット収納穴 10 Insulation Case 12 External Lead-out Terminal Support 13 Terminal Insertion Hole 14 Discharge Hole 15 Top Opening 16 Nut Storage Hole
Claims (1)
品及び外部導出端子を搭載し、該放熱板の外周に両端開
口の絶縁ケースを被せ、該絶縁ケースの内側に封止用樹
脂を充填する複合半導体装置用絶縁ケースにおいて、 該絶縁ケースの外周壁の内側に、外部導出端子支持部を
一体的に成形するとともに、該支持部の根元部分に洗浄
液の排出孔を設けたことを特徴とする複合半導体装置用
絶縁ケース。1. An electronic component such as a semiconductor chip and an external lead terminal are mounted on a heat sink, an outer case of the heat sink is covered with an insulating case having openings at both ends, and a sealing resin is filled inside the insulating case. In the insulating case for a composite semiconductor device, the external lead-out terminal supporting portion is integrally formed inside the outer peripheral wall of the insulating case, and a cleaning liquid discharge hole is provided at the root portion of the supporting portion. Insulation case for composite semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1996010964U JP3036640U (en) | 1996-10-08 | 1996-10-08 | Insulation case for composite semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1996010964U JP3036640U (en) | 1996-10-08 | 1996-10-08 | Insulation case for composite semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3036640U true JP3036640U (en) | 1997-05-02 |
Family
ID=43171392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1996010964U Expired - Lifetime JP3036640U (en) | 1996-10-08 | 1996-10-08 | Insulation case for composite semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3036640U (en) |
-
1996
- 1996-10-08 JP JP1996010964U patent/JP3036640U/en not_active Expired - Lifetime
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