JP3029398B2 - 半導体のチップと基板間の電気的連結構造 - Google Patents

半導体のチップと基板間の電気的連結構造

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Publication number
JP3029398B2
JP3029398B2 JP8013488A JP1348896A JP3029398B2 JP 3029398 B2 JP3029398 B2 JP 3029398B2 JP 8013488 A JP8013488 A JP 8013488A JP 1348896 A JP1348896 A JP 1348896A JP 3029398 B2 JP3029398 B2 JP 3029398B2
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Prior art keywords
semiconductor chip
substrate
electrical connection
connection structure
conductive
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JPH09129669A (ja
Inventor
興燮 錢
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エル・ジー・セミコン・カンパニー・リミテッド
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/1147—Manufacturing methods using a lift-off mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
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    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、半導体チップと基
板間の電気的連結構造に係るもので、詳しくは、基板上
のボンディングパッドにチップのバンプを確実に連結
し、電気的特性を改善して信頼性を向上し得る半導体チ
ップと基板間の電気的連結構造に関するものである。
【０００２】
【従来の技術】近来、半導体の高集積化に伴い、バンプ
を用いたベアーチップ（bear chip）を半導体基板上の
パッドに直接実装し電気的連結を行っている。そして、
該半導体チップに金属バンプを形成する技術は正常に広
用されていたが、該バンピングされたチップを基板上の
パッドに電気的連結する技術は未だ正常に適用されてい
ない。
【０００３】且つ、従来半導体のチップと基板間の電気
的連結構造を説明すると次のようであった。即ち、図６
に示したように、ＦＲー４ガラス叉はセラミックの基板
１が形成され、該基板１上にアルミニウムＡｌ叉は銅Ｃ
ｕのボンディングパッド２が形成される。次いで、図４
に示したように、該基板１のボンディングパッド２上に
半導体チップ３の金属性バンプ４が電気的連結される
が、この場合、それら基板１のボンディングパッド２と
半導体チップ３のバンプ４間に、導電性ボール５ａの包
含された異方性接着剤５のＡＣＡ（anisotropic conduc
tive adhesive）叉はＡＣＦ（anisotropic conductive
film）を注入し、該異方性接着剤５の温度及び圧力を調
節しながら熱硬化させ、それら導電性ボール５ａのＺー
軸方向への電気伝導を可能にさせる。即ち、前記基板１
上のパッド２と半導体チップ３のバンプ４間の電気的連
結が導電性ボール５ａを介して行われるように半導体チ
ップと基板間の電気的連結構造が構成されていた。
【０００４】しかし、この場合、図５に示したように、
基板１上のパッド２上面と半導体チップ３のバンプ下面
との表面粗度及び傾斜等に従い、それら基板のパッド２
と半導体チップのバンプ間の電気的連結が導電性ボール
５ａを介して確実に行われない場合が発生していた。
【０００５】
【発明が解決しようとする課題】然るに、このような従
来半導体のチップと基板間の電気的連結構造において
は、基板のパッド上面とチップのバンプ下面との表面粗
度及び傾斜等に従い、それらパッド上面とバンプ下面間
に導電性ボールが正確に接続されない場合が発生し半導
体のチップと基板間の電気的連結が確実に行われないと
いう不都合な点があった。
【０００６】
【課題を解決するための手段】本発明の目的は、半導体
チップのバンプ下面と基板上パッドとの表面粗度及び傾
斜度には拘わりなく半導体チップと基板上パッドとの電
気的連結を確実に行い得る半導体チップと基板間の電気
的連結構造を提供しようとするものである。
【０００７】請求項１の発明による半導体チップと基板
間の電気的連結構造は、半導体基板上のボンディングパ
ッド上面に蒸着法を施して複数の微細な導電性金属突条
を夫々形成し、それら導電性金属突条上面に半導体チッ
プのバンプをボンディングしてなり、導電性金属突条と
半導体チップのバンプ間に導電性ボールを掛合させ、該
導電性ボールを介して電気的連結させる。請求項２の発
明による半導体チップと基板間の電気的連結構造は、請
求項１の発明の構成において、導電性ボールは、それら
導電性金属突条と半導体チップのバンプ間に導電性ボー
ルの包含された異方性接着剤を注入して形成掛合させ
る。請求項３の発明による半導体チップと基板間の電気
的連結構造は、請求項１または請求項２の発明の構成に
おいて、導電性金属突条は、高さが３μｍ程度に形成さ
れる。
【０００８】
【発明の実施の形態】以下、本発明の実施の形態の対し
図面を用いて説明する。本発明に係る半導体チップと基
板間の電気的連結構造においては、図１（Ａ）に示した
ように、先ず、ＦＲーガラス叉はセラミックを用いた基
板１０が形成され、該基板１０上所定部位にアルミニウ
ムＡｌ叉は銅Ｃｕを用いたボンディングパッド１２が形
成される。次いで、図１（Ｂ）に示したように、該基板
１０及びパッド１２上に感光膜１４がコーティングさ
れ、図１（ｃ）に示したように、該感光膜１４が感光性
マスクにより部分的に露出及び現像され、前記ボンディ
ングパッド１２上に所望パターンの凹凸部位が形成され
る。次いで、図１（Ｄ）に示したように、それら感光膜
１４及び基板１０上に蒸着（evaporation）、スパッタ
リング及び電気鍍金中何れ一つの方法により導電性金属
１６’が蒸着（deposition）される。次いで、図１
（Ｅ）に示したように、該感光膜１４と該感光膜１４上
の導電性金属１６’とが夫々除去され、基板１０のボン
ディングパッド１２上面に所定パターンの微細な導電性
金属突条１６が夫々形成される。この場合、該導電性金
属突条１６の高さは、３μｍの高さに形成することが好
ましい。
【０００９】その後、図２に示したように、このように
形成された半導体基板１０のボンディング１２上の各信
頼性金属突条１６上面に、第１実施形態として、半導体
チップ１３のバンプ２４底面を熱圧着し、半導体のチッ
プと基板間の電気的連結構造を構成する。
【００１０】且つ、本発明に係る半導体のチップと基板
間の電気的連結構造の第２実施形態として次のように構
成することもできる。即ち、図３に示したように、前記
第１実施形態と同様に形成された半導体基板１０のボン
ディングパッド１２上の各導電性金属突条１６と、前記
半導体チップ１３のバンプ２４下面との間に、導電性ボ
ール１５ａの包含された異方性接着剤のＡＣＡ叉はＡＣ
Ｆを注入し、該異方性接着剤の温度及び圧力を調節しな
がら熱硬化させて導電性ボール１５ａをそれらの間に形
成掛合させ、該導電性ボール１５ａを介して導電性金属
突条１６とバンプ２４間の電気的連結が行われるように
半導体のチップと基板間の電気的連結構造を構成するこ
ともできる。この場合、それら導電性ボール１５ａは、
導電性金属突条１６とバンプ２４間に該導電性ボール１
５ａの形が歪みながら掛合され、電気的に連結される。
【００１１】
【発明の効果】以上説明したように、本発明に係る半導
体のチップと基板間の電気的連結構造においては、基板
上のボンディングパッド上面に複数の微細な導電性金属
突条を形成し、それら導電性金属突条上面に半導体チッ
プのバンプを直接ボンディングするか、叉は異方性接着
剤を用い導電性ボールを介してボンディングするように
なっているため、半導体チップと基板間の電気的連結を
接続不良無しに確実に行い電気的特性を改善させて製品
の信頼性を向上し得るという効果がある。
【図面の簡単な説明】
【図１】（Ａ）−（Ｅ）本発明に係る半導体のチップと
基板間の電気的連結構造形成説明図である。
【図２】本発明に係る半導体のチップと基板間の電気的
連結構造の第１実施形態を示した縦断面図である。
【図３】本発明に係る半導体のチップと基板間の電気的
連結構造の第２実施形態を示した縦断面図である。
【図４】従来半導体のチップと基板間の電気的連結構造
を示した縦断面図である。
【図５】従来半導体のチップと基板間の電気的連結構造
の不良状態表示図である。
【図６】従来基板上のボンディングパッドを示した縦断
面図である。
【符号の説明】
１、１０：基板 ２、１２：ボンディングパッド ３、１３：半導体チップ ４、２４：バンプ ５：異方性接着剤 ５ａ，１５ａ：導電性ボール １４：感光膜 １６：導電性金属突条 １６’：導電性金属
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−151507（ＪＰ，Ａ) 特開 平１−20632（ＪＰ，Ａ) 特開 平２−187046（ＪＰ，Ａ) 特開 平３−236248（ＪＰ，Ａ)

Claims (3)

    (57)【特許請求の範囲】
  1. 【請求項１】 半導体チップと基板間の電気的連結構造
    であって、 半導体基板上のボンディングパッド上面に蒸着法を施し
    て複数の微細な導電性金属突条を夫々形成し、それら導
    電性金属突条上面に半導体チップのバンプをボンディン
    グしてなり、 前記導電性金属突条と前記半導体チップの前記バンプ間
    に導電性ボールを掛合させ、該導電性ボールを介して電
    気的連結させる、半導体チップと基板間の電気的連結構
    造。
  2. 【請求項２】 前記導電性ボールは、それら導電性金属
    突条と半導体チップのバンプ間に導電性ボールの包含さ
    れた異方性接着剤を注入して形成掛合させる、請求項１
    記載の半導体チップと基板間の電気的連結構造。
  3. 【請求項３】 前記導電性金属突条は、高さが３μｍ程
    度に形成される、請求項１または請求項２に記載の半導
    体チップと基板間の電気的連結構造。
JP8013488A 1995-10-19 1996-01-30 半導体のチップと基板間の電気的連結構造 Expired - Fee Related JP3029398B2 (ja)

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US5731636A (en) 1998-03-24
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