JP3024263B2 - Electronic component mounting head - Google Patents
Electronic component mounting headInfo
- Publication number
- JP3024263B2 JP3024263B2 JP3124328A JP12432891A JP3024263B2 JP 3024263 B2 JP3024263 B2 JP 3024263B2 JP 3124328 A JP3124328 A JP 3124328A JP 12432891 A JP12432891 A JP 12432891A JP 3024263 B2 JP3024263 B2 JP 3024263B2
- Authority
- JP
- Japan
- Prior art keywords
- head
- electronic component
- positive pressure
- mounting head
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品をプリント基板
に実装する電子部品実装ヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting head for mounting electronic components on a printed circuit board.
【０００２】[0002]
【従来の技術】近年、電子部品は急速に表面実装化さ
れ、実装には装着機が主流となってきている。一方電子
部品の中には異形部品があり、表面実装化が進んでいる
ものの、形状，コスト，はんだ付け工法などの関係から
挿入部品も多く存在している。2. Description of the Related Art In recent years, electronic components have been rapidly surface mounted, and mounting machines have become the mainstream for mounting. On the other hand, although there are odd-shaped components among electronic components and their surface mounting is progressing, there are also many inserted components due to the shape, cost, soldering method and the like.
【０００３】以下、従来の電子部品実装ヘッドについて
図２を参照しながら説明する。図に示すように、電子部
品Ａ２１を吸着する吸着ノズル２２および電子部品Ａ２
１を挾持する規正爪２３を設け、この規正爪２３を付勢
するばねＡ２４の力を伝達するブロック２５を設けて吸
着ロッド２６によりヘッド部２７に取り付けられてい
る。そして、前記ヘッド部２７内には、前記吸着ノズル
２２と連通する真空発生器２８が設けられている。A conventional electronic component mounting head will be described below with reference to FIG. As shown in the drawing, a suction nozzle 22 for sucking an electronic component A21 and an electronic component A2
1 is provided, and a block 25 for transmitting the force of a spring A24 that urges the setting claw 23 is provided. The block 25 is attached to the head 27 by a suction rod 26. Further, a vacuum generator 28 communicating with the suction nozzle 22 is provided in the head unit 27.
【０００４】上記構成において動作を説明すると、吸着
ロッド２６を下降させ、同時に真空発生器２８を稼動さ
せることによって、ヘッド下方に位置決めされた電子部
品Ａ２１を吸着ノズル２２で吸着し、次に規正爪２３に
よりばねＡ２４の力で電子部品Ａ２１を挾持し、ヘッド
はプリント基板２９の所定位置に移動し、吸着ロッド２
６を下降させ、真空発生器２８を停止し、電子部品Ａ２
１をプリント基板２９に装着していた。The operation of the above arrangement will be described. By lowering the suction rod 26 and simultaneously operating the vacuum generator 28, the electronic component A21 positioned below the head is suctioned by the suction nozzle 22, and then the control claw is set. 23, the electronic component A21 is held by the force of the spring A24, the head moves to a predetermined position on the printed circuit board 29, and the suction rod 2
6, the vacuum generator 28 is stopped, and the electronic component A2
1 was mounted on the printed circuit board 29.
【０００５】[0005]
【発明が解決しようとする課題】このような従来の電子
部品の装着装置では、実装可能な電子部品Ａ２１は吸着
ノズル２２により吸着されるものに限定される問題があ
った。In such a conventional electronic component mounting apparatus, there is a problem that the mountable electronic component A21 is limited to one that is sucked by the suction nozzle 22.
【０００６】本発明は上記課題を解決するもので、電子
部品の形状に限定されることなく電子部品を実装できる
電子部品実装ヘッドを提供することを目的とする。An object of the present invention is to provide an electronic component mounting head capable of mounting an electronic component without being limited to the shape of the electronic component.
【０００７】[0007]
【課題を解決するための手段】本発明の電子部品実装ヘ
ッドは、上記目的を達成するため、電子部品を負圧によ
り吸着し、実装する装着ヘッドと、正圧とばねにより挟
持動作を行い電子部品を実装する挿入ヘッドと、前記装
着ヘッドと挿入ヘッドの何れをも脱着可能でかつ前記装
着ヘッド又は挿入ヘッドのいずれかを取り付けると同時
に前記装着ヘッド又は挿入ヘッドのエア通路と連通する
エア通路を有するヘッド部と、このヘッド部に接続され
た真空発生器および正圧入切バルブと、この真空発生器
および正圧入切バルブに接続され正圧エアを前記真空発
生器および正圧入切バルブの何れかに供給しうるエア通
路切換バルブを設けた構成とする。In order to achieve the above object, an electronic component mounting head according to the present invention sucks an electronic component by a negative pressure, and performs a clamping operation by a mounting head to be mounted and a positive pressure and a spring. An insertion head for mounting components, and both the mounting head and the insertion head are detachable and the mounting head
At the same time as either the loading head or the insertion head is attached
Communicates with the air passage of the mounting head or the insertion head
A head having an air passage, and a head connected to the head;
Vacuum generator and positive pressure on / off valve and this vacuum generator
And positive pressure air connected to the positive pressure on / off valve to generate the vacuum
Air flow that can be supplied to either the breeder or the positive pressure on / off valve
The configuration is such that a road switching valve is provided.
【０００８】[0008]
【作用】本発明は上記した構成により、電子部品の形状
に応じて装着ヘッドあるいは挿入ヘッドを選択し使用で
きることとなり、電子部品の形状に限定されることなく
電子部品を実装することができるものである。According to the present invention, the mounting head or the insertion head can be selected and used according to the shape of the electronic component, and the electronic component can be mounted without being limited to the shape of the electronic component. is there.
【０００９】[0009]
【実施例】以下、本発明の一実施例について図１を参照
しながら説明する。なお、従来例と同一部分には同一番
号を付けて詳細な説明は省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG. The same parts as those in the conventional example are denoted by the same reference numerals, and detailed description is omitted.
【００１０】図に示すように、装着ヘッド１は吸着ノズ
ル２２，電子部品を挾持する規正爪２３、この規正爪２
３を付勢するばね２４の力を伝えるブロック２５、ヘッ
ド部２７への取り付けを行う吸着ロッド８から構成され
ている。As shown in FIG. 1, a mounting head 1 includes a suction nozzle 22, a setting claw 23 for holding electronic components,
It comprises a block 25 for transmitting the force of a spring 24 for biasing 3, and a suction rod 8 for attachment to the head 27.
【００１１】また、挿入ヘッド２は電子部品Ｂ３を挾持
する挾持爪４ａ，４ｂを、リンク５ａ，５ｂを介しピス
トン６に接続し、ピストン６はばねＢ７により付勢され
ている。The insertion head 2 has clamping claws 4a and 4b for clamping the electronic component B3 connected to the piston 6 via links 5a and 5b, and the piston 6 is urged by a spring B7.
【００１２】そして、挿入ヘッド２は挿入ヘッド本体８
により、前記装着ヘッド１のヘッド部２７に取り付け可
能に構成されている。The insertion head 2 is inserted into the insertion head body 8
Thereby, it can be attached to the head portion 27 of the mounting head 1.
【００１３】また、真空発生器９はエア回路１０をエア
回路切換バルブ１１を介して接続された後、前記ヘッド
部２７に接続され、前記エア回路切換バルブ１１と、前
記真空発生器９とヘッド部２７との間のエア回路を正圧
入切バルブ１２を介して接続している。The vacuum generator 9 is connected to the head section 27 after the air circuit 10 is connected via the air circuit switching valve 11, and is connected to the air circuit switching valve 11, the vacuum generator 9 and the head. An air circuit to and from the section 27 is connected via the positive pressure on / off valve 12.
【００１４】上記構成において動作を説明すると、電子
部品Ａ２１を実装する場合は、装着ヘッド１をヘッド部
２７に取り付け、エア回路１０より送られるエアをエア
回路切換バルブ１１により真空発生器９に供給して吸着
ロッド２６を下降させ、吸着ノズル２２により電子部品
Ａ２１を吸着する。その後吸着ロッド２６を上昇させ、
規正爪２３にて電子部品Ａ２１を規正し、装着ヘッド１
をプリント基板２９上で位置決めし、再び吸着ロッド２
６を下降させ、真空発生器９を停止し、電子部品Ａ２１
をプリント基板２９に装着する。The operation of the above configuration will be described. When the electronic component A21 is mounted, the mounting head 1 is mounted on the head section 27, and air sent from the air circuit 10 is supplied to the vacuum generator 9 by the air circuit switching valve 11. Then, the suction rod 26 is lowered, and the electronic component A21 is sucked by the suction nozzle 22. Then, the suction rod 26 is raised,
The electronic component A21 is set by the setting claw 23, and the mounting head 1 is set.
Is positioned on the printed circuit board 29, and the suction rod 2 is
6, the vacuum generator 9 is stopped, and the electronic component A21
Is mounted on the printed circuit board 29.
【００１５】また、電子部品Ｂ３を実装する場合は、挿
入ヘッド１をヘッド部２７へ取り付け、正圧入切バルブ
１２を入にしてエア回路切換バルブ１１を切り換え、エ
ア回路１０から送られる正圧の空気を挿入ヘッド１に送
る。この正圧によりピストン６が下降し、リンク５ａ，
５ｂを介して挾持爪４ａ，４ｂが開く、そして、吸着ロ
ッド８が下降する。そして、正圧入切バルブ１２を切に
し、ばねＢ７により、挾持爪４ａ，４ｂを閉じて電子部
品Ｂ３を挾持し、吸着ロッド８を上昇させ、挿入ヘッド
２をプリント基板２９上で位置決めし、吸着ロッド８を
下降させ、電子部品Ｂ３をプリント基板２９に挿入し、
正圧入切バルブ１２を再び入にし、挾持爪４ａ，４ｂを
開き吸着ロッド８を上昇させるものである。When the electronic component B3 is mounted, the insertion head 1 is attached to the head portion 27, the positive pressure on / off valve 12 is turned on, the air circuit switching valve 11 is switched, and the positive pressure sent from the air circuit 10 is changed. Air is sent to the insertion head 1. Due to this positive pressure, the piston 6 descends, and the link 5a,
The holding claws 4a, 4b are opened via 5b, and the suction rod 8 is lowered. Then, the positive pressure on / off valve 12 is turned off, the holding claws 4a and 4b are closed by the spring B7 to hold the electronic component B3, the suction rod 8 is raised, and the insertion head 2 is positioned on the printed circuit board 29, and suction is performed. The rod 8 is lowered, and the electronic component B3 is inserted into the printed circuit board 29,
The positive pressure on / off valve 12 is turned on again, the holding claws 4a and 4b are opened, and the suction rod 8 is raised.
【００１６】このように本発明の実施例の電子部品実装
ヘッドによれば、従来のヘッド部２７に負圧と正圧のエ
ア回路切換バルブ１１と挿入ヘッド２を付加させたこと
により、真空により吸着し、装着していた面実装部品だ
けでなく、表面吸着不可で挾持により装着あるいは挿入
する電子部品も実装することができる。As described above, according to the electronic component mounting head of the embodiment of the present invention, since the air circuit switching valve 11 for negative pressure and positive pressure and the insertion head 2 are added to the conventional head part 27, the head can be vacuumed. It is possible to mount not only the surface-mounted components that have been sucked and mounted, but also electronic components that can be mounted or inserted by clamping without surface suction.
【００１７】[0017]
【発明の効果】以上の実施例から明らかなように、本発
明によれば、１つのヘッド部で電子部品を吸着する装着
ヘッドおよび電子部品を挟持する挿入ヘッドを脱着と同
時にエア通路が連通し、ヘッド部に連なるエア切換バル
ブにより正圧若しくは負圧の何れか必要な方を供給する
ことができるので、極めて簡単に装着ヘッドと挿入ヘッ
ドの切換ができ、電子部品の形状に限定されることがな
く実装可能な電子部品実装ヘッドを提供できる。As is apparent from the above embodiments, according to the present invention, the mounting for picking up the electronic component with one head portion is performed.
The insertion head that holds the head and electronic components is
Air switching valve that sometimes communicates with the air passage and the head
Supply either positive pressure or negative pressure as required
The mounting head and insertion head
The electronic component mounting head can be switched, and can be mounted without being limited to the shape of the electronic component.
【図１】本発明の一実施例の電子部品実装ヘッドの概略
構成を示す断面図FIG. 1 is a sectional view showing a schematic configuration of an electronic component mounting head according to an embodiment of the present invention.
【図２】従来の電子部品実装ヘッドの概略構成を示す断
面図FIG. 2 is a sectional view showing a schematic configuration of a conventional electronic component mounting head.
１ 装着ヘッド ２ 挿入ヘッド ３ 電子部品Ｂ ９ 真空発生器 １１ エア回路切換バルブ ２１ 電子部品Ａ ２７ ヘッド部 DESCRIPTION OF SYMBOLS 1 Mounting head 2 Insertion head 3 Electronic component B 9 Vacuum generator 11 Air circuit switching valve 21 Electronic component A 27 Head part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山本 泰嗣 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平２−139138（ＪＰ，Ａ) 実開 平２−90024（ＪＰ，Ｕ) 実開 平１−74085（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 13/04 B23P 21/00 305 ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Yasushi Yamamoto 1006 Kazuma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-139138 (JP, A) 90024 (JP, U) Japanese Utility Model Application Hei 1-74085 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H05K 13/04 B23P 21/00 305
Claims (1)
装着ヘッドと、正圧とばねにより挟持動作を行い電子部
品Ｂを実装する挿入ヘッドと、前記装着ヘッドと挿入ヘ
ッドの何れをも脱着可能でかつ前記装着ヘッド又は挿入
ヘッドのいずれかを取り付けると同時に前記装着ヘッド
又は挿入ヘッドのエア通路と連通するエア通路を有する
ヘッド部と、このヘッド部に接続された真空発生器およ
び正圧入切バルブと、この真空発生器および正圧入切バ
ルブに接続され正圧エアを前記真空発生器および正圧入
切バルブの何れかに供給しうるエア通路切換バルブを設
けた電子部品実装ヘッド。1. A mounting head for adsorbing and mounting an electronic component A by a negative pressure, an insertion head for performing a clamping operation by a positive pressure and a spring to mount an electronic component B, and detaching and attaching both the mounting head and the insertion head. Possible and said mounting head or insertion
Attach any of the heads and at the same time
Or, a head portion having an air passage communicating with the air passage of the insertion head, a vacuum generator and a vacuum generator connected to the head portion.
And the positive pressure on / off valve and the vacuum generator and positive pressure on / off valve.
Positive pressure air connected to the vacuum generator and positive pressure
An electronic component mounting head provided with an air passage switching valve that can be supplied to any of the shutoff valves .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3124328A JP3024263B2 (en) | 1991-05-29 | 1991-05-29 | Electronic component mounting head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3124328A JP3024263B2 (en) | 1991-05-29 | 1991-05-29 | Electronic component mounting head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04352398A JPH04352398A (en) | 1992-12-07 |
| JP3024263B2 true JP3024263B2 (en) | 2000-03-21 |
Family
ID=14882622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3124328A Expired - Fee Related JP3024263B2 (en) | 1991-05-29 | 1991-05-29 | Electronic component mounting head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3024263B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103862281A (en) * | 2014-03-11 | 2014-06-18 | 大连理工大学 | Assembly method for miniature parts |
-
1991
- 1991-05-29 JP JP3124328A patent/JP3024263B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103862281A (en) * | 2014-03-11 | 2014-06-18 | 大连理工大学 | Assembly method for miniature parts |
| CN103862281B (en) * | 2014-03-11 | 2016-03-02 | 大连理工大学 | A kind of assembly method of micro part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04352398A (en) | 1992-12-07 |
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