JP2952675B2 - Method of manufacturing voice coil for speaker - Google Patents
Method of manufacturing voice coil for speakerInfo
- Publication number
- JP2952675B2 JP2952675B2 JP29388889A JP29388889A JP2952675B2 JP 2952675 B2 JP2952675 B2 JP 2952675B2 JP 29388889 A JP29388889 A JP 29388889A JP 29388889 A JP29388889 A JP 29388889A JP 2952675 B2 JP2952675 B2 JP 2952675B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- coil
- coil lead
- speaker
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、スピーカ用ボイスコイルの製造方法に関
し、さらに具体的に述べれば、コイル引出し線と、フレ
ームの接続端子からのリード線との接続方法に関するも
のである。The present invention relates to a method for manufacturing a voice coil for a speaker, and more specifically, to a connection between a coil lead wire and a lead wire from a connection terminal of a frame. It is about the method.
（従来の技術） 従来、スピーカ用ボイスコイルは、コイル引出し線
と、フレームの接続端子からのリード線との接続を、次
のような方法で行っていた。すなわち、まず、コイル引
出し線の絶縁膜を、皮膜剥離剤により除去した後、表面
に残存した剥離剤を布等でふき取った皮膜除去部分を溶
融はんだ槽に浸漬し、はんだ膜を形成する。次に、コイ
ル引出し線のはんだ膜形成部分をリード線に巻付け、そ
の上をはんだ付けし、両者を接続していた。(Prior Art) Conventionally, in a speaker voice coil, connection between a coil lead wire and a lead wire from a connection terminal of a frame has been performed by the following method. That is, first, the insulating film of the coil lead wire is removed with a film peeling agent, and the film-removed portion where the peeling agent remaining on the surface is wiped off with a cloth or the like is immersed in a molten solder bath to form a solder film. Next, the portion of the coil lead wire where the solder film was formed was wound around the lead wire, and the upper portion was soldered to connect the two.
また、特開昭54−151822号公報に記載のように、加熱
して引出し線の絶縁皮膜を炭化分解し、さらに加圧する
ことによって炭化分解した炭化物を破壊して半田付けす
る方法も検討されていた。Further, as described in JP-A-54-151822, a method of heating and carbonizing the insulating film of the lead wire and further applying pressure to destroy the carbonized carbonized material and soldering has been studied. Was.
（発明が解決しようとする課題） しかしながら、前者の接続方法では、絶縁皮膜の剥離
に用いる皮膜剥離剤は、強アルカリ性のため、作業者の
皮膚に付着すると有害なばかりでなく、コイル引出し線
に残留すると、腐食を誘発し、スピーカの性能を著しく
劣化させるという問題があった。また、工程数が多く、
作業が複雑で作業工数が多く、製造コストが高いという
問題もあった。さらに、コイル引出し線にはんだ膜を形
成する工程では、線材の損傷、変質等を招き易く、不良
率が高いという問題もあった。(Problems to be Solved by the Invention) However, in the former connection method, since the film peeling agent used for peeling the insulating film is strongly alkaline, it is not only harmful when it adheres to the worker's skin, but also harmful to the coil lead wire. If left, there is a problem that corrosion is induced and the performance of the speaker is significantly deteriorated. In addition, the number of processes is large,
There is also a problem that the work is complicated, the number of work steps is large, and the manufacturing cost is high. Further, in the step of forming a solder film on the coil lead wire, there is a problem that the wire is liable to be damaged or deteriorated, and the defect rate is high.
また、後者の接続方法では、炭化物を加圧によって破
壊して除去するため、炭化物が残存することもあり、接
続強度がばらつくとともに、電気的な接続の信頼性を得
るための加熱温度、加圧の圧力の管理も容易でなく、コ
イル引出し線の絶縁皮膜の厚さのばらつきも接続の信頼
性に大きな影響を与えるものであった。In the latter connection method, carbides are broken and removed by pressurization, so that carbides may remain.The connection strength varies, and a heating temperature and a pressurization for obtaining reliability of electrical connection are obtained. It was not easy to control the pressure, and the variation in the thickness of the insulating film of the coil lead wire had a great effect on the reliability of the connection.
本発明は上記の問題を解決するもので、作業工数が少
なく、しかも安全で信頼性の高いコイル引出し線とリー
ド線の接続方法を提供するものである。SUMMARY OF THE INVENTION The present invention solves the above problems, and provides a safe and reliable method of connecting a coil lead wire and a lead wire with a small number of work steps.
（課題を解決するための手段） 上記の課題を解決するため、本発明は、あらかじめ、
一部分にはんだ層を形成したリード線を用い、このはん
だ層形成部分にコイル引出し線を密着せしめた後、密着
部分に、局部的にパルスレーザ光を照射して、両者を接
続するものである。(Means for Solving the Problems) In order to solve the above problems, the present invention
A lead wire having a solder layer formed in a part thereof is used. A coil lead wire is brought into close contact with the solder layer forming portion, and then the pulsed laser beam is locally applied to the contact portion to connect the two.
（作 用） パルスレーザ光を当てると、まず、リード線に付着し
たはんだの表面が溶融して液化し、表面張力によって、
密着したコイル引出し線を包み込み、さらに内部まで溶
融が進むと、リード線とコイル引出し線を共に包み込
む。なお、この時外部に滴下することはない。次に、は
んだの温度がさらに上昇すると、コイル引出し線の絶縁
皮膜の樹脂が熱分解を起こし、ガスとなって放散（気
化）され、この時点で、はんだとコイル引出し線が直接
接触し、リード線とコイル引出し線が接続する。(Operation) When a pulsed laser beam is applied, the surface of the solder attached to the lead wire first melts and liquefies,
When the melting of the coil lead wire is wrapped around the closely attached coil lead wire, the lead wire and the coil lead wire are wrapped together. At this time, it does not drop outside. Next, when the temperature of the solder further rises, the resin of the insulating film of the coil lead wire is thermally decomposed and gasified and vaporized (evaporated). The wire and coil lead wire connect.
このように、本発明の接続方法では、有害な、皮膜剥
離剤を用いないので、作業環境上良好であり、コイル引
出し線を損傷する心配がない。また、短い工程で、接続
することが可能となり、絶縁皮膜は熱分解後に炭化して
残存することなく気化してしまい、安価で信頼性の高い
ボイスコイルの接続方法を提供することが可能となる。As described above, the connection method of the present invention does not use a harmful film peeling agent, so that the working environment is good and there is no risk of damaging the coil lead wire. In addition, connection can be made in a short process, and the insulating film is carbonized after pyrolysis and vaporized without remaining, thereby making it possible to provide an inexpensive and highly reliable voice coil connection method. .
（実施例） 本発明の実施例を第１図ないし第３図により説明す
る。(Embodiment) An embodiment of the present invention will be described with reference to FIGS.
第１図、第２図および第３図は、本発明による実施例
を工程順にした要部拡大斜視図および要部拡大断面図で
ある。第１図において、まず、フレーム端子（図示せ
ず）に接続されたリード線１の先端部に、はんだ層２を
形成する。次に、絶縁皮膜3aを剥離しないで、コイル引
出し線３の先端を、はんだ層２の形成部分に密着するよ
うに巻き付ける。次に、コイル用ボビン４の下方に巻回
したコイル５との関係位置を固定するため、補強紙６を
用いて、コイル引出し線３の根本近傍を、コイル用ボビ
ン４の表面に固定する。次に、コイル引出し線３と、リ
ード線１のはんだ層形成部分の密着部分に、YAGレーザ
光の焦点を絞って照射する。はんだ層２の表面がまず溶
融しコイル引出し線３に付着する。さらに照射を続ける
と、コイル引出し線３の絶縁皮膜が熱分解して気化し、
はんだ層２はコイル引出し線３の線材3b部分と直接接触
することとなり、コイル引出し線３とリード線１が導通
する。なお、レーザ照射は、コイル用ボビン４への熱影
響を避けるため、補強紙６で固定する前に行ってもよ
い。また、はんだ層２を円滑に溶融させるために、YAG
レーザ光は、パルス波とし、しかも、先鋭なピークよ
り、なだらかなピークをもつパルス波とすることが望ま
しい。1, 2 and 3 are an enlarged perspective view and an enlarged cross-sectional view of a main part of an embodiment according to the present invention in the order of steps. In FIG. 1, first, a solder layer 2 is formed at the tip of a lead wire 1 connected to a frame terminal (not shown). Next, the distal end of the coil lead wire 3 is wound so as to be in close contact with the portion where the solder layer 2 is formed without peeling off the insulating film 3a. Next, in order to fix the position relative to the coil 5 wound below the coil bobbin 4, the vicinity of the root of the coil lead wire 3 is fixed to the surface of the coil bobbin 4 using reinforcing paper 6. Next, the YAG laser beam is focused and applied to the contact portion between the coil lead wire 3 and the solder layer forming portion of the lead wire 1. The surface of the solder layer 2 first melts and adheres to the coil lead wire 3. When the irradiation is further continued, the insulating film of the coil lead wire 3 is thermally decomposed and vaporized,
The solder layer 2 comes into direct contact with the wire 3b of the coil lead 3, and the coil lead 3 and the lead 1 are conducted. The laser irradiation may be performed before fixing with the reinforcing paper 6 in order to avoid a thermal effect on the coil bobbin 4. In order to smoothly melt the solder layer 2, YAG
It is desirable that the laser light be a pulse wave and a pulse wave having a gentler peak than a sharp peak.
第２図は、レーザ照射前の状態で、はんだ層２が形成
されたリード線１の周りに絶縁皮膜3aが形成されたコイ
ル引出し線３が密着して巻かれている。第３図はレーザ
照射後の状態を示し、絶縁皮膜3aが気化して、残渣3cが
僅かに残っている。In FIG. 2, before the laser irradiation, a coil lead wire 3 on which an insulating film 3a is formed is tightly wound around a lead wire 1 on which a solder layer 2 is formed. FIG. 3 shows a state after laser irradiation, in which the insulating film 3a is vaporized and a small amount of the residue 3c remains.
（発明の効果） 以上説明したように、本発明によれば、従来のよう
に、皮膜剥離剤を使わないので、作業者の安全衛生上、
好ましいばかりでなく、剥離剤のアルカリ成分による、
線材の腐食、損傷もない。また、コイル引出し線の絶縁
皮膜の剥離、および予備はんだ付けの工程がなくなるの
で、製造工程が簡単となる。また、絶縁皮膜の炭化物も
気化によって極めて僅かしか残らない。従って、信頼性
の高い、安価なスピーカ用ボイスコイルを得ることがで
きる。(Effects of the Invention) As described above, according to the present invention, unlike the related art, a film peeling agent is not used.
Not only preferred, but also due to the alkaline component of the release agent,
No corrosion or damage to the wire. In addition, since the steps of peeling off the insulating film of the coil lead wire and the preliminary soldering are eliminated, the manufacturing process is simplified. Also, very little carbide of the insulating film remains due to vaporization. Therefore, a reliable and inexpensive speaker voice coil can be obtained.
第１図は本発明によるコイル引出し線とリード線接続部
を示す要部拡大斜視図、第２図および第３図は接続部の
レーザ照射前および照射後を示す要部拡大断面図であ
る。 １……リード線、２……はんだ層、３……コイル引出し
線、3a……絶縁皮膜、3b……線材、3c……残渣、４……
コイル用ボビン、５……コイル、６……補強紙。FIG. 1 is an enlarged perspective view of an essential part showing a coil lead wire and a lead wire connecting part according to the present invention, and FIGS. 2 and 3 are enlarged sectional views of an essential part showing a connecting part before and after laser irradiation. 1 ... lead wire, 2 ... solder layer, 3 ... coil lead wire, 3a ... insulating film, 3b ... wire, 3c ... residue, 4 ...
Coil bobbin, 5 ... coil, 6 ... reinforcing paper.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H04R 9/04 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H04R 9/04
Claims (1)
からのリード線にはんだを用いて接続するスピーカ用ボ
イスコイルの製造方法において、リード線にあらかじめ
形成したはんだ層に、絶縁皮膜が形成されているコイル
引出し線を巻き、パルス波のレーザ光を照射し、前記は
んだ層を溶融させると同時に、コイル引出し線の絶縁皮
膜を熱分解して気化させて除去し両者を接続することを
特徴とするスピーカ用ボイスコイルの製造方法。1. A method of manufacturing a voice coil for a speaker, wherein at least a coil lead wire is connected to a lead wire from a connection terminal by using a solder, an insulating film is formed on a solder layer previously formed on the lead wire. The coil lead wire is wound and irradiated with a pulsed laser beam to melt the solder layer, and at the same time, thermally decompose and remove the insulating film of the coil lead wire by vaporization to connect the two. A method for manufacturing a voice coil for a speaker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29388889A JP2952675B2 (en) | 1989-11-14 | 1989-11-14 | Method of manufacturing voice coil for speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29388889A JP2952675B2 (en) | 1989-11-14 | 1989-11-14 | Method of manufacturing voice coil for speaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03155300A JPH03155300A (en) | 1991-07-03 |
| JP2952675B2 true JP2952675B2 (en) | 1999-09-27 |
Family
ID=17800452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29388889A Expired - Fee Related JP2952675B2 (en) | 1989-11-14 | 1989-11-14 | Method of manufacturing voice coil for speaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2952675B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4142118B2 (en) * | 1994-12-27 | 2008-08-27 | 古河電気工業株式会社 | Manufacturing method of electronic parts and film peeling treatment method of insulated wires |
| JP4584064B2 (en) * | 2005-07-26 | 2010-11-17 | 株式会社東海理化電機製作所 | Wire connection method |
| JP4617421B2 (en) * | 2007-10-01 | 2011-01-26 | 多摩川精機株式会社 | Terminal structure and manufacturing method thereof |
| JP2013048065A (en) | 2011-08-29 | 2013-03-07 | Sumida Corporation | Leader line connection method |
-
1989
- 1989-11-14 JP JP29388889A patent/JP2952675B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03155300A (en) | 1991-07-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |