JP2935143B2 - Square chip resistor and method of manufacturing the same - Google Patents
Square chip resistor and method of manufacturing the sameInfo
- Publication number
- JP2935143B2 JP2935143B2 JP3150112A JP15011291A JP2935143B2 JP 2935143 B2 JP2935143 B2 JP 2935143B2 JP 3150112 A JP3150112 A JP 3150112A JP 15011291 A JP15011291 A JP 15011291A JP 2935143 B2 JP2935143 B2 JP 2935143B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating substrate
- flat plate
- chip resistor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、車載用、民生機器用
或いは産業機器用の角形チップ抵抗器、及びその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular chip resistor for a vehicle, a consumer device, or an industrial device, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】図３及び図４は、従来の角形チップ抵抗
器を示す要部断面図及び外観斜視図である。この角形チ
ップ抵抗器は、アルミナセラミック基板１の両端部に、
上面部、側面部及び裏面部を覆う断面「コ」字状の電極
部９が形成されている。この電極部９は、基板１の上面
側を１次電極２、基板１の側面側を２次電極２ａ、そし
て基板１の裏面側を３次電極３とされる。更に、基板１
の上面の両端部に形成した１次電極２，２間に跨がって
抵抗部５が形成されている。2. Description of the Related Art FIGS. 3 and 4 are a sectional view and a perspective view, respectively, showing a main part of a conventional square chip resistor. This square chip resistor is provided at both ends of the alumina ceramic substrate 1.
An electrode portion 9 having a U-shaped cross section that covers the upper surface, the side surface, and the back surface is formed. In the electrode section 9, the upper surface of the substrate 1 is the primary electrode 2, the side surface of the substrate 1 is the secondary electrode 2a, and the rear surface of the substrate 1 is the tertiary electrode 3. Further, the substrate 1
A resistance portion 5 is formed so as to extend between the primary electrodes 2 and 2 formed at both ends of the upper surface of the substrate.
【０００３】電極部９は、基板１の上面端部、側面及び
裏面端部にわたって、つまり断面「コ」字状に厚膜導体
ペースト（Ａｇペースト）にて厚膜導電層９１を形成
し、この厚膜導電層９１の上面にＮｉメッキ膜９２、更
にＮｉメッキ膜９２の上面にＰｂ−Ｓｎメッキ膜９３を
形成して３層構造としている。そして、アルミナセラミ
ック基板１の上面の両端部の１次電極（厚膜導電層９
１）２に跨がって抵抗膜（Ｒｕと硼珪酸鉛ガラスを主体
としたペースト）５１を印刷焼成し、この抵抗膜５１の
上面に１次保護膜（厚膜ガラス）５２、１次保護膜５２
の上面に２次保護膜（厚膜ガラス）５３、２次保護膜５
３の上面に保護外装膜（厚膜ガラス）５４をそれぞれ印
刷焼成して製造される。The electrode section 9 forms a thick-film conductive layer 91 with a thick-film conductor paste (Ag paste) over the upper end, the side, and the rear end of the substrate 1, that is, in a U-shaped cross section. A Ni plating film 92 is formed on the upper surface of the thick film conductive layer 91, and a Pb-Sn plating film 93 is further formed on the upper surface of the Ni plating film 92 to form a three-layer structure. Then, primary electrodes (thick film conductive layer 9) at both ends of the upper surface of alumina ceramic substrate 1 are formed.
1) A resistive film (paste mainly composed of Ru and lead borosilicate glass) 51 is printed and baked over 2 and a primary protective film (thick glass) 52 and a primary protective film are formed on the upper surface of the resistive film 51. Membrane 52
Protective film (thick film) 53, secondary protective film 5
The protective outer film (thick film glass) 54 is printed and baked on the upper surface of each of the light-emitting devices 3 and manufactured.
【０００４】[0004]
【発明が解決しようとする課題】上記、従来の角形チッ
プ抵抗器は、図３で示すように、例えばガラスエポキシ
配線基板の導体パターン７上に載置し（３次電極３を導
体パターン７上に載置し）、１次電極２及び側面電極２
ａ上と導体パターン７上にハンダ８を盛って接着固定す
る。電極部はハンダメッキされているので、ハンダ８の
盛が多い場合はもちろん、少ない場合もハンダ付け時に
電極部全体にハンダが載ってしまう。ところが、ハンダ
の温度に対する膨張収縮率は、電極部９を構成する厚膜
導体層９１の温度に対する膨張収縮率より遙に大きい。
このため、温度差（−５５°Ｃ乃至１２５°Ｃ、１００
０乃至３０００サイクル）によって、厚膜導体層９１が
ハンダ部分に引っ張られる等の機械的な応力集中が生
じ、１次電極２と２次保護膜５３との境界付近で厚膜導
体層９１がアルミナセラミック基板１から剥がれ、断線
する恐れがある等の不利がある。As shown in FIG. 3, the conventional square chip resistor is mounted on a conductor pattern 7 of, for example, a glass epoxy wiring board (the tertiary electrode 3 is placed on the conductor pattern 7). On the primary electrode 2 and the side electrode 2
The solder 8 is piled up and fixed on the conductor pattern 7 and the conductor pattern 7. Since the electrode portion is solder-plated, the solder is applied to the entire electrode portion at the time of soldering, not only when the number of the solders 8 is large but also when the number is small. However, the expansion and contraction rate with respect to the temperature of the solder is much larger than the expansion and contraction rate with respect to the temperature of the thick film conductor layer 91 constituting the electrode portion 9.
Therefore, the temperature difference (−55 ° C. to 125 ° C., 100 ° C.)
0 to 3000 cycles), mechanical stress concentration such as the thick-film conductor layer 91 being pulled by the solder portion occurs, and the thick-film conductor layer 91 becomes alumina near the boundary between the primary electrode 2 and the secondary protective film 53. There are disadvantages such as peeling from the ceramic substrate 1 and disconnection.
【０００５】又、従来の角形チップ抵抗器は、絶縁基板
１の両側面に２次電極（側面電極）２ａを形成しなけれ
ばならず、製造が手間である等の不利がある。In addition, the conventional square chip resistor has disadvantages in that the secondary electrodes (side electrodes) 2a must be formed on both side surfaces of the insulating substrate 1 and the production is troublesome.
【０００６】この発明は、以上のような課題を解消し、
製造が容易で、温度変化によっても厚膜導体層が基板か
ら剥がれて断線する恐れのない角形チップ抵抗器及びそ
の製造方法を提供することを目的とする。[0006] The present invention solves the above problems,
It is an object of the present invention to provide a square chip resistor which is easy to manufacture and has no risk of disconnection due to peeling of a thick film conductor layer from a substrate due to a temperature change, and a method of manufacturing the same.
【０００７】[0007]
【課題を解決するための手段及び作用】この目的を達成
するために、この発明の特許請求の範囲の請求項１記載
の角形チップ抵抗器は、電極形成部を貫通する貫通孔を
有する絶縁基板と、この絶縁基板の上面の両端部にそれ
ぞれ形成した電極と、絶縁基板の上面に電極間に跨がっ
て形成した抵抗部と、前記貫通孔に嵌挿され、絶縁基板
の上面の電極に接触する平板部及び絶縁基板の下面に接
触する平板部を有する電極金具とを備えることを特徴と
する。In order to attain this object, a square chip resistor according to claim 1 of the present invention has an insulating substrate having a through hole penetrating an electrode forming portion. And electrodes formed at both ends of the upper surface of the insulating substrate, a resistance portion formed across the electrodes on the upper surface of the insulating substrate, and inserted into the through-hole, and connected to the electrodes on the upper surface of the insulating substrate. An electrode fitting having a flat plate portion in contact with and a flat plate portion in contact with the lower surface of the insulating substrate is provided.
【０００８】この角形チップ抵抗器では、絶縁基板に２
次電極（側面電極）を形成せず、絶縁基板の上面にのみ
電極（１次電極）を形成する。そして、貫通孔に電極金
具を嵌挿することで、電極金具の軸部が貫通孔に挿通さ
れ、電極金具の一方の平板部が絶縁基板の上面の電極に
接触し、他方の平板部が絶縁基板の下面に接触する。こ
の結果、絶縁基板の上面の両端部（１次電極形成部）に
一方の平板部が位置すると共に、絶縁基板の下面の両端
部（３次電極形成部）に他方の平板部が位置し、絶縁基
板の上面の電極は電極金具を通じて絶縁基板の下面の平
板部に導通することになる。つまり、電極金具が１次電
極と３次電極の機能を兼有することになる。In this rectangular chip resistor, two
The electrode (primary electrode) is formed only on the upper surface of the insulating substrate without forming the next electrode (side electrode). Then, by inserting the electrode fitting into the through hole, the shaft of the electrode fitting is inserted into the through hole, and one flat part of the electrode fitting comes into contact with the electrode on the upper surface of the insulating substrate, and the other flat part is insulated. Contact the lower surface of the substrate. As a result, one flat plate portion is located at both end portions (primary electrode forming portions) of the upper surface of the insulating substrate, and the other flat plate portion is located at both end portions (tertiary electrode forming portion) of the lower surface of the insulating substrate, The electrode on the upper surface of the insulating substrate is electrically connected to the flat plate on the lower surface of the insulating substrate through the electrode fitting. That is, the electrode fittings have both functions of the primary electrode and the tertiary electrode.
【０００９】これにより、この角形チップ抵抗器を配線
基板の導体パターン上に載置し（３次電極としての電極
金具の平板部を導体パターン上に載置し）、ハンダで接
着固定する際は、導体パターンと平板部との間のみに接
着ハンダを介装することで実行できる。従って、１次電
極としての電極金具の平板部にはハンダ盛りを行う必要
がなく、ハンダの熱膨張係数と電極の熱膨張係数の違い
による機械的応力集中が避けられ、断線する恐れが解消
できる。Thus, when the square chip resistor is placed on the conductor pattern of the wiring board (the flat plate portion of the electrode fitting as the tertiary electrode is placed on the conductor pattern) and is fixed by soldering, This can be performed by interposing an adhesive solder only between the conductor pattern and the flat plate portion. Therefore, it is not necessary to perform solder embossing on the flat plate portion of the electrode fitting as the primary electrode, so that mechanical stress concentration due to the difference between the coefficient of thermal expansion of the solder and the coefficient of thermal expansion of the electrode can be avoided, and the risk of disconnection can be eliminated. .
【００１０】又、特許請求の範囲の請求項２記載の角形
チップ抵抗器の製造方法は、絶縁基板の両端部にそれぞ
れ貫通孔を形成する工程と、この貫通孔に対応する絶縁
基板の上面にそれぞれ厚膜導体層を形成する工程と、絶
縁基板の上面の厚膜導体層間に跨がって抵抗部を形成す
る工程と、前記貫通孔に挿通される軸部と、この軸部の
両端に軸部の延伸方向とは垂直方向に設けられた平板部
とを有する電極金具の軸部を前記貫通孔に嵌挿すると共
に、一方の平板部を絶縁基板の上面の厚膜導体層に接触
させ、他方の平板部を絶縁基板の下面に接触させる工程
とからなることを特徴とする。According to a second aspect of the present invention, there is provided a method of manufacturing a square chip resistor, comprising the steps of forming through holes at both ends of an insulating substrate, and forming the through holes on the upper surface of the insulating substrate corresponding to the through holes. A step of forming a thick film conductor layer, a step of forming a resistance portion over the thick film conductor layer on the upper surface of the insulating substrate, a shaft portion inserted into the through hole, and two ends of the shaft portion. The shaft portion of the electrode fitting having a flat portion provided in a direction perpendicular to the extending direction of the shaft portion is fitted into the through hole, and one flat portion is brought into contact with the thick film conductor layer on the upper surface of the insulating substrate. Contacting the other flat portion with the lower surface of the insulating substrate.
【００１１】この角形チップ抵抗器の製造方法では、絶
縁基板に形成した貫通孔に電極金具を取付ければ、電極
金具の一方の平板部が絶縁基板の上面の電極に接触し、
他方の平板部が絶縁基板の下面に接触する。つまり、電
極金具の一方の平板部が１次電極として、他方の平板部
が３次電極として機能する。このため、絶縁基板に２次
電極（側面電極）を形成する工程を省くことができ、製
造が簡単でコストを削減できる。In this method of manufacturing a rectangular chip resistor, if an electrode fitting is attached to a through hole formed in an insulating substrate, one flat plate portion of the electrode fitting contacts an electrode on the upper surface of the insulating substrate,
The other flat portion contacts the lower surface of the insulating substrate. That is, one flat plate portion of the electrode fitting functions as a primary electrode, and the other flat plate portion functions as a tertiary electrode. Therefore, the step of forming the secondary electrode (side electrode) on the insulating substrate can be omitted, and the manufacturing can be simplified and the cost can be reduced.
【００１２】[0012]
【実施例】以下、この発明に係る角形チップ抵抗器を実
施例に基づいて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a square chip resistor according to the present invention will be described based on embodiments.
【００１３】図１は、その一実施例に係る角形チップ抵
抗器の要部断面図、図２は、その要部断面斜視図であ
る。この角形チップ抵抗器は、両端部（電極形成部）を
それぞれ貫通する貫通孔４，４を有するアルミナセラミ
ック基板１と、この基板１の上面の両端部にそれぞれ形
成された１次電極（表面電極）としての厚膜導体層２１
と、厚膜導体層２１，２１間に跨がって形成された抵抗
部５と、貫通孔４，４にそれぞれ嵌挿された電極金具
６，６とを備える。FIG. 1 is a cross-sectional view of a main part of a rectangular chip resistor according to one embodiment, and FIG. 2 is a cross-sectional perspective view of the main part. The square chip resistor includes an alumina ceramic substrate 1 having through holes 4 penetrating both ends (electrode forming portions), and primary electrodes (surface electrodes) formed on both ends of an upper surface of the substrate 1. Thick film conductor layer 21)
And a resistance part 5 formed so as to extend between the thick film conductor layers 21 and 21, and electrode fittings 6 and 6 respectively fitted in the through holes 4 and 4.
【００１４】抵抗部５は、厚膜導体層２１，２１間に跨
がって形成された抵抗膜５１と、抵抗膜５１上に形成さ
れた内部保護膜（１次保護膜）５２と、内部保護膜５２
上に形成された２次保護膜５３とからなり、抵抗膜５１
にはレーザトリミング溝５１ａが形成され、抵抗値が調
整されている。更に、抵抗部５は保護外装膜５４により
被覆され、保護外装膜５４には抵抗値表示等の標印が施
されている。The resistance portion 5 includes a resistance film 51 formed over the thick film conductor layers 21 and 21, an internal protection film (primary protection film) 52 formed on the resistance film 51, Protective film 52
And a secondary protection film 53 formed thereon.
Is formed with a laser trimming groove 51a, and the resistance value is adjusted. Further, the resistance portion 5 is covered with a protective sheathing film 54, and the protective sheathing film 54 is marked with a mark such as a resistance value display.
【００１５】電極金具６は、ここでは、上側金具６１と
下側金具６２とで構成された断面Ｉ字状を呈するもので
ある。上側金具６１は、一定幅長さ（厚膜導体層２１に
対応する幅長さ）を有する平板部６１ａと、平板部６１
ａの面内に貫通孔４に対応して突設された短筒部６１ｂ
とからなる。下側金具６２は、一定幅長さを有する平板
部６２ａと、平板部６２ａの面内に短筒部６１ｂに嵌着
するよう突設された軸部６２ｂとからなる。上側金具６
１と下側金具６２が嵌着した状態では、上側金具６１の
平板部６１ａが厚膜導体層２１に接触し、下側金具６２
の平板部６２ａが基板１の下面に接触する。従って、厚
膜導体層２１は、上側金具６１と下側金具６２を通じて
平板部６２ａと導通し、平板部６１ａが１次電極とし
て、平板部６２ａが３次電極として機能することにな
る。Here, the electrode fitting 6 has an I-shaped cross section composed of an upper fitting 61 and a lower fitting 62. The upper metal fitting 61 includes a flat plate portion 61 a having a constant width length (a width length corresponding to the thick film conductor layer 21), and a flat plate portion 61.
a short cylindrical portion 61b protruding in the plane of a corresponding to the through hole 4
Consists of The lower metal fitting 62 includes a flat plate portion 62a having a constant width and a length, and a shaft portion 62b protruding from the flat plate portion 62a so as to be fitted to the short cylindrical portion 61b. Upper bracket 6
1 and the lower metal fitting 62 are fitted, the flat plate portion 61 a of the upper metal fitting 61 contacts the thick film conductor layer 21, and the lower metal fitting 62.
Contact the lower surface of the substrate 1. Therefore, the thick film conductor layer 21 is electrically connected to the flat plate portion 62a through the upper metal fitting 61 and the lower metal fitting 62, and the flat plate portion 61a functions as a primary electrode and the flat plate portion 62a functions as a tertiary electrode.
【００１６】上記角形チップ抵抗器は、次の工程によっ
て製造される。まず、予めアルミナセラミック基板１の
両端部に、つまり電極部を形成する部分に、基板１を貫
通する貫通孔４をそれぞれ形成する。そして、この貫通
孔４に対応する基板１の上面の両端部に、それぞれＡｇ
−Ｐｄ又はＡｇペーストにより厚膜導体層２１を形成す
る。次に、アルミナセラミック基板１の上面両端側に形
成した厚膜導体層２１，２１間に跨がって抵抗部５を形
成する。この抵抗部５では、厚膜導体層２１，２１間に
跨がって、抵抗膜（Ａｇ−Ｐｄ、Ｒｕと硼珪酸鉛ガラス
を主体とするペースト）５１を印刷焼成する。この抵抗
膜５１は、適所にレーザトリミング溝５１ａが形成され
ることで、抵抗値が調整される。そして、抵抗膜５１の
上面に、ガラスペーストにて内部保護膜（１次保護膜）
５２を印刷焼成し、更に内部保護膜５２の上面に２次保
護膜５３を印刷焼成する。その後、抵抗部５（即ち２次
保護膜５３）の上面に保護外装膜５４を印刷焼成し、保
護外装膜５４に抵抗値表示等の標印を厚膜印刷で行う。The square chip resistor is manufactured by the following steps. First, through holes 4 penetrating the substrate 1 are formed in advance at both ends of the alumina ceramic substrate 1, that is, at portions where the electrode portions are to be formed. Then, Ag is provided on both ends of the upper surface of the substrate 1 corresponding to the through holes 4 respectively.
-The thick film conductor layer 21 is formed from Pd or Ag paste. Next, the resistance portion 5 is formed so as to extend between the thick film conductor layers 21 and 21 formed on both ends of the upper surface of the alumina ceramic substrate 1. In the resistance section 5, a resistance film (paste mainly composed of Ag-Pd, Ru and lead borosilicate glass) 51 is printed and fired across the thick film conductor layers 21 and 21. The resistance value of the resistance film 51 is adjusted by forming a laser trimming groove 51a at an appropriate position. Then, on the upper surface of the resistive film 51, an internal protective film (primary protective film) using a glass paste.
52 is printed and baked, and a secondary protective film 53 is printed and baked on the upper surface of the internal protective film 52. After that, the protective exterior film 54 is printed and baked on the upper surface of the resistor portion 5 (that is, the secondary protective film 53), and a mark such as a resistance value display is formed on the protective exterior film 54 by thick film printing.
【００１７】次いで、多数個のチップ抵抗器が連結状態
にある基板から各チップ品にチップブレイクする。ブレ
イク後に、各チップ品において、電極金具６のうち、下
側金具６２の軸部６２ｂを貫通孔４に嵌挿し、上側金具
６１の短筒部６１ｂを厚膜導体層２１の上面側から貫通
孔４に嵌挿し、軸部６２ｂを短筒部６１ｂ内に嵌着して
かしめる。これにより、上側金具６１と下側金具６２が
一体に結合された電極部が形成され、角形チップ抵抗器
の完成品が得られる。Next, a chip break is performed on each chip product from a substrate in which a large number of chip resistors are connected. After the break, in each chip product, of the electrode fittings 6, the shaft portion 62b of the lower metal fitting 62 is inserted into the through-hole 4, and the short cylindrical portion 61b of the upper metal fitting 61 is inserted into the through-hole from the upper surface side of the thick film conductor layer 21. 4 and the shaft portion 62b is fitted into the short cylindrical portion 61b and swaged. Thus, an electrode portion in which the upper metal fitting 61 and the lower metal fitting 62 are integrally connected is formed, and a completed rectangular chip resistor is obtained.
【００１８】このようにして製造した角形チップ抵抗器
では、基板１に２次電極（側面電極）を形成せず、１次
電極としての厚膜導体層２１のみを形成し、貫通孔４に
電極金具６を嵌着すれば、厚膜導体層２１と上側金具６
１の平板部６１ａが接触し、下側金具６２の平板部６２
ａが基板１の下面に接触する。従って、この角形チップ
抵抗器を配線基板の導体パターン７上に載置し（平板部
６２ａを導体パターン７上に載置し）、ハンダ８で接着
固定する際は、導体パターン７と平板部６２ａとの間の
みに接着ハンダ８を介装することで実行できる。それに
より、厚膜導体層２１、即ち上側金具６１の平板部６１
ａにはハンダ盛りを施す必要がなく、ハンダの熱膨張係
数と厚膜導体層２１の熱膨張係数の違いによる機械的応
力集中が避けられ、断線する恐れが解消できる。In the rectangular chip resistor manufactured as described above, the secondary electrode (side surface electrode) is not formed on the substrate 1 and only the thick film conductor layer 21 as the primary electrode is formed. If the metal fitting 6 is fitted, the thick film conductor layer 21 and the upper metal fitting 6
The first flat plate portion 61a contacts the flat plate portion 62 of the lower metal fitting 62.
a contacts the lower surface of the substrate 1. Therefore, when this square chip resistor is placed on the conductor pattern 7 of the wiring board (the flat plate portion 62a is placed on the conductor pattern 7) and fixed by soldering 8, the conductor pattern 7 and the flat plate portion 62a This can be performed by interposing the adhesive solder 8 only between the two. Thereby, the thick film conductor layer 21, that is, the flat plate portion 61 of the upper metal fitting 61 is formed.
It is not necessary to perform solder embossing on a, mechanical stress concentration due to the difference between the thermal expansion coefficient of the solder and the thermal expansion coefficient of the thick film conductor layer 21 can be avoided, and the risk of disconnection can be eliminated.
【００１９】又、この角形チップ抵抗器の製造方法で
は、基板１の貫通孔４に電極金具６を取付ければ電極部
が形成されるので、２次電極（側面電極）を形成する工
程を省くことができ、製造が簡単でコストを削減でき
る。In this method of manufacturing a square chip resistor, an electrode portion is formed by attaching an electrode fitting 6 to the through hole 4 of the substrate 1, so that a step of forming a secondary electrode (side electrode) is omitted. Can be manufactured easily and cost can be reduced.
【００２０】[0020]
【発明の効果】以上説明したように、この発明の角形チ
ップ抵抗器によれば、絶縁基板の貫通孔に電極金具を嵌
着し、その平板部を１次電極及び２次電極として使用す
ることとしたから、チップ側部に電極が形成されないの
で、外部導体パターンと抵抗器とを接続する際に、１次
電極として絶縁基板の上面の電極に接触する電極金具の
平板部にハンダ盛りをする必要がなく、また、ハンダが
ハンダメッキ部分を介して、上面の電極の平板部に載る
ことがないから、ハンダの熱膨張係数と電極の熱膨張係
数の違いによる機械的応力集中が避けられ、断線する恐
れが解消できる。As described above, according to the rectangular chip resistor of the present invention, the electrode fitting is fitted into the through hole of the insulating substrate, and the flat plate portion is used as the primary electrode and the secondary electrode. Therefore, since no electrodes are formed on the chip side portion, when connecting the external conductor pattern and the resistor, soldering is performed on the flat plate portion of the electrode fitting that contacts the electrode on the upper surface of the insulating substrate as a primary electrode. It is not necessary, and since the solder does not rest on the flat part of the electrode on the upper surface via the solder plating part, mechanical stress concentration due to the difference between the thermal expansion coefficient of the solder and the thermal expansion coefficient of the electrode is avoided, The risk of disconnection can be eliminated.
【００２１】又、この発明の角形チップ抵抗器の製造方
法によれば、２次電極（側面電極）を形成する工程を省
くことができ、製造が簡単でコストを削減できるだけで
なく、外部電極のメッキ工程を省略でき、メッキ用の複
雑な液管理、高額なメッキ設備が不要となる。Further, according to the method of manufacturing the square chip resistor of the present invention, the step of forming the secondary electrode (side electrode) can be omitted, and the manufacturing can be simplified and the cost can be reduced. The plating process can be omitted, and complicated liquid management for plating and expensive plating equipment are not required.
【図１】実施例に係る角形チップ抵抗器を示す要部断面
図である。FIG. 1 is a sectional view of a main part showing a square chip resistor according to an embodiment.
【図２】同実施例に係る角形チップ抵抗器の要部断面斜
視図である。FIG. 2 is a sectional perspective view of a main part of the rectangular chip resistor according to the embodiment.
【図３】従来例に係る角形チップ抵抗器の要部断面図で
ある。FIG. 3 is a sectional view of a main part of a rectangular chip resistor according to a conventional example.
【図４】同従来例に係る角形チップ抵抗器の外観斜視図
である。FIG. 4 is an external perspective view of a square chip resistor according to the conventional example.
１ 絶縁基板 ４ 貫通孔 ５ 抵抗部 ６ 電極金具 ７ 導体パターン ８ ハンダ ２１ 厚膜導体層 ６１ 上側金具 ６２ 下側金具 ６１ａ，６２ａ 平板部 ６１ｂ 短筒部 ６２ｂ 軸部 DESCRIPTION OF SYMBOLS 1 Insulating substrate 4 Through-hole 5 Resistance part 6 Electrode fitting 7 Conductor pattern 8 Solder 21 Thick film conductor layer 61 Upper metal fitting 62 Lower metal fitting 61a, 62a Flat plate part 61b Short cylinder part 62b Shaft part
Claims (2)
基板と、この絶縁基板の上面の両端部にそれぞれ形成し
た電極と、絶縁基板の上面に電極間に跨がって形成した
抵抗部と、前記貫通孔に嵌挿され、絶縁基板の上面の電
極に接触する平板部及び絶縁基板の下面に接触する平板
部を有する電極金具とを備えることを特徴とする角形チ
ップ抵抗器。An insulating substrate having a through hole penetrating the electrode forming portion; and an insulating substrate formed at both ends of an upper surface of the insulating substrate.
And electrodes were formed straddling between the electrodes on the upper surface of the insulating substrate
A resistance portion, and a power supply electrode on the upper surface of the insulating substrate, which is inserted into the through hole.
A flat plate part that contacts the pole and a flat plate that contacts the lower surface of the insulating substrate
And an electrode fitting having a portion .
する工程と、この貫通孔に対応する絶縁基板の上面にそ
れぞれ厚膜導体層を形成する工程と、絶縁基板の上面の
厚膜導体層間に跨がって抵抗部を形成する工程と、前記
貫通孔に挿通される軸部と、この軸部の両端に軸部の延
伸方向とは垂直方向に設けられた平板部とを有する電極
金具の軸部を前記貫通孔に嵌挿すると共に、一方の平板
部を絶縁基板の上面の厚膜導体層に接触させ、他方の平
板部を絶縁基板の下面に接触させる工程とからなること
を特徴とする角形チップ抵抗器の製造方法。Wherein the step of forming the respective through-holes on both ends of the insulating substrate, the upper surface of the insulating substrate corresponding to the through hole Niso
Forming a respectively thick film conductor layer, the upper surface of the insulating substrate
Forming a resistor portion over the thick film conductor layer;
A shaft portion inserted into the through-hole and extension of the shaft portion at both ends of the shaft portion.
An electrode having a flat portion provided in a direction perpendicular to the stretching direction
Insert the shaft of the metal fitting into the through hole, and
Contact the thick conductor layer on the top surface of the insulating substrate, and
Contacting the plate portion with the lower surface of the insulating substrate.
A method for manufacturing a square chip resistor, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3150112A JP2935143B2 (en) | 1991-06-21 | 1991-06-21 | Square chip resistor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3150112A JP2935143B2 (en) | 1991-06-21 | 1991-06-21 | Square chip resistor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04372101A JPH04372101A (en) | 1992-12-25 |
| JP2935143B2 true JP2935143B2 (en) | 1999-08-16 |
Family
ID=15489754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3150112A Expired - Fee Related JP2935143B2 (en) | 1991-06-21 | 1991-06-21 | Square chip resistor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2935143B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3307533B2 (en) * | 1996-05-14 | 2002-07-24 | アルプス電気株式会社 | Chip electronic component and its manufacturing method, and surge absorber and its manufacturing method |
| KR100495131B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | method of positive temperature coefficient electrical device for surface mounting |
| KR100495128B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | Surface mountable electric device using electrical wire |
| CN109411167A (en) * | 2018-12-14 | 2019-03-01 | 中国电子科技集团公司第四十三研究所 | A kind of termination electrode has the thick film sheet type resistance and preparation method of through-hole structure |
| JPWO2020196571A1 (en) * | 2019-03-28 | 2020-10-01 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757502U (en) * | 1980-09-19 | 1982-04-05 | ||
| JPH0366101A (en) * | 1989-08-04 | 1991-03-20 | Matsushita Electric Ind Co Ltd | Electric circuit component |
| JPH0430502A (en) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Ind Co Ltd | Square chip component |
-
1991
- 1991-06-21 JP JP3150112A patent/JP2935143B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04372101A (en) | 1992-12-25 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |