JPH04372101A - Square-shaped chip resistor and its manufacture - Google Patents
Square-shaped chip resistor and its manufactureInfo
- Publication number
- JPH04372101A JPH04372101A JP3150112A JP15011291A JPH04372101A JP H04372101 A JPH04372101 A JP H04372101A JP 3150112 A JP3150112 A JP 3150112A JP 15011291 A JP15011291 A JP 15011291A JP H04372101 A JPH04372101 A JP H04372101A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating substrate
- thick film
- primary
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005355 lead glass Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】この発明は、車載用、民生機器用
或いは産業機器用の角形チップ抵抗器、及びその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular chip resistor for use in vehicles, consumer equipment, or industrial equipment, and a method for manufacturing the same.
【０００２】0002
【従来の技術】図４は、従来の角形チップ抵抗器を示す
斜視図である。この角形チップ抵抗器は、アルミナセラ
ミック基板１の両端部に、上面部、側面部及び裏面部を
覆う断面「コ」字状の電極部９が形成されている。この
電極部９は、基板１の上面側を１次電極２、基板１の側
面側を２次電極２ａ、そして基板１の裏面側を３次電極
３とされる。更に、基板１上面の両端部に形成した１次
電極２、２間に跨がって抵抗部５を形成している。図３
の断面図で示すように、電極部９は、基板１の上面端部
、側面及び裏面端部に亘って、つまり断面「コ」字状に
厚膜導体ペースト（Ａｇペースト）にて厚膜導電層９１
を形成し、この厚膜導電層９１の上面にＮｉメッキ膜９
２、更にＮｉメッキ膜９２の上面にＰｂ−Ｓｎメッキ膜
９３を形成して３層構造としている。そして、アルミナ
セラミック基板１の上面の両端部の１次電極（厚膜導電
層９１）２に跨がって抵抗膜（Ｒｕと硼珪酸鉛ガラスを
主体としたペースト）５１を印刷焼成し、この抵抗膜５
１上面に１次保護膜（厚膜ガラス）５２、１次保護膜５
２上面に２次保護膜（厚膜ガラス）５３、２次保護膜５
３上面に保護外装膜（厚膜ガラス）５４をそれぞれ印刷
焼成して製造される。2. Description of the Related Art FIG. 4 is a perspective view of a conventional rectangular chip resistor. In this rectangular chip resistor, electrode portions 9 having a U-shaped cross section are formed at both ends of an alumina ceramic substrate 1, covering the top, side, and back surfaces. This electrode section 9 has a primary electrode 2 on the upper surface side of the substrate 1, a secondary electrode 2a on the side surface side of the substrate 1, and a tertiary electrode 3 on the back surface side of the substrate 1. Further, a resistor portion 5 is formed spanning between the primary electrodes 2 formed at both ends of the upper surface of the substrate 1. Figure 3
As shown in the cross-sectional view, the electrode section 9 is made of thick film conductive paste (Ag paste) over the top, side and back ends of the substrate 1, that is, in a U-shaped cross section. layer 91
A Ni plating film 9 is formed on the upper surface of this thick film conductive layer 91.
2. Furthermore, a Pb--Sn plating film 93 is formed on the upper surface of the Ni plating film 92 to obtain a three-layer structure. Then, a resistive film (paste mainly composed of Ru and borosilicate lead glass) 51 is printed and fired across the primary electrode (thick film conductive layer 91) 2 at both ends of the upper surface of the alumina ceramic substrate 1. Resistive film 5
1 Primary protective film (thick film glass) 52 on top surface, primary protective film 5
2 Secondary protective film (thick film glass) 53 on the top surface, secondary protective film 5
A protective exterior film (thick film glass) 54 is printed and fired on the upper surface of each of the three.
【０００３】0003
【発明が解決しようとする課題】上記、従来の角形チッ
プ抵抗器は、図３で示すように、例えばガラスエポキシ
配線基板の導体パターン７上に載置し（３次電極３を導
体パターン７上に載置し）、１次電極２及び側面電極２
ａ上と導体パターン７上にハンダ８をもり接着固定する
。ところが、ハンダの温度に対する膨張収縮率は、電極
部を構成する厚膜導体層９１の温度に対する膨張収縮率
より遙に大きい。このため、温度差（−５５℃乃至１２
５℃、１０００乃至３０００サイクル）によって、厚膜
導体層９１がハンダ部分に引っ張られる等の機械的な応
力集中が生じ、１次電極２と２次保護膜５３との境界付
近で厚膜導体層９１が、アルミナセラミック基板１から
剥がれ、断線する虞れがある等の不利があった。[Problems to be Solved by the Invention] As shown in FIG. ), the primary electrode 2 and the side electrode 2
Solder 8 is applied on top of a and the conductor pattern 7 to secure it. However, the expansion/contraction rate with respect to temperature of the solder is much larger than the expansion/contraction rate with respect to temperature of the thick film conductor layer 91 constituting the electrode portion. For this reason, the temperature difference (-55℃ to 12℃
5° C., 1,000 to 3,000 cycles), mechanical stress concentration such as the thick film conductor layer 91 being pulled to the solder portion occurs, and the thick film conductor layer 91 near the boundary between the primary electrode 2 and the secondary protective film 53 91 may be peeled off from the alumina ceramic substrate 1 and breakage may occur.
【０００４】また、従来の角形チップ抵抗器は、絶縁基
板１の両側面に２次電極（側面電極）２ａを形成しなけ
ればならず、製造が手間である等の不利があった。Furthermore, the conventional rectangular chip resistor has the disadvantage that secondary electrodes (side electrodes) 2a must be formed on both sides of the insulating substrate 1, making manufacturing time-consuming.
【０００５】この発明では、以上のような課題を解消さ
せ、製造が容易で、温度変化によっても厚膜導体層が基
板から剥がれ断線する虞れのない角形チップ抵抗器及び
その製造方法を提供することを目的とする。The present invention solves the above-mentioned problems and provides a rectangular chip resistor that is easy to manufacture and is free from the risk of the thick film conductor layer peeling off from the substrate and breaking due to temperature changes, and a method for manufacturing the same. The purpose is to
【０００６】[0006]
【課題を解決するための手段及び作用】この目的を達成
させるために、この発明の特許請求の範囲の請求項１記
載の角形チップ抵抗器は、電極形成部に上面から下面に
形成した貫通孔を有する絶縁基板と、この絶縁基板の上
面の両端部に形成した１次電極と、絶縁基板の裏面の両
端部に形成した３次電極と、前記貫通孔を通して１次電
極と３次電極を電気的に接続した導通部と、前記絶縁基
板の上面に１次電極間に跨がって形成した抵抗部とから
構成されている。[Means and operations for solving the problem] In order to achieve this object, a rectangular chip resistor according to claim 1 of the claims of the present invention is provided with through holes formed in the electrode forming portion from the upper surface to the lower surface. an insulating substrate having a and a resistive part formed on the upper surface of the insulating substrate so as to span between the primary electrodes.
【０００７】このような構成を有する角形チップ抵抗器
では、絶縁基板に２次電極（側面電極）を形成せず、１
次電極（上面電極）と３次電極（裏面電極）のみを形成
する。そして、１次電極と３次電極間に対応して、絶縁
基板に設けた貫通孔の導通部にて、１次電極と３次電極
とを電気的に接続する。この接続は、例えば１次電極及
び３次電極を形成する際に、電極部の１層目、つまり厚
膜導体膜（Ａｇペースト）を成形する際、同時に貫通孔
に厚膜導体（Ａｇペースト）を塗布充填して形成して実
行する。これにより、この角形チップ抵抗器を配線基板
の導体パターン上に載置し（３次電極を導体パターン上
に載置し）、ハンダで接着固定する際は、導体パターン
と３次電極との間のみに接着ハンダを介装することで実
行できる。従って、１次電極にはハンダ盛りが省略でき
、ハンダの熱膨張係数と厚膜導体層の熱膨張係数の違い
による機械的応力集中が避けられ、断線する虞れが解消
できる。[0007] In a rectangular chip resistor having such a configuration, a secondary electrode (side electrode) is not formed on the insulating substrate;
Only the secondary electrode (top electrode) and tertiary electrode (back electrode) are formed. Then, the primary electrode and the tertiary electrode are electrically connected through a conductive portion of a through hole provided in the insulating substrate in correspondence between the primary electrode and the tertiary electrode. For example, when forming the primary electrode and the tertiary electrode, when forming the first layer of the electrode part, that is, the thick film conductor film (Ag paste), the thick film conductor film (Ag paste) is applied to the through hole at the same time. Apply, fill, form and execute. As a result, when this square chip resistor is placed on the conductor pattern of the wiring board (the tertiary electrode is placed on the conductor pattern) and fixed with solder, there is a gap between the conductor pattern and the tertiary electrode. This can be done by interposing adhesive solder on the chisel. Therefore, it is possible to omit soldering on the primary electrode, and mechanical stress concentration due to the difference between the thermal expansion coefficient of the solder and the thick film conductor layer can be avoided, and the risk of wire breakage can be eliminated.
【０００８】また、特許請求の範囲の請求項２記載の角
形チップ抵抗器の製造方法は、絶縁基板の両端部に貫通
孔を形成する工程と、この貫通孔に対応する絶縁基板の
上面及び下面に厚膜導体膜を形成し、且つ貫通孔に厚膜
導体を塗布して貫通孔と上・下面の厚膜導体膜とを連続
させる工程と、絶縁基板の上面両端側に形成した厚膜導
体層に跨がって抵抗部を形成する工程と、上・下面の厚
膜導体膜上にメッキ層を形成する工程とから成ることを
特徴としている。The method for manufacturing a rectangular chip resistor according to claim 2 further includes the step of forming through holes at both ends of an insulating substrate, and the upper and lower surfaces of the insulating substrate corresponding to the through holes. A step of forming a thick film conductor film on the through hole and connecting the through hole with the thick film conductor film on the upper and lower surfaces by coating the through hole with the thick film conductor film, and forming a thick film conductor film on both ends of the upper surface of the insulating substrate. It is characterized by comprising a step of forming a resistor section across layers, and a step of forming a plating layer on the thick film conductor film on the upper and lower surfaces.
【０００９】このような角形チップ抵抗器の製造方法で
は、絶縁基板に予め、上下面を貫通する貫通孔を形成す
る。そして、１次電極と２次電極を形成する際、つまり
厚膜導体膜を形成する時に同時に、貫通孔に厚膜導体を
塗布することで、１次電極と２次電極とを電気的に接続
する。従って、この製造方法では２次電極（側面電極）
を形成する工程を省くことができ、製造が簡単でコスト
ダウンできる。[0009] In the method of manufacturing such a rectangular chip resistor, a through hole is formed in advance in an insulating substrate, passing through the upper and lower surfaces thereof. Then, when forming the primary electrode and the secondary electrode, that is, when forming the thick film conductor film, a thick film conductor is applied to the through hole to electrically connect the primary electrode and the secondary electrode. do. Therefore, in this manufacturing method, the secondary electrode (side electrode)
The process of forming can be omitted, making manufacturing simple and reducing costs.
【００１０】0010
【実施例】図１は、この発明に係る角形チップ抵抗器の
具体的な一実施例を示す側面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a side view showing a specific embodiment of a rectangular chip resistor according to the present invention.
【００１１】角形チップ抵抗器は、アルミナセラミック
基板１の上面に１次電極（表面電極）２、下面に３次電
極（裏面電極）３をそれぞれ形成し、基板１の上面両端
側に形成した１次電極２、２間に跨がって抵抗部５を形
成すると共に、上記１次電極２と３次電極３とを基板１
に設けた貫通孔４の厚膜導体４１にて電気的に接続して
成る。 この角形チップ抵抗器は、次の工程によって
製造される。アルミナセラミック基板１の両端部に、つ
まり電極部を形成する部分に、基板１上面及び下面を貫
通する貫通孔４を予め形成する。そして、この貫通孔４
に対応するアルミナセラミック基板１の上面及び下面の
各両端にＡｇ−Ｐｄ又はＡｇペーストにより厚膜導体膜
２１、３１を形成する。この時、同時に、貫通孔４に厚
膜導体をエアで吸引しながら埋め込み、厚膜導体４１に
て上・下面の厚膜導体膜２１、３１を電気的に接続する
。
更に、アルミナセラミック基板１の上面両端側に形成し
た厚膜導体層２１、２１間に跨がって抵抗部５を形成す
る。この抵抗部５は、１次電極２、２の厚膜導体層２１
、２１に跨がって、抵抗膜（Ａｇ−Ｐｄ、Ｒｕと硼珪酸
鉛ガラスを主体としたペースト）５１を印刷焼成する。
この抵抗膜５１は、適所にレーザトリミング溝５１ａが
形成され抵抗値が調整される。そして、この抵抗膜５１
上面に、ガラスペーストにて内部保護膜（１次保護膜）
５２を印刷焼成し、更に、この内部保護膜５２上面に２
次保護膜５３を印刷焼成した後、２次保護膜５３上面に
保護外装膜５４を印刷焼成する。次に、この保護外装膜
５４に抵抗値表示等の標印を厚膜印刷で行う。その後は
多数個のチップ抵抗器が連結状態にある基板状から各チ
ップ品へと、チップブレーキングする。そして更に、基
板１上・下面の厚膜導体膜２１、３１上に、それぞれＮ
ｉメッキ膜２２、３２をバレルメッキで形成し、このＮ
ｉメッキ膜２２、３２上面にＳｎ−Ｐｂメッキ膜２３、
３３をバレルメッキで形成して、１次電極２及び３次電
極３をハンダ付け可能に完全に形成する。これにより、
チップ抵抗の完成品が得られる。The square chip resistor has a primary electrode (front electrode) 2 formed on the top surface of an alumina ceramic substrate 1, a tertiary electrode (back electrode) 3 formed on the bottom surface, and electrodes 1 formed on both ends of the top surface of the substrate 1. A resistive portion 5 is formed spanning between the primary electrodes 2 and 2, and the primary electrode 2 and the tertiary electrode 3 are connected to the substrate 1.
They are electrically connected to each other by a thick film conductor 41 in a through hole 4 provided in the through hole 4 . This square chip resistor is manufactured by the following steps. Through holes 4 passing through the upper and lower surfaces of the substrate 1 are formed in advance at both ends of the alumina ceramic substrate 1, that is, at the portions where the electrode portions are to be formed. And this through hole 4
Thick film conductor films 21 and 31 are formed using Ag-Pd or Ag paste on both ends of the upper and lower surfaces of the alumina ceramic substrate 1 corresponding to the above. At this time, at the same time, a thick film conductor is buried in the through hole 4 while being sucked with air, and the thick film conductor 41 electrically connects the thick film conductor films 21 and 31 on the upper and lower surfaces. Further, a resistor portion 5 is formed spanning between the thick film conductor layers 21 formed on both ends of the upper surface of the alumina ceramic substrate 1. This resistor section 5 includes a thick film conductor layer 21 of the primary electrodes 2, 2.
, 21, a resistive film 51 (paste mainly composed of Ag-Pd, Ru, and borosilicate lead glass) is printed and fired. This resistance film 51 has laser trimming grooves 51a formed at appropriate locations to adjust the resistance value. And this resistive film 51
Internal protective film (primary protective film) with glass paste on the top surface
52 is printed and fired, and furthermore, 2 is coated on the upper surface of this internal protective film 52.
After printing and baking the secondary protective film 53, a protective exterior film 54 is printed and baked on the upper surface of the secondary protective film 53. Next, markings such as resistance values are printed on the protective outer film 54 by thick film printing. Thereafter, chip breaking is applied to each chip product from the substrate in which a large number of chip resistors are connected. Further, on the thick film conductor films 21 and 31 on the upper and lower surfaces of the substrate 1, N
The i-plated films 22 and 32 are formed by barrel plating, and the N
Sn-Pb plating film 23 on the top surface of i-plating films 22 and 32,
33 is formed by barrel plating to completely form the primary electrode 2 and the tertiary electrode 3 so that they can be soldered. This results in
A finished chip resistor product is obtained.
【００１２】このような構成を有する角形チップ抵抗器
では、基板１に２次電極（側面電極）を形成せず、１次
電極（上面電極）２と３次電極（裏面電極）３のみを形
成する。そして、１次電極２と３次電極３間を貫通孔４
の厚膜導体４１にて電気的に接続する。この接続は、１
次電極２及び３次電極３を形成する際に、電極部の１層
目、つまり厚膜導体膜（Ａｇペースト）２１、３１を形
成する際、同時に貫通孔４内に厚膜導体（Ａｇペースト
）４１を吸引形成して実行する。これにより、この角形
チップ抵抗器を配線基板の導体パターン７上に載置し（
３次電極３を導体パターン７上に載置し）、ハンダ８で
接着固定する際は、導体パターン７と３次電極３との間
のみに接着ハンダ８を介装することで実行できる。従っ
て、１次電極２にはハンダ盛りが省略でき、ハンダの熱
膨張係数と厚膜導体層の熱膨張係数の違いによる機械的
応力集中が避けられ、断線する虞れが解消できる。In the rectangular chip resistor having such a configuration, no secondary electrode (side electrode) is formed on the substrate 1, but only the primary electrode (top electrode) 2 and the tertiary electrode (back electrode) 3 are formed. do. A through hole 4 is formed between the primary electrode 2 and the tertiary electrode 3.
The thick film conductor 41 is used for electrical connection. This connection is 1
When forming the secondary electrode 2 and the tertiary electrode 3, when forming the first layer of the electrode section, that is, the thick film conductor film (Ag paste) 21, 31, the thick film conductor film (Ag paste) is simultaneously inserted into the through hole 4. ) 41 by suction and execution. As a result, this square chip resistor is placed on the conductor pattern 7 of the wiring board (
When placing the tertiary electrode 3 on the conductor pattern 7 and fixing it with solder 8, this can be done by interposing the adhesive solder 8 only between the conductor pattern 7 and the tertiary electrode 3. Therefore, it is possible to omit soldering on the primary electrode 2, and mechanical stress concentration due to the difference between the thermal expansion coefficient of the solder and the thick film conductor layer can be avoided, and the risk of wire breakage can be eliminated.
【００１３】また、この角形チップ抵抗器の製造方法で
は、絶縁基板１に予め、上下面を貫通する貫通孔４を形
成する。そして、１次電極２と３次電極３を形成する際
、つまり厚膜導体膜２１、３１を形成する時に同時に、
貫通孔４に厚膜導体４１を塗布することで、１次電極２
と３次電極３とを電気的に接続する。従って、この製造
方法では２次電極（側面電極）を形成する工程を省くこ
とができ、製造が簡単でコストダウンできる。[0013] Furthermore, in this method of manufacturing a rectangular chip resistor, a through hole 4 penetrating through the upper and lower surfaces of the insulating substrate 1 is formed in advance. Then, when forming the primary electrode 2 and the tertiary electrode 3, that is, when forming the thick conductor films 21 and 31, at the same time,
By applying the thick film conductor 41 to the through hole 4, the primary electrode 2
and the tertiary electrode 3 are electrically connected. Therefore, in this manufacturing method, the step of forming the secondary electrode (side electrode) can be omitted, making manufacturing simple and reducing costs.
【００１４】図２は、角形チップ抵抗器の他の実施例を
示す要部説明図である。この実施例の角形チップ抵抗器
は、アルミナセラミック基板１の両端部に、基板１を貫
通する貫通孔４を形成し、この貫通孔４に対応する基板
１上面に、厚膜導体層２１を形成する。そして、基板１
上面に形成された厚膜導体層２１、２１間に跨がって、
抵抗膜５１を印刷焼成し、この抵抗膜５１上面にガラス
ペーストで内部保護膜（１次保護膜）５２、２次保護膜
５３をそれぞれ印刷焼成し、２次保護膜５３上面に外装
保護膜５４を印刷焼成している。この実施例の特徴は、
貫通孔４に対し上下から嵌挿する電極金具６にある。電
極金具６は、上側金具６１と下側金具６２と構成される
。上側金具６１は、一定幅長さ（厚膜導体層２１に対応
する幅長さ）の平板部６１ａと、平板部６１ａの面内に
下方向へ突設された短筒部６１ｂとから成る。この短筒
部６１ｂは、上記貫通孔４に対応して突設してある。
また、下側金具６２は一定幅長さを有する平板部６２ａ
と、平板部６２ａの面内に、前記短筒部６１ｂを嵌着す
る軸部６２ｂとから成る。この下側金具６２の軸部６２
ｂを貫通孔４に嵌挿し、上側金具６１の短筒部６１ｂを
、厚膜導体層２１上面側から貫通孔４に嵌挿し、軸部６
２ｂを短筒部６１ｂ内に嵌着してかしめる。これにより
電極部が形成される。この場合も、側面電極が不要とな
る。また、電極金具６を使用することで、外部電極のメ
ッキ工程が省略できる許かりでなく、メッキ用の複雑な
液管理、及び高額なメッキ設備が不要となる。FIG. 2 is a diagram illustrating the main parts of another embodiment of a square chip resistor. In the rectangular chip resistor of this embodiment, through holes 4 passing through the substrate 1 are formed at both ends of an alumina ceramic substrate 1, and a thick film conductor layer 21 is formed on the upper surface of the substrate 1 corresponding to the through holes 4. do. And board 1
Straddling between the thick film conductor layers 21, 21 formed on the upper surface,
A resistive film 51 is printed and fired, an internal protective film (primary protective film) 52 and a secondary protective film 53 are printed and fired using glass paste on the upper surface of the resistive film 51, and an external protective film 54 is formed on the upper surface of the secondary protective film 53. is printed and fired. The features of this embodiment are:
The electrode fitting 6 is fitted into the through hole 4 from above and below. The electrode fitting 6 includes an upper fitting 61 and a lower fitting 62. The upper metal fitting 61 consists of a flat plate part 61a having a constant width (width corresponding to the thick film conductor layer 21) and a short cylindrical part 61b projecting downward within the plane of the flat plate part 61a. This short cylindrical portion 61b is provided in a protruding manner corresponding to the through hole 4. Further, the lower metal fitting 62 has a flat plate portion 62a having a constant width and length.
and a shaft portion 62b into which the short cylindrical portion 61b is fitted within the plane of the flat plate portion 62a. The shaft portion 62 of this lower metal fitting 62
b into the through hole 4, and insert the short cylindrical portion 61b of the upper metal fitting 61 into the through hole 4 from the upper surface side of the thick film conductor layer 21.
2b is fitted into the short cylindrical portion 61b and caulked. This forms an electrode section. Also in this case, side electrodes are not required. Furthermore, by using the electrode fitting 6, the plating process for the external electrode can be omitted, and complicated liquid management for plating and expensive plating equipment are no longer necessary.
【００１５】[0015]
【発明の効果】この発明では、以上のように、絶縁基板
の上面に１次電極、下面に３次電極をそれぞれ形成し、
絶縁基板の上面両端側に形成した１次電極間に跨がって
抵抗部を形成すると共に、上記１次電極と３次電極とを
絶縁基板に設けた貫通孔の導通部にて電気的に接続する
こととしたから、外部導体パターンと抵抗器とを接続す
る際に、１次電極にはハンダ盛りが省略でき、ハンダの
熱膨張係数と厚膜導体層の熱膨張係数の違いによる機械
的応力集中が避けられ、断線する虞れが解消できる。ま
た、角形チップ抵抗器の製造方法では、２次電極（側面
電極）を形成する工程を省くことができ、製造が簡単で
コストダウンできる等、発明目的を達成した優れた効果
を有する。[Effects of the Invention] As described above, in this invention, a primary electrode is formed on the upper surface of an insulating substrate, a tertiary electrode is formed on the lower surface,
A resistance portion is formed spanning between the primary electrodes formed on both ends of the upper surface of the insulating substrate, and the primary electrode and the tertiary electrode are electrically connected through the conductive portion of the through hole provided in the insulating substrate. Therefore, when connecting the external conductor pattern and the resistor, it is possible to omit soldering on the primary electrode, and the mechanical Stress concentration can be avoided and the risk of wire breakage can be eliminated. In addition, the method for manufacturing a square chip resistor has excellent effects that achieve the purpose of the invention, such as the step of forming secondary electrodes (side electrodes) being omitted, making manufacturing simple and reducing costs.
【図１】実施例角形チップ抵抗器を示す要部説明図であ
る。FIG. 1 is an explanatory diagram of main parts showing an example square chip resistor.
【図２】実施例角形チップ抵抗器の他の実施例を示す要
部説明図である。FIG. 2 is an explanatory diagram of main parts showing another example of the example square chip resistor.
【図３】従来の角形チップ抵抗器を示す要部説明図であ
る。FIG. 3 is an explanatory diagram of main parts of a conventional square chip resistor.
【図４】従来の角形チップ抵抗器を示す斜視図である。FIG. 4 is a perspective view showing a conventional square chip resistor.
１ 絶縁基板 ２ １次電極 ３ ２次電極 ４ 貫通孔 ５ 抵抗部 1 Insulating substrate 2 Primary electrode 3 Secondary electrode 4 Through hole 5 Resistance part
Claims (2)
孔を有する絶縁基板と、この絶縁基板の上面の両端部に
形成した１次電極と、絶縁基板の裏面の両端部に形成し
た３次電極と、前記貫通孔を通して１次電極と３次電極
を電気的に接続した導通部と、前記絶縁基板の上面に１
次電極間に跨がって形成した抵抗部とからなることを特
徴とする角形チップ抵抗基板。Claims: 1. An insulating substrate having a through hole formed from the upper surface to the lower surface in an electrode forming part, primary electrodes formed at both ends of the upper surface of the insulating substrate, and 3 primary electrodes formed at both ends of the back surface of the insulating substrate. a secondary electrode, a conductive part that electrically connects the primary electrode and the tertiary electrode through the through hole, and a conductive part that electrically connects the primary electrode and tertiary electrode through the through hole;
A rectangular chip resistance board characterized by comprising a resistance section formed across two electrodes.
と、この貫通孔に対応する絶縁基板の上面及び下面に厚
膜導体層を形成し、且つ貫通孔に厚膜導体を塗布して貫
通孔と上・下面の厚膜導体層とを連続させる工程と、絶
縁基板の上面両端側に形成した厚膜導体層間に跨がって
抵抗部を形成する工程と、上・下面の厚膜導体層上にメ
ッキ層を形成する工程とから成る角形チップ抵抗器の製
造方法。2. A step of forming through holes at both ends of an insulating substrate, forming a thick film conductor layer on the upper and lower surfaces of the insulating substrate corresponding to the through holes, and applying a thick film conductor to the through holes. a process of connecting the through hole and the thick film conductor layers on the upper and lower surfaces; a process of forming a resistor part spanning between the thick film conductor layers formed on both ends of the upper surface of the insulating substrate; A method for manufacturing a rectangular chip resistor comprising the step of forming a plating layer on a membrane conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3150112A JP2935143B2 (en) | 1991-06-21 | 1991-06-21 | Square chip resistor and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3150112A JP2935143B2 (en) | 1991-06-21 | 1991-06-21 | Square chip resistor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04372101A true JPH04372101A (en) | 1992-12-25 |
| JP2935143B2 JP2935143B2 (en) | 1999-08-16 |
Family
ID=15489754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3150112A Expired - Fee Related JP2935143B2 (en) | 1991-06-21 | 1991-06-21 | Square chip resistor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2935143B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129144C (en) * | 1996-05-14 | 2003-11-26 | 阿尔卑斯电气株式会社 | Chip electronic device and its mfg. method |
| KR100495131B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | method of positive temperature coefficient electrical device for surface mounting |
| KR100495128B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | Surface mountable electric device using electrical wire |
| CN109411167A (en) * | 2018-12-14 | 2019-03-01 | 中国电子科技集团公司第四十三研究所 | A kind of termination electrode has the thick film sheet type resistance and preparation method of through-hole structure |
| WO2020196571A1 (en) * | 2019-03-28 | 2020-10-01 | ローム株式会社 | Chip resistor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757502U (en) * | 1980-09-19 | 1982-04-05 | ||
| JPH0366101A (en) * | 1989-08-04 | 1991-03-20 | Matsushita Electric Ind Co Ltd | Electric circuit component |
| JPH0430502A (en) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Ind Co Ltd | Square chip component |
-
1991
- 1991-06-21 JP JP3150112A patent/JP2935143B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757502U (en) * | 1980-09-19 | 1982-04-05 | ||
| JPH0366101A (en) * | 1989-08-04 | 1991-03-20 | Matsushita Electric Ind Co Ltd | Electric circuit component |
| JPH0430502A (en) * | 1990-05-28 | 1992-02-03 | Matsushita Electric Ind Co Ltd | Square chip component |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129144C (en) * | 1996-05-14 | 2003-11-26 | 阿尔卑斯电气株式会社 | Chip electronic device and its mfg. method |
| KR100495131B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | method of positive temperature coefficient electrical device for surface mounting |
| KR100495128B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | Surface mountable electric device using electrical wire |
| CN109411167A (en) * | 2018-12-14 | 2019-03-01 | 中国电子科技集团公司第四十三研究所 | A kind of termination electrode has the thick film sheet type resistance and preparation method of through-hole structure |
| WO2020196571A1 (en) * | 2019-03-28 | 2020-10-01 | ローム株式会社 | Chip resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2935143B2 (en) | 1999-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01302803A (en) | Chip resistor and its manufacture | |
| JP2007073693A (en) | Chip resistor and method of manufacturing same | |
| JP6688025B2 (en) | Chip resistor and method of manufacturing chip resistor | |
| JPH04372101A (en) | Square-shaped chip resistor and its manufacture | |
| US10276285B2 (en) | Chip resistor | |
| JP4046178B2 (en) | Chip resistor and manufacturing method thereof | |
| JPH01109702A (en) | Chip resistor | |
| JPH05135902A (en) | Rectangular type chip resistor and manufacture thereof | |
| JP2806802B2 (en) | Chip resistor | |
| JP4510235B2 (en) | Electronic components and multiple chip resistors | |
| JP2839262B2 (en) | Chip resistor and manufacturing method thereof | |
| JP3353037B2 (en) | Chip resistor | |
| JP3110677B2 (en) | Chip resistor | |
| JP2003282304A (en) | Chip resistor and its manufacturing method | |
| JP4059967B2 (en) | Chip-type composite functional parts | |
| JPS6322665Y2 (en) | ||
| JPH0513201A (en) | Square chip resistance | |
| JPH0653004A (en) | Rectangular chip resistor and its manufacture | |
| JPH07211504A (en) | Terminal electrode for surface-mounting type electronic parts and its production | |
| JP3323156B2 (en) | Chip resistor | |
| JP2866808B2 (en) | Manufacturing method of chip resistor | |
| JP3323140B2 (en) | Chip resistor | |
| JP3435419B2 (en) | Chip resistor | |
| JPH11204313A (en) | Electronic component and manufacture thereof | |
| JP3159963B2 (en) | Chip resistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |