JP2902467B2 - Reflow equipment - Google Patents
Reflow equipmentInfo
- Publication number
- JP2902467B2 JP2902467B2 JP25090690A JP25090690A JP2902467B2 JP 2902467 B2 JP2902467 B2 JP 2902467B2 JP 25090690 A JP25090690 A JP 25090690A JP 25090690 A JP25090690 A JP 25090690A JP 2902467 B2 JP2902467 B2 JP 2902467B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling
- board
- cooling means
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はプリント基板上の半田ペーストを加熱溶融し
て所定電子部品を半田付けする際に用いられるリフロー
装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow apparatus used for heating and melting a solder paste on a printed circuit board to solder a predetermined electronic component.
従来の技術 近年、電子部品実装基板は薄形化の傾向にあり、又基
板両面への実装も行われている。このような電子部品実
装基板を製造する際、プリント基板上の半田ペーストを
加熱溶融するリフロー装置が用いられる。2. Description of the Related Art In recent years, electronic component mounting boards have tended to be thinner, and mounting on both sides of the board has been performed. When manufacturing such an electronic component mounting board, a reflow apparatus that heats and melts a solder paste on a printed board is used.
従来のリフロー装置は、第４図に示すように、基板ａ
をその両側縁部で支承して搬送するため、左右１対のエ
ンドレスチェーンｂ、ｂを循環移動させ、加熱部及び冷
却部を順次通過させる。冷却部では、冷却用ファンなど
の冷却手段（図示せず）を基板ａの上方、又は上方及び
下方に設けている。As shown in FIG. 4, a conventional reflow apparatus uses a substrate a
Is transported while being supported at both side edges thereof, a pair of left and right endless chains b, b are circulated and sequentially passed through a heating unit and a cooling unit. In the cooling section, a cooling means (not shown) such as a cooling fan is provided above the substrate a, or above and below the substrate a.
発明が解決しようとする課題 しかし上記従来例では、基板がその両側縁部において
支承されているのみであるため、加熱されて軟化した基
板の左右中央分が自重によって下がり、第５図に示すよ
うに、基板ａにソリｓが生じる結果、電子回路基板の不
良の一因になるという問題がある。具体的には、基板寸
法150×120×0.8mmのガラスエポキシ基板に電子部品を
装着後、従来の装置を用いてリフローを行ったところ、
平均値3.1mm、最大値4.0mmのソリｓが発生した。Problems to be Solved by the Invention However, in the above-mentioned conventional example, since the substrate is only supported on both side edges, the left and right central portions of the heated and softened substrate are lowered by their own weights, as shown in FIG. In addition, there is a problem that the warpage s occurs on the substrate a, which causes a defect of the electronic circuit board. Specifically, after mounting electronic components on a glass epoxy board with a board size of 150 × 120 × 0.8 mm, reflow was performed using a conventional device,
A sled with an average value of 3.1 mm and a maximum value of 4.0 mm occurred.
尚、このようなソリに対して片面実装の場合は、第６
図に示すように、エンドレスチェーンｂ、ｂ間に下方か
ら基板ａの中央分を支承するガイドｃを設け、且つ基板
ａの左右両側縁部が浮上がらないように基板押えｄを設
けることによって前記ソリを防止することができるが、
両面実装の場合は前記ガイドｃを設けることができな
い。In the case of single-sided mounting on such a sled, the sixth
As shown in the figure, a guide c is provided between the endless chains b and b to support the center of the board a from below, and a board presser d is provided so that the left and right side edges of the board a do not float. Can prevent sledging,
In the case of double-sided mounting, the guide c cannot be provided.
本発明は上記問題点に鑑み、両面実装の場合でも基板
のソリ発生を防止することができるリフロー装置を提供
することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a reflow apparatus capable of preventing warpage of a substrate even in the case of double-sided mounting.
課題を解決するための手段 本発明は上記目的を達成するため、基板をその両側部
で支承して装置内部に配した加熱部及び冷却部を順次搬
送する搬送手段を備えたリフロー装置であって、冷却部
において基板の両側縁部の上方への動きを規制する基板
押えを設けると共に、この基板押え規制部によって規制
された基板の下面に、基板の搬送方向に向けて斜下後方
より冷却用気体を吹付ける整流板を有する下方冷却手段
を設けたことを特徴とする。Means for Solving the Problems In order to achieve the above object, the present invention is a reflow apparatus provided with a transport means for sequentially transporting a heating unit and a cooling unit arranged inside a device by supporting a substrate on both sides thereof. In the cooling section, a board press for restricting the upward movement of both side edges of the board is provided, and the lower surface of the board regulated by the board press restricting section is provided for cooling from the rear obliquely downward in the board transfer direction. A lower cooling means having a flow straightening plate for blowing gas is provided.
作用 上記構成によれば、下方冷却手段によって基板の下面
に冷却用気体を吹付けて大きな風圧を前記基板に下方か
ら加えることにより、加熱されて軟化した基板の中央部
が自重によって下がるのを抑えることができる。この風
圧による基板の浮上りは、基板の両側縁部の上方への動
きを抑える規制部材によって防止することができる。ま
た、整流板の働きによって、冷却用気体が加熱部に流込
むことによる加熱部の温度低下を防止しながら、基板の
冷却を行うことができる。According to the above-described structure, the cooling gas is blown onto the lower surface of the substrate by the lower cooling unit to apply a large wind pressure to the substrate from below, thereby preventing the heated and softened substrate from being lowered by its own weight. be able to. The floating of the substrate due to the wind pressure can be prevented by a restricting member that suppresses the upward movement of both side edges of the substrate. In addition, the function of the rectifying plate allows the substrate to be cooled while preventing the temperature of the heating unit from lowering due to the cooling gas flowing into the heating unit.
実施例 本発明の実施例を、第１図ないし第３図に基き説明す
る。Embodiment An embodiment of the present invention will be described with reference to FIGS.
第３図に示す全体構成において、リフロー装置は基板
１を加熱するための加熱部２と、加熱された基板１を冷
却するための冷却部３と、これら加熱部２及び冷却部３
を通して基板１を搬送する基板搬送部４とを備えてい
る。この基板搬送部４は、第１図及び第２図に示すよう
に、左右１対のチェーンガイド５、５によってエンドレ
スチェーン６を循環移動可能に案内支持してなり、エン
ドレスチェーン６の内側方に突出する突出ピン７によっ
て基板１をその両側縁部において支承し搬送する構成と
なっている。エンドレスチェーン５の上側部位は図示し
ない駆動手段により第２図及び第３図に矢印で示す搬送
方向に循環移動させられる。In the overall configuration shown in FIG. 3, the reflow apparatus includes a heating unit 2 for heating the substrate 1, a cooling unit 3 for cooling the heated substrate 1, and a heating unit 2 and a cooling unit 3 for heating the substrate 1.
And a substrate transport unit 4 that transports the substrate 1 through the substrate. As shown in FIG. 1 and FIG. 2, the substrate transfer section 4 guides and supports the endless chain 6 so as to be able to move in a circulating manner by a pair of right and left chain guides 5, 5. The structure is such that the substrate 1 is supported and conveyed at both side edges by the protruding projection pins 7. The upper portion of the endless chain 5 is circulated by a driving means (not shown) in the transport direction shown by the arrows in FIGS. 2 and 3.
冷却部３において、各チェーンガイド５の上面前後２
箇所に、基板１の両側縁部を上方から押え付ける円盤状
の基板押え８を配設している。この基板押え８は、支持
部９によって回転不能で且つ上下移動可能に保持された
支持軸10の内側端部に回転可能に支持されている。又支
持軸10と前記チェーンガイド５との間に引張コイルバネ
11を介装し、前記支持軸10を下向きに常時付勢してい
る。In the cooling section 3, the front and rear 2
A disk-shaped substrate presser 8 for pressing both side edges of the substrate 1 from above is provided at each location. The substrate retainer 8 is rotatably supported by an inner end of a support shaft 10 which is held by a support portion 9 so as to be non-rotatable and vertically movable. A tension coil spring is provided between the support shaft 10 and the chain guide 5.
11, the support shaft 10 is constantly urged downward.
両チェーンガイド５、５間で前後２箇所の基板押え
８、８の間の下方に、基板１の下面に冷却用気体を吹付
ける下方冷却手段12を設けている。この下方冷却手段12
は上下開口のケース13の下部にフィルタ14を有する空気
取入口15を備えると共に、前記空気取入口15から外気を
取入れてこれをケース13の上部に備えた冷却風吹出口16
から基板１の下面に向けて強制的に吹付ける無段階風速
調整可能の送風機17を備えている。又前記冷却風吹出口
16内には、冷却風が加熱部２に流込むのを回避するため
前記冷却風を基板１の下面に対し若干斜め後方から吹付
けるため複数の整流板18を備えている。A lower cooling means 12 for blowing a cooling gas to the lower surface of the substrate 1 is provided below the two substrate holders 8, 8 between the two chain guides 5, 5. This lower cooling means 12
Is provided with an air inlet 15 having a filter 14 at the lower part of a case 13 having upper and lower openings, and a cooling air outlet 16 provided with air at the upper part of the case 13 by taking in outside air from the air inlet 15.
A blower 17 capable of steplessly adjusting the wind speed for forcibly blowing from the bottom toward the lower surface of the substrate 1 is provided. The cooling air outlet
A plurality of rectifying plates 18 are provided in the inside 16 for blowing the cooling air onto the lower surface of the substrate 1 slightly obliquely from behind in order to prevent the cooling air from flowing into the heating unit 2.
上記構成において、基板搬送部４によってその両側縁
部が支承された基板１は加熱部２で加熱された後、冷却
部３に搬送され、ここで両側縁部が基板押え８によりエ
ンドレスチェーン６に向けて押付けられると共に、下方
冷却手段12により下方から基板１の下面に冷却風が吹付
けられ前記下面に風圧が加えられる。In the above configuration, the substrate 1, whose both side edges are supported by the substrate transfer unit 4, is heated by the heating unit 2 and then transferred to the cooling unit 3, where the both side edges are connected to the endless chain 6 by the substrate holder 8. At the same time, cooling air is blown from below onto the lower surface of the substrate 1 by the lower cooling means 12 to apply wind pressure to the lower surface.
これにより、片面実装か両面実装であるかにかから
ず、基板１のソリ発生を防止することができる。又送風
機17の風速を基板１や実装部品に応じて調整すると好適
である。尚、下方冷却手段12の送風経路中に風量調節弁
を設けても良い。更に本実施例では下方冷却手段12から
の冷却風が加熱部２に流込まないので加熱部２における
リフロー温度が前記冷却風の影響を受けにくい。This prevents warpage of the substrate 1 regardless of whether it is single-sided mounting or double-sided mounting. It is preferable to adjust the wind speed of the blower 17 according to the substrate 1 and the mounted components. It should be noted that an air flow control valve may be provided in the air flow path of the lower cooling means 12. Further, in this embodiment, since the cooling air from the lower cooling means 12 does not flow into the heating unit 2, the reflow temperature in the heating unit 2 is hardly affected by the cooling air.
本発明は上記実施例に示すほか、種々の態様に構成す
ることができる。例えば上記実施例では基板下面に向け
て冷却用気体を吹付ける下方冷却手段を示したが、第３
図に仮想線で示すように、基板上面に向けて冷却用気体
を吹付ける上方冷却手段19を併設し、且つ基板下面に対
する吹付量を基板上面に対する吹付量よりも大きくする
ことによって、冷却の急速化を実現しつつソリ防止を図
ることができる。The present invention can be configured in various modes in addition to the embodiments described above. For example, in the above embodiment, the lower cooling means for blowing the cooling gas toward the lower surface of the substrate is shown.
As shown by the phantom line in the figure, an upper cooling means 19 for blowing a cooling gas toward the upper surface of the substrate is also provided, and the amount of spraying on the lower surface of the substrate is made larger than the amount of spraying on the upper surface of the substrate. Prevention of warpage can be achieved while realizing the construction.
発明の効果 本発明は上記構成、作用を有するので、冷却時におけ
る基板の中央部を従来例のようなガイドを用いることな
く支承することができる結果、両面実装の場合でも基板
のソリ発生を防止することができる。また、下方冷却手
段に整流板を設けることで、冷却用気体が加熱部に流込
むことによる加熱部の温度低下を防止しながら基板の前
記冷却を行うことができる。Since the present invention has the above-described configuration and operation, it is possible to support the central portion of the board at the time of cooling without using a guide as in the conventional example. As a result, even in the case of double-sided mounting, prevention of warpage of the board is prevented. can do. In addition, by providing the rectifying plate in the lower cooling means, the cooling of the substrate can be performed while preventing the temperature of the heating unit from lowering due to the cooling gas flowing into the heating unit.
第１図は本発明の実施例の要部を示す縦断側面図、第２
図はその横断正面図、第３図は全体構成の概略を示す側
面図、第４図は従来例の要部を示す横断正面図、第５図
はソリが発生した基板の斜視図、第６図は片面実装の場
合の従来例の要部を示す横断正面図である。 ２……加熱部 ３……冷却部 ４……基板搬送部 ８……基板押え 12……下方冷却手段 18……整流板 19……上方冷却手段FIG. 1 is a longitudinal sectional side view showing a main part of an embodiment of the present invention.
FIG. 3 is a cross-sectional front view, FIG. 3 is a side view schematically showing the overall structure, FIG. 4 is a cross-sectional front view showing a main part of a conventional example, FIG. 5 is a perspective view of a substrate on which warpage has occurred, and FIG. The figure is a cross-sectional front view showing a main part of a conventional example in the case of single-side mounting. 2 ... Heating section 3 ... Cooling section 4 ... Substrate transport section 8 ... Substrate holder 12 ... Lower cooling means 18 ... Rectifier plate 19 ... Upper cooling means
───────────────────────────────────────────────────── フロントページの続き (72)発明者 池田 修 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平２−213195（ＪＰ，Ａ) 特開 平３−254386（ＪＰ，Ａ) 特開 平２−307697（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) B23K 1/008 H05K 3/34 511 H05K 3/22 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Osamu Ikeda, Inventor 1006 Kazuma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-213195 (JP, A) JP-A-3-3 254386 (JP, A) JP-A-2-3077697 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) B23K 1/008 H05K 3/34 511 H05K 3/22
Claims (2)
した加熱部及び冷却部を順次搬送する搬送手段を備えた
リフロー装置であって、冷却部において基板の両側縁部
の上方への動きを規制する基板押えを設けると共に、こ
の基板押え規制部によって規制された基板の下面に、基
板の搬送方向に向けて斜下後方より冷却用気体を吹付け
る整流板を有する下方冷却手段を設けたことを特徴とす
るリフロー装置。1. A reflow apparatus comprising a transport means for supporting a substrate on both sides thereof and sequentially transporting a heating section and a cooling section disposed inside the apparatus, wherein the cooling section is provided above both side edges of the substrate. And a lower cooling means having a rectifying plate that blows a cooling gas from the rear obliquely downward toward the direction of transporting the substrate, on the lower surface of the substrate regulated by the substrate retaining regulating unit. A reflow device characterized by being provided.
冷却用気体を上方から吹付ける上方冷却手段を設け、且
つ下方冷却手段からの吹付量を前記上方冷却手段からの
吹付量よりも大きく設定したことを特徴とする請求項１
記載のリフロー装置。2. An upper cooling means for blowing a cooling gas from above on the upper surface of the substrate regulated by the substrate pressing means, and a blowing amount from the lower cooling means is set to be larger than a blowing amount from the upper cooling means. 2. The method according to claim 1, wherein
The reflow device as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25090690A JP2902467B2 (en) | 1990-09-19 | 1990-09-19 | Reflow equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25090690A JP2902467B2 (en) | 1990-09-19 | 1990-09-19 | Reflow equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04127962A JPH04127962A (en) | 1992-04-28 |
| JP2902467B2 true JP2902467B2 (en) | 1999-06-07 |
Family
ID=17214787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25090690A Expired - Fee Related JP2902467B2 (en) | 1990-09-19 | 1990-09-19 | Reflow equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2902467B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2573354Y2 (en) * | 1992-12-28 | 1998-05-28 | 日本電熱計器株式会社 | Printed circuit board transfer device in spray type fluxer |
| TWI769030B (en) * | 2021-07-28 | 2022-06-21 | 印能科技股份有限公司 | Warpage Suppression Reflow Oven |
-
1990
- 1990-09-19 JP JP25090690A patent/JP2902467B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04127962A (en) | 1992-04-28 |
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