JP3218588B2 - Reflow soldering equipment - Google Patents
Reflow soldering equipmentInfo
- Publication number
- JP3218588B2 JP3218588B2 JP18840294A JP18840294A JP3218588B2 JP 3218588 B2 JP3218588 B2 JP 3218588B2 JP 18840294 A JP18840294 A JP 18840294A JP 18840294 A JP18840294 A JP 18840294A JP 3218588 B2 JP3218588 B2 JP 3218588B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- substrate
- reflow soldering
- teflon sheet
- teflon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板の下面から加熱手
段により熱を加えて半田付けを行なうリフロー半田付け
装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering apparatus for applying heat from a lower surface of a substrate by a heating means to perform soldering.
【０００２】[0002]
【従来の技術】一般に、下面に放熱用の金属ベースを備
えたメタルコア基板などの金属基板では、基板の上面に
形成された導電パターン部に予め半田を塗布した後に、
各種の電子部品を載置し、基板の下面から熱を加えるこ
とによって、各部品に対する半田付けを行なうようにし
ている。図４はこの種のリフロー半田付け装置の一例を
示すものであり、同図において、１，２は左右一対の回
転軸であり、この回転軸１，２間には、上面が平坦状に
形成された加熱手段たるヒータ３が複数設けられる。４
は回転軸１，２間を循回する無端状のポリ四フッ化エチ
レン（商標名：テフロン）製のシート（以下、テフロン
シートと称する。）であり、この回転するシート４の上
面に金属基板５を載置することにより、金属基板５を傷
付けることなく、ヒータ３から金属基板５に熱を加えて
半田付けを行なうことができる。2. Description of the Related Art Generally, in a metal substrate such as a metal core substrate having a metal base for heat radiation on a lower surface, a solder is previously applied to a conductive pattern portion formed on an upper surface of the substrate, and then,
Various electronic components are placed, and heat is applied from the lower surface of the board to perform soldering on each component. FIG. 4 shows an example of this type of reflow soldering apparatus. In FIG. 4, reference numerals 1 and 2 denote a pair of left and right rotation shafts, and a flat upper surface is formed between the rotation shafts 1 and 2. A plurality of heaters 3 serving as heating means are provided. 4
Is an endless sheet made of polytetrafluoroethylene (trade name: Teflon) (hereinafter referred to as Teflon sheet) circulating between the rotating shafts 1 and 2, and a metal substrate is provided on the upper surface of the rotating sheet 4. By mounting 5, soldering can be performed by applying heat from heater 3 to metal substrate 5 without damaging metal substrate 5.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術のリフロ
ー半田付け装置は、ベルト状に形成されたテフロンシー
ト４の端部を重ね合わせて接着剤で接合しているため、
ヒータ３からの熱による影響で、テフロンシート４の端
部にある接着部６が高温で劣化し、接着部６周辺が歪ん
だり膨らんだりして、凹凸状に変形する。したがって、
この様な状態で接着部６の周辺に金属基板５を載置して
も、ヒータ３からの熱が均一に行き渡らなくなって、半
田付け不良などの不具合を発生する。しかも、テフロン
シート４は、回転軸１，２によって張力が常時加えられ
ており、接着部６周辺が一旦高温で劣化し始めると、接
着部６の中央部付近から回転軸１，２の方向に沿って一
層大きな膨らみが生じる。この結果、接着部６周辺のみ
ならず、テフロンシート４の広範囲にわたって金属基板
５を載置できなくなり、量産性が著しく低下するなどの
問題が生じていた。In the reflow soldering apparatus of the prior art described above, the ends of the Teflon sheet 4 formed in a belt shape are overlapped and joined with an adhesive.
Due to the influence of the heat from the heater 3, the bonding portion 6 at the end of the Teflon sheet 4 is deteriorated at a high temperature, and the periphery of the bonding portion 6 is distorted or swelled and deformed into an uneven shape. Therefore,
Even if the metal substrate 5 is placed around the bonding portion 6 in such a state, the heat from the heater 3 will not be evenly distributed, and defects such as defective soldering will occur. Moreover, the Teflon sheet 4 is constantly tensioned by the rotating shafts 1 and 2, and once the periphery of the bonding portion 6 starts to deteriorate at a high temperature, the vicinity of the central portion of the bonding portion 6 moves in the direction of the rotating shafts 1 and 2. Along with a larger bulge. As a result, the metal substrate 5 cannot be placed not only around the bonding portion 6 but also over a wide area of the Teflon sheet 4, causing a problem that mass productivity is significantly reduced.
【０００４】そこで、本発明は上記問題点に鑑み、シー
トの変形による半田付け不良などを防止するとともに、
回転軸の張力によりシートがさらに変形することを防止
できるリフロー半田付け装置を提供することをその目的
とする。[0004] In view of the above problems, the present invention prevents soldering failure due to deformation of a sheet and the like.
It is an object of the present invention to provide a reflow soldering apparatus that can prevent a sheet from being further deformed by the tension of a rotating shaft.
【０００５】[0005]
【課題を解決するための手段】本発明のリフロー半田付
け装置は、一対の回転軸間を循回するシートに基板を載
置し、前記基板の下面から加熱手段により熱を加えて半
田付けを行なうリフロー半田付け装置において、前記回
転軸に一対の無端状チェーンを掛装し、この無端状チェ
ーン間に複数のキャリアバーを架け渡すとともに、前記
シートの搬送方向側に位置する端部が前記キャリアバー
の一側に取付けられるように、前記各キャリアバー毎に
前記シートを取付けて構成される。According to the reflow soldering apparatus of the present invention, a substrate is placed on a sheet circulating between a pair of rotating shafts, and heat is applied from a lower surface of the substrate by heating means to perform soldering. in the reflow soldering apparatus to carry out, and hung a pair of endless chains to the rotating shaft, together to bridge multiple carrier bars between the endless chain, the
The end located on the sheet conveying direction side is the carrier bar.
The carrier sheet is attached to each of the carrier bars so as to be attached to one side of the carrier bar.
【０００６】[0006]
【作用】上記構成により、シートの搬送方向側に位置す
る端部が前記キャリアバーの一側に取付けられるよう
に、各キャリアバー毎にシートを取付けているので、シ
ートの取付部から離れた部分に基板を一枚ずつ載置する
ことで、加熱手段からの熱によって取付部が変形して
も、基板を均一に加熱することができる。また、シート
はキャリアバーを介して回転軸間を循回するため、シー
トは回転軸による張力の影響を受けなくなる。According to the above construction, the sheet is positioned on the side of the sheet conveying direction.
End is attached to one side of the carrier bar.
In addition, since a sheet is attached to each carrier bar,
Place the boards one by one on the part away from the mounting part of the board
Thus, even if the mounting portion is deformed by the heat from the heating means, the substrate can be uniformly heated. Further, since the sheet circulates between the rotation axes via the carrier bar, the sheet is not affected by the tension caused by the rotation axis.
【０００７】[0007]
【実施例】以下、本発明の一実施例を図１乃至図３に基
づいて説明する。先ず、図１に基づいて装置全体の構成
を説明すると、11は、基板搬送部12を収納する本体ケー
スであり、この本体ケース11の前面には、各種の操作表
示部13が設けられている。また、14は基板搬送部12の上
部を覆うようにして設けられた開閉可能なカバーであ
り、基板搬送部12の搬送方向に沿って開口部15が形成さ
れる。この開口部15の前方から後述する金属基板28を基
板搬送部12に載置すると、図示しない反対側の開口部に
半田付けされた金属基板28が搬送される。なお、16は基
板搬送部12の動作状態を監視する窓部、17は緊急時にリ
フロー半田付け装置を停止する緊急停止スイッチであ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. First, the configuration of the entire apparatus will be described with reference to FIG. 1. Reference numeral 11 denotes a main body case that houses a substrate transport section 12, and various operation display sections 13 are provided on the front surface of the main body case 11. . Reference numeral 14 denotes an openable / closable cover provided so as to cover an upper portion of the substrate transport unit 12, and an opening 15 is formed along the transport direction of the substrate transport unit 12. When a metal substrate 28, which will be described later, is placed on the substrate transport unit 12 from the front of the opening 15, the metal substrate 28 soldered to the opposite opening (not shown) is transported. Reference numeral 16 denotes a window for monitoring the operation state of the board transfer unit 12, and 17 denotes an emergency stop switch for stopping the reflow soldering device in an emergency.
【０００８】次に、図２および図３に基づいて基板搬送
部12の構成を詳述する。同図において、21，22は円筒状
に形成された左右一対の回転軸であり、回転軸21，22の
一方には、図示しないが減速機構を備えた駆動モータが
設けられる。23，24は回転軸21，22の両端部に掛装され
る一対の金属製の無端状チェーンであり、回転軸21，22
を回転操作することによって、図２および図３に示す矢
印方向に循回するようになっている。回転軸21，22の間
には、無端状チェーン23，24の搬送方向に沿って加熱手
段たるヒータ25が複数設けられる。このヒータ25の上面
は、無端状チェーン23，24と略同一高さをなす略平坦状
に形成され、半田を溶融し得る約２５０℃の温度に加熱
される。Next, the structure of the substrate transfer section 12 will be described in detail with reference to FIGS. In the figure, reference numerals 21 and 22 denote a pair of left and right rotary shafts formed in a cylindrical shape, and one of the rotary shafts 21 and 22 is provided with a drive motor (not shown) having a speed reduction mechanism. Reference numerals 23 and 24 denote a pair of metal endless chains mounted on both ends of the rotating shafts 21 and 22, respectively.
Is rotated in the direction of the arrow shown in FIG. 2 and FIG. A plurality of heaters 25 as heating means are provided between the rotating shafts 21 and 22 along the transport direction of the endless chains 23 and 24. The upper surface of the heater 25 is formed in a substantially flat shape having substantially the same height as the endless chains 23 and 24, and is heated to a temperature of about 250 ° C. at which the solder can be melted.
【０００９】26は、無端状チェーン23，24間に架け渡さ
れた棒状部材たるキャリアバーである。このキャリアバ
ー26は、無端状チェーン23，24の搬送方向に沿って所定
間隔毎に横設され、各キャリアバー26の一側には、０．
２乃至３．０ｍｍの厚さに形成された耐熱性を有するテ
フロンシート27が取付け固定される。各テフロンシート
27は互いに同一形状をなし、無端状チェーン23，24の搬
送方向側に位置する端部27Ａが、キャリアバー26にそれ
ぞれ挾着される。キャリアバー26は金属基板28に対応し
て複数設けられており、テフロンシート27の端部27Ａ以
外の部分に金属基板28を一枚ずつ載せることができる。
基板たる金属基板28は、上面にのみ各種の電子部品29を
搭載しており、下面は例えばアルミニウムなどの金属ベ
ース（図示せず）が設けられている。Reference numeral 26 denotes a carrier bar which is a rod-like member extended between the endless chains 23 and 24. The carrier bars 26 are provided laterally at predetermined intervals along the transport direction of the endless chains 23 and 24, and one side of each carrier bar 26 is provided with a 0.1 bar.
A Teflon sheet 27 having a thickness of 2 to 3.0 mm and having heat resistance is attached and fixed. Each Teflon sheet
Numerals 27 have the same shape, and end portions 27A of the endless chains 23 and 24 located on the transport direction side are clamped to the carrier bar 26, respectively. A plurality of carrier bars 26 are provided corresponding to the metal substrates 28, and the metal substrates 28 can be placed one by one on portions other than the end 27A of the Teflon sheet 27.
Various electronic components 29 are mounted only on the upper surface of the metal substrate 28 as a substrate, and a metal base (not shown) such as aluminum is provided on the lower surface.
【００１０】そして、金属基板28の上面のランド部（図
示せず）に予め半田を塗布形成し、所定の位置に電子部
品29を載置した後に、この金属基板28を開口部15の前方
から基板搬送部12のテフロンシート27に載置すると、金
属基板28は各ヒータ25により下面から加熱されながら、
無端状チェーン23，24の搬送方向に沿ってテフロンシー
ト27とともに移動する。したがって、この移動によって
金属基板28の半田はヒータ25からの熱で次第に溶融し、
電子部品29は金属基板28の上部でそれぞれ半田付けされ
る。また、金属基板28はテフロンシート27の取付部であ
る端部27Ａから離れた部分に一枚ずつ載置されるため、
仮にヒータ25からの熱によりテフロンシート27の端部27
Ａに歪みや膨らみを生じても、金属基板28を載置する部
分には殆ど影響がなく、引き続きヒータ25を介して金属
基板28を均一に加熱することが可能となる。特に本実施
例のように、テフロンシート27の端部27Ａをキャリアバ
ー26に挾着すると、接着剤を用いずにテフロンシート27
をキャリアバー26とともに搬送させることができ、従来
のような接着剤によるテフロンシート27の変形に伴う不
具合を一掃できる。さらに、テフロンシート27はキャリ
アバー26を介して回転軸21，22間を循回するため、テフ
ロンシート27には回転軸21，22による張力が全く加わら
なくなる。したがって、回転軸21，22からの張力によ
り、テフロンシート27が広範囲にわたって変形する虞れ
も同時に回避できる。[0010] Then, solder is applied to a land portion (not shown) on the upper surface of the metal substrate 28 in advance, and an electronic component 29 is placed at a predetermined position. When placed on the Teflon sheet 27 of the substrate transport unit 12, the metal substrate 28 is heated from below by each heater 25,
It moves together with the Teflon sheet 27 along the transport direction of the endless chains 23 and 24. Therefore, by this movement, the solder of the metal substrate 28 is gradually melted by the heat from the heater 25,
The electronic components 29 are soldered on the upper portions of the metal substrates 28, respectively. In addition, since the metal substrates 28 are placed one by one on a portion apart from the end portion 27A which is a mounting portion of the Teflon sheet 27,
If the heat from the heater 25 causes the end 27 of the Teflon sheet 27
Even if distortion or bulging occurs in A, the portion on which the metal substrate 28 is placed has almost no effect, and the metal substrate 28 can be heated uniformly via the heater 25 continuously. In particular, when the end portion 27A of the Teflon sheet 27 is sandwiched between the carrier bars 26 as in this embodiment, the Teflon sheet 27 can be used without using an adhesive.
Can be conveyed together with the carrier bar 26, and the problems associated with the deformation of the Teflon sheet 27 due to the conventional adhesive can be eliminated. Further, since the Teflon sheet 27 circulates between the rotating shafts 21 and 22 via the carrier bar 26, no tension is applied to the Teflon sheet 27 by the rotating shafts 21 and 22 at all. Therefore, the possibility that the Teflon sheet 27 is deformed over a wide range due to the tension from the rotating shafts 21 and 22 can be avoided at the same time.
【００１１】以上のように、上記実施例によれば、一対
の回転軸21，22間を循回するテフロンシート27に金属基
板28を載置し、金属基板28の下面からヒータ25により熱
を加えて半田付けを行なうリフロー半田付け装置におい
て、回転軸21，22に一対の無端状チェーン23，24を掛装
し、この無端状チェーン23，24間に複数のキャリアバー
26を架け渡すとともに、各キャリアバー26毎にテフロン
シート27を取付けて構成したものであるから、テフロン
シート27の端部27Ａが変形しても、金属基板28を均一に
加熱して、半田付け不良などの不具合を回避できるとと
もに、回転軸21，22の張力に起因するテフロンシート27
の広範囲な変形を防止することが可能となる。As described above, according to the above embodiment, the metal substrate 28 is placed on the Teflon sheet 27 circulating between the pair of rotating shafts 21 and 22, and heat is applied from the lower surface of the metal substrate 28 by the heater 25. In addition, in a reflow soldering apparatus for performing soldering, a pair of endless chains 23 and 24 are mounted on rotating shafts 21 and 22, and a plurality of carrier bars are provided between the endless chains 23 and 24.
26, and a Teflon sheet 27 is attached to each carrier bar 26. Therefore, even if the end 27A of the Teflon sheet 27 is deformed, the metal substrate 28 is uniformly heated and soldered. In addition to avoiding defects such as defects, the Teflon sheet 27 caused by the tension of the rotating shafts 21 and 22
Over a wide range can be prevented.
【００１２】また、このような構成において、接着剤を
用いずに各テフロンシート27の端部27Ａをキャリアバー
26に挾着すると、従来のような接着剤によるテフロンシ
ート27の変形に伴う不具合を完全に一掃できる。Further, in such a configuration, the end 27A of each Teflon sheet 27 is connected to the carrier bar without using an adhesive.
When the Teflon sheet 27 is sandwiched between the Teflon sheets 27, the problems associated with the deformation of the Teflon sheet 27 due to the conventional adhesive can be completely eliminated.
【００１３】本実施例の場合、テフロンシート27上に金
属基板28を載置する構成となっているため、少なくとも
金属基板28は片面に電子部品29を実装する基板であれば
よい。テフロンシート27の形状，厚さなどは、金属基板
28の表面積やヒータ25の加熱能力などを考慮することが
好ましい。また、キャリアバー26を無端状チェーン23，
24の適所に取外し可能な状態で架け渡し、複数のキャリ
アバー26にそれぞれ異なる形状のテフロンシート27を取
付け固定すれば、同一の装置で複数種の金属基板28に対
応することが可能となる。In this embodiment, since the metal substrate 28 is placed on the Teflon sheet 27, at least the metal substrate 28 may be a substrate on which the electronic component 29 is mounted on one surface. The shape and thickness of the Teflon sheet 27 are
It is preferable to consider the surface area of the heater 28, the heating capacity of the heater 25, and the like. Further, the carrier bar 26 is connected to the endless chain 23,
If the Teflon sheets 27 having different shapes are respectively attached and fixed to the plurality of carrier bars 26 so that they can be detached and put in place at the appropriate positions, it is possible to cope with a plurality of types of metal substrates 28 with the same device.
【００１４】なお、本発明は上記実施例に限定されるも
のではなく、本発明の要旨の範囲において種々の変形実
施が可能である。The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the present invention.
【００１５】[0015]
【発明の効果】本発明は、一対の回転軸間を循回するシ
ートに基板を載置し、前記基板の下面から加熱手段によ
り熱を加えて半田付けを行なうリフロー半田付け装置に
おいて、前記回転軸に一対の無端状チェーンを掛装し、
この無端状チェーン間に複数のキャリアバーを架け渡す
とともに、前記シートの搬送方向側に位置する端部が前
記キャリアバーの一側に取付けられるように、前記各キ
ャリアバー毎に前記シートを取付けたものであるから、
シートの変形による半田付け不良などを防止するととも
に、回転軸の張力によりシートがさらに変形することを
防止できるリフロー半田付け装置を提供することが可能
となる。According to the present invention, there is provided a reflow soldering apparatus for mounting a substrate on a sheet circulating between a pair of rotating shafts and applying heat from a lower surface of the substrate by heating means to perform soldering. Hang a pair of endless chains on the shaft,
A plurality of carrier bars are bridged between the endless chains, and the end located on the side in the sheet conveying direction is
Since the sheet is attached to each of the carrier bars so as to be attached to one side of the carrier bar,
It is possible to provide a reflow soldering apparatus capable of preventing defective soldering due to deformation of the sheet and preventing the sheet from being further deformed by the tension of the rotating shaft.
【００１６】[0016]
【図１】本発明の一実施例を示す装置全体の斜視図であ
る。FIG. 1 is a perspective view of an entire apparatus showing an embodiment of the present invention.
【図２】同上基板搬送部の斜視図である。FIG. 2 is a perspective view of the same substrate transport unit.
【図３】同上要部の正面図である。FIG. 3 is a front view of a main part of the above.
【図４】従来例を示す斜視図である。FIG. 4 is a perspective view showing a conventional example.
21，22 回転軸 23，24 無端状チェーン 25 ヒータ（加熱手段） 26 キャリアバー 27 テフロンシート 28 金属基板（基板） 21, 22 Rotating shaft 23, 24 Endless chain 25 Heater (heating means) 26 Carrier bar 27 Teflon sheet 28 Metal substrate (substrate)
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/34 507 B23K 1/008 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/34 507 B23K 1/008
Claims (1)
を載置し、前記基板の下面から加熱手段により熱を加え
て半田付けを行なうリフロー半田付け装置において、前
記回転軸に一対の無端状チェーンを掛装し、この無端状
チェーン間に複数のキャリアバーを架け渡すとともに、
前記シートの搬送方向側に位置する端部が前記キャリア
バーの一側に取付けられるように、前記各キャリアバー
毎に前記シートを取付けたことを特徴とするリフロー半
田付け装置。1. A reflow soldering apparatus in which a substrate is placed on a sheet circulating between a pair of rotating shafts, and heat is applied from a lower surface of the substrate by heating means to perform soldering. Attach an endless chain, span multiple carrier bars between the endless chains,
The end located on the side of the sheet conveyance direction is the carrier.
A reflow soldering apparatus wherein the sheet is attached to each of the carrier bars so as to be attached to one side of the bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18840294A JP3218588B2 (en) | 1994-08-10 | 1994-08-10 | Reflow soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18840294A JP3218588B2 (en) | 1994-08-10 | 1994-08-10 | Reflow soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0856073A JPH0856073A (en) | 1996-02-27 |
| JP3218588B2 true JP3218588B2 (en) | 2001-10-15 |
Family
ID=16223023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18840294A Expired - Fee Related JP3218588B2 (en) | 1994-08-10 | 1994-08-10 | Reflow soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3218588B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4713444B2 (en) * | 2006-11-16 | 2011-06-29 | 本田技研工業株式会社 | Reflow device |
-
1994
- 1994-08-10 JP JP18840294A patent/JP3218588B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0856073A (en) | 1996-02-27 |
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