JP2900476B2 - Dispersion plating equipment - Google Patents
Dispersion plating equipmentInfo
- Publication number
- JP2900476B2 JP2900476B2 JP4336990A JP4336990A JP2900476B2 JP 2900476 B2 JP2900476 B2 JP 2900476B2 JP 4336990 A JP4336990 A JP 4336990A JP 4336990 A JP4336990 A JP 4336990A JP 2900476 B2 JP2900476 B2 JP 2900476B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- work
- plating solution
- dispersant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は金属メツキ液中に分散剤を分散して電気メツ
キとする分散メツキ装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to a dispersion plating apparatus for dispersing a dispersing agent in a metal plating liquid to produce an electric plating.
（従来の技術） 通常の金属メツキ液中に非電導性粉体である分散剤を
分散させながら電気メツキをすることによりメツキ皮膜
中に分散剤を共折させて均一なメツキ皮膜が得られる。(Prior Art) An electric plating is performed while dispersing a non-conductive powder as a dispersing agent in a normal metal plating liquid, whereby the dispersing agent is co-folded in the plating film to obtain a uniform plating film.
このためにメツキ液中に分散剤（SiC）を分散させる
手段として従来より、 （１）メツキ液をモータにて機械的に攪拌する方法、 （２）ワークをメツキ液中にて振動あるいは揺動させる
方法、 （３）メツキ液をエヤーにて攪拌するか、前記（１）及
び（２）の方法を併用する方法、 がある。For this purpose, conventionally, as a means for dispersing the dispersant (SiC) in the plating liquid, (1) a method of mechanically stirring the plating liquid with a motor, (2) a work being vibrated or rocked in the plating liquid. And (3) stirring the plating solution by air or using the methods (1) and (2) together.
第４図はワーク20を回転軸21にて揺動し、更にエヤー
22にて攪拌する装置で、第５図はワーク20を矢印の如く
回転揺動させながら、ポンプ攪拌装置23にて攪拌するも
のである。FIG. 4 shows that the work 20 is swung around the rotating shaft 21 and the air
FIG. 5 shows an apparatus for stirring by a pump stirring apparatus 23 while rotating and swinging a work 20 as shown by an arrow in FIG.
（発明が解決しようとする課題） しかし前記（１）機械的攪拌装置及び（２）ワークの
振動あるいは揺動装置は大規模な設備が必要となり、
（３）空気攪拌装置はワークの材質によつては表面が酸
化されるために製品の品質が低下するという問題点があ
る。(Problems to be Solved by the Invention) However, the above-mentioned (1) mechanical stirring device and (2) work vibration or swinging device require large-scale equipment,
(3) The air stirring device has a problem that the quality of the product is deteriorated because the surface is oxidized depending on the material of the work.
又メツキ処理槽は、バツチ式が多いため、高速化がし
にくく、部分メツキの際には別にマスキング装置が必要
となり、生産効率が良くないという問題点がある。In addition, since the plating processing tank is often a batch type, it is difficult to increase the speed, and a separate masking device is required in the case of partial plating, so that there is a problem that the production efficiency is not good.
本発明は金属メツキ液中に分散剤を分散して電気メツ
キにて部分メツキを行う場合に、大規模な設備を必要と
することなく、かつ高品質なメツキ皮膜が効率的に得ら
れるメツキ装置を技術的課題とするものである。The present invention relates to a plating apparatus in which a dispersing agent is dispersed in a metal plating liquid to perform partial plating by electric plating, without requiring a large-scale facility, and a high-quality plating film can be efficiently obtained. Is a technical issue.
（課題を解決するための手段） 課題を解決するために講じた技術的手段は次のようで
ある。(Means for solving the problem) The technical measures taken to solve the problem are as follows.
金属メッキ液中に分散剤を入れて電気メッキを行う、
メッキ液槽とメッキ処理槽とよりなる分散メッキ装置に
於いて、前記メッキ液槽には機械攪拌装置とエアー攪拌
装置及びポンプ強制循環装置を設け、前記メッキ処理槽
は上治具と下治具に２分割してそれぞれに電極を配置
し、メッキ処理するワークを前記上治具と下治具にては
さみこみ、前記メッキ処理槽にメッキ液の循環通路を設
けて均一な分散剤を有するメッキ液を強制的に循環させ
て、前記ワークのメッキ処理すべき位置に前記メッキ液
を循環させて前記ワークに部分メッキさせることを特徴
とする分散メッキ装置である。Perform electroplating by putting a dispersant in the metal plating solution,
In a dispersion plating apparatus comprising a plating bath and a plating bath, the plating bath is provided with a mechanical stirrer, an air stirrer, and a pump forced circulation device, and the plating bath has an upper jig and a lower jig. The work to be plated is sandwiched between the upper jig and the lower jig, and a plating solution circulation path is provided in the plating bath to form a plating solution having a uniform dispersant. For forcibly circulating the plating solution and circulating the plating solution to a position of the work to be plated to partially plate the work.
（作用） メツキ液槽には機械的攪拌とエヤー攪拌によりSiCよ
りなる分散剤を常に均一に液中に分散させ、又ポンプに
より強制的にメツキ処理槽に循環させることにより高電
流密度操作ができメツキの高速化が可能となる。(Function) In the plating liquid tank, a dispersing agent composed of SiC is always uniformly dispersed in the liquid by mechanical stirring and air stirring, and high current density operation can be performed by forcibly circulating the dispersant into the plating processing tank by a pump. It is possible to speed up the plating.
又メツキ処理槽を上、下に２分割した治具として、非
メツキ部分をシリコンラバー等にて狭着することにより
部分メツキが可能となり、特別にマスキング装置を必要
としない、コンパクトな分散メツキ槽である。In addition, as a jig that divides the plating processing tank into upper and lower parts, it is possible to perform partial plating by narrowing the non-plated part with silicon rubber, etc., and it is a compact dispersion plating tank that does not require a special masking device. It is.
（実施例） 以下実施例について説明する。Example An example will be described below.
第１図は第２図に示す自動車用クラツチに使用される
ダイヤフラムスプリング10の先端部11にニツケルメツキ
を行う高速分散メツキ装置である。FIG. 1 shows a high-speed dispersion plating device for performing a nickel plating on a distal end portion 11 of a diaphragm spring 10 used in the automobile clutch shown in FIG.
第２図の10はワークで、先端部11に自動車用クラツチ
として使用される場合に耐摩耗性強化のためにニツケル
メツキ（斜線で示す）が行われている。In FIG. 2, reference numeral 10 denotes a work, which is provided with a nickel plating (indicated by diagonal lines) at the tip end portion 11 to enhance abrasion resistance when used as an automobile clutch.
第１図に示す本装置はメツキ液貯槽Ａとメツキ処理槽
Ｂとその間をつなぐ循環系から構成されている。The apparatus shown in FIG. 1 is composed of a plating liquid storage tank A, a plating processing tank B, and a circulation system connecting them.
メツキ液貯槽Ａはメツキ槽１、プロペラ攪拌機２、エ
ヤー配管３があり、４はポンプで、前記プロペラ攪拌機
２による機械的攪拌とエヤー配管３を通じでエヤーを送
り込むエヤー攪拌で、メツキ液中にSiCよりなる分散剤
を分散させておき、メツキ液中に分散剤が沈降するのを
防止している。The plating liquid storage tank A has a plating tank 1, a propeller stirrer 2, and an air pipe 3. A pump 4 is a mechanical stirrer by the propeller stirrer 2 and an air stirrer that sends air through the air pipe 3. A dispersant is dispersed to prevent the dispersant from settling in the plating solution.
第１図及び第３図に示すメツキ処理槽Ｂは上治具６と
下治具７より構成され、中央部には陽極８と陽極しやへ
い板９がある。10はクラツチ用ダイヤフラムスプリング
であるワークで先端部11にニツケルメツキ処理をするも
ので、12はＯリングである。The plating bath B shown in FIGS. 1 and 3 is composed of an upper jig 6 and a lower jig 7, and has an anode 8 and an anode shielding plate 9 in the center. Reference numeral 10 denotes a work which is a diaphragm spring for a clutch, which performs a nickel plating process on a tip portion 11, and 12 denotes an O-ring.
メツキ処理槽Ｂはメツキ処理すべきワーク10を上治具
６と下治具７にてはさみこむもので、メツキ液漏れを無
くするためにＯリング12を取付ける。The plating bath B holds the workpiece 10 to be plated by the upper jig 6 and the lower jig 7, and has an O-ring 12 mounted thereon to eliminate the leakage of plating liquid.
又ワーク10は11に示す位置に部分メツキを行うために
上治具６と下治具７の表面にシリコン系ゴム13をはりつ
けてマスキングとするものである。The work 10 is formed by masking a silicon rubber 13 on the surface of the upper jig 6 and the lower jig 7 in order to perform partial plating at the position indicated by 11.
陽極８にはニツケル鋼棒が使用され、下治具の14は陰
極でそれに導通した陰極板15がある。A nickel steel rod is used for the anode 8, and the lower jig 14 is a cathode, and there is a cathode plate 15 connected to the cathode.
前記メツキ液槽及びメツキ処理槽よりなる分散メツキ
装置に於いて、ワークのメツキ皮膜の品質は、メツキ液
組成が一定なれば次の因子で容易に制御することができ
る。In the dispersing plating apparatus including the plating liquid tank and the plating processing tank, the quality of the plating film on the work can be easily controlled by the following factors if the plating liquid composition is constant.
（１）膜厚→電流密度（高速化の際には流量増加が必
要）、 （２）均一電着性→陽極とワーク間距離、及び陽極しや
へい板の巾と長さ、 （３）均一分散性→メツキ処理槽Ｂおよびメツキ液貯槽
内のメツキ液の攪拌、 （４）皮膜中分散量→流量、 上記方法でメツキ皮膜を形成した時のメツキ液組成と
品質を第１表に示す。(1) film thickness → current density (increase in flow rate is required for high speed), (2) uniform electrodeposition → distance between anode and workpiece, width and length of anode shield plate, (3) Uniform dispersibility → stirring of plating liquid in plating processing tank B and plating liquid storage tank, (4) Dispersion amount in coating → flow rate, Table 1 shows plating liquid composition and quality when plating film is formed by the above method. .
第１表 （１）メツキ液組成 スルフアミン酸ニツケル 500g/L 酸化ニツケル 5g/L ホウ酸 35g/L 次亜リン酸ソーダ 2g/L サツカリン 1g/L 分散剤 40g/L （２）メツキ皮膜品質 皮膜 20μ／分 硬度 HV800 皮膜中分散剤量 5wt％ 以上より従来バツチ式で約５個のワークのメツキ処理
について約20〜22分を必要としていたが、本装置の使用
によりマスキング工程が不必要でかつ１個２分程の短時
間で処理できかつ品質のバラツキも極めて少ないもので
ある。Table 1 (1) Composition of plating solution Nickel sulfamate 500 g / L Nickel oxide 5 g / L Boric acid 35 g / L Sodium hypophosphite 2 g / L Satsukaline 1 g / L Dispersant 40 g / L (2) Quality of plating film 20 μm / Min Hardness HV800 The amount of dispersant in the coating is more than 5wt%. Conventionally, about 20 to 22 minutes are required for the plating process of about 5 workpieces by the batch type. It can be processed in a short time of about 2 minutes and has very little variation in quality.
（発明の効果） 本発明は次の効果を有する。すなわち、 （１）メツキ液の攪拌が効果的に行われるために、メツ
キ皮膜に分散剤を均一に分散されており、製品の品質向
上がはかれる。(Effects of the Invention) The present invention has the following effects. That is, (1) the dispersant is uniformly dispersed in the plating film because the plating liquid is effectively stirred, and the quality of the product is improved.
（２）メツキ処理槽では強制循環が行われているため、
高電流密度操作ができ生産性の向上がはかれる。(2) Since forced circulation is performed in the plating treatment tank,
High current density operation can be performed and productivity can be improved.
（３）メツキ処理槽が２分割されているために部分メツ
キが容易にできる。(3) Since the plating bath is divided into two parts, partial plating can be easily performed.
第１図は本実施例の概略説明図、第２図はワークの一部
分破断を有する断面図、第３図はメツキ処理槽の拡大説
明図、第４図及び第５図は従来例の説明図である。 Ａ……メツキ液槽、Ｂ……メツキ処理槽、２……機械的
攪拌装置、３……エヤー攪拌装置、４……ポンプ装置、
６……上治具、７……下治具、８……陽極、10……ワー
ク、14……陰極。FIG. 1 is a schematic explanatory view of the present embodiment, FIG. 2 is a cross-sectional view of the work having a partial breakage, FIG. 3 is an enlarged explanatory view of a plating processing tank, and FIGS. It is. A: plating liquid tank, B: plating processing tank, 2 ... mechanical stirring device, 3 ... air stirring device, 4 ... pump device,
6 upper jig, 7 lower jig, 8 anode, 10 work, 14 cathode.
Claims (1)
キを行う、メッキ液槽とメッキ処理槽とよりなる分散メ
ッキ装置に於いて、前記メッキ液槽には機械攪拌装置と
エアー攪拌装置及びポンプ強制循環装置を設け、前記メ
ッキ処理槽は上治具と下治具に２分割してそれぞれに電
極を配置し、メッキ処理するワークを前記上治具と下治
具にてはさみこみ、前記メッキ処理槽にメッキ液の循環
通路を設けて均一な分散剤を有するメッキ液を強制的に
循環させて、前記ワークのメッキ処理すべき位置に前記
メッキ液を循環させて前記ワークに部分メッキさせるこ
とを特徴とする分散メッキ装置。1. A dispersing plating apparatus comprising a plating solution tank and a plating tank, in which a dispersant is placed in a metal plating solution to perform electroplating, wherein the plating solution tank has a mechanical stirring device and an air stirring device. And a pump forced circulation device is provided, the plating tank is divided into an upper jig and a lower jig, and electrodes are arranged respectively. A plating solution circulation path is provided in the plating bath to forcibly circulate a plating solution having a uniform dispersant, and circulate the plating solution to a position of the work to be plated to partially plate the work. A dispersion plating apparatus characterized by the above-mentioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336990A JP2900476B2 (en) | 1990-02-23 | 1990-02-23 | Dispersion plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4336990A JP2900476B2 (en) | 1990-02-23 | 1990-02-23 | Dispersion plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03247794A JPH03247794A (en) | 1991-11-05 |
| JP2900476B2 true JP2900476B2 (en) | 1999-06-02 |
Family
ID=12661930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4336990A Expired - Fee Related JP2900476B2 (en) | 1990-02-23 | 1990-02-23 | Dispersion plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2900476B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3035114B2 (en) * | 1993-04-01 | 2000-04-17 | 日本テクノ株式会社 | Electrodeposition equipment |
| KR100877380B1 (en) * | 2007-05-30 | 2009-01-09 | 한국생산기술연구원 | A Electro Dispersion Plating Apparatus for Synchronizer Ring |
-
1990
- 1990-02-23 JP JP4336990A patent/JP2900476B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03247794A (en) | 1991-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |