JP2841598B2 - Electrical joining method of ceramics and insert material for electrical joining - Google Patents
Electrical joining method of ceramics and insert material for electrical joiningInfo
- Publication number
- JP2841598B2 JP2841598B2 JP33404489A JP33404489A JP2841598B2 JP 2841598 B2 JP2841598 B2 JP 2841598B2 JP 33404489 A JP33404489 A JP 33404489A JP 33404489 A JP33404489 A JP 33404489A JP 2841598 B2 JP2841598 B2 JP 2841598B2
- Authority
- JP
- Japan
- Prior art keywords
- joined
- current
- ceramics
- joining
- energizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は、特に少なくとも一方が絶縁性のセラミック
スとの接合に好適な電気接合方法及びその接合用インサ
ート材に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention particularly relates to an electric joining method suitable for joining with at least one of insulating ceramics and an insert material for joining the same.
＜従来技術と発明が解決しようとする問題点＞ セラミックス同士またはセラミックスと金属とを接合
する場合、特開昭61−36180号及び62−202875号公報に
示されるように、セラミックスの導電性を利用して接合
方向に電流を流し、そのときに発生するジュール熱によ
り、セラミックスを高温度に加熱させて電気的な接合を
行っている。<Problems to be Solved by the Prior Art and the Invention> When joining ceramics or ceramics and metal, as described in JP-A-61-36180 and JP-A-62-202875, the conductivity of ceramics is used. Then, an electric current is caused to flow in the joining direction, and the ceramics is heated to a high temperature by Joule heat generated at that time to perform electrical joining.
しかし、両者ともセラミックスの導電性を利用してい
るために、絶縁性セラミックスについては、電気的な接
合がないという根本的な問題点がある。一方、前者につ
いては、通電電極を被接合部材の突合せ部近傍に近づけ
ることにより、局部加熱を行っているが、電極を被接合
部材の外周面に設けているために、複雑形状になると外
周面に沿って電極を設け難くくなるという問題がある。
また、電流が外周面より流れ込むために、電極を近づけ
ると、突合せ面の広い被接合部では、その外周側と内部
側とで電流密度が異なり、それに伴う発熱量が異なるた
めに、突合せ部全体を均一に加熱できないという問題が
ある。他方、後者については、セラミックス全体が加熱
されるために、高温接合や大気中の接合では、セラミッ
クスの劣化が全体に及ぶ虞れがある。However, since both use the conductivity of ceramics, there is a fundamental problem with insulating ceramics that there is no electrical connection. On the other hand, in the former, local heating is performed by bringing the energized electrode closer to the vicinity of the butted portion of the member to be joined. However, since the electrode is provided on the outer peripheral surface of the member to be joined, the outer peripheral surface becomes complicated when the shape becomes complicated. There is a problem that it becomes difficult to provide an electrode along.
In addition, when the electrodes are brought closer to each other because the current flows from the outer peripheral surface, the current density differs between the outer peripheral side and the inner side of the joined part having a large butted surface, and the amount of heat generated thereby differs. Cannot be heated uniformly. On the other hand, in the latter case, since the entire ceramic is heated, there is a possibility that the deterioration of the ceramic may be entirely caused in the high-temperature bonding or the bonding in the atmosphere.
＜問題点を解決するための手段＞ 本発明は、上記の問題点を解決するために、請求項１
においては、被接合セラミックスと導電性被接合部材と
の間に、高導電性通電部材と高導電性通電部材よりも大
きい抵抗率を有する通電発熱部材とを備えた電気接合用
インサート材を介在させて突合せ、導電性被接合部材と
高導電性通電部材との間に電流を通じることにより、主
に通電発熱部材に生じるジュール熱によって、突合せ部
及びその近傍を直接加熱して接合することを特徴として
いる。<Means for Solving the Problems> The present invention is directed to claim 1 in order to solve the above problems.
In the above, between the ceramics to be bonded and the conductive member to be bonded, an insert member for electrical bonding including a high conductive member and a conductive member having a higher resistivity than the high conductive member is interposed. The butt joint and its vicinity are directly heated and joined mainly by Joule heat generated in the current-carrying heat-generating member by passing an electric current between the conductive joined member and the highly conductive energized member. And
また、請求項２においては、被接合セラミックスと被
接合部材との間に、第１及び第２の高導電性通電部材と
高導電性通電部材間に設けられ、かつ高導電性通電部材
よりも大きい抵抗率を有する通電発熱部材とを備えた電
気接合用インサート材を介在させて突合せ、前記第１及
び第２の高導電性通電部材間に電流を通じることによ
り、主に通電発熱部材に生じるジュール熱によって、前
記突合せ部及びその近傍を直接加熱して接合することを
特徴としている。According to a second aspect of the present invention, the first conductive member and the second conductive member are provided between the ceramics to be bonded and the member to be bonded. Abutting and interposing an electrical joining insert material having an electric heating member having a large resistivity, and passing an electric current between the first and second highly conductive electric members, mainly occurs in the electric heating member. The joint and the vicinity thereof are directly heated and joined by Joule heat.
さらに、請求項3,4においては、被接合セラミックス
と被接合部材との電気接合用インサート材であって、高
導電性通電部材と通電発熱部材とが予め強固に接合さ
れ、また前述の２者に、さらに少なくとも一層からなる
熱応力緩和部材とが予め強固に接合されていることを特
徴としている。Further, according to claims 3 and 4, an insert material for electric joining between a ceramic to be joined and a member to be joined, wherein the highly conductive energizing member and the energizing heat generating member are firmly joined in advance, and In addition, at least one layer of a thermal stress relaxation member is firmly joined in advance.
＜作 用＞ 以上のような方法及びインサート材とすることによ
り、被接合セラミックスと被接合部材との間に介在した
通電発熱部材から発生するジュール熱が他よりも大きく
なるので、両者による突合せ部及びその近傍を集中的か
つ均一に加熱させることができ、かつ応力緩和に対応さ
せることができる。特に、少なくとも一方が絶縁性の被
接合セラミックスを接合する場合に、本発明が最大限に
発揮される。<Operation> By using the method and the insert material as described above, the Joule heat generated from the current-carrying heating member interposed between the ceramics to be bonded and the member to be bonded becomes larger than the other. And its vicinity can be intensively and uniformly heated, and can cope with stress relaxation. In particular, the present invention is maximized when at least one of the insulating ceramics is joined.
＜実施例＞ 実施例１ 第１図は、本発明の第１の接合方法を示す実施例の概
略断面図であって、絶縁性のセラミックスと導電性被接
合部材とを接合する場合を示している。まず、被接合セ
ラミックス１を絶縁性Si3N4（φ７×10mm）、導電性被
接合部材２をコバール（φ７×7mm）とし、この間に、T
i/Cu/Ag合金箔の接合剤3a（φ７×0.3mm）を介在したタ
ングステン（抵抗率ρ＝５×10-6Ω・cm）の高導電性通
電部材４（φ７×0.3mm）とTiN含有Si3N4セラミックス
（抵抗率ρ＝５×10-3Ω・cm）の通電発熱部材５（φ７
×3mm）とからなる電気接合用インサート材８の両面
に、接合剤3aと同様の接合剤3b,3cを設けて配設する。
配設に際しては、通電部材４がセラミックス１側に、か
つ発熱部材５が被接合部材２側になるようにする。ここ
で、通電を容易にするために、通電部材４の外周方向に
突出した端子部材９が設けられており、この端子部は接
合後、不必要であれば、加工により除去する。つぎに、
この構成体中の発熱部材５が高導電性の通電補助部材10
に向くように載置し、接合方向に約50kg/cm2の圧力Ｐを
加えて固定する。<Example> Example 1 Fig. 1 is a schematic sectional view of an example showing a first bonding method of the present invention, showing a case where an insulating ceramic and a conductive member to be bonded are bonded. I have. First, the ceramic 1 to be joined is made of insulating Si 3 N 4 (φ7 × 10 mm), and the conductive member 2 is made of Kovar (φ7 × 7 mm).
Tungsten (resistivity ρ = 5 × 10 −6 Ω · cm) highly conductive conductive member 4 (φ7 × 0.3 mm) and TiN with i / Cu / Ag alloy foil bonding agent 3a (φ7 × 0.3 mm) interposed Electric heating member 5 (φ7) containing Si 3 N 4 ceramics (resistivity ρ = 5 × 10 −3 Ω · cm)
× 3 mm), the same bonding agents 3b and 3c as the bonding agent 3a are provided and arranged on both surfaces of the electrical bonding insert material 8 made of the same material.
At the time of disposition, the energizing member 4 is located on the ceramics 1 side, and the heat generating member 5 is located on the joined member 2 side. Here, in order to facilitate the energization, a terminal member 9 protruding in the outer peripheral direction of the energizing member 4 is provided, and after joining, if unnecessary, it is removed by processing. Next,
The heat generating member 5 in this structure is a highly conductive energizing auxiliary member 10.
And fixed by applying a pressure P of about 50 kg / cm 2 in the joining direction.
このような構成において、接合雰囲気を真空とし、高
導電性通電部材４と通電補助部材10との間に電圧を印加
すると、発熱部材５の抵抗率を通電部材４よりも十分大
きくしているので、電流は接合剤3a,発熱部材5,接合剤3
c及び導電性被接合部材２を接合方向に略均一に流れ
る。本実施例では、発熱部材５の抵抗率を他よりも大き
くしているので、発熱部材５でのジュール熱が主とな
り、その熱が接合剤3a,通電部材4,接合剤3,被接合セラ
ミックス１及び接合剤3c,被整合部材２へと順次に伝導
し、それぞれの接合剤とその両側の各部材とが反応する
まで、電流を徐々に増加させ、発熱部材５の中央部の温
度を放射温度計により測定しつつ、約30℃/minの率で約
950℃まで加熱し、10分間保持した後、電流を徐々に減
少させ、約30℃/minで室温まで冷却し接合を完了した。
接合強度については、常温でせん断試験を行った結果、
約90MPaであった。In such a configuration, when the joining atmosphere is vacuum and a voltage is applied between the highly conductive energizing member 4 and the energizing auxiliary member 10, the resistivity of the heating member 5 is made sufficiently higher than that of the energizing member 4. The current is the bonding agent 3a, the heating member 5, the bonding agent 3
c and the conductive member 2 flow substantially uniformly in the bonding direction. In the present embodiment, since the resistivity of the heat generating member 5 is made higher than the others, the Joule heat in the heat generating member 5 is mainly used, and the heat is generated by the bonding agent 3a, the conductive member 4, the bonding agent 3, and the ceramic to be bonded. 1 and the bonding agent 3c and the member to be aligned 2 in sequence, gradually increasing the current until the respective bonding agent reacts with each member on both sides thereof, and radiates the temperature at the center of the heat generating member 5. While measuring with a thermometer, at a rate of about 30 ° C / min
After heating to 950 ° C. and holding for 10 minutes, the current was gradually reduced and cooled to room temperature at about 30 ° C./min to complete the joining.
As for the joining strength, as a result of conducting a shear test at room temperature,
It was about 90 MPa.
実施例２ 第２図は、本発明の第１の接合方法の他の実施例を示
す概略断面図であって、実施例１に熱応力緩和を考慮し
た場合を示しており、実施例１と異なる点は、導電性被
接合部材２と通電発熱部材５との間に、熱応力緩和部材
６を配設している。配設に際しては、接合剤3c側に熱応
力緩和部材６を設け、この緩和部材６被接合部材２との
間に接合剤3dを介在させる。接合剤3dは、実施例１の3a
〜3cと同様に、Ti/Cu/Ag合金箔である。Embodiment 2 FIG. 2 is a schematic sectional view showing another embodiment of the first joining method of the present invention, showing a case in which thermal stress relaxation is considered in Embodiment 1. The difference is that a thermal stress relieving member 6 is disposed between the conductive member 2 and the energized heat generating member 5. At the time of disposition, a thermal stress relaxation member 6 is provided on the side of the bonding agent 3c, and the bonding agent 3d is interposed between the relaxation member 6 and the member 2 to be bonded. The bonding agent 3d is 3a of the first embodiment.
Like 3c, it is a Ti / Cu / Ag alloy foil.
このような構成の主たる目的は、被接合部材２と発熱
部材５との熱膨張係数が大きくなると、残留応力が発生
し、強度が低下する虞れがあるために、熱応力を緩和す
る必要がある。The main purpose of such a configuration is that when the coefficient of thermal expansion between the member to be joined 2 and the heat-generating member 5 is increased, residual stress is generated and the strength may be reduced. is there.
熱応力緩和部材６としては、被接合部材２と発熱部材
５との中間的な熱膨張係数を有する材料たは延性の大き
な金属、例えばCu,Al,Niなどを用いることができる。ま
た、複数の組成からなる熱応力緩和層を段階的に形成す
ればより効果的である。なお、この部材は導電性が必要
であり、また抵抗率が発熱部材５と略同等であれば、発
熱部材となりうる。As the thermal stress relieving member 6, a material having an intermediate thermal expansion coefficient between the member to be joined 2 and the heat generating member 5 or a metal having a large ductility, for example, Cu, Al, Ni or the like can be used. Further, it is more effective to form a thermal stress relaxation layer having a plurality of compositions stepwise. This member needs to be conductive, and can be a heating member if the resistivity is substantially equal to that of the heating member 5.
本実施例の接合条件については、実施例１と同様であ
るので省略する。The joining conditions of this embodiment are the same as those of the first embodiment, and therefore will not be described.
以上の実施例1,2においては、導電性被接合部剤２と
しては、SiC,TiN,TiCなどの単一導電性セラミックスま
たは絶縁性セラミックスに導電性材を付与した複合セラ
ミックス、サーメット、金属が例示され、また通電発熱
部材５として、上記のセラミックスの他、サーメットが
例示できるが、発熱部材５は被接合部材２よりも大きい
抵抗率を有するものを選定する必要がある。In the above Examples 1 and 2, as the conductive part 2, a composite ceramic, a cermet, or a metal obtained by adding a conductive material to a single conductive ceramic such as SiC, TiN, or TiC or an insulating ceramic is used. The cermet can be exemplified as the energizing heating member 5 in addition to the above ceramics. However, it is necessary to select the heating member 5 having a higher resistivity than the member 2 to be joined.
また、高導電性通電部材４としては発熱部材５の抵抗
率に比べて十分に小さい抵抗率を有する材料で、かつ接
合終了までの過程で全体が溶融するなどして、通電に支
障をきたすことのない材料が必要であり、上記の被接合
部材２と同様のものが例示される。The highly conductive energizing member 4 is made of a material having a resistivity sufficiently smaller than the resistivity of the heat generating member 5, and the whole is melted in the process until the joining is completed, so that the energization is hindered. Therefore, a material similar to the above-described member 2 to be joined is required.
さらに、被接合セラミックス１を絶縁性としたが、導
電性であっても可能であり、この場合、被接合部材１を
通って上部から電流が流れ出ないように、この部材１の
上部を絶縁すればよい。Further, although the ceramics 1 to be joined is made insulative, it is also possible to use a conductive material. In this case, the upper part of the member 1 is insulated so that current does not flow from the upper part through the member 1 to be joined. I just need.
実施例３ 第３図は、本発明の第２の接合方法を示す実施例の概
略断面図であって、絶縁性のセラミックスと絶縁性の被
接合部材とを接合する場合を示している。まず、被接合
セラミックス１を絶縁性Al2O3（φ７×20mm）、被接合
部材２′を絶縁性Al2O3（φ７×20mm）とし、この間
に、TiC含有Al2O3セラミックス（ρ＝４×10-2Ω・cm）
の通電発熱部材５（φ７×3mm）の両面にTi/Cu/Ag合金
箔の接合剤3a,3b（φ７×0.3mm）を介して設けられたMo
（ρ＝５×10-6Ω・cm）の第１及び第２の高導電性通電
部材4a,4b（φ７×0.3mm）とからなる電気接合用インサ
ート材８を配設する。配設に際しては、このインサート
材８の両面に、接合剤3a,3bと同様の接合剤3c,3dを設け
る。第１及び第２の通電部材4a,4bについては、実施例
１と同様に通電用の端子部9a,9bがそれぞれ設けられて
いる。つぎに、この構成体を接合方向に約50kg/cm2の圧
力Ｐを加えて固定する。Embodiment 3 FIG. 3 is a schematic sectional view of an embodiment showing a second joining method of the present invention, and shows a case where an insulating ceramic and an insulating member to be joined are joined. First, the ceramic 1 to be bonded is made of insulating Al 2 O 3 (φ7 × 20 mm), and the member to be bonded 2 ′ is made of insulating Al 2 O 3 (φ7 × 20 mm), during which the TiC-containing Al 2 O 3 ceramic (ρ = 4 × 10 -2 Ω · cm)
Provided on both surfaces of the current-carrying heat-generating member 5 (φ7 × 3 mm) with bonding agents 3a, 3b (φ7 × 0.3 mm) of Ti / Cu / Ag alloy foil.
An insert member 8 for electrical joining is provided which includes first and second high-conductive members 4a and 4b (φ7 × 0.3 mm) (ρ = 5 × 10 −6 Ω · cm). At the time of disposition, the same bonding agents 3c and 3d as the bonding agents 3a and 3b are provided on both surfaces of the insert material 8. The first and second current-carrying members 4a and 4b are provided with current-carrying terminals 9a and 9b, respectively, as in the first embodiment. Next, the structure is fixed by applying a pressure P of about 50 kg / cm 2 in the joining direction.
このような構成において、接合雰囲気を真空とし、第
１及び第２の通電部材4a,4b間に電圧を印加すると、発
熱部材５の抵抗率を通電部材4a,4bよりも十分大きくし
ているので、電流は接合剤3a,発熱部材５及び接合剤3b
を接合方向に略均一に流れる。本実施例では、発熱部材
５の抵抗率を他よりも大きくしているので、発熱部材５
でのジュール熱が主となり、その熱が接合剤3a,第１の
通電部材4a,接合剤3c,被接合セラミックス１及び接合剤
3b,第２の通電部材4b,接合剤3d,被接合部材２′へと順
次に伝導し、それぞれの接合剤とその両側の各部材とが
反応して接合を完了するまで、実施例１を同条件で行っ
た。その結果、接合体より3mm×4mm×40mmの試験片を切
り出し、常温で４点曲げ試験で約180MPaの接合強度が得
られた。In such a configuration, when the joining atmosphere is set to a vacuum and a voltage is applied between the first and second current-carrying members 4a and 4b, the resistivity of the heat-generating member 5 is made sufficiently higher than that of the current-carrying members 4a and 4b. The current is controlled by the bonding agent 3a, the heating member 5 and the bonding agent 3b.
Flows almost uniformly in the joining direction. In the present embodiment, since the resistivity of the heat generating member 5 is set to be higher than others, the heat generating member 5
Joule heat is mainly generated by the bonding agent 3a, the first conductive member 4a, the bonding agent 3c, the ceramics 1 to be bonded, and the bonding agent.
3b, the second current-carrying member 4b, the bonding agent 3d, and the conduction to the member to be welded 2 'in order, and the bonding agent and each member on both sides of the member react to complete the bonding until the bonding is completed. Performed under the same conditions. As a result, a test piece of 3 mm × 4 mm × 40 mm was cut out from the joined body, and a bonding strength of about 180 MPa was obtained in a four-point bending test at room temperature.
実施例４ 第４図は、本発明の第２の接合方法の他の実施例を示
す概略断面図であって、実施例３に熱応力緩和を考慮し
た場合を示しており、実施例３と異なる点は、被接合部
材２′を金属、例えば鋼としているので、第２の高導電
性通電部材4bと被接合部材２′との間に熱応力緩和部材
６を配設している。配設に際しては接合剤3d側に緩和部
材６を設け、この緩和部材６と被接合部材２′との間に
接合剤3eを介在させる。接合剤3eは、接合剤3a〜3dと同
様に、Ti/Cu/Ag合金箔である。Embodiment 4 FIG. 4 is a schematic sectional view showing another embodiment of the second joining method of the present invention, showing a case where thermal stress relaxation is taken into consideration in Embodiment 3. The difference is that the member to be joined 2 ′ is made of metal, for example, steel, so that the thermal stress relaxation member 6 is disposed between the second highly conductive energizing member 4 b and the member to be joined 2 ′. At the time of disposition, the relaxation member 6 is provided on the side of the bonding agent 3d, and the bonding agent 3e is interposed between the relaxation member 6 and the member to be bonded 2 '. The bonding agent 3e is a Ti / Cu / Ag alloy foil, like the bonding agents 3a to 3d.
このような構成の目的は、熱応力緩和であって、緩和
部材６として実施例２と同様のものが適用できる。The purpose of such a configuration is thermal stress relaxation, and the same as in the second embodiment can be applied as the relaxing member 6.
本実施例の接合条件は、実施例１と同様であるので省
略する。The joining conditions in this embodiment are the same as those in the first embodiment, and a description thereof will be omitted.
以上の実施例3,4において、第１及び第２の通電部材4
a,4bを同種としたが，異種であってもよい。ただし、発
熱部材５及び被接合部材２′の熱膨張係数が著しく異な
る場合は、第２の通電部材4bとして、発熱部材５と被接
合部材２′との中間的な熱膨張係数を有する材料を選ぶ
とより好ましい。In the above third and fourth embodiments, the first and second current-carrying members 4
Although a and 4b are of the same species, they may be of different species. However, when the thermal expansion coefficient of the heat generating member 5 and the member to be joined 2 ′ are significantly different, a material having an intermediate thermal expansion coefficient between the heat generating member 5 and the member to be joined 2 ′ is used as the second energizing member 4b. It is more preferable to choose.
また、緩和部材６は第２の通電部材4bと被接合部材
２′との間に配設してもよい。Further, the relaxing member 6 may be disposed between the second energizing member 4b and the member to be joined 2 '.
さらに、被接合セラミックス１は導電性セラミックス
が適用でき、被接合部材２′は導電性セラミックス，サ
ーメットのいずれでも適用できるが、この場合には、実
施例1,2のように、絶縁を考慮すればよい。Further, the ceramics 1 to be bonded can be made of conductive ceramics, and the member to be bonded 2 'can be made of either conductive ceramics or cermet. In this case, as in the first and second embodiments, insulation is taken into consideration. I just need.
なお、以上の実施例１〜４の接合剤3a〜3eは、それぞ
れ両側の材料同士が直接、拡散などにより反応強固に接
合できる場合は、特に必要ではない。Note that the bonding agents 3a to 3e of the above Examples 1 to 4 are not particularly necessary when the materials on both sides can be firmly bonded to each other by reaction directly by diffusion or the like.
実施例５ 本実施例は、請求項1,3に対応する。Embodiment 5 This embodiment corresponds to claims 1 and 3.
第５図は、本発明の第１の接合方法に適用される第１
の電気接合用インサート材を示す概略断面図である。図
において、通電を容易にするための端子部９が設けられ
た高導電性通電部材４と通電発熱部材５とが、予め強固
に接合され一体化されており、さらに必要に応じてその
両面に接合剤3b,3cが形成されている。FIG. 5 shows the first bonding method applied to the first bonding method of the present invention.
It is a schematic sectional drawing which shows the insert material for electrical joining of. In the figure, a highly conductive energizing member 4 provided with a terminal portion 9 for facilitating energization and an energizing heat generating member 5 are firmly joined and integrated in advance, and if necessary, on both surfaces thereof. The bonding agents 3b and 3c are formed.
一体化の方法としては、接合剤による接合またはホッ
トプレス、HIPなどによる拡散接合が可能である。As an integration method, bonding by a bonding agent or diffusion bonding by hot pressing, HIP, or the like is possible.
接合剤3b,3cの形成方法としては、スクリーン印刷、
スプレー法、イオンプレーティング、CVD、溶射などの
あらゆる薄膜または厚膜作成技術が適用できる。As a method for forming the bonding agents 3b and 3c, screen printing,
Any thin or thick film forming technique such as spraying, ion plating, CVD, and thermal spraying can be applied.
実施例６ 本実施例は、請求項1,4に対応する。Embodiment 6 This embodiment corresponds to claims 1 and 4.
第６図は、本発明の第１の接合方法に適用される第２
の電気接合用インサート材を示す概略断面図である。図
において、実施例５の通電部材４と発熱部材５とに、さ
らに発熱部材５側に設けられた熱応力緩和部材６との３
者が、予め強固に接合され一体化されており、必要に応
じてその両面に接合剤3b,3dが形成されている。FIG. 6 shows a second bonding method applied to the first bonding method of the present invention.
It is a schematic sectional drawing which shows the insert material for electrical joining of. In the figure, the current-carrying member 4 and the heat-generating member 5 of the fifth embodiment are further combined with a thermal-stress-relieving member 6 provided on the heat-generating member 5 side.
The members are firmly bonded and integrated in advance, and the bonding agents 3b and 3d are formed on both surfaces thereof as necessary.
実施例７ 本実施例は、請求項2,3に対応する。Embodiment 7 This embodiment corresponds to claims 2 and 3.
第７図は、本発明の第２の接合方法に適用される第１
の電気接合用インサート材をを示す概略断面図である。
図において、通電を容易にするための端子部9a,9bがそ
れぞれ設けられた第１及び第２の高導電性通電部材4a,4
b間に、通電発熱部材５が予め強固に接合され一体化さ
れており、必要に応じてその両面に接合剤3c,3dが形成
されている。FIG. 7 shows a first bonding method applied to the second bonding method of the present invention.
It is a schematic sectional drawing which shows the insert material for electrical joining of.
In the figure, first and second high-conductive members 4a, 4 provided with terminal portions 9a, 9b, respectively, for facilitating conduction.
Between b, the current-carrying heat-generating member 5 is firmly bonded and integrated in advance, and bonding agents 3c and 3d are formed on both surfaces thereof as required.
実施例８ 本実施例は、請求項2,4に対応する。Embodiment 8 This embodiment corresponds to claims 2 and 4.
第８図は、本発明の第２の接合方法に適用される第２
の電気接合用インサート材を示す概略断面図である。図
において、実施例７の第１の通電部材4a,発熱部材5,第
２の通電部材4bとに、さらに第２の通電部材4b側に設け
られた熱応力緩和部材６との４者が、予め強固に接合さ
れ一体化されており、必要に応じてその両側に接合剤3
c,3eが形成されている。なお、緩和部材６は第２の通電
部材4bと被接合部材２′との間に配設してもよい。FIG. 8 shows a second bonding method applied to the second bonding method of the present invention.
It is a schematic sectional drawing which shows the insert material for electrical joining of. In the figure, a first current-carrying member 4a, a heat-generating member 5, and a second current-carrying member 4b of Example 7, and a thermal stress relaxation member 6 provided on the second current-carrying member 4b side, It is firmly bonded and integrated in advance, and if necessary, a bonding agent 3
c, 3e are formed. The relaxing member 6 may be provided between the second energizing member 4b and the member to be joined 2 '.
＜発明の効果＞ 本発明の請求項１及び２の効果は、被接合セラミック
スと被接合部材との間に介在した通電発熱部材から発生
するジュール熱を他よりも大きくさせたので、両者によ
り突合せ部及びその近傍を集中的かつ均一に加熱させる
ことができ、かつ応力緩和に対応させることができる。
特に、少なくとも一方が絶縁性の被接合セラミックスを
接合する場合に、本発明を最大限に発揮させることがで
きる。<Effect of the Invention> The effect of claims 1 and 2 of the present invention is that the Joule heat generated from the current-carrying heating member interposed between the ceramics to be bonded and the member to be bonded is made larger than the others, so that the two are joined together. The portion and its vicinity can be intensively and uniformly heated, and can cope with stress relaxation.
In particular, when at least one of the ceramics to be bonded is insulated, the present invention can be maximized.
また、突合せ部及びその近傍のみを直接加熱するよう
にしたので、被接合セラミックス全体の劣化を最少限に
とどめることができ、かつ加熱効率が高く、短時間接
合、設備費の低減、ランニングコストの低減が可能であ
るという実用上の価値が大である。In addition, since only the butted portion and the vicinity thereof are directly heated, deterioration of the whole ceramics to be joined can be minimized, and the heating efficiency is high, the joining time is short, the equipment cost is reduced, and the running cost is reduced. The practical value that reduction is possible is great.
請求項3,4の効果は、高導電性通電部材と通電発熱部
材、またはこの２者にさらに熱応力緩和部材とを一体化
して、必要に応じてその両面に接合剤を設けることによ
り、取扱い及び接合時の位置合せが容易になり、接合工
程を簡略することができ、また、現場作業が容易とな
る。The effects of claims 3 and 4 can be achieved by integrating a highly conductive current-carrying member and a current-carrying heat-generating member, or a thermal stress relaxation member on the two members, and providing a bonding agent on both surfaces as necessary. In addition, alignment at the time of joining becomes easy, the joining process can be simplified, and on-site work becomes easy.
第１図及び第２図は、それぞれ本発明の第１の接合方法
を示す実施例及び他の実施例の概略断面図である。 第３図および第４図は、それぞれ本発明の第２の接合方
法を示す実施例及び他の実施例の概略断面図である。 第５図及び第６図は、それぞれ本発明の第１の接合方法
に適用される第１及び第２の電気接合用インサート材を
示す概略断面図である。 第７図及び第８図は、それぞれ本発明の第２の接合方法
に適用される第１及び第２の電気接合用インサート材を
示す概略断面図である。 １……被接合セラミックス、2,2′……被接合部材、3a
〜3e……接合剤、4,4a,4b……高導電性通電部材、５…
…通電発熱部材、６……熱応力緩和部材、８……電気接
合用インサート材。1 and 2 are schematic sectional views of an embodiment and another embodiment, respectively, showing a first joining method of the present invention. FIG. 3 and FIG. 4 are schematic sectional views of an embodiment and another embodiment, respectively, showing a second joining method of the present invention. 5 and 6 are schematic cross-sectional views showing first and second electric joining insert materials applied to the first joining method of the present invention, respectively. FIG. 7 and FIG. 8 are schematic cross-sectional views showing first and second electric joining insert materials applied to the second joining method of the present invention, respectively. 1 ... Ceramics to be joined, 2, 2 '... Member to be joined, 3a
... 3e ... bonding agent, 4, 4a, 4b ... highly conductive conductive member, 5 ...
... Electric heating member, 6 ... Stress relaxation member, 8 ... Insert material for electrical joining.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−106662（ＪＰ，Ａ) 特開 平３−5380（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C04B 37/00──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-106662 (JP, A) JP-A-3-5380 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C04B 37/00
Claims (4)
の間に、高導電性通電部材と前記高導電性通電部材より
も大きい抵抗率を有する通電発熱部材とを備えた電気接
合用インサート材を介在させて突合せ、前記導電性被接
合部材と高導電性通電部材との間に電流を通じることに
より、主に前記通電発熱部材に生じるジュール熱によっ
て、前記突合せ部及びその近傍を直接加熱して接合する
セラミックスの電気接合方法。1. An electrical joining insert material comprising a highly conductive current-carrying member and a current-carrying heat-generating member having a higher resistivity than the high conductive current-carrying member between a ceramic to be joined and a conductive member to be joined. By passing current between the conductive joined member and the highly conductive energizing member, Joule heat generated mainly in the energizing heating member directly heats the abutting portion and the vicinity thereof. Electrical joining method for ceramics.
に、第１及び第２の高導電性通電部材と前記高導電性通
電部材間に設けられ、かつ前記高導電性通電部材よりも
大きい抵抗率を有する通電発熱部材とを備えた電気接合
用インサート材を介在させて突合せ、前記第１及び第２
の高導電性通電部材間に電流を通じることにより、主に
前記通電発熱部材に生じるジュール熱によって、前記突
合せ部及びその近傍を直接加熱して接合するセラミック
スの電気接合方法。2. A high-conductivity energizing member which is provided between first and second high-conductivity energizing members and between the high-conductivity energizing member and between the ceramics to be joined and the member to be joined. Butting with an electric joining insert material having an electric heating member having a specific resistance interposed therebetween, and
A method of electrically joining ceramics, in which a current is passed between the highly conductive energizing members to directly heat and join the butted portion and its vicinity mainly by Joule heat generated in the energizing heating member.
材と通電発熱部材とが、予め強固に接合されているセラ
ミックスの電気接合用インサート材。3. An insert material for electrical joining of ceramics, wherein the highly conductive member according to claim 1 and the current-carrying member are firmly joined in advance.
材と通電発熱部材とに、さらに少なくとも一層からなる
熱応力緩和部材とを備えており、前記高導電性部材と通
電発熱部材と熱応力緩和部材とが、予め強固に接合され
ているセラミックスの電気接合用インサート材。4. The high-conductivity member and the current-carrying member according to claim 1 or 2, further comprising at least one thermal stress relaxation member. An insert material for electrical joining of ceramics, in which a thermal stress relaxation member is firmly joined in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33404489A JP2841598B2 (en) | 1989-12-22 | 1989-12-22 | Electrical joining method of ceramics and insert material for electrical joining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33404489A JP2841598B2 (en) | 1989-12-22 | 1989-12-22 | Electrical joining method of ceramics and insert material for electrical joining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03193674A JPH03193674A (en) | 1991-08-23 |
| JP2841598B2 true JP2841598B2 (en) | 1998-12-24 |
Family
ID=18272882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33404489A Expired - Lifetime JP2841598B2 (en) | 1989-12-22 | 1989-12-22 | Electrical joining method of ceramics and insert material for electrical joining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2841598B2 (en) |
-
1989
- 1989-12-22 JP JP33404489A patent/JP2841598B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03193674A (en) | 1991-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH08264256A (en) | Connecting method for terminal and electric wire, and connecting electrode | |
| JP2841598B2 (en) | Electrical joining method of ceramics and insert material for electrical joining | |
| EP0503094A4 (en) | Method of electrically joining objects to be joined including ceramics | |
| JP2870822B2 (en) | Bonding method between silicon and glass | |
| JPH09172057A (en) | Electrostatic chuck | |
| JP2706726B2 (en) | Electric joining method of ceramics | |
| JP2745538B2 (en) | Electric joining method between ceramics and insert material for joining | |
| JP2745539B2 (en) | Electrical joining method of ceramics and metal and insert material for joining | |
| JP2773257B2 (en) | Electric bonding method between Si-containing silicon carbide ceramics | |
| JPH0383870A (en) | Electric bonding of metal si-containing silicon carbide ceramic | |
| JPH05111778A (en) | Resistance welding method for different kinds of metals | |
| GB1590836A (en) | Electrically heated apparatus | |
| JPH01176283A (en) | Method for electrically joining ceramics | |
| JP2000286466A (en) | Si-ge semiconductor device and manufacture of the same, and thermoelectric conversion module | |
| JPH09205134A (en) | Electrostatic chuck | |
| JPH03193675A (en) | Electric joining method for ceramics and insert material for electric joining | |
| JP3060536B2 (en) | Electric joining method of ceramics | |
| JP2745522B2 (en) | Electrical joining method of ceramics and heating member for joining | |
| JPH01132077A (en) | Method of connecting wire and the like | |
| JP2902131B2 (en) | Joint structure and joining method between aluminum material and copper material | |
| JP2778146B2 (en) | Electrical joining method of current-carrying terminal member of ceramic heating element | |
| JPS6255252B2 (en) | ||
| JP2022146324A (en) | Sleeve type electrode and joining method with use of sleeve type electrode | |
| JPH036633B2 (en) | ||
| JP2004082151A (en) | Method of brazing different metallic materials |