JP2807838B2 - Stencil for resin sealing of semiconductor integrated element and resin sealing method - Google Patents
Stencil for resin sealing of semiconductor integrated element and resin sealing methodInfo
- Publication number
- JP2807838B2 JP2807838B2 JP1322221A JP32222189A JP2807838B2 JP 2807838 B2 JP2807838 B2 JP 2807838B2 JP 1322221 A JP1322221 A JP 1322221A JP 32222189 A JP32222189 A JP 32222189A JP 2807838 B2 JP2807838 B2 JP 2807838B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- stencil
- resin sealing
- sealing
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電気配線基板の表面実装に於ける半導体集
積素子の樹脂封止用孔版および樹脂封止方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing stencil and a resin sealing method for a semiconductor integrated element in surface mounting of an electric wiring board.
従来の技術 近時、電気配線基板例えばプリント配線基板の表面実
装に於ては、その高密度化にともない、半導体集積素子
（以下単に「素子」という）を裸状態でプリント基板
（以下単に「基板」という）に搭載した後、素子と基板
をボンディングする傾向にある。この場合、基板上に裸
状態で搭載された素子を、品質維持などを目的として、
電気絶縁性樹脂で封止することが必要となる。2. Description of the Related Art In recent years, in the surface mounting of an electric wiring board, for example, a printed wiring board, a semiconductor integrated device (hereinafter, simply referred to as an “element”) is bare and a printed circuit board (hereinafter, simply referred to as a “ ), The device and the substrate tend to be bonded. In this case, for the purpose of maintaining the quality of the element mounted on the substrate in a bare state,
It is necessary to seal with an electrically insulating resin.
従来、素子の樹脂封止法としては、空気圧作動方式の
ディスペンサーを用いて、基板上に搭載の素子上に液状
封止樹脂を滴下させて封止する、所謂ポッテイング法が
提案されている。しかしながら、ポッテイング法には以
下の様な問題点があり、好ましくない。Conventionally, a so-called potting method has been proposed as a resin sealing method of an element, in which a liquid sealing resin is dropped and sealed on an element mounted on a substrate using a pneumatically operated dispenser. However, the potting method has the following problems and is not preferred.
（イ）素子を封止する樹脂が半球状の外観形状となり、
厚みの中央を最大として外周に至る程、漸次薄くなるの
で、均一な樹脂封止性が得られない。(A) The resin for encapsulating the element has a hemispherical appearance,
Since the thickness gradually becomes smaller from the center of the thickness to the outer periphery, uniform resin sealing properties cannot be obtained.
（ロ）通常四角形である素子を樹脂封止すると、樹脂層
が半球状となって、余分な部分まで封止されるので、搭
載部分の高密度化の点から好ましくない。(B) When a rectangular element is sealed with a resin, the resin layer becomes hemispherical and an extra portion is sealed, which is not preferable in terms of increasing the density of the mounting portion.
（ハ）LSIなど大型の素子は、樹脂を数回に別けて滴下
して封止されるが、封止後の外観が一様となりにくく、
厚みも不均一となり、樹脂封止性が不安定である。(C) Large devices such as LSIs are sealed by dropping the resin several times, but the appearance after sealing is difficult to be uniform.
The thickness also becomes uneven, and the resin sealing property is unstable.
（ニ）一回の滴下によって一個の素子を封止する方式で
あるので、生産性がよくない。(D) The productivity is poor because one element is sealed by one drop.
（ホ）一回の滴下から次の滴下に移る際、樹脂に糸引き
現象がみられることがあり、糸引きによって基板を汚す
虞れがある。(E) When shifting from one drop to the next drop, a stringing phenomenon may be observed in the resin, and the substrate may be stained by the stringing.
発明が解決しようとする問題点 本発明者は、基板上の素子の搭載パターンと同一パタ
ーンで通孔が形成された孔版を用い、第１図に示す様
に、孔版（３）の通孔（ａ）と基板（１）上の素子
（５）の位置合せを行ない、通孔（ａ）と素子（５）の
間に、素子封止に必要な空隙（７）を形成し、この空隙
（７）内に通孔（ａ）を通じて液状封止樹脂をスキージ
の作動により押込み充填することにより、従来技術の問
題点を解消し得ることを見出し、先に特許出願した（特
開昭64−82639号）。Problem to be Solved by the Invention The present inventor uses a stencil having through holes formed in the same pattern as the mounting pattern of the elements on the substrate, and as shown in FIG. a) is aligned with the element (5) on the substrate (1), and a gap (7) necessary for element sealing is formed between the through hole (a) and the element (5). It has been found that the problems of the prior art can be solved by injecting and filling the liquid sealing resin through the through hole (a) by squeegee operation through the through hole (a). A patent application was previously filed (Japanese Patent Application Laid-Open No. 64-82639). issue).
上記方法によれば、確かに、素子を良好に封止できる
が、以下の様な問題点があり、一層の改良が必要である
ことが判明した。According to the above method, the device can be sealed well, but it has the following problems, and it has been found that further improvement is required.
（ヘ）孔版を作成する際、通孔を形成することにより、
孔版材料の持つ残留応力の均衡がくずれ、応力集中が起
こり、孔版に反り、うねりなどが生じる。そのため、均
一な樹脂封止性が得られない可能性がある。(F) When creating a stencil, by forming through holes,
The balance of the residual stress of the stencil material is disrupted, stress concentration occurs, and the stencil material is warped or undulated. Therefore, there is a possibility that uniform resin sealing properties cannot be obtained.
（ト）基板と孔版の接触面積が大きいため、毛細現象に
より、基板と孔版の隙間から封止樹脂が滲み出る。(G) Since the contact area between the substrate and the stencil is large, the sealing resin oozes out of the gap between the substrate and the stencil due to the capillary phenomenon.
（チ）基板に素子を搭載して封止した後、改めて他の部
品（抵抗、コンデンサ、コイルなど）を搭載しなければ
ならず、工程が繁雑である。(H) After mounting and sealing the element on the substrate, another component (resistance, capacitor, coil, etc.) must be mounted again, and the process is complicated.
問題点を解決するための手段 本発明者らは、上記問題点に鑑みて鋭意研究を重ねた
結果、下面側から上向きに凹入るザグリ部を備えた孔版
を用いる場合には、孔版にそり、うねりなどが生ずるこ
とがなくなり、より確実により均一な樹脂封止性が得ら
れ、且つ基板と孔版との隙間から封止樹脂が滲み出すこ
とがなくなり、しかも上記ザグリ部内に樹脂封止を必要
としない他の部品を収納できるので、基板上に素子及び
他の部品を全て搭載した後でも、素子の樹脂封止を行い
得ることを見出し、本発明を完成した。Means for Solving the Problems The present inventors have conducted intensive studies in view of the above problems, and as a result, when using a stencil having a counterbore portion that is recessed upward from the lower surface side, the stencil, Undulation and the like do not occur, more uniform resin sealing properties are obtained, and the sealing resin does not ooze out of the gap between the substrate and the stencil. Since other components that do not need to be accommodated can be housed, it has been found that resin sealing of the device can be performed even after the device and all other components are mounted on the substrate, and the present invention has been completed.
すなわち本発明は、下記半導体集積素子の封止用孔版
および封止方法を提供するものである。That is, the present invention provides a sealing stencil for a semiconductor integrated device and a sealing method described below.
電気配線基板上に搭載されている樹脂封止対象の半
導体集積素子の搭載パターンと同一パターンで通孔部が
形成され、且つ、通孔部と通孔部との間及び／又は通孔
部と縁部との間に下面側から上向きに凹入するザグリ部
が設けられ、該ザグリ部内に上記基板上に予め搭載され
ている樹脂封止を必要としない他の部品を収納できる構
成になっていることを特徴とする半導体集積素子の樹脂
封止用孔版。A through-hole is formed in the same pattern as the mounting pattern of the semiconductor integrated element to be resin-sealed mounted on the electric wiring board, and between the through-holes and / or between the through-holes. A counterbore portion that is recessed upward from the lower surface side is provided between the edge portion and the counterbore portion, and the counterbore portion is configured to be able to store other components that are not mounted on the board and that do not require resin sealing. A stencil for resin sealing of a semiconductor integrated device.
電気配線基板上に搭載の半導体集積素子を孔版印刷
手段を適用して樹脂封止するに際し、上記基板上に樹脂
封止を必要としない他の部品を予め搭載しておき、孔版
として請求項１記載の孔版を適用し、該孔版のザグリ部
材に上記他の部品を収納した状態で半導体集積素子の樹
脂封止を行うことを特徴とする樹脂封止方法。2. A semiconductor integrated device mounted on an electric wiring board is sealed with a resin by applying a stencil printing means, and other components which do not require the resin sealing are mounted on the board in advance and used as a stencil. A resin sealing method, comprising applying the stencil described in the above, and performing resin sealing of the semiconductor integrated element in a state where the other component is stored in the counterbore member of the stencil.
実 施 例 本発明孔版につき、添付図面にもとづき説明する。EXAMPLE The stencil of the present invention will be described with reference to the accompanying drawings.
第２乃至４図は、本発明孔版の一実施例を示す図面で
あり、第２図は平面図、第３図は第２図の破線ｐにおけ
る断面図、第４図は底面図を示す。2 to 4 are drawings showing an embodiment of the stencil of the present invention. FIG. 2 is a plan view, FIG. 3 is a sectional view taken along a broken line p in FIG. 2, and FIG. 4 is a bottom view.
本発明孔版（３）の材質は特に制限されないが、例え
ば、銅、ニッケル、ステンレススチールなどの金属が好
ましい。孔版の厚みは、素子の厚みよりも大きければ特
に制限されず、素子の厚みに応じて適宜選択すれば良
い。通常は、1.0〜5.0mm程度とすれば良い。Although the material of the stencil (3) of the present invention is not particularly limited, for example, a metal such as copper, nickel, and stainless steel is preferable. The thickness of the stencil is not particularly limited as long as it is larger than the thickness of the element, and may be appropriately selected according to the thickness of the element. Usually, it may be about 1.0 to 5.0 mm.
本発明孔版（３）は、通孔（ａ）を有している。該通
孔（ａ）は、基板上の素子の搭載パターンと同一のパタ
ーン、すなわち、基板上に搭載された素子の平面形状と
相似形で且つこれよりも大きく形成されており、第７図
に示される様に、素子（５）と同心となるように位置合
わせしたとき、素子（５）の全周面に均一巾の空隙
（７）を形成する。このような構成により、樹脂封止面
積を最小限とすることが可能となる。The stencil (3) of the present invention has a through hole (a). The through-hole (a) is formed in the same pattern as the mounting pattern of the element on the substrate, that is, in a shape similar to the planar shape of the element mounted on the substrate and larger than this, as shown in FIG. As shown, when aligned so as to be concentric with the element (5), a void (7) having a uniform width is formed on the entire peripheral surface of the element (5). With such a configuration, the resin sealing area can be minimized.
通孔（ａ）の有効高さは、上記素子（５）の厚みより
も大きければ特に制限されず、得ようとする封止樹脂層
（図示せず）の厚みなどに応じて適宜選択決定すればよ
い。The effective height of the through hole (a) is not particularly limited as long as it is larger than the thickness of the element (5), and may be appropriately selected and determined according to the thickness of a sealing resin layer (not shown) to be obtained. I just need.
通孔（ａ）の直径又は一辺の長さは特に制限されない
が、通常100mm程度未満、好ましくは30mm程度未満とす
る。100mmを超えると、後に詳述する様に、不都合な点
が生じる虞れがあるので、通孔（ａ）の上端部に、孔版
（３）の上面に連続して多孔膜を形成しても良い。例え
ば、第５図に示される様に、通孔（ａ）の上端部に小通
孔（a2）を有する多孔膜（a1）を形成しても良い。多孔
膜（a1）の開口面積（すなわち小通孔（a2）の全面積）
は特に制限されないが、通常、通孔（ａ）全面積の30〜
70％程度とすれば良い。開口面積があまり小さいと、ス
キージによる液状封止樹脂の押出し充填を妨げる虞れが
ある。小通孔（a2）の孔径は、通常0.2〜2.0mm程度とす
れば良い。The diameter or the length of one side of the through hole (a) is not particularly limited, but is usually less than about 100 mm, preferably less than about 30 mm. If it exceeds 100 mm, as will be described in detail later, inconveniences may occur. Therefore, even if a porous film is formed at the upper end of the through hole (a) continuously on the upper surface of the stencil (3). good. For example, as shown in FIG. 5, a porous membrane (a 1 ) having a small through-hole (a 2 ) at the upper end of the through-hole (a) may be formed. The opening area of the porous membrane (a 1 ) (ie, the entire area of the small through-hole (a 2 ))
Is not particularly limited, but is usually 30 to 30
It should be about 70%. If the opening area is too small, there is a risk that the extrusion filling of the liquid sealing resin by the squeegee may be hindered. The hole diameter of the small through hole (a 2 ) may be usually about 0.2 to 2.0 mm.
通孔の形成は、例えばエッチング処理などの通常の孔
版印刷法に従って行なうことができる。The formation of the through holes can be performed according to a normal stencil printing method such as an etching process.
一方、本発明孔版（３）の下面には、通孔（ａ）と縁
部（ｂ）との間にザグリ部（ｃ）が設けられている。さ
らに図示しないが、孔版に２個以上の通孔が形成されて
いる場合には、通孔と通孔の間にも、ザグリ部を設けて
も良い。ザグリ部を設けることにより、本発明の種々の
効果が得られる。ザグリ部の大きさ、深さなどは、基板
上の素子以外の部品およびその搭載パターンに応じて適
宜選択すれば良い。ザグリ部の形成は、通孔の形成と同
様にして行なうことができる。On the other hand, on the lower surface of the stencil (3) of the present invention, a counterbore portion (c) is provided between the through hole (a) and the edge portion (b). Although not shown, when two or more through-holes are formed in the stencil, a counterbore portion may be provided between the through-holes. By providing the counterbore portion, various effects of the present invention can be obtained. The size and depth of the counterbore portion may be appropriately selected according to components other than the elements on the substrate and their mounting patterns. The formation of the counterbore portion can be performed in the same manner as the formation of the through hole.
本発明の方法は、上記特定構造の孔版を使用する以外
は、特開昭64−82639号に記載の方法と同様に行なうこ
とができる。The method of the present invention can be carried out in the same manner as the method described in JP-A-64-82639, except that the stencil having the above specific structure is used.
例えば、第６図に示す工程順に従って行なえば良い。
第６図（イ）に示される第１工程に於て、孔版（３）が
スクリーン印刷機（図示せず）の所定位置に、一方基板
（１）が上記印刷機のスライドテーブル（９）上に、そ
れぞれ固定され、更に孔版（３）上に所定量の液状封止
樹脂（11）が供給される。次に上記印刷機を作動させ
て、孔版（３）の通孔（ａ）（第７図参照）と、基板
（１）上に搭載の素子（５）との位置合わせが行なった
後、孔版（３）が基板（１）面に押付けられ、通孔
（ａ）内にこれに対応する上記素子（５）が同心状に収
納される。For example, the steps may be performed in the order of steps shown in FIG.
In a first step shown in FIG. 6 (a), the stencil (3) is placed at a predetermined position on a screen printing machine (not shown), and the substrate (1) is placed on a slide table (9) of the printing machine. And a predetermined amount of liquid sealing resin (11) is supplied onto the stencil (3). Next, the printing press is operated to align the through holes (a) of the stencil (3) (see FIG. 7) with the elements (5) mounted on the substrate (1). (3) is pressed against the surface of the substrate (1), and the corresponding element (5) is accommodated concentrically in the through hole (a).
この収納後の状態が第７図に拡大して示され、通孔
（ａ）とこれに収納された素子（５）との間には、素子
（５）の樹脂封止に必要な空隙（７）が形成されてい
る。なお孔版（３）の下面には、第５図に示される様
に、通孔（ａ）およびザグリ部（ｃ）を除いて、各種乳
剤（例えばPVA系）の感光膜（ｄ）を形成してもよい。
感光膜は、素子（５）の樹脂封止操作時に基板面に当接
し、クッショ層及びシール層として機能する。また膜厚
を選択することにより、孔版（３）の肉厚を調整でき
る。図７に示すように、ザグリ部（ｃ）内には樹脂封止
を必要としない他の部品（13）が収納されている。FIG. 7 is an enlarged view of the state after the storage, and a gap (a) necessary for resin sealing of the element (5) is provided between the through hole (a) and the element (5) stored therein. 7) is formed. On the lower surface of the stencil (3), as shown in FIG. 5, a photosensitive film (d) of various emulsions (for example, PVA) is formed except for the through-hole (a) and the counterbore (c). You may.
The photosensitive film contacts the substrate surface during the resin sealing operation of the element (5) and functions as a cushion layer and a seal layer. The thickness of the stencil (3) can be adjusted by selecting the film thickness. As shown in FIG. 7, another component (13) that does not require resin sealing is housed in the counterbore portion (c).
上記第６図（イ）の工程で、樹脂封止に必要な空隙
（７）が形成された後は、第６図（ロ）に示される様
に、液状封止樹脂（11）がドクターナイフ（15）の作動
をして薄層状に広げられる。次に第６図（ハ）に示され
る様に、スキージ（17）を作動させて、樹脂（11）が通
孔（ａ）を通じて空隙（７）内に押出し充填される。而
して、この押出し充填後、孔版（３）を当初の位置まで
退去させることにより、第６図（ニ）に示される様に、
素子（５）が樹脂層（11′）で封止される。孔版（３）
の基板（１）面への押付けと、スキージ（17）による樹
脂（11）の押出し充填を同時に行なってもよい。封止後
は、常法に従い樹脂を硬化させればよい。After the space (7) required for resin sealing is formed in the step of FIG. 6 (a), as shown in FIG. 6 (b), the liquid sealing resin (11) is By the operation of (15), it can be spread in a thin layer. Next, as shown in FIG. 6 (c), the squeegee (17) is operated, and the resin (11) is extruded and filled into the gap (7) through the through hole (a). After the extrusion filling, the stencil (3) is retracted to the initial position, as shown in FIG. 6 (d).
The element (5) is sealed with the resin layer (11 '). Engraving (3)
Of the resin (11) by the squeegee (17) and the pressing of the resin (11) by the squeegee (17) may be simultaneously performed. After sealing, the resin may be cured according to a conventional method.
このように、本発明孔版を適用することにより、基板
上に素子に加え樹脂封止を必要としない他の部品を予め
搭載した状態で、上記素子の樹脂封止を行い得る。As described above, by applying the stencil of the present invention, the above-described element can be resin-sealed in a state where, in addition to the element, other components that do not require resin sealing are mounted on the substrate in advance.
なお、通孔（ａ）の直径又は一辺の長さが100mmを超
えるような大きいものである場合、孔版（３）の基板
（１）面への押付けと、スキージ（17）による樹脂（1
1）の押出し充填を同時に行なうと、ドクターナイフ（1
5）による液状封止樹脂（11）の返しを行なう際に液だ
れが生じたり、或いはスキージ（17）による樹脂（11）
の押出し充填時にスキージ（17）下端のゴム質の部分が
通孔（ａ）に食い込み、樹脂層（11′）の上面を湾入さ
せる可能性がある。これを防止するために、上述した様
に、通孔（ａ）の上端部に多孔膜（a1）を形成してもよ
い（第５図）。When the diameter of the through hole (a) or the length of one side exceeds 100 mm, the stencil (3) is pressed against the surface of the substrate (1) and the resin (1) by the squeegee (17) is pressed.
When the extrusion filling of 1) is performed simultaneously, the doctor knife (1
When the liquid sealing resin (11) is turned back by 5), dripping occurs or the resin (11) by squeegee (17)
During extrusion filling, the rubbery portion at the lower end of the squeegee (17) may bite into the through-hole (a), causing the upper surface of the resin layer (11 ') to indent. To prevent this, a porous membrane (a 1 ) may be formed at the upper end of the through hole (a) as described above (FIG. 5).
封止に用いられる液状樹脂（11）としては、シリコン
樹脂、エポキシ樹脂、ウレタン樹脂、ポリブタジエン樹
脂、フェノール樹脂、アクリル樹脂、ポリイミド樹脂な
どの公知の樹脂或いは樹脂組成物を用いることができ
る。その中でも、例えば、液状エポキシ樹脂、芳香族ジ
アミンと第４級フォスフォニウム塩との反応生成物であ
る硬化剤、難燃剤、無機質充填物などを含有する一液性
エポキシ樹脂組成物などが好ましい。As the liquid resin (11) used for the sealing, a known resin or resin composition such as a silicone resin, an epoxy resin, a urethane resin, a polybutadiene resin, a phenol resin, an acrylic resin, and a polyimide resin can be used. Among them, for example, a liquid epoxy resin, a one-part epoxy resin composition containing a curing agent that is a reaction product of an aromatic diamine and a quaternary phosphonium salt, a flame retardant, an inorganic filler, and the like are preferable. .
また、液状樹脂の粘度は、特に制限されないが、充填
性、封止樹脂層が硬化する迄の形状維持性などを考慮す
ると、常温で200〜2000ポイズ程度とするのがよい。Although the viscosity of the liquid resin is not particularly limited, it is preferably about 200 to 2000 poise at room temperature in consideration of the filling property, the shape maintaining property until the sealing resin layer is cured, and the like.
液状樹脂の粘度が高い場合には、第８図に示す様な構
造を有するスキージ（17）を用いて、押出し充填を行な
ってもよい。該スキージ（17）は、ホルダー（19）の下
端に、２等辺三角状の押出し部材（21）と、該部材（2
1）の進行方向前面側の傾斜面（23）と、直線で結べる
ように連接され、インキ返しに相当する傾斜板（25）を
備えている。傾斜板（25）の傾斜角度θは、通常30〜70
゜程度とすればよい。押出し部材（21）および傾斜板
（21）は、いずれもゴム製（例えばウレタンゴム、SB
R、ネオプレンゴム、ブチルゴムなど）のものが好まし
く、80〜90゜程度の硬度（JIS6301規格）を持ち、通常
のスキージの硬度（65゜〜75゜）よりも材質的に多少硬
いものが用いられる。このようなスキージ（17）を用い
ることにより、粘度の高い液状封止樹脂（11）の押出し
充填を支障なく行なうことができる。When the viscosity of the liquid resin is high, extrusion filling may be performed using a squeegee (17) having a structure as shown in FIG. The squeegee (17) has an isosceles triangular extrusion member (21) at the lower end of the holder (19), and the member (2).
An inclined plate (25) is connected to the inclined surface (23) on the front side in the traveling direction of 1) so as to be connected in a straight line, and corresponds to ink return. The inclination angle θ of the inclined plate (25) is usually 30 to 70
It should be about ゜. The extrusion member (21) and the inclined plate (21) are both made of rubber (for example, urethane rubber, SB
R, neoprene rubber, butyl rubber, etc.) are preferable, and have a hardness of about 80 to 90 mm (JIS6301 standard) and are somewhat harder than the normal squeegee hardness (65 to 75 mm). . By using such a squeegee (17), the high-viscosity liquid sealing resin (11) can be extruded and filled without any trouble.
発明の効果 本発明によれば、下記の様な優れた効果が達成され
る。Effects of the Invention According to the present invention, the following excellent effects are achieved.
Ｉ）本発明孔版はザグリ部を有しているので、その製造
時に、反り、うねりなどが生じない。そのため、封止樹
脂の厚みがより均一となり、安定でより確実な樹脂封止
効果が得られる。I) Since the stencil of the present invention has a counterbore portion, no warpage, undulation, etc. occur during its manufacture. Therefore, the thickness of the sealing resin becomes more uniform, and a stable and more reliable resin sealing effect can be obtained.
II）本発明孔版にザグリ部が形成されているため、基板
と孔版との隙間から封止樹脂が滲み出すことがない。II) Since the countersink portion is formed on the stencil of the present invention, the sealing resin does not ooze out of the gap between the substrate and the stencil.
III）本発明孔版にザグリ部が形成されているため、基
板上に素子およびその他の部品をすべて搭載した後で
も、素子の樹脂封止を行ない得る。且つ、素子を最小面
積で樹脂封止し得るので、基板の高密度化に対処でき
る。III) Since the countersink portion is formed on the stencil of the present invention, the resin sealing of the element can be performed even after all the elements and other components are mounted on the substrate. In addition, since the element can be resin-sealed with a minimum area, it is possible to cope with high density of the substrate.
IV）封止樹脂層の厚みのコントロールが容易である。IV) The thickness of the sealing resin layer can be easily controlled.
Ｖ）プリトン基板上に搭載されたすべての半導体集積素
子を、一度に樹脂封止できるので、生産性に優れる。V) Since all the semiconductor integrated elements mounted on the Priton substrate can be sealed with resin at a time, the productivity is excellent.
VI）LSI,VLSIなど大型のものであっても、一回の操作で
樹脂封止できるので、樹脂の糸引き現象が発生せず、基
板の汚染を防止できる。VI) Even large-sized devices such as LSIs and VLSIs can be resin-sealed in a single operation, so that stringing of the resin does not occur and contamination of the substrate can be prevented.
第１図は特開昭64−82639号に記載の方法の概略説明
図、第２図乃至第５図は本発明孔版の一例を示す図面、
第６図（イ）〜（ニ）は本発明方法の一実施状況を工程
順に示す概略図、第７図は孔版の通孔と基板上の半導体
集積素子の位置合わせ状況を示す拡大断面図、第８図は
本発明法に適用される好ましいスキージの一例を示す縦
断側面図である。 図において、（ａ）は通孔部、（a1）は多孔膜、（a2）
は小通孔、（ｂ）は縁部、（ｃ）はザグリ部、（ｄ）は
感光膜、（１）はプリント基板、（３）は孔版、（５）
は半導体集積素子、（７）は樹脂封止に必要な空隙、
（９）はスクリーン印刷機のスライドテーブル、（11）
は液状封止樹脂、（11′）は樹脂層、（13）は半導体集
積素子以外の部品、（15）はドクターナイフ、（17）は
スキージ、（19）はホルダー、（21）は押出し部材と、
（23）は傾斜面、（25）は傾斜板である。FIG. 1 is a schematic explanatory view of the method described in JP-A-64-82639, FIGS. 2 to 5 are drawings showing an example of the stencil of the present invention,
6 (a) to 6 (d) are schematic views showing one embodiment of the method of the present invention in the order of steps, FIG. 7 is an enlarged sectional view showing the alignment of the through holes of the stencil and the semiconductor integrated device on the substrate, FIG. 8 is a vertical sectional side view showing an example of a preferred squeegee applied to the method of the present invention. In the figure, (a) is a through hole, (a 1 ) is a porous membrane, and (a 2 )
Is a small through hole, (b) is an edge, (c) is a counterbore portion, (d) is a photosensitive film, (1) is a printed circuit board, (3) is a stencil, (5)
Is a semiconductor integrated device, (7) is a gap required for resin sealing,
(9) is a slide table of a screen printing machine, (11)
Is a liquid sealing resin, (11 ') is a resin layer, (13) is a part other than a semiconductor integrated element, (15) is a doctor knife, (17) is a squeegee, (19) is a holder, and (21) is an extruded member. When,
(23) is an inclined surface, and (25) is an inclined plate.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 21/56──────────────────────────────────────────────────の Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 21/56
Claims (2)
対象の半導体集積素子の搭載パターンと同一パターンで
通孔部が形成され、且つ、通孔部と通孔部の間及び／又
は通孔部と縁部との間に下面側から下向きに凹入するザ
グリ部が設けられ、該ザグリ部内に上記基板上に予め搭
載されている樹脂封止を必要としない他の部品を収納で
きる構成になっていることを特徴とする半導体集積素子
の樹脂封止用孔版。A through-hole is formed in the same pattern as a mounting pattern of a semiconductor integrated element to be sealed with a resin mounted on an electric wiring board, and between the through-holes and / or between the through-holes. A counterbore portion that is recessed downward from the lower surface side is provided between the through hole portion and the edge portion, and other components that do not require resin sealing and are mounted on the substrate in advance can be stored in the counterbore portion. A stencil for resin sealing of a semiconductor integrated device, wherein the stencil has a configuration.
孔版印刷手段を適用して樹脂封止するに際し、上記基板
上に樹脂封止を必要としない他の部品を予め搭載してお
き、孔版として請求項１記載の孔版を適用し、該孔版の
ザグリ部内に上記他の部品を収納した状態で半導体集積
素子の樹脂封止を行うことを特徴とする樹脂封止方法。2. A semiconductor integrated element mounted on an electric wiring board is sealed with a resin by applying a stencil printing means, and other parts not requiring resin sealing are mounted on the board in advance. A resin sealing method, wherein the stencil according to claim 1 is applied as a stencil, and the semiconductor integrated element is sealed with a resin while the other component is housed in a counterbore portion of the stencil.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1322221A JP2807838B2 (en) | 1989-12-11 | 1989-12-11 | Stencil for resin sealing of semiconductor integrated element and resin sealing method |
| US07/624,440 US5232651A (en) | 1989-12-11 | 1990-12-10 | Method of sealing electric parts mounted on electric wiring board with resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1322221A JP2807838B2 (en) | 1989-12-11 | 1989-12-11 | Stencil for resin sealing of semiconductor integrated element and resin sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181142A JPH03181142A (en) | 1991-08-07 |
| JP2807838B2 true JP2807838B2 (en) | 1998-10-08 |
Family
ID=18141297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1322221A Expired - Lifetime JP2807838B2 (en) | 1989-12-11 | 1989-12-11 | Stencil for resin sealing of semiconductor integrated element and resin sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2807838B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2600208Y2 (en) * | 1993-07-06 | 1999-10-04 | 佐々木 ▲廣▼ | Tooling forced oil feed mechanism |
| US6067709A (en) * | 1996-02-23 | 2000-05-30 | Mpm Corporation | Applying encapsulating material to substrates |
| JP3330084B2 (en) | 1998-05-29 | 2002-09-30 | 松下電工株式会社 | Semiconductor element encapsulation printing mask and method of using the same |
| JP2000068302A (en) * | 1998-08-25 | 2000-03-03 | Rohm Co Ltd | Packaging method in hybrid integrated circuit |
| JP5286532B2 (en) * | 2008-10-24 | 2013-09-11 | 株式会社プロセス・ラボ・ミクロン | Paste printing plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01270325A (en) * | 1988-04-22 | 1989-10-27 | Seiko Epson Corp | Mask for potting seal |
-
1989
- 1989-12-11 JP JP1322221A patent/JP2807838B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03181142A (en) | 1991-08-07 |
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