JP3158399B2 - Resin coating method - Google Patents
Resin coating methodInfo
- Publication number
- JP3158399B2 JP3158399B2 JP11319298A JP11319298A JP3158399B2 JP 3158399 B2 JP3158399 B2 JP 3158399B2 JP 11319298 A JP11319298 A JP 11319298A JP 11319298 A JP11319298 A JP 11319298A JP 3158399 B2 JP3158399 B2 JP 3158399B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- filling
- solder bump
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田バンプを装着
した半導体装置の基板上に、樹脂を供給し、この樹脂を
前記半田バンプを含む前記基板上の所要空間に広げるこ
とで、被覆を行う樹脂塗布方法に関する。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a coating by supplying a resin onto a substrate of a semiconductor device having solder bumps mounted thereon, and spreading the resin to a required space on the substrate including the solder bumps. The present invention relates to a resin coating method.
【０００２】[0002]
【従来の技術】従来、ＣＳＰなどの微小半田バンプを、
その外部端子とする半導体装置では、実装後の信頼性を
確保するため、実装後に、半導体装置の実装部品と基板
との間に保護用の樹脂を充填していた。しかし、この方
法は、実装工数もかかり、実装後のリペアが困難であ
る。そこで、機械構造的に弱い半田バンプの基部のみに
樹脂を塗布し、半田バンプを補強することが考えられて
いる。2. Description of the Related Art Conventionally, fine solder bumps such as CSP
In a semiconductor device serving as the external terminal, in order to ensure reliability after mounting, after mounting, a resin for protection is filled between a mounting component of the semiconductor device and a substrate. However, this method requires a large number of mounting steps, and it is difficult to perform repair after mounting. Therefore, it has been considered that a resin is applied only to the base of the solder bump which is mechanically weak to reinforce the solder bump.
【０００３】その場合の樹脂塗布方法は、図４に示すよ
うに、予め半導体装置の基板１１０上にある半田バンプ
１１１の上半部分にマスク用樹脂１０８をコーティング
して置き、これに対して親和性のない補強樹脂１０９を
ディスペンサ１０４を介して基板１１０上の所要箇所
に、所定量で充填する。しかし、ここで使用している補
強樹脂１０９は、その粘度が高いため、ディスペンサ１
０４で、半導体装置の基板中央に供給しただけでは、基
板１１０の周辺部まで広がらない。In this case, as shown in FIG. 4, an upper half portion of a solder bump 111 on a substrate 110 of a semiconductor device is coated with a masking resin 108 in advance, as shown in FIG. A required portion on the substrate 110 is filled with a predetermined amount of a non-reinforcing reinforcing resin 109 via the dispenser 104. However, since the reinforcing resin 109 used here has a high viscosity, the dispenser 1
In 04, the supply to the center of the substrate of the semiconductor device does not spread to the peripheral portion of the substrate 110.
【０００４】このため、その後に、樹脂充填箇所の上か
らゴム材などよりなる平板状の押圧部材１０６を押し付
けて、加圧することにより、補強樹脂１０９を、半導体
装置の基板１１０の最外周の、少なくとも、半田バンプ
１１１のある位置より外側まで押し広げ、これによっ
て、全半田バンプ１１１に対して、補強樹脂１０９によ
る補強を確保している。For this reason, the flattening pressing member 106 made of a rubber material or the like is pressed from above the resin-filled portion and pressurized, so that the reinforcing resin 109 is removed from the outermost periphery of the substrate 110 of the semiconductor device. At least, the solder bumps 111 are pushed out from a certain position to the outside, thereby reinforcing all the solder bumps 111 with the reinforcing resin 109.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、この場
合、樹脂の供給工程と樹脂の押し広げ工程の２工程があ
るため、樹脂塗布装置としては、樹脂供給用と押し広げ
用の２ヘッドを別に用意する必要があり、それらを毎
回、切替えて使うため、装置が複雑となり、また、時間
ロスが大きいという問題があった。However, in this case, since there are two steps of a resin supply step and a resin spreading step, two heads for supplying the resin and for spreading the resin are separately prepared as the resin coating apparatus. However, since they must be switched and used each time, there is a problem that the apparatus becomes complicated and time loss is large.
【０００６】本発明は、以上の問題点を解決するために
なされたもので、その目的とするところは、半導体装置
の基板上での樹脂の供給と押し広げとを同時に実現でき
る樹脂塗布方法を提供することにある。The present invention has been made to solve the above problems, and an object of the present invention is to provide a resin coating method capable of simultaneously supplying and spreading resin on a substrate of a semiconductor device. To provide.
【０００７】[0007]
【課題を解決するための手段】このため、本発明では、
基板上の半田バンプの上面にマスク樹脂を有し、前記基
板上の前記半田バンプと前記マスク用樹脂とを、前記半
田バンプの上面の前記マスク樹脂を含む、前記半田バン
プとほぼ同一の高さを有する樹脂で覆われた基板であっ
て、前記樹脂充填を１工程で行う基板の製造方法におい
て、基板上の半田バンプの上面にマスク用樹脂をコーテ
ィングする第１のステップと、押圧部材を前記基板上の
前記半田バンプに接触する第２ステップと、前記基板の
上に樹脂充填を行って前記樹脂を基板上に広げる第３の
ステップとを有すること、もしくは、押圧部材を基板上
の半田バンプに接触する第１のステップと、前記基板の
上に樹脂充填を行って前記樹脂を基板上に広げる第２ス
テップと、樹脂充填後、更に前記押圧部材を降下させる
第３のステップとを有すること、もしくは、基板上の半
田バンプの上面にマスク用樹脂をコーティングする第１
のステップと、押圧部材を前記基板上の前記半田バンプ
に接触する第２ステップと、前記基板の上に樹脂充填を
行って前記樹脂を基板上に広げる第３のステップと、樹
脂充填後、更に前記押圧部材を降下させる第４のステッ
プとを有することを特徴とする。Therefore, in the present invention,
A mask resin is provided on the upper surface of the solder bump on the substrate,
The solder bumps on the plate and the resin for the mask are
The solder bump including the mask resin on the upper surface of the pad bump;
The board is covered with a resin that has almost the same height as the
And a method for manufacturing a substrate in which the resin filling is performed in one step.
Te performs a first step of coating a resin mask on the upper surface of the solder bumps on the substrate, a second step of contacting the pressing member to said solder bumps on said substrate, a resin filling on the substrate A third step of spreading the resin on the substrate, or a first step of bringing a pressing member into contact with a solder bump on the substrate, and filling the resin on the substrate so that the resin Or a third step of further lowering the pressing member after filling the resin, or a first step of coating the upper surface of the solder bump on the substrate with a masking resin.
And a second step of bringing a pressing member into contact with the solder bumps on the substrate; a third step of performing resin filling on the substrate to spread the resin on the substrate; And a fourth step of lowering the pressing member.
【０００８】また、本発明の樹脂塗布装置では、前記基
板の上で樹脂充填を行うための充填器と、これを昇降可
能に装備する機台と、前記充填器下に設けたノズルを挿
通する孔を有すると共にノズル先端のレベルで前記基板
上の樹脂充填箇所の周囲空間を厚み方向に規制する押圧
部材とを具備し、前記樹脂充填箇所から周囲へ樹脂を拡
げることを特徴とする。Further, in the resin coating apparatus of the present invention, a filling device for filling the resin on the substrate, a machine base equipped with the filling device, and a nozzle provided below the filling device are inserted. A pressure member having holes and regulating the space around the resin filling location on the substrate in the thickness direction at the level of the nozzle tip, and spreading the resin from the resin filling location to the periphery.
【０００９】このような構成にすることで、半導体装置
の基板に対する樹脂の塗布作業を、ディスペンサによる
樹脂充填工程と、充填された樹脂を基板上に拡げる樹脂
押圧工程との切換を行うことなく、単一作業の上で実現
することができる。With such a configuration, the operation of applying the resin to the substrate of the semiconductor device can be performed without switching between the resin filling step using a dispenser and the resin pressing step for spreading the filled resin on the substrate. It can be realized on a single operation.
【００１０】[0010]
【発明の実施の形態】以下、本発明を図１ないし図３を
参考にして、具体的に説明する。ここでは、機台として
の上下駆動ユニット５に、押圧部材としての加圧用ブロ
ック３が取り付けられており、また、その加圧用ブロッ
ク３の下面にゴム材６が取り付けられている。加圧用ブ
ロック３および押圧部材６の中央には、それぞれ、貫通
穴７があり、ディスペンサ用シリンジ１（充填器の）に
設けたノズル４を挿通させてあって、ノズル先端は、少
なくとも、押圧部材６の下面より上で終わっている。な
お、シリンジ１自体は、ホルダー２を介して、上下駆動
ユニット３に支持されている。また、前記上下駆動ユニ
ット５は、ガイドポール１２に沿って上下に昇降される
構成になっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be specifically described with reference to FIGS. Here, a pressing block 3 as a pressing member is attached to a vertical drive unit 5 as a machine base, and a rubber material 6 is attached to the lower surface of the pressing block 3. At the center of the pressing block 3 and the pressing member 6, there is a through hole 7, respectively, through which the nozzle 4 provided in the dispenser syringe 1 (of the filling device) is inserted. 6 ends above the lower surface. The syringe 1 itself is supported by a vertical drive unit 3 via a holder 2. The vertical drive unit 5 is configured to move up and down along a guide pole 12.
【００１１】そして、基板１０の上で樹脂充填を行う際
に、充填箇所の周囲空間を厚み方向に規制する押圧部材
のゴム材６を働かせて、充填樹脂の、充填箇所からの周
囲への流れを与えるのである。なお、この実施の形態で
は、予め、半田バンプ１１の上面に、補強樹脂９に対し
て親和性のないマスク用樹脂８をコーティングして置
く。When the resin is filled on the substrate 10, the rubber material 6 of the pressing member that regulates the space around the filling point in the thickness direction acts to allow the resin to flow from the filling point to the periphery. To give. In this embodiment, the mask resin 8 having no affinity for the reinforcing resin 9 is coated on the upper surface of the solder bump 11 in advance.
【００１２】これにより、半導体装置における半田バン
プ１１の基部に、補強樹脂９を塗布する場合、先ず、上
下駆動ユニット５を降下し、これと一体に動作するゴム
材６を下降させ、半田バンプ１１の上面に接触させる。
次に、ノズル４の先端より所定量の樹脂を吐出させる
が、基板１０上の所定箇所（この実施の形態では、１個
である）に充填された樹脂は、その充填箇所から、周囲
に広がり、ゴム材６の下面で規制されるように、半田バ
ンプ１１を含む基板１０とゴム材６との隙間に入り込
み、結果として、少なくとも、半田バンプ１１の最外周
の外側まで、扁平に押し広げる。Thus, when the reinforcing resin 9 is applied to the base of the solder bump 11 in the semiconductor device, first, the vertical drive unit 5 is lowered, and the rubber material 6 which operates integrally therewith is lowered. Contact the upper surface of the
Next, a predetermined amount of resin is discharged from the tip of the nozzle 4, and the resin filled in a predetermined portion (one in this embodiment) on the substrate 10 spreads from the filled portion to the periphery. As a result, the rubber material 6 enters the gap between the substrate 10 including the solder bump 11 and the rubber material 6 so as to be regulated by the lower surface of the rubber material 6, and as a result, is flattened and spread at least to the outermost periphery of the solder bump 11.
【００１３】なお、要すれば、必要に応じて、加圧ブロ
ック３のみを、更に下降させ、補強樹脂９を機械的に押
し下げ、基板１０のほぼ全体により確実に樹脂を押し広
げることもできる。また、図３には、押圧部材における
貫通穴の数を複数個（この事例では５個）とし、これに
対応して、ノズル４の数も増している構造の樹脂塗装装
置を示している。If necessary, if necessary, only the pressure block 3 is further lowered to mechanically push down the reinforcing resin 9 so that the resin can be spread out almost completely over the substrate 10. FIG. 3 shows a resin coating apparatus having a structure in which the number of through holes in the pressing member is plural (five in this case) and the number of nozzles 4 is correspondingly increased.
【００１４】このような構成では、基板１０上に対する
ノズル４からの樹脂の充填機能と、これを、マスク用樹
脂９を含む半田バンプ１１の直径相当の層厚、あるい
は、上述のように、ゴム材６による押さえ込みで、それ
以下の層厚で、押し広げる機能とを、同時に達成するこ
とができる。[0014] In this configuration, the filling function of the resin from the nozzle 4 to the substrate 10, this tree mask
A layer thickness equivalent to the diameter of the solder bump 11 containing the oil 9 or
Is the holding down by the rubber material 6 as described above.
With the following layer thickness, the function of spreading can be achieved at the same time.
【００１５】[0015]
【発明の効果】本発明は、以上詳述したようになるか
ら、樹脂充填と同時に基板上での樹脂の押し拡げを行う
ので、塗布時間が短縮できるという効果が得られ、しか
も、構造を簡素化できるので、装置として、その小型化
が達成される。これにより最外周への樹脂の広がりを効
率良く行うことができる。Since the present invention has been described in detail above, since the resin is pushed and spread on the substrate simultaneously with the filling of the resin, the effect that the coating time can be shortened is obtained, and the structure is simplified. Therefore, the size of the device can be reduced. Thereby, the resin can be efficiently spread to the outermost periphery.
【図１】本発明の実施の形態を示す概略側面図である。FIG. 1 is a schematic side view showing an embodiment of the present invention.
【図２】同じく、使用態様を示す縦断側面図である。FIG. 2 is a vertical sectional side view showing a use mode.
【図３】押圧部材の平面構造の一例を示す平面図であ
る。FIG. 3 is a plan view illustrating an example of a planar structure of a pressing member.
【図４】従来例の説明図である。FIG. 4 is an explanatory diagram of a conventional example.
１ ディスペンサ用シリンジ（充填器） ２ ホルダ ３ 加圧ブロック（押圧部材の一部） ４ ノズル ５ 上下駆動ブロック ６ ゴム材（押圧部材の他部） ７ 貫通穴 ８ マスク用樹脂 ９ 補強樹脂 １０ 基板（半導体装置の） １１ 半田バンプ Reference Signs List 1 syringe for dispenser (filler) 2 holder 3 pressure block (part of pressing member) 4 nozzle 5 vertical drive block 6 rubber material (other part of pressing member) 7 through hole 8 resin for mask 9 reinforcing resin 10 substrate ( 11) Solder bump of semiconductor device
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平７−283254（ＪＰ，Ａ) 特開 平６−55119（ＪＰ，Ａ) 特開 平９−283555（ＪＰ，Ａ) 特開 平９−64078（ＪＰ，Ａ) 特開 平６−89914（ＪＰ，Ａ) 特開 平８−288293（ＪＰ，Ａ) 特開 平10−335336（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/56 H01L 21/60 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-7-283254 (JP, A) JP-A-6-55119 (JP, A) JP-A 9-283555 (JP, A) JP-A 9-283 64078 (JP, A) JP-A-6-89914 (JP, A) JP-A-8-288293 (JP, A) JP-A-10-335336 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/56 H01L 21/60
Claims (3)
を有し、前記基板上の前記半田バンプと前記マスク用樹
脂とを、前記半田バンプの上面の前記マスク樹脂を含
む、前記半田バンプとほぼ同一の高さを有する樹脂で覆
われた基板であって、前記樹脂充填を１工程で行う基板
の製造方法において、基板上の半田バンプの上面にマス
ク用樹脂をコーティングする第１のステップと、押圧部
材を前記基板上の前記半田バンプに接触する第２ステッ
プと、前記基板の上に樹脂充填を行って前記樹脂を基板
上に広げる第３のステップとを有することを特徴とする
樹脂塗布方法。1. A mask resin is provided on an upper surface of a solder bump on a substrate.
The solder bumps on the substrate and the mask tree
Containing the mask resin on the upper surface of the solder bump.
The resin is covered with a resin having substantially the same height as the solder bumps.
Substrate, wherein the resin filling is performed in one step
A first step of coating the upper surface of the solder bump on the substrate with a masking resin, a second step of contacting a pressing member with the solder bump on the substrate, and filling the resin on the substrate. And spreading the resin on a substrate by performing the following steps.
を有し、前記基板上の前記半田バンプと前記マスク用樹
脂とを、前記半田バンプの上面の前記マスク樹脂を含
む、前記半田バンプとほぼ同一の高さを有する樹脂で覆
われた基板であって、前記樹脂充填を１工程で行う基板
の製造方法において、押圧部材を基板上の半田バンプに
接触する第１のステップと、前記基板の上に樹脂充填を
行って前記樹脂を基板上に広げる第２ステップと、樹脂
充填後、更に前記押圧部材を降下させる第３のステップ
とを有することを特徴とする樹脂塗布方法。2. A mask resin is provided on the upper surface of the solder bump on the substrate.
The solder bumps on the substrate and the mask tree
Containing the mask resin on the upper surface of the solder bump.
The resin is covered with a resin having substantially the same height as the solder bumps.
Substrate, wherein the resin filling is performed in one step
A first step of contacting a pressing member with a solder bump on a substrate; a second step of filling the substrate with a resin to spread the resin on the substrate; And a third step of lowering the pressing member.
を有し、前記基板上の前記半田バンプと前記マスク用樹
脂とを、前記半田バンプの上面の前記マスク樹脂を含
む、前記半田バンプとほぼ同一の高さを有する樹脂で覆
われた基板であって、前記樹脂充填を１工程で行う基板
の製造方法において、基板上の半田バンプの上面にマス
ク用樹脂をコーティングする第１のステップと、押圧部
材を前記基板上の前記半田バンプに接触する第２ステッ
プと、前記基板の上に樹脂充填を行って前記樹脂を基板
上に広げる第３のステップと、樹脂充填後、更に前記押
圧部材を降下させる第４のステップとを有することを特
徴とする樹脂塗布方法。3. A mask resin is provided on the upper surface of the solder bump on the substrate.
The solder bumps on the substrate and the mask tree
Containing the mask resin on the upper surface of the solder bump.
The resin is covered with a resin having substantially the same height as the solder bumps.
Substrate, wherein the resin filling is performed in one step
A first step of coating the upper surface of the solder bump on the substrate with a masking resin, a second step of contacting a pressing member with the solder bump on the substrate, and filling the resin on the substrate. And a fourth step of lowering the pressing member after filling the resin with the resin applying method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11319298A JP3158399B2 (en) | 1998-04-23 | 1998-04-23 | Resin coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11319298A JP3158399B2 (en) | 1998-04-23 | 1998-04-23 | Resin coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11307556A JPH11307556A (en) | 1999-11-05 |
| JP3158399B2 true JP3158399B2 (en) | 2001-04-23 |
Family
ID=14605895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11319298A Expired - Fee Related JP3158399B2 (en) | 1998-04-23 | 1998-04-23 | Resin coating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3158399B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101261104B1 (en) | 2008-04-04 | 2013-05-06 | 데쿠세리아루즈 가부시키가이샤 | Semiconductor device and method for manufacturing the same |
-
1998
- 1998-04-23 JP JP11319298A patent/JP3158399B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11307556A (en) | 1999-11-05 |
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