JP2785991B2 - Hoop-shaped lead frame welding equipment - Google Patents
Hoop-shaped lead frame welding equipmentInfo
- Publication number
- JP2785991B2 JP2785991B2 JP2021797A JP2179790A JP2785991B2 JP 2785991 B2 JP2785991 B2 JP 2785991B2 JP 2021797 A JP2021797 A JP 2021797A JP 2179790 A JP2179790 A JP 2179790A JP 2785991 B2 JP2785991 B2 JP 2785991B2
- Authority
- JP
- Japan
- Prior art keywords
- hoop
- lead frame
- shaped lead
- lead frames
- types
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Led Device Packages (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はフープ状リードフレーム溶接装置に関する。Description: TECHNICAL FIELD The present invention relates to a hoop-shaped lead frame welding apparatus.
従来、１装置内に２種類の半導体素子例えば発光素子
及び受光素子を搭載する製造工程では、１種類のフープ
状リードフレームの長さ方向に連続して複数個のアイラ
ンドを設け、隣接するアイランド上に対をなす発光素子
及び受光素子を搭載していた。2. Description of the Related Art Conventionally, in a manufacturing process of mounting two types of semiconductor elements such as a light emitting element and a light receiving element in one device, a plurality of islands are provided continuously in the length direction of one type of hoop-shaped lead frame, And a light emitting element and a light receiving element forming a pair.
又他の方法としては、個々の半導体装置について専用
の短冊状リードフレームを製造し、各リードフレームに
発光素子と受光素子とを分離して組み込み、素子を封入
する工程前に、リードフレームの発光素子と受光素子と
を対向させ両方リードフレーム間を溶接していた。As another method, a dedicated strip-shaped lead frame is manufactured for each semiconductor device, and a light emitting element and a light receiving element are separately incorporated into each lead frame. The element and the light receiving element were opposed to each other, and both lead frames were welded.
しかしながら、上述した従来の製造方法では、フープ
状リードフレーム１種類に複数のアイランドを設けた場
合、発光素子と受光素子とが対向位置にないため、素子
の封入工程前に発光素子の光を受光素子に向けて反射さ
せるためのゲル状樹脂を被覆させる必要があり、工程数
が増大してしまうという欠点がある。また、ゲル状樹脂
と素子との間に気密性の点で問題が生じ、この半導体装
置では耐湿性が著しく劣化するという欠点がある。However, in the above-described conventional manufacturing method, when a plurality of islands are provided in one type of hoop-shaped lead frame, the light emitting element and the light receiving element are not located at opposing positions. It is necessary to coat a gel-like resin for reflecting light toward the element, and there is a disadvantage that the number of steps is increased. In addition, there is a problem in terms of airtightness between the gel resin and the element, and this semiconductor device has a disadvantage that moisture resistance is significantly deteriorated.
又短冊状のリードフレームを対向して溶接する場合、
ゲル状樹脂の被覆が不要となり、耐湿性劣化に関しては
改善されるものの、製造工程が１工程増えることから、
１工程分の作業者が必要とし、この半導体装置のコスト
が高くなるという欠点がある。When welding strip-shaped lead frames facing each other,
Although the coating of the gel resin is not required, and the deterioration of the moisture resistance is improved, the manufacturing process is increased by one step.
There is a drawback in that a worker for one process is required, and the cost of the semiconductor device is increased.
本発明の目的は前記課題を解決したフープ状リードフ
レーム溶接装置を提供することにある。An object of the present invention is to provide a hoop-shaped lead frame welding apparatus that solves the above problems.
上述した従来の製造装置に対し、本発明では２種類の
フープ状リードフレームを前工程と後工程とを連結させ
て連続的に流し、さらに各リードフレームの半導体素子
を対向させて両リードフレームを一定間隔毎に溶接する
という相違点を有する。In contrast to the above-described conventional manufacturing apparatus, in the present invention, two types of hoop-shaped lead frames are continuously flowed by connecting a pre-process and a post-process, and furthermore, the semiconductor elements of each lead frame are opposed to each other so that both lead frames are connected. The difference is that welding is performed at regular intervals.
前記目的を達成するため、本発明に係るフープ状リー
ドフレーム溶接装置においては、連続的に形成されてい
るアイランドに半導体素子が搭載された２種類のフープ
状リードフレームの半導体素子搭載側を対向させて各々
のリードフレームを前工程から後工程に連続して搬送す
る搬送部と、 ２種類のフープ状リードフレームを位置決めして重ね
合わせる位置決め部と、 重ね合わせたリードフレームを一定間隔で溶接結合さ
せる溶接ヘッド部とを有するものである。In order to achieve the above object, in the hoop lead frame welding apparatus according to the present invention, the semiconductor element mounting sides of two types of hoop lead frames in which semiconductor elements are mounted on continuously formed islands are opposed to each other. A transport unit that continuously transports each lead frame from the pre-process to the post-process, a positioning unit that positions and overlaps two types of hoop-shaped lead frames, and welds the superposed lead frames at regular intervals And a welding head.
以下、本発明の実施例を図により説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
（実施例１） 第１図は本発明の実施例１を示す正面図である。(Example 1) Fig. 1 is a front view showing Example 1 of the present invention.
図において、本発明は長さ方向に半導体素子搭載のア
イランドを一定ピッチで形成したフープ状リードフレー
ムを用いるものであり、本発明装置２はフープ状リード
フレームに半導体素子の搭載を行う前工程と、半導体素
子の封入を行う後工程との間に設置されるものであり、
２種類のフープ状リードフレームを前工程から後工程に
かけて連続的に搬送しつつ必要な処理を自動的に行うも
のである。すなわち、アイランドに半導体素子（例えば
発光素子及び受光素子）4a,4bがそれぞれ搭載された２
種類のフープ状リードフレーム1a,1bを半導体素子搭載
側を対向させて前工程から後工程に連続して搬送する搬
送部３と、半導体素子4a,4bが対向するように２種類の
フープ状リードフレーム1a,1bを位置決めして重ね合せ
る位置決め部５と、重ね合された２種類のフープ状リー
ドフレーム1a,1bを一定間隔毎に溶接結合させる溶接ヘ
ッド６とを有している。In the drawing, the present invention uses a hoop-shaped lead frame in which islands on which semiconductor elements are mounted are formed at a constant pitch in the longitudinal direction. The device 2 of the present invention includes a pre-process for mounting a semiconductor element on a hoop-shaped lead frame. , Is installed between the post-process of encapsulating the semiconductor element,
Necessary processing is automatically performed while continuously transporting two types of hoop-shaped lead frames from a pre-process to a post-process. That is, a semiconductor device (for example, a light emitting device and a light receiving device) 4a and 4b mounted on an island, respectively.
A transport unit 3 for continuously transporting the different types of hoop lead frames 1a and 1b from the previous process to the subsequent process with the semiconductor element mounting side facing each other, and two types of hoop leads so that the semiconductor devices 4a and 4b face each other. It has a positioning part 5 for positioning and superimposing the frames 1a and 1b, and a welding head 6 for welding and joining the two types of superposed lead frames 1a and 1b at regular intervals.
搬送部３は、位置決め部５の前段に位置し前工程から
の２種類のフープ状リードフレーム1a,1bの送り方向を
その両者が重なり合う方向に転換する第１のローラ3a,3
bと、位置決め部５の後段に位置し溶接結合されたフー
プ状リードフレーム1a,1bを後工程に搬出する第２のロ
ーラ3c,3dとを有している。The transport unit 3 is a first roller 3a, 3 which is located in front of the positioning unit 5 and changes the feed direction of the two types of hoop-shaped lead frames 1a, 1b from the previous process to a direction in which the two overlap.
b, and second rollers 3c, 3d which are located at the subsequent stage of the positioning section 5 and carry out the hoop-shaped lead frames 1a, 1b welded and connected to a subsequent process.
位置決め部５は２種類のリードフレーム1a,1bの両側
縁に一定ピッチで形成された送り孔を利用して対をなす
半導体素子4a,4bが対向するように２種類のリードフレ
ーム1a,1bを位置決めして重ね合せる。尚、位置決め部
５としては２種類のリードフレーム1a,1bを位置決め重
ね合せることが可能な構造のものであれば、実施例以外
のものでもよい。The positioning part 5 uses two kinds of lead frames 1a, 1b so that the semiconductor elements 4a, 4b forming a pair face each other using feed holes formed at both sides of the two kinds of lead frames 1a, 1b at a constant pitch. Position and overlap. It should be noted that the positioning portion 5 may have a structure other than the embodiment as long as it has a structure capable of positioning and overlapping two types of lead frames 1a and 1b.
溶接ヘッド６は位置決め部５の上方にリードフレーム
送り方向に沿い前後に一定間隔あけて設置されており、
昇降することにより、重ね合されたリードフレーム1a,1
bを溶接結合する。The welding heads 6 are installed above the positioning unit 5 at regular intervals in the front-back direction along the lead frame feed direction.
By ascending and descending, the superposed lead frames 1a, 1
b is welded.
フープ状リードフレーム1a,1bは本装置２の搬送部３
に装着されており、一定ストロークで後工程に送り込ま
れる。The hoop-shaped lead frames 1a, 1b
And is sent to the subsequent process at a constant stroke.
２種類のフープ状リードフレーム1a,1bは各々の半導
体素子4a,4b同士が対向した状態で本装置２の位置決め
部５で位置決め重ね合された後、溶接ヘッド部６により
溶接される。その後、フープ状リードフレーム1a,1bは
搬送部３によって後工程に送り込まれる。The two types of hoop-shaped lead frames 1a and 1b are positioned and overlapped by the positioning unit 5 of the present apparatus 2 with the semiconductor elements 4a and 4b facing each other, and then welded by the welding head unit 6. Thereafter, the hoop-shaped lead frames 1a and 1b are sent to a subsequent process by the transport unit 3.
（実施例２） 第２図は本発明の実施例２を示す平面図である。Second Embodiment FIG. 2 is a plan view showing a second embodiment of the present invention.
本実施例は搬送部３に、連続した一方のフープ状リー
ドフレームを短冊状に切断し、この短冊状リードフレー
ムを位置決め部５に搬入する前工程装置７及びリードフ
レーム搬送ユニット９を含んでいる。In the present embodiment, the transport unit 3 includes a pre-process device 7 and a lead frame transport unit 9 for cutting one continuous hoop-shaped lead frame into a strip shape and carrying the strip-shaped lead frame into the positioning unit 5. .
一方のフープ状リードフレーム1aは本装置２の搬送部
３に装着され連続したまま位置決め部５に送られ、他方
のフープ状リードフレーム1bは搬送部３の前工程装置７
に装着され、その装置７上で短冊状リードフレーム８に
切断され、この短冊状リードフレーム８はリードフレー
ム搬送ユニット９によって、位置決め部５まで搬送され
る。位置決め部５では半導体素子4a,4b同士が対向した
状態で連続したフープ状リードフレーム1aに短冊状リー
ドフレーム８を位置決めして重ね合せ、フープ状リード
フレーム1aと短冊状リードフレーム８とは溶接ヘッド部
６により溶接される。One hoop-shaped lead frame 1a is attached to the transport section 3 of the present apparatus 2 and is sent to the positioning section 5 while being continuous, and the other hoop-shaped lead frame 1b is connected to the pre-process apparatus 7 of the transport section 3.
, And cut into strip-shaped lead frames 8 on the device 7, and the strip-shaped lead frames 8 are transported to the positioning unit 5 by the lead frame transport unit 9. In the positioning section 5, the strip-shaped lead frame 8 is positioned and superimposed on the continuous hoop-shaped lead frame 1a in a state where the semiconductor elements 4a and 4b face each other, and the hoop-shaped lead frame 1a and the strip-shaped lead frame 8 are welded to each other. Welded by part 6.
本実施例では前工程に他の工程が入り込んでも対応可
能であるため、種々の品種の半導体装置の製造工程に応
用できるという利点がある。In this embodiment, since it is possible to cope with the case where other processes are included in the previous process, there is an advantage that the present invention can be applied to the manufacturing processes of various types of semiconductor devices.
以上説明したように本発明は、前・後工程を連結し２
種類のフープ状リードフレームを連続的に搬送し、半導
体素子側を対向にしてリードフレーム同士を溶接し、こ
れを封入することができ、光反射用被覆形成に伴なう耐
湿性劣化を解消でき、作業者作業を介さずに連続的に作
業を自動化できるため、半導体装置のコストダウンを図
れるという効果がある。As described above, according to the present invention, the pre-process and post-process
Various types of hoop-shaped leadframes can be continuously conveyed, the leadframes can be welded together with the semiconductor element side facing each other, and these can be sealed, eliminating the degradation of moisture resistance associated with the formation of a light-reflective coating. In addition, since the work can be continuously automated without the intervention of the worker, there is an effect that the cost of the semiconductor device can be reduced.
第１図は本発明の実施例１を示す正面図、第２図は本発
明の実施例２を示す平面図である。 1a,1b……フープ状リードフレーム ２……本発明装置、３……搬送部 4a,4b……半導体素子、５……位置決め部 ６……溶接ヘッド、７……前工程装置 ８……短冊状リードフレーム ９……リードフレーム搬送ユニットFIG. 1 is a front view showing a first embodiment of the present invention, and FIG. 2 is a plan view showing a second embodiment of the present invention. 1a, 1b: hoop-shaped lead frame 2: apparatus of the present invention, 3: transport section 4a, 4b: semiconductor element, 5: positioning section 6: welding head, 7: pre-process apparatus 8: strip Lead frame 9: Lead frame transport unit
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−121357（ＪＰ，Ａ) 特開 昭62−114255（ＪＰ，Ａ) 実開 平１−112588（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) B23K 37/04,37/047 H01L 23/48 H01L 21/50 H01L 33/00────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-121357 (JP, A) JP-A-62-114255 (JP, A) JP-A-1-112588 (JP, U) (58) Survey Field (Int.Cl. 6 , DB name) B23K 37 / 04,37 / 047 H01L 23/48 H01L 21/50 H01L 33/00
Claims (1)
体素子が搭載された２種類のフープ状リードフレームの
半導体素子搭載側を対向させて各々のリードフレームを
前工程から後工程に連続して搬送する搬送部と、 ２種類のフープ状リードフレームを位置決めして重ね合
わせる位置決め部と、 重ね合わせたリードフレームを一定間隔で溶接結合させ
る溶接ヘッド部とを有することを特徴とするフープ状リ
ードフレーム溶接装置。1. A semiconductor device is mounted on a continuously formed island, and the semiconductor device mounting side of two types of hoop-shaped lead frames is opposed to each other. A hoop-shaped lead frame comprising: a transfer section for transferring; a positioning section for positioning and overlapping two types of hoop-shaped lead frames; and a welding head section for welding and joining the overlapped lead frames at regular intervals. Welding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021797A JP2785991B2 (en) | 1990-01-31 | 1990-01-31 | Hoop-shaped lead frame welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021797A JP2785991B2 (en) | 1990-01-31 | 1990-01-31 | Hoop-shaped lead frame welding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03226397A JPH03226397A (en) | 1991-10-07 |
| JP2785991B2 true JP2785991B2 (en) | 1998-08-13 |
Family
ID=12065043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021797A Expired - Lifetime JP2785991B2 (en) | 1990-01-31 | 1990-01-31 | Hoop-shaped lead frame welding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2785991B2 (en) |
-
1990
- 1990-01-31 JP JP2021797A patent/JP2785991B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03226397A (en) | 1991-10-07 |
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