JP2763470B2 - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JP2763470B2 JP2763470B2 JP5013286A JP1328693A JP2763470B2 JP 2763470 B2 JP2763470 B2 JP 2763470B2 JP 5013286 A JP5013286 A JP 5013286A JP 1328693 A JP1328693 A JP 1328693A JP 2763470 B2 JP2763470 B2 JP 2763470B2
- Authority
- JP
- Japan
- Prior art keywords
- metallized
- insulating base
- insulating
- wiring board
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体素子等の電子部品
を搭載する配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board on which electronic components such as semiconductor elements are mounted.
【０００２】[0002]
【従来の技術】従来、半導体素子等の電子部品を搭載す
る配線基板はアルミナセラミックス等の電気絶縁材料か
ら成り、上面に半導体素子等の電子部品を搭載するため
の搭載部を有する四角形状からなる絶縁基体と、前記絶
縁基体の電子部品搭載部より下面にかけて導出されるタ
ングステン、モリブデン、マンガン等の高融点金属粉末
より成る複数個のメタライズ配線層と、前記絶縁基体の
下面に形成され、各メタライズ配線層に電気的に接続す
る複数個のメタライズパッドとから構成されており、絶
縁基体の電子部品搭載部に半導体素子等の電子部品を、
該電子部品の各電極とメタライズ配線層とを半田等のロ
ウ材を介し接合させることによって取着するとともに、
絶縁基体下面のメタライズパッドをエポキシ樹脂等から
成る外部電気回路基板の配線導体に半田等のロウ材を介
し接続することによって配線基板上に搭載された半導体
素子等の電子部品は外部電気回路に接続されることとな
る。2. Description of the Related Art Conventionally, a wiring board on which electronic components such as semiconductor elements are mounted is made of an electrically insulating material such as alumina ceramics and has a square shape having a mounting portion for mounting electronic components such as semiconductor elements on the upper surface. An insulating base, a plurality of metallized wiring layers made of a high melting point metal powder such as tungsten, molybdenum, or manganese which are led out from an electronic component mounting portion of the insulating base to a lower surface; A plurality of metallized pads electrically connected to the wiring layer, and an electronic component such as a semiconductor element is mounted on an electronic component mounting portion of the insulating base.
Attaching by joining each electrode of the electronic component and the metallized wiring layer via a brazing material such as solder,
By connecting the metallized pad on the lower surface of the insulating base to the wiring conductor of the external electric circuit board made of epoxy resin or the like via a brazing material such as solder, the electronic components such as semiconductor elements mounted on the wiring board are connected to the external electric circuit. Will be done.
【０００３】尚、前記従来の配線基板においてはアルミ
ナセラミックス等の電気絶縁材料から成る絶縁基体はセ
ラミック原料粉末に適当な有機溶剤、溶媒を添加混合し
て泥漿状となすとともにこれを従来周知のドクターブレ
ード法やカレンダーロール法等を採用し、シート状に成
形することによってセラミックグリーンシート（セラミ
ック生シート）を得、しかる後、前記セラミックグリー
ンシートに適当な打ち抜き加工を施すとともに複数枚積
層し、高温（約１６００℃）で焼成することによって製
作される。In the above-mentioned conventional wiring board, an insulating base made of an electrically insulating material such as alumina ceramic is formed into a slurry by adding an appropriate organic solvent and a solvent to ceramic raw material powder and mixing it with a conventionally known doctor. A ceramic green sheet (ceramic green sheet) is obtained by forming the sheet into a sheet shape by employing a blade method, a calendar roll method, or the like. Thereafter, the ceramic green sheet is subjected to an appropriate punching process and a plurality of sheets are laminated. (About 1600 ° C.).
【０００４】また前記メタライズ配線層及びメタライズ
パッドはタングステン、モリブデン、マンガン等の高融
点金属粉末に適当な有機溶剤、溶媒を添加混合して得た
金属ペーストを絶縁基体となるセラミックグリーンシー
トに予めスクリーン印刷法等の厚膜手法により所定パタ
ーンに印刷塗布しておくことによって絶縁基体の所定位
置に所定形状に形成される。The metallized wiring layer and the metallized pad are preliminarily screened on a ceramic green sheet as an insulating substrate by adding a metal paste obtained by adding a suitable organic solvent and a solvent to a refractory metal powder such as tungsten, molybdenum, manganese or the like. By printing and applying a predetermined pattern by a thick film technique such as a printing method, a predetermined shape is formed at a predetermined position on the insulating substrate.
【０００５】しかしながら、この従来の配線基板は絶縁
基体を構成するアルミナセラミックスの熱膨張係数が
６．０〜７．５×１０-6／℃であり、エポキシ樹脂から
成る外部電気回路基板の熱膨張係数（２３〜７５×１０
-6／℃）及び半田の熱膨張係数（２４×１０-6／℃）と
大きく相違することから絶縁基体の下面に被着させたメ
タライズパッドを外部電気回路基板の配線導体に半田等
のロウ材を介して接合させた場合、絶縁基体と外部電気
回路基板及び絶縁基体と半田との間で、且つ伸縮の差が
大きい絶縁基体の角部近傍に大きな熱応力が発生すると
ともに、これが絶縁基体の角部近傍に位置するメタライ
ズパッドと絶縁基体との界面に内在して、以下に述べる
欠点を招来してしまう。However, in this conventional wiring board, the thermal expansion coefficient of the alumina ceramics constituting the insulating base is 6.0 to 7.5 × 10 -6 / ° C., and the thermal expansion of the external electric circuit board made of epoxy resin. Coefficient (23 to 75 × 10
−6 / ° C.) and the coefficient of thermal expansion of the solder (24 × 10 −6 / ° C.), so that the metallized pad adhered to the lower surface of the insulating base is soldered to the wiring conductor of the external electric circuit board. When they are joined via a material, a large thermal stress is generated between the insulating base and the external electric circuit board and between the insulating base and the solder, and near the corner of the insulating base having a large difference in expansion and contraction. , Which are present at the interface between the metallized pad and the insulating base located near the corner of the substrate, causing the following defects.
【０００６】即ち、配線基板に搭載した半導体素子等の
電子部品が作動時に熱を発生し、該熱が配線基板の絶縁
基体、外部電気回路基板及びこれらを接合する半田に繰
り返し印加されると絶縁基体等に熱膨張が起こって絶縁
基体とメタライズパッドとの界面に内在している応力の
大きさに変化が生じ、この応力変化が繰り返し生じると
メタライズパッドと絶縁基体との接合が破れてメタライ
ズパッドが絶縁基体より剥離してしまい、その結果、半
導体素子等の電子部品を外部電気回路に確実、強固に電
気的接続することができないという欠点を有していた。That is, an electronic component such as a semiconductor element mounted on a wiring board generates heat during operation, and when the heat is repeatedly applied to the insulating base of the wiring board, the external electric circuit board, and the solder for joining them, the insulation is generated. Thermal expansion occurs in the substrate, etc., causing a change in the magnitude of the stress existing at the interface between the insulating base and the metallized pad. If this stress change occurs repeatedly, the bond between the metallized pad and the insulating base is broken, and the metallized pad is broken. Have been separated from the insulating base, and as a result, there has been a drawback that electronic components such as semiconductor elements cannot be reliably and firmly electrically connected to an external electric circuit.
【０００７】そこで上記欠点を解消するために金属ペー
ストを所定パターンに印刷塗布したセラミックグリーン
シートを焼成し、下面にメタライズパッドを被着させた
絶縁基体を製作する際に、メタライズパッドとなる金属
ペーストパターンの外周部を含むセラミックグリーンシ
ート全面にセラミックの泥漿物から成る絶縁ペーストを
印刷塗布しておき、メタライズパッドの外周部を絶縁基
体に焼結一体化した環状突起体で覆うことが提案されて
いる（実開昭５７ー７８６５１号参照）。Therefore, in order to solve the above-mentioned drawback, a ceramic green sheet having a metal paste printed and applied in a predetermined pattern is baked to produce an insulating substrate having a metallized pad adhered to the lower surface. It has been proposed that an insulating paste made of ceramic mud is printed and applied to the entire surface of the ceramic green sheet including the outer peripheral portion of the pattern, and the outer peripheral portion of the metallized pad is covered with an annular projection sintered and integrated with the insulating base. (See Japanese Utility Model Laid-Open No. 57-78651).
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、メタラ
イズパッドとなる金属ペーストパターンの外周部を含む
セラミックグリーンシートの全面に絶縁ペーストを印刷
塗布し、これを焼成することによって製作されるメタラ
イズパッドの外周部を環状突起体で覆った絶縁基体はセ
ラミックグリーンシートと絶縁ペーストの焼成収縮に大
きな差があるため絶縁基体に大きな反りが発生し、その
結果、絶縁基体下面のメタライズパッドを外部電気回路
基板の所定配線導体に正確に接合させるのが不可とな
り、半導体素子等の電子部品を外部電気回路に正確に電
気的接続できないという欠点を誘発してしまう。However, an insulating paste is printed and applied over the entire surface of the ceramic green sheet including the outer peripheral portion of the metal paste pattern to be a metallized pad, and the outer peripheral portion of the metallized pad is manufactured by firing. The insulating substrate covered with an annular projection has a large difference in firing shrinkage between the ceramic green sheet and the insulating paste, and the insulating substrate is greatly warped. This makes it impossible to accurately join the wiring conductor to the wiring conductor, which causes a drawback that an electronic component such as a semiconductor element cannot be accurately electrically connected to an external electric circuit.
【０００９】[0009]
【発明の目的】本発明は上記欠点に鑑みて案出されたも
ので、その目的は配線基板におけるメタライズパッドの
絶縁基体からの剥離を有効に防止し、且つ配線基板を外
部電気回路基板に確実、強固に接続することができる配
線基板を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to effectively prevent metallized pads on a wiring board from peeling off from an insulating substrate, and to securely connect the wiring board to an external electric circuit board. To provide a wiring board that can be firmly connected.
【００１０】[0010]
【課題を解決するための手段】本発明は複数個のメタラ
イズ配線層を有し、四角形状を成す絶縁基体の下面に、
前記メタライズ配線層に電気的に接続する複数個のメタ
ライズパッドを被着させて成る配線基板であって、前記
絶縁基体の角部近傍に位置するメタライズパッドの外周
部が、該外周部周辺の絶縁基体下面より延出する環状突
起体と絶縁基体下面とで挟持されていることを特徴とす
るものである。SUMMARY OF THE INVENTION The present invention has a plurality of metallized wiring layers, and has a quadrangular insulating base on a lower surface thereof.
A wiring board comprising a plurality of metallization pads electrically connected to the metallization wiring layer, wherein an outer peripheral portion of the metallized pad located near a corner of the insulating base has an insulation around the outer peripheral portion. The annular projection extending from the lower surface of the base and the lower surface of the insulating base are sandwiched.
【００１１】[0011]
【実施例】次に本発明を添付図面に基づき詳細に説明す
る。BRIEF DESCRIPTION OF THE DRAWINGS FIG.
【００１２】図１は本発明の配線基板の一実施例を示す
断面図、図２は底面図、図３は要部拡大図であり、図
中、１は絶縁基体、２はメタライズ配線層、３はメタラ
イズパッドである。FIG. 1 is a cross-sectional view showing an embodiment of a wiring board according to the present invention, FIG. 2 is a bottom view, and FIG. 3 is an enlarged view of a main part, wherein 1 is an insulating base, 2 is a metallized wiring layer, 3 is a metallization pad.
【００１３】前記絶縁基体１は四角形状を成し、その上
面に半導体素子等の電子部品４が搭載される搭載部を有
している。The insulating substrate 1 has a rectangular shape and has a mounting portion on which an electronic component 4 such as a semiconductor element is mounted on its upper surface.
【００１４】前記絶縁基体１はアルミナセラミックス等
の電気絶縁材料から成り、例えば、アルミナ（Ａｌ2 Ｏ
3 ）、シリカ（ＳｉＯ2 ）、カルシア（ＣａＯ）、マグ
ネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤、溶媒
を添加混合して泥漿状となすとともにこれを従来周知の
ドクターブレード法やカレンダーロール法等を採用する
ことによってセラミックグリーンシート（セラミック生
シート）を形成し、しかる後、前記セラミックグリーン
シートに適当な打ち抜き加工を施すとともに複数枚積層
し、高温（約１６００℃）で焼成することによって製作
される。[0014] The insulating substrate 1 is made of an electrically insulating material such as alumina ceramics, such as alumina (Al 2 O
3 ) Raw materials such as silica (SiO 2 ), calcia (CaO), and magnesia (MgO) are mixed with an appropriate organic solvent and a solvent to form a slurry, which is then formed into a slurry, which is conventionally known by a doctor blade method or a calender roll. By forming a ceramic green sheet (ceramic green sheet) by employing a method or the like, a suitable punching process is then performed on the ceramic green sheet, a plurality of the sheets are laminated, and fired at a high temperature (about 1600 ° C.). Be produced.
【００１５】また前記絶縁基体１には電子部品搭載部よ
り下面にかけて導出される複数個のメタライズ配線層２
が形成されており、該メタライズ配線層２の電子部品搭
載部には電子部品４の各電極が半田等のロウ材を介して
接合され、これによって電子部品４の各電極がメタライ
ズ配線層２に電気的に接続される。The insulating substrate 1 has a plurality of metallized wiring layers 2 extending from the electronic component mounting portion to the lower surface.
Are formed, and each electrode of the electronic component 4 is bonded to the electronic component mounting portion of the metallized wiring layer 2 via a brazing material such as solder, so that each electrode of the electronic component 4 is connected to the metallized wiring layer 2. Electrically connected.
【００１６】前記メタライズ配線層２はタングステン、
モリブデン、マンガン等の高融点金属粉末から成り、該
高融点金属粉末に適当な有機溶剤、溶媒を添加混合して
得た金属ペーストを従来周知のスクリーン印刷法等の厚
膜形成技術を採用し、絶縁基体１となるセラミックグリ
ーンシートに予め所定パターンに印刷塗布しておくこと
によって絶縁基体１の電子部品搭載部から下面にかけて
被着形成される。The metallized wiring layer 2 is made of tungsten,
Molybdenum, made of high melting point metal powder such as manganese, a suitable organic solvent to the high melting point metal powder, a metal paste obtained by adding and mixing a solvent, employing a conventionally known thick film forming technology such as screen printing method, The ceramic green sheet serving as the insulating base 1 is printed and applied in a predetermined pattern in advance, so that the ceramic green sheet is adhered and formed from the electronic component mounting portion of the insulating base 1 to the lower surface.
【００１７】前記絶縁基体１は更にその下面に複数個の
メタライズパッド３が被着されており、該各メタライズ
パッド３には絶縁基体１の下面に導出させた複数個のメ
タライズ配線層２の各一端が各々、電気的に接続されて
いる。The insulating substrate 1 further has a plurality of metallized pads 3 attached to the lower surface thereof. Each of the metallized pads 3 has a plurality of metallized wiring layers 2 led out to the lower surface of the insulating substrate 1. One ends are each electrically connected.
【００１８】前記メタライズパッド３は電子部品４の各
電極が接続されているメタライズ配線層２を外部電気回
路に電気的に接続する作用を為し、外部電気回路基板６
の配線導体７に半田等のロウ材８を介して接合される。The metallized pad 3 functions to electrically connect the metallized wiring layer 2 to which each electrode of the electronic component 4 is connected to an external electric circuit.
To the wiring conductor 7 via a brazing material 8 such as solder.
【００１９】尚、前記メタライズパッド３はタングステ
ン、モリブデン、マンガン等の高融点金属粉末から成
り、該高融点金属粉末に適当な有機溶剤、溶媒を添加混
合して得た金属ペーストを絶縁基体１となるセラミック
グリーンシートに予め従来周知のスクリーン印刷法等に
より印刷塗布しておくことによって絶縁基体１の下面に
被着形成される。The metallized pad 3 is made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like. A metal paste obtained by adding a suitable organic solvent and a solvent to the high melting point metal powder is mixed with the insulating base 1. The ceramic green sheet is formed on the lower surface of the insulating substrate 1 by printing and applying the same in advance by a conventionally known screen printing method or the like.
【００２０】また前記メタライズ配線層２及びメタライ
ズパッド３はその露出する表面にニッケル、金等の良導
電性で耐蝕性に優れ、且つロウ材と濡れ性の良い金属を
メッキ法により０. １乃至２０. ０μｍの厚みに層着さ
せておくとメタライズ配線層２及びメタライズパッド３
の酸化腐食を有効に防止することができるとともにメタ
ライズ配線層２への半田を介しての電子部品４の接合及
びメタライズパッド３と外部電気回路基板６の配線導体
７とのロウ材８を介しての接合を強固となすことができ
る。従って、前記メタライズ配線層２及びメタライズパ
ッド３はその露出表面にニッケル、金等を０. １乃至２
０. ０μｍの厚みに層着させておくことが好ましい。On the exposed surfaces of the metallized wiring layer 2 and the metallized pad 3, a metal such as nickel or gold having good conductivity and excellent corrosion resistance and a metal having good wettability with a brazing material is used in a range of 0.1 to 0.1. If it is layered to a thickness of 20.0 μm, the metallized wiring layer 2 and the metallized pad 3
Of the electronic component 4 via solder to the metallized wiring layer 2 and the brazing material 8 between the metallized pad 3 and the wiring conductor 7 of the external electric circuit board 6. Can be firmly joined. Therefore, the metallized wiring layer 2 and the metallized pad 3 are coated with nickel, gold or the like on the exposed surfaces of 0.1 to 2 mm.
It is preferable that the layer is deposited to a thickness of 0.0 μm.
【００２１】前記絶縁基体１の下面に被着させた複数個
のメタライズパッド３のうち絶縁基体１の角部近傍Ａに
位置するメタライズパッド３はその外周部が更に絶縁基
体１下面より延出する環状突起体５で覆われており、絶
縁基体１下面と環状突起体５とで挾持されている。Of the plurality of metallized pads 3 attached to the lower surface of the insulating substrate 1, the outer peripheral portion of the metallized pad 3 located near the corner A of the insulating substrate 1 further extends from the lower surface of the insulating substrate 1. It is covered with the annular projection 5 and is sandwiched between the lower surface of the insulating base 1 and the annular projection 5.
【００２２】前記絶縁基体１の角部近傍Ａに位置するメ
タライズパッド３はその外周部が絶縁基体１下面と環状
突起体５とで挾持され、メタライズパッド３の被着強度
が補強されているため、絶縁基体１のメタライズパッド
３を外部電気回路基板６の配線導体７に半田等のロウ材
８を介し接合させる際に発生する大きな熱応力が絶縁基
体１の角部近傍Ａに位置するメタライズパッド３と絶縁
基体１との界面に内在し、該内在応力の大きさが変化し
たとしてもメタライズパッド３と絶縁基体１との接合が
破れてメタライズパッド３が絶縁基体１より剥離するこ
とはなくなる。The metallized pad 3 located near the corner A of the insulating base 1 has its outer peripheral portion sandwiched between the lower surface of the insulating base 1 and the annular projection 5 so that the adhesion strength of the metallized pad 3 is reinforced. A large thermal stress generated when joining the metallized pad 3 of the insulating base 1 to the wiring conductor 7 of the external electric circuit board 6 via the brazing material 8 such as solder is generated in the metallized pad located near the corner A of the insulating base 1. The metallized pad 3 is not present at the interface between the metallized pad 3 and the insulating substrate 1, and the metallized pad 3 is not separated from the insulating substrate 1 even if the magnitude of the internal stress changes.
【００２３】前記環状突起体５はアルミナセラミックス
等の電気絶縁材料から成り、アルミナ等のセラミック原
料粉末に適当な有機溶剤、溶媒を添加混合して得た絶縁
ペーストを絶縁基体１となるセラミックグリーンシート
の角部近傍表面に印刷したメタライズパッド３となる金
属ペーストパターンの外周部及び該外周部周辺のセラミ
ックグリーンシート上に予め所定厚みに塗布しておくこ
とによって、メタライズパッド３の外周部及び該外周部
周辺の絶縁基体１に接合される。この場合、環状突起体
５となる絶縁ペーストは絶縁基体１となるセラミックグ
リーンシートの角部近傍の一部表面に塗布されているこ
とから、これをセラミックグリーンシートと共に焼成
し、焼結一体化させて絶縁基体１となしても絶縁基体１
には大きな反りが発生することはなく、その結果、絶縁
基体１下面のメタライズパッド３を外部電気回路基板６
の配線導体７に正確に接合させることも可能となる。The annular projection 5 is made of an electrically insulating material such as alumina ceramics. An insulating paste obtained by adding a suitable organic solvent and a solvent to a ceramic raw material powder such as alumina is mixed with a ceramic green sheet to be used as an insulating substrate 1. The outer peripheral portion of the metal paste pattern to be the metallized pad 3 printed on the surface in the vicinity of the corner and the ceramic green sheet around the outer peripheral portion are coated in advance with a predetermined thickness, so that the outer peripheral portion of the metallized pad 3 and the outer periphery are formed. It is joined to the insulating base 1 around the part. In this case, since the insulating paste for forming the annular projections 5 is applied to a part of the surface of the ceramic green sheet serving as the insulating substrate 1 near the corners, the insulating paste is fired together with the ceramic green sheet and sintered and integrated. To form the insulating base 1
Does not cause a large warp, and as a result, the metallized pads 3 on the lower surface of the insulating base 1 are removed from the external electric circuit board 6.
It is also possible to join the wiring conductor 7 accurately.
【００２４】尚、前記環状突起体５はメタライズパッド
３に接合する幅Ｘを５０乃至１００μｍとするとメタラ
イズパッド３と絶縁基体１との被着強度を大きく補強す
ることができ、メタライズパッド３の絶縁基体１からの
剥離を有効に防止することができる。よって前記環状突
起体５のメタライズパッド３との接合はその幅Ｘを５０
乃至１００μｍとしておくことが好ましい。When the width X of the annular projection 5 to be bonded to the metallized pad 3 is set to 50 to 100 μm, the adhesion strength between the metallized pad 3 and the insulating base 1 can be greatly enhanced, and the insulation of the metallized pad 3 can be improved. Peeling from the substrate 1 can be effectively prevented. Therefore, the width X of the annular projection 5 and the metallized pad 3 are set to 50
It is preferable to set the thickness to 100 μm.
【００２５】また前記環状突起体５は絶縁基体１との接
合幅Ｙを５０乃至１００μｍとすると、焼成時の絶縁基
体１に与える応力が極めて小さくなり、絶縁基体に反り
は発生するのを皆無として、且つ絶縁基体１との接合強
度を強固となすことができる。従って、前記環状突起体
５は絶縁基体１との接合幅Ｙを５０乃至１００μｍとし
ておくことが好ましい。When the annular projection 5 has a bonding width Y of 50 to 100 μm with the insulating substrate 1, the stress applied to the insulating substrate 1 at the time of firing becomes extremely small, and the insulating substrate does not warp. In addition, the bonding strength with the insulating base 1 can be increased. Accordingly, it is preferable that the width Y of the annular protrusion 5 to be bonded to the insulating base 1 is set to 50 to 100 μm.
【００２６】更に前記環状突起体５はその厚みＺを２０
乃至４０μｍとしておくとメタライズパッド３と絶縁基
体１との被着強度を大きく補強することができるととも
にメタライズパッド３と外部電気回路基板６の配線導体
７とのロウ材８を介しての接合を強固となすことができ
る。従って、前記環状突起体５はその厚みＺを２０乃至
４０μｍとしておくことが好ましい。The annular projection 5 has a thickness Z of 20.
When the thickness is set to 40 μm, the adhesion strength between the metallized pad 3 and the insulating base 1 can be greatly enhanced, and the bonding between the metallized pad 3 and the wiring conductor 7 of the external electric circuit board 6 via the brazing material 8 is strengthened. Can be made. Therefore, it is preferable that the thickness Z of the annular projection 5 is set to 20 to 40 μm.
【００２７】また前記環状突起体５はその組成を絶縁基
体１と同質の組成で形成しておくと環状突起体５と絶縁
基体１との接合強度をより向上させることができる。従
って前記環状突起体５はその組成を絶縁基体１と同質の
組成で形成しておくことが好ましい。When the annular projection 5 is formed with the same composition as the insulating base 1, the bonding strength between the annular projection 5 and the insulating base 1 can be further improved. Therefore, it is preferable to form the annular projection 5 with the same composition as the insulating base 1.
【００２８】かくして本発明の配線基板によれば絶縁基
体１の電子部品搭載部に半導体素子等の電子部品４を、
該電子部品４の各電極とメタライズ配線層２とを半田等
のロウ材を介し接合させることによって取着するととも
に、絶縁基体１下面のメタライズパッド３をエポキシ樹
脂等から成る外部電気回路基板６の配線導体７に半田等
のロウ材８を介し接続することによって配線基板上に搭
載された半導体素子等の電子部品４は外部電気回路に接
続されることとなる。Thus, according to the wiring board of the present invention, the electronic component 4 such as a semiconductor element is mounted on the electronic component mounting portion of the insulating base 1.
The electrodes of the electronic component 4 and the metallized wiring layer 2 are attached by joining them via a brazing material such as solder, and the metallized pads 3 on the lower surface of the insulating base 1 are connected to the external electric circuit board 6 made of epoxy resin or the like. By connecting to the wiring conductor 7 via a brazing material 8 such as solder, the electronic component 4 such as a semiconductor element mounted on the wiring board is connected to an external electric circuit.
【００２９】尚、本発明は上述の実施例に限定されるも
のではなく、本発明の要旨を逸脱しない範囲であれば種
々の変更は可能である。The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
【００３０】また上述の実施例では絶縁基体１をアルミ
ナセラミックス等の無機物のみで形成した場合を例に挙
げて説明したがアルミナセラミックス等の無機物から成
る基板上面にポリイミド樹脂等の有機高分子材料より形
成される絶縁膜と、蒸着、スパッタリング等の薄膜形成
技術により形成される配線導体とを多層に積層した薄膜
多層配線部を被着させたものであってもよい。In the above embodiment, the case where the insulating substrate 1 is formed only of an inorganic material such as alumina ceramics has been described as an example. However, an organic polymer material such as a polyimide resin is formed on the upper surface of the substrate made of an inorganic material such as alumina ceramics. It may be a thin film multilayer wiring portion in which an insulating film to be formed and a wiring conductor formed by a thin film forming technique such as vapor deposition or sputtering are laminated in multiple layers.
【００３１】[0031]
【発明の効果】本発明の配線基板によれば、絶縁基体の
下面に被着したメタライズパッドの外周部を、該外周部
周辺の絶縁基体下面より延出する環状突起体と絶縁基体
とで挾持し、メタライズパッドの絶縁基体への被着強度
を補強したことからメタライズパッドの絶縁基体からの
剥離を有効に防止でき、その結果、配線基板を外部電気
回路基板に強固に接合し、電子部品を外部電気回路に確
実、強固に電気的接続することが可能となる。According to the wiring board of the present invention, the outer peripheral portion of the metallized pad adhered to the lower surface of the insulating base is held between the insulating substrate and the annular projection extending from the lower surface of the insulating substrate around the outer peripheral portion. In addition, since the metallized pad has been reinforced to adhere to the insulating substrate, the metallized pad can be effectively prevented from peeling off from the insulating substrate. As a result, the wiring board is firmly joined to the external electric circuit board, and the electronic component is connected. It is possible to reliably and firmly make an electrical connection to an external electric circuit.
【００３２】また、メタライズパッドの外周部を挾持す
る環状突起体を絶縁基体の角部近傍に位置するメタライ
ズパッドの外周部周辺のみに設けたことから、環状突起
体を絶縁基体に接合させる時に絶縁基体に与える応力が
極めて小さなものとなり、その結果、絶縁基体に反りが
発生するのを皆無として、メタライズパッドを外部電気
回路基板の所定配線導体に正確、且つ確実に接合させる
ことも可能となる。Further, since the annular projection for clamping the outer peripheral portion of the metallized pad is provided only around the outer peripheral portion of the metallized pad located near the corner of the insulating base, the insulating member is insulated when the annular projection is joined to the insulating base. The stress applied to the substrate is extremely small, and as a result, the occurrence of warpage in the insulating substrate is eliminated, and the metallized pad can be accurately and reliably bonded to the predetermined wiring conductor of the external electric circuit board.
【図１】本発明の配線基板の一実施例を示す断面図であ
る。FIG. 1 is a sectional view showing one embodiment of a wiring board of the present invention.
【図２】図１に示す配線基板の底面図である。FIG. 2 is a bottom view of the wiring board shown in FIG.
【図３】図１に示す配線基板の要部拡大図である。FIG. 3 is an enlarged view of a main part of the wiring board shown in FIG. 1;
１・・・絶縁基体 ２・・・メタライズ配線層 ３・・・メタライズパッド ４・・・電子部品 ５・・・環状突起体 ６・・・外部電気回路基板 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Metallized wiring layer 3 ... Metallized pad 4 ... Electronic component 5 ... Annular protrusion 6 ... External electric circuit board
Claims (1)
状を成す絶縁基体の下面に、前記メタライズ配線層に電
気的に接続する複数個のメタライズパッドを被着させて
成る配線基板であって、前記絶縁基体の角部近傍に位置
するメタライズパッドはその各々の外周部が、該各外周
部周辺の絶縁基体下面より延出する互いに独立した複数
個の環状突起体で被覆されており、メタライズパッドの
各々の外周部が前記各環状突起体と絶縁基体下面とで挟
持されていることを特徴とする配線基板。1. A wiring board comprising a plurality of metallized wiring layers, wherein a plurality of metallized pads electrically connected to the metallized wiring layers are adhered to a lower surface of a quadrangular insulating base. The metallized pad located near the corner of the insulating substrate has its outer peripheral portion
Independent from each other extending from the lower surface of the insulating base around the part
Is covered with the annular projections,
A wiring board, wherein each outer peripheral portion is sandwiched between each of the annular protrusions and the lower surface of the insulating base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5013286A JP2763470B2 (en) | 1993-01-29 | 1993-01-29 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5013286A JP2763470B2 (en) | 1993-01-29 | 1993-01-29 | Wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06232288A JPH06232288A (en) | 1994-08-19 |
| JP2763470B2 true JP2763470B2 (en) | 1998-06-11 |
Family
ID=11828962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5013286A Expired - Fee Related JP2763470B2 (en) | 1993-01-29 | 1993-01-29 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2763470B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57191054U (en) * | 1981-05-28 | 1982-12-03 |
-
1993
- 1993-01-29 JP JP5013286A patent/JP2763470B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06232288A (en) | 1994-08-19 |
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