JP2674586B2 - Printed wiring board mounting structure - Google Patents
Printed wiring board mounting structureInfo
- Publication number
- JP2674586B2 JP2674586B2 JP7276072A JP27607295A JP2674586B2 JP 2674586 B2 JP2674586 B2 JP 2674586B2 JP 7276072 A JP7276072 A JP 7276072A JP 27607295 A JP27607295 A JP 27607295A JP 2674586 B2 JP2674586 B2 JP 2674586B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- wiring board
- printed wiring
- smd package
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明はプリント配線基板の
実装構造に関し、特にＳＭＤ（ＳｕｒｆａｃｅＭｏｕｎ
ｔｉｎｇ Ｄｅｖｉｃｅ）パッケージのプリント配線基
板への実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board mounting structure, and more particularly to an SMD (Surface Mount).
The present invention relates to a mounting structure of a toning device package on a printed wiring board.
【０００２】[0002]
【従来の技術】従来、この種の実装構造においては、例
えば、熱膨張率１０以上の多層プリント基板上に熱膨張
率１０未満のＳＭＤパッケージを実装する場合、ＳＭＤ
パッケージのリードを多層プリント基板上のランド等に
ハンダ付けすると、ＳＭＤパッケージと多層プリント基
板との間の熱膨張率の差からハンダ付け部分にクラック
が入ることがある。2. Description of the Related Art Conventionally, in this type of mounting structure, for example, when an SMD package having a coefficient of thermal expansion of less than 10 is mounted on a multilayer printed circuit board having a coefficient of thermal expansion of 10 or more, SMD
When the leads of the package are soldered to lands or the like on the multilayer printed board, cracks may occur in the soldered portion due to the difference in coefficient of thermal expansion between the SMD package and the multilayer printed board.
【０００３】これを防ぐために、図３及び図４に示すよ
うに、プリント基板１５上に配線パターン１３に接続さ
れるＳＭＤパッケージ１１のリード１２間に溝１４を配
設し、この溝１４でＳＭＤパッケージ１１とプリント基
板１５との間の熱膨張率の差による熱歪みを吸収してい
る。この実装構造については、特開平５−３３５７１５
号公報に詳述されている。In order to prevent this, as shown in FIGS. 3 and 4, a groove 14 is provided between the leads 12 of the SMD package 11 connected to the wiring pattern 13 on the printed circuit board 15, and the SMD is formed in the groove 14. The thermal strain due to the difference in the coefficient of thermal expansion between the package 11 and the printed board 15 is absorbed. Regarding this mounting structure, see Japanese Patent Laid-Open No. 5-335715.
The details are described in Japanese Patent Publication No.
【０００４】[0004]
【発明が解決しようとする課題】上述した従来の実装構
造では、ＳＭＤパッケージとプリント基板との間に熱歪
みに対する部分的な緩衝帯が設けられているだけなの
で、プリント基板の熱膨張によるＳＭＤパッケージへの
影響が抑えにくくなっている。In the conventional mounting structure described above, only a partial buffer zone against thermal strain is provided between the SMD package and the printed circuit board, so the SMD package due to thermal expansion of the printed circuit board. It is difficult to suppress the effect on.
【０００５】また、ＳＭＤパッケージのリード間にプリ
ント基板上に配設された溝があるため、その溝に対応す
る位置にあるＳＭＤパッケージのリードを使用すること
ができなくなる。Further, since there is a groove provided on the printed board between the leads of the SMD package, it becomes impossible to use the leads of the SMD package located at the positions corresponding to the grooves.
【０００６】そこで、本発明の目的は上記の問題点を解
消し、ＳＭＤパッケージのリードをすべて使用すること
ができ、かつプリント基板とＳＭＤパッケージとの間の
熱歪みを吸収しやすくすることができるプリント配線基
板の実装構造を提供することにある。Therefore, an object of the present invention is to solve the above problems, use all the leads of the SMD package, and make it easier to absorb thermal strain between the printed circuit board and the SMD package. It is to provide a mounting structure of a printed wiring board.
【０００７】[0007]
【課題を解決するための手段】本発明によるプリント配
線基板の実装構造は、リードを有する表面実装型部品が
実装されるプリント配線基板の実装構造であって、前記
表面実装型部品の実装位置に設けられた凹部と、前記リ
ードに電気的に接続される接続部を含みかつ前記凹部内
に各々独立して突出形成された複数の凸部と、前記凹部
外に配設された信号線と前記接続部とを電気的に接続し
かつ前記凹部内に収納される配線部材とを備えている。A mounting structure of a printed wiring board according to the present invention is a mounting structure of a printed wiring board on which a surface mounting type component having a lead is mounted, and the mounting position of the surface mounting type component is A plurality of convex portions each including a concave portion provided, a connecting portion electrically connected to the lead, and independently formed in the concave portion; a signal line disposed outside the concave portion; And a wiring member electrically connected to the connection portion and housed in the recess.
【０００８】[0008]
【発明の実施の形態】まず、本発明の作用について以下
に述べる。DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the operation of the present invention will be described below.
【０００９】ＳＭＤパッケージの実装位置（ＳＭＤパッ
ケージの下部位置及び外周位置）に溝を形成してプリン
ト基板上に凹部を設け、その凹部内に複数のランド形成
部を各々独立に突出形成し、複数のランド形成部上のラ
ンド部各々にハンダ付けされたリードを、溝内に収納さ
れるＶ字型の金属ラインでプリント基板上の配線パター
ンに電気的に接続する。A groove is formed at a mounting position of the SMD package (a lower position and an outer peripheral position of the SMD package) to form a recess on the printed circuit board, and a plurality of land forming portions are independently formed in the recess to form a plurality of protrusions. The leads soldered to the respective land portions on the land forming portion are electrically connected to the wiring pattern on the printed circuit board by the V-shaped metal line housed in the groove.
【００１０】これによって、プリント基板の熱膨張を溝
及び金属ラインで吸収することが可能となるので、ＳＭ
Ｄパッケージとプリント基板との熱歪みが吸収しやすく
なるとともに、ＳＭＤパッケージの周囲に設けられたリ
ードがすべてランド形成部上のランド部にハンダ付け可
能となるので、リードがすべて使用可能となる。As a result, the thermal expansion of the printed circuit board can be absorbed by the groove and the metal line.
The thermal distortion between the D package and the printed circuit board is easily absorbed, and all the leads provided around the SMD package can be soldered to the lands on the land forming portion, so that all the leads can be used.
【００１１】次に、本発明の一実施例について図面を参
照して説明する。図１は本発明の一実施例の平面図であ
り、図２は図１のＡＡ線に沿う矢視方向の断面図であ
る。これらの図において、本発明の一実施例による実装
構造では、プリント基板７上にＳＭＤパッケージ１の下
部及び外周に溝４を形成してＳＭＤパッケージ１の実装
位置に凹部を形成するとともに、ＳＭＤパッケージ１の
外周の各辺に対応して複数のランド形成部３を配設す
る。Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA of FIG. In these figures, in a mounting structure according to an embodiment of the present invention, a groove 4 is formed in a lower portion and an outer periphery of the SMD package 1 on a printed circuit board 7 to form a recess at a mounting position of the SMD package 1, and at the same time, in the SMD package. A plurality of land forming portions 3 are arranged corresponding to each side of the outer periphery of 1.
【００１２】ここで、溝４はＳＭＤパッケージ１の下部
に形成した溝と外周に形成した溝とがつながるようにし
てあるので、複数のランド形成部３各々は溝４によって
凹部の底部から夫々独立に突出形成されるようにして配
設されることとなる。また、複数のランド形成部３の上
には夫々ＳＭＤパッケージ１のリード２に対応する位置
にランド部が形成されている。Since the groove 4 is formed so that the groove formed in the lower portion of the SMD package 1 and the groove formed in the outer periphery are connected to each other, each of the plurality of land forming portions 3 is independently formed by the groove 4 from the bottom of the recess. It is arranged so as to be formed so as to project. Land portions are formed on the plurality of land forming portions 3 at positions corresponding to the leads 2 of the SMD package 1, respectively.
【００１３】リード２とプリント基板７上の配線パター
ン８とはＶ字型の金属ライン５によって電気的に接続さ
れており、金属ライン５の大部分が溝４内に収納される
ようになっている。The leads 2 and the wiring pattern 8 on the printed circuit board 7 are electrically connected by a V-shaped metal line 5, and most of the metal line 5 is housed in the groove 4. There is.
【００１４】また、ＳＭＤパッケージ１の外周の各辺に
対応するリード２に接続される金属ライン５は夫々固定
ブロック６で位置決めされるとともに、金属ライン５を
ＳＭＤパッケージ１の各辺毎に夫々固定ブロック６に接
着しておくことで一つの部品として扱うことが可能とな
っている。Further, the metal lines 5 connected to the leads 2 corresponding to the respective sides on the outer periphery of the SMD package 1 are positioned by the fixing blocks 6, respectively, and the metal lines 5 are fixed on the respective sides of the SMD package 1. It can be handled as one part by adhering it to the block 6.
【００１５】よって、ランド形成部３上のランド部にハ
ンダ付けされたリード２に対する金属ライン５の接続工
程を、ＳＭＤパッケージ１の外周の各辺毎に行うことが
でき、ＳＭＤパッケージ１の実装工程を短縮することが
できる。Therefore, the step of connecting the metal line 5 to the lead 2 soldered to the land portion on the land forming portion 3 can be performed for each side of the outer periphery of the SMD package 1, and the mounting step of the SMD package 1 can be performed. Can be shortened.
【００１６】このように、ＳＭＤパッケージ１の実装位
置に溝４を形成してプリント基板７上に凹部を設け、そ
の凹部内に複数のランド形成部３を各々独立に突出形成
し、複数のランド形成部３上のランド部各々にハンダ付
けされたリード２を、溝４内に収納されるＶ字型の金属
ライン５でプリント基板７上の配線パターン８に電気的
に接続することによって、プリント基板７の熱膨張を溝
４及び金属ライン５で吸収することが可能となるので、
ＳＭＤパッケージ１とプリント基板７との熱歪みを吸収
しやすくすることができる。As described above, the groove 4 is formed at the mounting position of the SMD package 1 to form the concave portion on the printed board 7, and the plurality of land forming portions 3 are independently formed in the concave portion to form the plurality of lands. The leads 2 soldered to the lands on the forming part 3 are electrically connected to the wiring patterns 8 on the printed circuit board 7 by the V-shaped metal lines 5 housed in the grooves 4 to print. Since the thermal expansion of the substrate 7 can be absorbed by the groove 4 and the metal line 5,
It is possible to easily absorb the thermal strain between the SMD package 1 and the printed board 7.
【００１７】この場合、ＳＭＤパッケージ１の周囲に設
けられたリード２はすべてランド形成部３上のランド部
にハンダ付けすることが可能となるので、ＳＭＤパッケ
ージ１のリード２をすべて使用することができる。In this case, since all the leads 2 provided around the SMD package 1 can be soldered to the lands on the land forming portion 3, all the leads 2 of the SMD package 1 can be used. it can.
【００１８】[0018]
【発明の効果】以上説明したように本発明によれば、表
面実装型部品の実装位置に凹部を設け、その凹部内にリ
ードに電気的に接続される接続部を含む複数の凸部を各
々独立して突出形成し、凹部内に収納される配線部材で
凹部外に配設された信号線と接続部とを電気的に接続す
ることによって、ＳＭＤパッケージのリードをすべて使
用することができ、かつプリント基板とＳＭＤパッケー
ジとの間の熱歪みを吸収しやすくすることができるとい
う効果がある。As described above, according to the present invention, a concave portion is provided at the mounting position of the surface mount type component, and a plurality of convex portions including connecting portions electrically connected to the leads are provided in the concave portion. All the leads of the SMD package can be used by independently projecting and forming a wiring member housed in the recess to electrically connect the signal line arranged outside the recess to the connection portion. Moreover, there is an effect that it is possible to easily absorb the thermal strain between the printed circuit board and the SMD package.
【図１】本発明の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.
【図２】図１のＡＡ線に沿う矢視方向の断面図である。FIG. 2 is a sectional view taken along line AA in FIG.
【図３】従来例の平面図である。FIG. 3 is a plan view of a conventional example.
【図４】図３のＢＢ線に沿う矢視方向の断面図である。FIG. 4 is a sectional view taken along line BB in FIG.
【符号の説明】 １ ＳＭＤパッケージ ２ リード ３ ランド形成部 ４ 溝 ５ 金属ライン ６ 固定ブロック ７ プリント基板 ８ 配線パターン[Explanation of reference numerals] 1 SMD package 2 lead 3 land forming portion 4 groove 5 metal line 6 fixed block 7 printed circuit board 8 wiring pattern
Claims (3)
れるプリント配線基板の実装構造であって、前記表面実
装型部品の実装位置に設けられた凹部と、前記リードに
電気的に接続される接続部を含みかつ前記凹部内に各々
独立して突出形成された複数の凸部と、前記凹部外に配
設された信号線と前記接続部とを電気的に接続しかつ前
記凹部内に収納される配線部材とを有することを特徴と
するプリント配線基板の実装構造。1. A mounting structure of a printed wiring board on which a surface mounting type component having a lead is mounted, wherein a recess provided at a mounting position of the surface mounting type component is electrically connected to the lead. A plurality of convex portions each including a connection portion and independently formed in the concave portion, electrically connecting the signal line arranged outside the concave portion and the connection portion and housed in the concave portion. And a printed wiring board mounted thereon.
の外周の各辺に対応して配設されたことを特徴とする請
求項１記載のプリント配線基板の実装構造。2. The mounting structure for a printed wiring board according to claim 1, wherein the plurality of convex portions are arranged corresponding to respective sides of an outer periphery of the surface mount type component.
外周の各辺に対応して設けられかつ前記配線部材の接続
位置を設定するための固定ブロック部材を含むことを特
徴とする請求項１または請求項２記載のプリント配線基
板の実装構造。3. The wiring member includes a fixed block member which is provided corresponding to each side of the outer periphery of the surface mount type component and which sets a connection position of the wiring member. The printed wiring board mounting structure according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7276072A JP2674586B2 (en) | 1995-10-25 | 1995-10-25 | Printed wiring board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7276072A JP2674586B2 (en) | 1995-10-25 | 1995-10-25 | Printed wiring board mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09121081A JPH09121081A (en) | 1997-05-06 |
| JP2674586B2 true JP2674586B2 (en) | 1997-11-12 |
Family
ID=17564417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7276072A Expired - Lifetime JP2674586B2 (en) | 1995-10-25 | 1995-10-25 | Printed wiring board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2674586B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007123143A1 (en) | 2006-04-21 | 2007-11-01 | Panasonic Corporation | Memory card |
| CN108323024A (en) * | 2018-04-19 | 2018-07-24 | 深圳市精益华精密模具厂 | A kind of printed wiring board mold |
| FR3117303B1 (en) * | 2020-12-09 | 2023-01-06 | Safran Electronics & Defense | Reduction of stress zones in the soldered joints of an electronic board |
-
1995
- 1995-10-25 JP JP7276072A patent/JP2674586B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09121081A (en) | 1997-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1126919A (en) | Printed wiring board | |
| JP2541063Y2 (en) | Printed circuit board pattern structure | |
| JP2674586B2 (en) | Printed wiring board mounting structure | |
| EP1594353A1 (en) | High frequency multilayer printed wiring board | |
| JP2605489B2 (en) | Printed wiring board | |
| JP2886613B2 (en) | Multilayer printed wiring board for surface mounting | |
| JP2674184B2 (en) | Surface mount printed wiring board | |
| JPH0744043Y2 (en) | Printed wiring board | |
| JP2001094000A (en) | Semiconductor device | |
| JPH01304795A (en) | Method for wiring printed board | |
| JP2522585Y2 (en) | Donut type jumper wire unit | |
| JP2704076B2 (en) | Integrated circuit package | |
| JPH06350243A (en) | Printed wiring board | |
| JPH08130361A (en) | Printed wiring board | |
| JPH04309288A (en) | Printed circuit board | |
| JP2706673B2 (en) | Printed wiring board | |
| JPH04307784A (en) | Printed wiring board | |
| JPH0749825Y2 (en) | Soldering structure for chip parts | |
| JPS63198301A (en) | Chip component | |
| JPH08172257A (en) | Printed-circuit board | |
| JPH1070351A (en) | Structure of mounting electronic component | |
| JPH07122843A (en) | Printed wiring board | |
| JPH07147481A (en) | Method of mounting electronic part | |
| JPH06125170A (en) | External memory device | |
| JPH0265295A (en) | Printed board |