JP2611877B2 - Super-finish polishing machine for ultra-thin metal plates - Google Patents

Super-finish polishing machine for ultra-thin metal plates

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Publication number
JP2611877B2
JP2611877B2 JP3046207A JP4620791A JP2611877B2 JP 2611877 B2 JP2611877 B2 JP 2611877B2 JP 3046207 A JP3046207 A JP 3046207A JP 4620791 A JP4620791 A JP 4620791A JP 2611877 B2 JP2611877 B2 JP 2611877B2
Authority
JP
Japan
Prior art keywords
metal plate
ultra
thin metal
polishing
tension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3046207A
Other languages
Japanese (ja)
Other versions
JPH04269163A (en
Inventor
泰彦 服部
光一 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Priority to JP3046207A priority Critical patent/JP2611877B2/en
Publication of JPH04269163A publication Critical patent/JPH04269163A/en
Application granted granted Critical
Publication of JP2611877B2 publication Critical patent/JP2611877B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、金属箔状の極薄金属板
を回転研磨工具により鏡面状に超仕上研磨するための装
置に関するものである。ここで「超仕上研磨」とは、そ
の仕上面の最大粗さが0.03μm以下であって、研磨
条痕の認められない写像性の高い仕上面が得られる程度
の研磨をいう。また、「極薄金属板」とは、厚さが0.
1mm程度のステンレス薄板などのことをいう。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for ultra-finish polishing of an ultra-thin metal plate in the form of a metal foil to a mirror surface using a rotary polishing tool.
It is related to the location. Here, "super finishing polishing" refers to polishing in which the maximum roughness of the finished surface is 0.03 [mu] m or less, and a finished surface with high image clarity without polishing streaks is obtained. The “ultra-thin metal plate” means that the thickness is 0.3 mm.
It refers to a stainless steel sheet of about 1 mm.

【0002】[0002]

【従来の技術】通常の厚さを有する金属板を仕上研磨す
るには、図8に示されるようにして行っている。即ち、
金属板W’の一方の端末部のみを挟着具41で挟着し
て、回転研磨工具42を矢印で示される方向(研磨工具
42の回転抵抗によって金属板W’に張力が生ずる方
向)に移動させて、その研磨を行っている。
2. Description of the Related Art Finish polishing of a metal plate having a normal thickness is performed as shown in FIG. That is,
Only one end portion of the metal plate W ′ is clamped by the clamp 41, and the rotary polishing tool 42 is moved in the direction indicated by the arrow (the direction in which the metal plate W ′ generates tension due to the rotational resistance of the polishing tool 42). It is moved to perform the polishing.

【0003】一方、半導体部品などは、僅かの塵埃類の
存在も許されないスーパークリーンルームにおいて製造
されており、このスーパークリーンルームに設置される
ロボットのハンドなどの可動部は、これに付着している
ゴミ類が室内に落下しないように蛇腹で覆う必要がある
と共に、この蛇腹自体の内外周面にゴミ類が付着するの
を防ぎたい場合がある。このような場合には、蛇腹を金
属箔状の極薄金属板で構成すると同時に、この極薄金属
板の表裏両面を鏡面状に研磨仕上げすると、上記したこ
とを実現できる。しかし、板厚が0.1mm程度の金属
箔状の極薄金属板を上記した方法によって研磨すると、
研磨工具42の圧着時に生ずる回転抵抗が極薄金属板に
対して大き過ぎるため、研磨中にこの極薄金属板に「シ
ワ」或いは「ヤブレ」が生じて、研磨できない。
[0003] On the other hand, semiconductor parts and the like are manufactured in a super clean room where the presence of even a small amount of dust is not allowed. A movable part such as a hand of a robot installed in the super clean room has dust attached thereto. In some cases, the bellows need to be covered with a bellows so as not to fall into the room, and there is a case where it is desired to prevent dust from adhering to the inner and outer peripheral surfaces of the bellows itself. In such a case, the above-described thing can be realized by forming the bellows with a metal foil-shaped ultrathin metal plate and polishing and polishing both the front and back surfaces of the ultrathin metal plate to mirror surfaces. However, when polishing a metal foil-like ultrathin metal plate having a plate thickness of about 0.1 mm by the above-described method,
Since the rotational resistance generated during the pressing of the polishing tool 42 is too large for the ultra-thin metal plate, "wrinkles" or "vibrations" occur in the ultra-thin metal plate during polishing, and the polishing cannot be performed.

【0004】[0004]

【発明が解決しようとする課題】本発明の課題は、研磨
台に対する金属箔状の極薄金属板の固定方法の工夫によ
って、「シワ」又は「ヤブレ」が生ずることなく、極薄
金属板の超仕上研磨を高精度で、しかも高能率で行える
ようにすることである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for fixing an ultrathin metal plate in the form of a metal foil to a polishing table without causing "wrinkles" or "blurring". An object of the present invention is to enable super finish polishing with high precision and high efficiency.

【0005】[0005]

【課題を解決するための手段】この課題を解決するため
に本発明の採用した手段は、少なくとも一方が研磨台の
長手方向にスライド可能なように、該研磨台の長手方向
の両端部に配置されて、該研磨台に載置された極薄金属
板の両端末部を着脱可能に挟着するための一対の挟着装
置と、スライド可能な側の挟着装置に引張力を作用させ
て、両端末部が前記一対の挟着装置で挟着されている極
薄金属板に張力を付与するための張力付与装置とを備え
ていて、該張力付与装置によって張力が付与された状態
で研磨台に載置されている極薄金属板を回転研磨工具に
より研磨する構成の極薄金属板の超仕上研磨装置におい
て、前記研磨台の上面に弾性板を一体に取付けて、該研
磨台の長手方向の両端部を端面に向かって低くなるよう
な傾斜面に形成し、しかも前記一対の挟着装置の各挟着
部を研磨台の上面よりも低い位置に設けることにより、
研磨台に載置されている極薄金属板の全幅に亘って回転
研磨工具の回転抵抗に勝る張力が付与されるようにし
て、該極薄金属板の両端末部を斜下方に引張って、極薄
金属板を弾性板に密着させるように構成したことであ
る。
In order to solve the above problem, a means adopted by the present invention is arranged at both ends in the longitudinal direction of the polishing table so that at least one of them can slide in the longitudinal direction of the polishing table. Then, a pair of clamping devices for detachably clamping both ends of the ultra-thin metal plate placed on the polishing table, and by applying a tensile force to the clamping device on the slidable side A tension applying device for applying tension to the ultra-thin metal plate whose both end portions are sandwiched by the pair of sandwiching devices, and polishing in a state where tension is applied by the tension applying device. In an ultra-thin metal plate super-finishing polishing apparatus configured to polish an ultra-thin metal plate placed on a table with a rotary polishing tool, an elastic plate is integrally attached to an upper surface of the polishing table, and a longitudinal direction of the polishing table is It is formed on the inclined surface as decreased toward the end surface of both end portions in a direction Moreover by providing the respective clamping portion of the pair of clamping devices at a position lower than the upper surface of the grinding stand,
Rotates over the entire width of the ultra-thin metal plate placed on the polishing table
Ensure that the tension is greater than the rotational resistance of the polishing tool.
Then, both ends of the ultra-thin metal plate are pulled obliquely downward, so that the ultra-thin metal plate is brought into close contact with the elastic plate.

【0006】[0006]

【発明の作用】上記構成により、研磨台に載置されてい
る極薄金属板の全幅に亘って回転研磨工具の回転抵抗に
勝る張力が付与されるように、該極薄金属板の両端末部
が斜下方に引張られることにより、極薄金属板の全体が
弾性板に密着する。このため、極薄金属板は、その全幅
に亘って回転研磨工具の回転抵抗に勝る張力が付与さ
れ、しかも弾性板に密着して貼り付けられた状態で、
転研磨工具により超仕上研磨されるので、「シワ」又は
「ヤブレ」が生じなくなって、高精度で、しかも高能率
な研磨ができる。
According to the above construction, the polishing table is placed on the polishing table.
Over the entire width of an ultra-thin metal plate
Both ends of the ultra-thin metal plate so as to provide higher tension
Is pulled obliquely downward, so that the entire ultrathin metal plate comes into close contact with the elastic plate. Thus, ultra-thin metal plate, the full width
Tension greater than the rotational resistance of the rotary polishing tool
In addition, since it is super-finished and polished by a rotary polishing tool in a state of being stuck to and adhered to an elastic plate , "wrinkles" or "blurring" does not occur, and highly accurate and highly efficient polishing can be performed. .

【0007】[0007]

【実施例】図1ないし図3に、本発明に係る極薄金属板
の研磨装置が示されている。この研磨装置は、ベッド1
の中央部に設置された研磨台2と、この研磨台2の長手
方向Qの両端部分にそれぞれ設置される一対の挟着装置
,Aと、スライド可能に設置された挟着装置A
に引張力を作用させて、両挟着装置A,Aでその両
端末部が挟着されている極薄金属板Wに所定の張力を付
与せしめるための張力付与装置Bとを有している。研磨
台2の長手方向Qの両端部は緩やかにわん曲して、端面
に向かって低くなるような傾斜面となっていて、その上
面には、ウレタンゴムなどから成る弾性板3が取付けら
れている。研磨台2の長手方向Qの両端部に設置された
一対の挟着装置A,Aのうち一方の装置Aは、研
磨台2の長手方向Qに沿ってスライド可能にベッド1に
設置され、他方の装置Aは、ベッド1に固定して設置
されているが、両装置A,Aの構成は同一である。
1 to 3 show an apparatus for polishing an extremely thin metal plate according to the present invention. The polishing apparatus is a bed 1
, A pair of clamping devices A 1 and A 2 respectively disposed at both ends of the polishing table 2 in the longitudinal direction Q, and a clamping device A slidably disposed. 1
And a tension applying device B for applying a predetermined tension to the ultra-thin metal plate W whose both end portions are clamped by the clamping devices A 1 and A 2 by applying a tensile force to the metal sheet W. ing. Both ends of the polishing table 2 in the longitudinal direction Q are gently bent to form an inclined surface that becomes lower toward the end surface, and an elastic plate 3 made of urethane rubber or the like is attached to the upper surface thereof. I have. One of the devices A 1 of the grinding stand longitudinal Q pair of clamping devices A 1 installed in both ends of the 2, A 2 is installed slidably on the bed 1 in the longitudinal direction Q of the grinding stand 2 The other device A 2 is fixedly installed on the bed 1, but the configurations of both devices A 1 and A 2 are the same.

【0008】図1ないし図5に詳細に示されるように、
挟着装置Aは、ベッド1に一対のガイド体4を介して
研磨台2の長手方向Qにスライド可能に設置された基板
5と、この基板5の上に配置される挟着板6とで構成さ
れる。基板5の先端部の上面には、傾斜した挟着面5a
が形成されており、挟着板6の先端部の下面には、前記
挟着面5aに対応する挟着面6aが傾斜して形成されて
いる。基板5における挟着板6の先端部であって、しか
もその両側の部分には、それぞれ支持体7が取付けられ
ている。挟着板6の先端部であって、しかもその両端の
部分が枢着ピン8を介してそれぞれ前記支持体7に枢着
されている。また、挟着板6の後端部分は、斜上方に立
上がった立上り部6bが形成され、この立上り部6bの
上端には水平部6cが後方に向かって形成され、この水
平部6cの両端部と、前記基板5との間の空間部に、そ
れぞれ圧縮スプリング9が弾装されている。よって、挟
着板6は、圧縮スプリング9の復元力により一対の枢着
ピン8を中心に回動して、その挟着面6aが基板5の挟
着面5aに対して圧着する方向に付勢されている。この
ため、挟着板6の水平部6cに力Pを作用させると、図
4で二点鎖線で示されるように、挟着板6が枢着ピン8
を中心にして時計方向に回動し、これにより基板5の挟
着面5aと、挟着板6の挟着面6aとの間に所定の隙間
が形成されて、この隙間に極薄金属板Wの端末部を挿入
し、その後に前記力Pを解除すると、圧縮スプリング9
の復元力によって、挟着板6が枢着ピン8を中心にして
反時計方向に回動するように付勢されて、基板5の挟着
面5aと、挟着板6の挟着面6aとの間で極薄金属板W
の端末部が挟着される。これらの挟着面5a,6aは、
研磨台2(或いは弾性板3)の上面よりも低い位置に設
けられている。挟着板6を回動させるための枢着ピン8
は、挟着面6aに近い部分に設けられているので、圧縮
スプリング9の復元力は拡大されて、挟着面6aの部分
に作用する。この結果、極薄金属板Wの端末部を挟着す
る力が大きくなる。挟着板6の幅は、挟着する極薄金属
板Wの幅よりも広くする必要がある。他方の挟着装置A
は、固定ピン11を介してベッド1に固定されている
点を除き、上記挟着装置Aと同一構成である。
As shown in detail in FIGS. 1 to 5,
The clamping device A 1 includes a substrate 5 slidably mounted on the bed 1 in the longitudinal direction Q of the polishing table 2 via a pair of guides 4, and a clamping plate 6 disposed on the substrate 5. It consists of. An inclined holding surface 5a is provided on the upper surface of the tip of the substrate 5.
The holding surface 6a corresponding to the holding surface 5a is formed on the lower surface of the distal end portion of the holding plate 6 at an angle. Supports 7 are attached to the front end of the sandwiching plate 6 of the substrate 5 and to both sides thereof. The distal end portion of the holding plate 6, and both end portions thereof, are pivotally attached to the support body 7 via pivot pins 8. The rear end portion of the sandwiching plate 6 is formed with a rising portion 6b that rises obliquely upward, and a horizontal portion 6c is formed rearward at the upper end of the rising portion 6b, and both ends of the horizontal portion 6c are formed. A compression spring 9 is elastically mounted in a space between the unit and the substrate 5. Therefore, the holding plate 6 is rotated around the pair of pivot pins 8 by the restoring force of the compression spring 9, and is attached in a direction in which the holding surface 6 a is pressed against the holding surface 5 a of the substrate 5. It is being rushed. For this reason, when a force P is applied to the horizontal portion 6c of the holding plate 6, as shown by a two-dot chain line in FIG.
And a predetermined gap is formed between the holding surface 5a of the substrate 5 and the holding surface 6a of the holding plate 6, and an extremely thin metal plate is formed in the gap. When the end of W is inserted and the force P is subsequently released, the compression spring 9
The restoring force causes the holding plate 6 to be urged to rotate counterclockwise about the pivot pin 8, and the holding surface 5 a of the substrate 5 and the holding surface 6 a of the holding plate 6 Between ultra-thin metal plate W
Terminal portion is pinched. These clamping surfaces 5a, 6a
It is provided at a position lower than the upper surface of the polishing table 2 (or the elastic plate 3). A pivot pin 8 for rotating the holding plate 6
Is provided in a portion close to the holding surface 6a, the restoring force of the compression spring 9 is enlarged, and acts on the portion of the holding surface 6a. As a result, the force for pinching the terminal portion of the ultrathin metal plate W increases. The width of the sandwiching plate 6 needs to be wider than the width of the ultra-thin metal plate W to be sandwiched. The other clamping device A
2, except that it is fixed to the bed 1 via the fixing pin 11, which is the clamping device A 1 and the same configuration.

【0009】次に、張力付与装置Bについて説明する。
挟着装置Aを構成している基板5の後端部の中央にブ
ロック体12が固着され、このブロック体12にねじ棒
13の先端部が固着されて、このねじ棒13は、ベッド
1の側板1aを貫通して外部に水平に突出しており、側
板1aの外側に設けられた軸受14によりねじ棒13は
支持されている。ねじ棒13のベッド1の側板1aから
突出した部分に雄ねじ部13aが設けられ、ハンドル1
5に固設された雌ねじ体16と、ねじ棒13の雄ねじ部
13aとが螺合され、この雌ねじ体16と前記軸受14
との間に圧縮スプリング17が弾装されている。このた
め、ハンドル15を所定方向に回転させて、圧縮スプリ
ング17を更に圧縮させると、スライド可能な挟着装置
に引張力が作用して、両端末部が一対の挟着装置A
,Aで挟着されている極薄金属板Wに所定の張力が
全幅にわたって加えられる。また、ハンドル15の回転
量を調整して、圧縮スプリング17の圧縮量を調整する
と、極薄金属板Wに加えられる張力の調整を行える。
Next, the tension applying device B will be described.
Clamping device is secured block body 12 is in the center of the rear end portion of the substrate 5 constituting the A 1, in the block body 12 is fixed the front end portion of the threaded rod 13, the threaded rod 13, the bed 1 And projecting horizontally to the outside through the side plate 1a, and the screw rod 13 is supported by a bearing 14 provided outside the side plate 1a. A male screw portion 13a is provided at a portion of the screw rod 13 protruding from the side plate 1a of the bed 1, and a handle 1
The female screw body 16 fixed to the screw 5 and the male screw portion 13a of the screw rod 13 are screwed together.
And a compression spring 17 is elastically mounted. Therefore, by rotating the handle 15 in a predetermined direction, further compressing the compression spring 17, the force pulling the slidable clamping device A 1 acts, both end portions a pair of clamping devices A
1, a predetermined tension to the ultra-thin metal plate W has been clamped by A 2 is applied over the entire width. When the amount of rotation of the handle 15 is adjusted to adjust the amount of compression of the compression spring 17, the tension applied to the ultrathin metal plate W can be adjusted.

【0010】研磨作業に先立って研磨台2に極薄金属板
Wをセッティングするには、図4に示されるように、挟
着板6の水平部6cに力Pを加えて、この挟着板6の挟
着面6aを基板5の挟着面5aから離し、両挟着面5
a,6aの間に形成される隙間に極薄金属板Wの端末部
を挿入し、その後に力Pを解除すると、圧縮スプリング
9の復元力により、両挟着面5a,6aの間で極薄金属
板Wの端末部が挟着される。極薄金属板Wの他方の端末
部も、全く同様にして挟着すると、その両端末部が一対
の挟着装置A,Aで挟着される。次に、ハンドル1
5を回転させて、張力付与装置Bの圧縮スプリング17
の圧縮量を増すと、スライド可能な挟着装置Aに引張
力が作用して、一対の挟着装置A.Aで挟着されて
いる極薄金属板Wの両端末部が斜め下方に引張られて、
この極薄金属板Wに所定の張力が加えられると共に、こ
の張力により極薄金属板Wが、研磨台2に取付けられた
弾性板3に密着する。極薄金属板Wに加えられる張力
は、回転研磨工具を極薄金属板Wに圧着させて研磨する
際に生ずる回転抵抗よりも大きくする必要がある。
In order to set the ultra-thin metal plate W on the polishing table 2 prior to the polishing operation, as shown in FIG. 4, a force P is applied to the horizontal portion 6c of the clamping plate 6, and 6 is separated from the clamping surface 5a of the substrate 5,
When the end of the ultra-thin metal plate W is inserted into the gap formed between the a and 6a and then the force P is released, the restoring force of the compression spring 9 causes the pole between the two clamping surfaces 5a and 6a to move. A terminal portion of the thin metal plate W is sandwiched. When the other end portion of the ultrathin metal plate W is also sandwiched in exactly the same manner, the two end portions are sandwiched by the pair of sandwiching devices A 1 and A 2 . Next, handle 1
5 to rotate the compression spring 17 of the tension applying device B.
When the amount of compression is increased, a tensile force acts on the slidable clamping device A 1 , and a pair of clamping devices A 1 . Both end portions of the ultra-thin metal plate W has been clamped by A 2 is pulled obliquely downward,
A predetermined tension is applied to the ultra-thin metal plate W, and the ultra-thin metal plate W comes into close contact with the elastic plate 3 attached to the polishing table 2 by this tension. The tension applied to the ultra-thin metal plate W needs to be larger than the rotational resistance generated when the rotary polishing tool is pressed against the ultra-thin metal plate W and polished.

【0011】張力付与装置Bによって張力が加えられて
いる極薄金属板Wを回転研磨工具18により研磨する
と、極薄金属板Wに回転研磨工具18の回転抵抗よりも
大きな張力が全幅にわたって加えられて、極薄金属板W
の全体が弾性板3に密着して貼り付けられた状態となっ
ているために、「シワ」,「ヤブレ」などが全く生じる
ことなく、極薄金属板Wを支障なく研磨できる。研磨方
向は、張力方向の場合(図6参照)と、張力と直交する
方向の場合(図7参照)とがあり、いずれの場合でも研
磨可能である。また、極薄金属板Wを両面研磨する場合
には、一面の研磨後において極薄金属板Wを反転させ
て、セッティングし直して他面を研磨すればよい。
When the ultra-thin metal plate W to which tension is applied by the tension applying device B is polished by the rotary polishing tool 18, a tension greater than the rotational resistance of the rotary polishing tool 18 is applied to the ultra-thin metal plate W over the entire width. And ultra-thin metal plate W
Is completely adhered to the elastic plate 3 so that the ultra-thin metal plate W can be polished without any trouble without any "wrinkles" or "blurring". The polishing direction includes a tension direction (see FIG. 6) and a direction perpendicular to the tension (see FIG. 7), and polishing is possible in any case. When the ultra-thin metal plate W is polished on both surfaces, the ultra-thin metal plate W may be turned over after polishing on one surface, and the other surface may be polished by resetting.

【0012】また、一対の挟着装置の双方を研磨台の長
手方向にスライド可能な構成にしてもよく、挟着装置及
び張力付与装置の構成も上記実施例のものに限定されな
い。
Further, both of the pair of clamping devices may be configured to be slidable in the longitudinal direction of the polishing table, and the configurations of the clamping device and the tension applying device are not limited to those in the above embodiment.

【0013】[0013]

【発明の効果】本発明は、研磨台の上面に弾性板を一体
に取付けて、該研磨台の長手方向の両端部を端面に向か
って低くなるような傾斜面に形成し、しかも一対の挟着
装置の各挟着部を研磨台の上面よりも低い位置に設け
て、研磨台に載置されている極薄金属板の全幅に亘って
回転研磨工具の回転抵抗よりも大きな張力が加えられた
状態にして、該極薄金属板の両端末部を斜下方に引張る
ことにより、極薄金属板を弾性板に密着させるように構
成されているので、極薄金属板は、弾性板に密着して貼
り付けられた状態で、回転研磨工具により超仕上研磨さ
れるため、「シワ」又は「ヤブレ」が生じなくなって、
高精度で、しかも高能率な研磨ができる。
According to the present invention, an elastic plate is integrally attached to the upper surface of a polishing table, and both ends in the longitudinal direction of the polishing table are formed on inclined surfaces that become lower toward the end surface. Each clamping part of the deposition device is provided at a position lower than the top of the polishing table
Over the entire width of the ultra-thin metal plate placed on the polishing table.
Tension greater than the rotational resistance of the rotary polishing tool was applied
And pull both ends of the ultra-thin metal plate obliquely downward.
Thereby, since the ultra-thin metal plate is configured to be in close contact with the elastic plate, the ultra-thin metal plate is in close contact with the elastic plate and is super-finished and polished by a rotary polishing tool. , "Wrinkles" or "blurring" no longer occurs,
Polishing with high accuracy and high efficiency is possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る極薄金属板の研磨装置の平面図で
ある。
FIG. 1 is a plan view of a polishing apparatus for an ultra-thin metal plate according to the present invention.

【図2】本発明に係る極薄金属板の研磨装置の中央断面
側面図である。
FIG. 2 is a central sectional side view of a polishing apparatus for an ultra-thin metal plate according to the present invention.

【図3】本発明に係る極薄金属板の研磨装置の正面図で
ある。
FIG. 3 is a front view of a polishing apparatus for an ultra-thin metal plate according to the present invention.

【図4】挟着装置Aの拡大断面図である。4 is an enlarged sectional view of the clamping device A 1.

【図5】挟着装置A,Aを構成している基板5と挟
着板6とを分離させた図である。
FIG. 5 is a diagram in which a substrate 5 and a holding plate 6 constituting the holding devices A 1 and A 2 are separated.

【図6】極薄金属板Wの研磨方向を示す図である。FIG. 6 is a view showing a polishing direction of the ultra-thin metal plate W.

【図7】極薄金属板Wの他の研磨方向を示す図である。FIG. 7 is a view showing another polishing direction of the ultrathin metal plate W.

【図8】通常の厚さの金属板W’を従来方法により固定
して研磨している状態の図である。
FIG. 8 is a view showing a state in which a metal plate W ′ having a normal thickness is fixed and polished by a conventional method.

【符号の説明】[Explanation of symbols]

.A:挟着装置 B:張力付与装置 Q:研磨台の長手方向 W:極薄金属板 2:研磨台 3:弾性板 5:挟着装置の基板 5a:基板の挟着面(挟着部) 6:挟着装置の挟着板 6a:挟着板の挟着面(挟着部)A 1 . A 2 : clamping device B: tension applying device Q: longitudinal direction of polishing table W: ultra-thin metal plate 2: polishing table 3: elastic plate 5: substrate of clamping device 5a: clamping surface of substrate (clamping portion) 6): clamping plate of clamping device 6a: clamping surface (clamping portion) of clamping plate

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 少なくとも一方が研磨台の長手方向にス
ライド可能なように、該研磨台の長手方向の両端部に配
置されて、該研磨台に載置された極薄金属板の両端末部
を着脱可能に挟着するための一対の挟着装置と、スライ
ド可能な側の挟着装置に引張力を作用させて、両端末部
が前記一対の挟着装置で挟着されている極薄金属板に張
力を付与するための張力付与装置とを備えていて、該張
力付与装置によって張力が付与された状態で研磨台に載
置されている極薄金属板を回転研磨工具により研磨する
構成の極薄金属板の超仕上研磨装置であって、 前記研磨台の上面に弾性板を一体に取付けて、該研磨台
の長手方向の両端部を端面に向かって低くなるような傾
斜面に形成し、しかも前記一対の挟着装置の各挟着部を
研磨台の上面よりも低い位置に設けることにより、研磨
台に載置されている極薄金属板の全幅に亘って回転研磨
工具の回転抵抗に勝る張力が付与されるようにして、該
極薄金属板の両端末部を斜下方に引張って、極薄金属板
を弾性板に密着させるように構成したことを特徴とする
極薄金属板の超仕上研磨装置。
1. Both end portions of an ultrathin metal plate placed on the polishing table so that at least one of them is slidable in the longitudinal direction of the polishing table, and is disposed at both ends in the longitudinal direction of the polishing table. A pair of clamping devices for detachably clamping the device, and a tension force applied to the clamping device on the slidable side, so that both terminal portions are clamped by the pair of clamping devices. A tension applying device for applying a tension to the metal plate, wherein the ultra-thin metal plate placed on the polishing table in a state where tension is applied by the tension applying device is polished by a rotary polishing tool. An ultra-thin metal plate super-finishing polishing apparatus, wherein an elastic plate is integrally attached to the upper surface of the polishing table, and both ends in the longitudinal direction of the polishing table are formed on inclined surfaces that become lower toward the end surface. and, moreover lower position than the upper surface of the grinding stand each clamping portion of the pair of clamping devices By providing in, polishing
Rotary polishing over the entire width of the ultra-thin metal plate placed on the table
The tension that exceeds the rotational resistance of the tool is applied so that
An ultra- thin metal plate super-finishing polishing apparatus characterized in that both ends of the ultra-thin metal plate are pulled obliquely downward so that the ultra-thin metal plate is in close contact with the elastic plate.
JP3046207A 1991-02-18 1991-02-18 Super-finish polishing machine for ultra-thin metal plates Expired - Lifetime JP2611877B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3046207A JP2611877B2 (en) 1991-02-18 1991-02-18 Super-finish polishing machine for ultra-thin metal plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3046207A JP2611877B2 (en) 1991-02-18 1991-02-18 Super-finish polishing machine for ultra-thin metal plates

Publications (2)

Publication Number Publication Date
JPH04269163A JPH04269163A (en) 1992-09-25
JP2611877B2 true JP2611877B2 (en) 1997-05-21

Family

ID=12740641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3046207A Expired - Lifetime JP2611877B2 (en) 1991-02-18 1991-02-18 Super-finish polishing machine for ultra-thin metal plates

Country Status (1)

Country Link
JP (1) JP2611877B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107378772A (en) * 2017-09-01 2017-11-24 广东利迅达机器人***股份有限公司 A kind of thermo jug earclip grinding clamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416076A (en) * 1978-07-28 1979-02-06 Aisin Seiki Co Ltd Multiple brake system of vehicle
JPS61244435A (en) * 1985-04-19 1986-10-30 Tokyo Seimitsu Sokki Kk Holding and feeding apparatus for thin band plate
JPH052281Y2 (en) * 1988-03-02 1993-01-20

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107378772A (en) * 2017-09-01 2017-11-24 广东利迅达机器人***股份有限公司 A kind of thermo jug earclip grinding clamp
CN107378772B (en) * 2017-09-01 2019-03-19 广东利迅达机器人***股份有限公司 A kind of thermo jug earclip grinding clamp

Also Published As

Publication number Publication date
JPH04269163A (en) 1992-09-25

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