JP2611424B2 - Lead detection mechanism - Google Patents
Lead detection mechanismInfo
- Publication number
- JP2611424B2 JP2611424B2 JP1090033A JP9003389A JP2611424B2 JP 2611424 B2 JP2611424 B2 JP 2611424B2 JP 1090033 A JP1090033 A JP 1090033A JP 9003389 A JP9003389 A JP 9003389A JP 2611424 B2 JP2611424 B2 JP 2611424B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- substrate
- electrodes
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 〔概要〕 挿入した部品のリードの抜け防止曲げと同時にリード
挿入の正否を検出することができるリード検出機構に関
し、 簡単な機構でリードの誤検出を防止することができる
リード検出機構を提供することを目的とし、 複数のリードを有する部品を自動挿入装置によって基
板に自動挿入した時に、対向するリードを内側に所定角
度だけ曲げ変形させると共に、リードの挿入の正否を検
出するリード検出機構であって、リード挿入時に基板の
上側でリードに接触する導電性の接触部材と、孔の配列
の間で基板の下面を保持し、保持面の両縁から幅を狭く
する方向に所定長さの勾配面を形成した受け台と、受け
台の左右に配置され、先端に勾配面に対向する面を有
し、剛性を有する絶縁材で形成され、導電性硬質材料か
ら成る複数の電極を孔の配列方向のピッチで先端を露出
させて内蔵し、他の位置から電極の他端を導出させ、勾
配面にリードを押圧する方向に駆動手段によって進退自
在に連動する一対の押圧部材とを備え、自動挿入後、左
右の押圧部材を前進させて先端でリードを勾配面に押圧
し、各電極の他端と接触部材の間に電圧を印加する構成
とする。DETAILED DESCRIPTION OF THE INVENTION [Summary] A lead detection mechanism capable of simultaneously detecting whether or not a lead has been inserted into a component to prevent the lead from being pulled out and bent and simultaneously detecting whether the lead has been inserted can be prevented from being erroneously detected by a simple mechanism. The purpose of the present invention is to provide a lead detection mechanism. When a component having a plurality of leads is automatically inserted into a board by an automatic insertion device, the opposing leads are bent inward by a predetermined angle and the correctness of lead insertion is detected. A lead detecting mechanism for holding a lower surface of a substrate between an array of holes and a conductive contact member that contacts the lead on the upper side of the substrate when inserting the lead, and narrowing the width from both edges of the holding surface. A pedestal having a sloped surface of a predetermined length formed thereon, and a surface disposed on the left and right sides of the pedestal, having a surface facing the sloped surface at the tip, formed of a rigid insulating material, and formed of a conductive hard material. A plurality of electrodes consisting of a plurality of electrodes are built in with their tips exposed at a pitch in the arrangement direction of the holes, the other ends of the electrodes are led out from other positions, and the drive means moves in a direction to press the lead on the inclined surface so as to freely move forward and backward. A pair of pressing members are provided, and after the automatic insertion, the left and right pressing members are advanced to press the lead against the inclined surface at the tip, and a voltage is applied between the other end of each electrode and the contact member.
本発明は、複数のリードを有する部品の自動挿入時に
リード挿入の正否を検出するリード検出機構に係り、特
に挿入した部品のリードの抜け防止曲げと同時にリード
挿入の正否を検出することができるリード検出機構に関
するものである。The present invention relates to a lead detection mechanism for detecting whether a lead has been inserted correctly when a component having a plurality of leads is automatically inserted, and more particularly to a lead that can detect the correctness of lead insertion simultaneously with prevention of bending of the inserted component. It relates to a detection mechanism.
近来、プリント基板にICやLSI等の電子部品を搭載す
るのに、自動挿入装置によって基板上の孔に部品のリー
ドを自動挿入しているが、挿入した時にすべてのリード
が正常に孔を貫通したか否かをセンサによって検出して
判定しているが、従来、反射型センサ或いはピン接触に
よる方法が一般的であるが、反射光による誤検出の発
生,或いは機構が複雑になるという欠点があるので、簡
単な機構で誤検出を防止する方法が望まれている。Recently, when mounting electronic components such as ICs and LSIs on a printed circuit board, the leads of the components are automatically inserted into the holes on the board by an automatic insertion device, but when inserted, all the leads normally pass through the holes The detection is performed by a sensor to determine whether the detection has been performed. Conventionally, a reflection type sensor or a pin contact method is generally used. However, there is a disadvantage that erroneous detection due to reflected light occurs or a mechanism becomes complicated. Therefore, a method for preventing erroneous detection with a simple mechanism is desired.
第4図に従来例(1)を示す。図に示すように、自動
挿入装置1の挿入位置でプリント基板(以下基板とい
う)11aの孔12a,12b,…にIC2aのリード23a,23b,…が挿
入されている。IC2aはリード23a,23b,…が両側面から出
て下方へほぼ直角に曲げられて対向し、種類により両側
で例えば20,18,16,14,8ピンを備えている。第5図に20
ピンの場合を例示している。FIG. 4 shows a conventional example (1). As shown in the figure, leads 23a, 23b,... Of the IC 2a are inserted into holes 12a, 12b,. The leads 23a, 23b,... Come out from both sides and are bent downward at substantially right angles to face each other, and have, for example, 20, 18, 16, 14, and 8 pins on both sides depending on the type. Fig. 5 shows 20
The case of a pin is illustrated.
リード23a,23b,…は孔12a,12b,…の列の対向距離より
僅か広く曲げられており、挿入時に左右からヘッド3a,3
bで押えて狭められて孔12a,12b,…に挿入される。The leads 23a, 23b,... Are bent slightly wider than the opposing distance of the row of holes 12a, 12b,.
Pressed down by b, narrowed and inserted into holes 12a, 12b,.
リード検出機構4の反射型光センサ(以下センサとい
う)S1,S2,…が基板11aの孔12a,12b,…に挿入されたリ
ード23a,23b,…が下方に突出している内側に最多リード
数に対応して配置されている。The reflection type optical sensors (hereinafter referred to as sensors) S1, S2,... Of the lead detection mechanism 4 have the largest number of leads inside, where the leads 23a, 23b,. It is arranged corresponding to.
センサS1,S2,…は、発光素子41a,41b,…及び受光素子
42a,42b,…が夫々光ファイバー43a,43b,…によって出力
部44a,44b,…の発光部45a,45b,…及び受光部46a,46b,…
に連結して構成されており、リード23a,23b,…が孔12a,
12b,…を貫通して基板11aの下側に出ているか否かを検
出する。The sensors S1, S2,... Are light-emitting elements 41a, 41b,.
The light emitting portions 45a, 45b,... And the light receiving portions 46a, 46b,... Of the output portions 44a, 44b,.
, And leads 23a, 23b,.
12b,... Are detected to be below the substrate 11a.
即ち、図において左側に示すように貫通していればO
N,右側のように足折れで貫通していなければOFFと検出
される。OFFがあると装置が停止して図示省略した表示
ランプ及びブザーによって報知され、オペレータによっ
て該当部品に識別マークが付けられる。That is, if it penetrates as shown on the left side of the figure, O
N, if it does not penetrate due to a broken foot as shown on the right, it is detected as OFF. When it is turned off, the apparatus stops and is notified by a display lamp and a buzzer (not shown), and an identification mark is attached to the corresponding part by the operator.
基板11aの左右の孔12a,12b,…の間の下面は受け台5a
に保持されている。第6図に示すように、受け台5aは、
剛性を有する材料,例えば工具鋼で形成され、上端両サ
イドに内側に所定角度で所定長さの勾配面50aが設けら
れ、勾配面50aの下端から下は垂直面51が形成されてい
る。更に受け台5a上部にはリード23a,23b,…の下端に対
向する位置まで、孔12a,12b,…の間隔でリード23a,23b,
…が通過する幅で櫛形に最多リード数だけスリット54a,
54b,…が設けられている。また受け台5aは図示省略した
移動機構によって孔12a,12b,…の列方向へスリットピッ
チの1/2だけ往復移動する。The lower surface between the left and right holes 12a, 12b,.
Is held in. As shown in FIG. 6, the cradle 5a
It is formed of a rigid material, for example, tool steel, and has a slope 50a of a predetermined length at a predetermined angle inside on both sides of the upper end, and a vertical surface 51 below the lower end of the slope 50a. Further, the leads 23a, 23b,... Are spaced at the intervals of the holes 12a, 12b,.
… The width through which… passes, the number of slits 54a,
54b, ... are provided. The cradle 5a is reciprocated by 1/2 of the slit pitch in the row direction of the holes 12a, 12b,.
また受け台5aの勾配面50aと垂直面51で形成される左
右の角部に向けて、斜め方向に受け台4aと同材料で形成
された押圧材6a,6bが配置され図示省略した駆動機構に
よって連動して前進及び後退する。Further, pressing members 6a and 6b formed of the same material as the cradle 4a are disposed obliquely toward left and right corners formed by the inclined surface 50a and the vertical surface 51 of the cradle 5a. It moves forward and backward in conjunction with.
従って、リード23a,23b,…の挿入の正否の検出は、こ
のスリット54a,54b,…を介して行われ、検出が済むと受
け台5aを移動機構によって移動させた後、第6図(b)
に示すように、押圧部材6aが前進して受け台5aにリード
23a,23b,…を押圧してリード抜け防止曲げ加工が行われ
る。これは次々に部品が挿入されるので、その振動によ
る挿入済み部品の浮き上がりを防止するものである。Therefore, whether the insertion of the leads 23a, 23b,... Is correct is detected through the slits 54a, 54b,..., And after the detection, the cradle 5a is moved by the moving mechanism. )
As shown in the figure, the pressing member 6a advances and leads to the cradle 5a.
By pressing 23a, 23b,..., The lead-out prevention bending process is performed. This is to prevent the inserted components from being lifted by the vibration since the components are inserted one after another.
曲げ加工が済むとヘッド3a,3bが上方向へ退避すると
共に、受け台5aが移動して元の位置に復帰し、曲げたリ
ード23a,23b,…がスリット54a,54b,…から抜けるので、
基板11aを移動させて次の部品挿入位置を受け台5aにセ
ットすることができる。When the bending process is completed, the heads 3a, 3b are retracted upward, and the cradle 5a moves to return to the original position, and the bent leads 23a, 23b,... Come out of the slits 54a, 54b,.
The board 11a can be moved to set the next component insertion position on the receiving table 5a.
また第7図に従来例(2)を示す。図に示すように、
自動挿入装置1aのリード検出機構4aは、基板11aの孔12
a,12b,…の下方に夫々対応して接触ピン70とスプリング
71から成るプローブ7a,7b,…が配置されて保持部材72に
保持され、プローブ7a,7b,…の下端部の両側には発光素
子73a,73b,…及び受光素子74a,74b,…から成る遮蔽型光
センサ(以下センサという)K1,K2,…が配置されてい
る。FIG. 7 shows a conventional example (2). As shown in the figure,
The lead detection mechanism 4a of the automatic insertion device 1a is
Contact pins 70 and springs corresponding to below a, 12b, ... respectively
Are arranged and held by a holding member 72. On both sides of the lower ends of the probes 7a, 7b, ..., light-emitting elements 73a, 73b, ... and light-receiving elements 74a, 74b, ... are provided. Shielded optical sensors (hereinafter referred to as sensors) K1, K2,... Are arranged.
従って孔12a,12b,…を貫通したリード23a,23b,…がプ
ローブ7a,7b,…の上端に接触してスプリング71の弾力に
抗して降下すると、下端がセンサK1,K2,…が遮蔽されて
ON,または遮蔽されなかった時は挿入不良でOFFと検出さ
れる。Therefore, when the leads 23a, 23b, ... penetrating the holes 12a, 12b, ... come into contact with the upper ends of the probes 7a, 7b, ... and descend against the elasticity of the spring 71, the lower ends shield the sensors K1, K2, .... Been
When it is not ON or is not shielded, it is detected as OFF due to poor insertion.
この場合にもリード抜け防止曲げ加工を行うことは勿
論で、リード検出を行った後、プローブ7a,7b,…を保持
している保持部材72を下方向或いは横方向へ退避させ
て、受け台5aを基板11aの下に位置させてから押圧部材6
aが前進して曲げ加工を行っている。In this case as well, lead bending prevention processing is performed, and after lead detection is performed, the holding member 72 holding the probes 7a, 7b,. 5a is positioned below the substrate 11a, and then the pressing member 6
a moves forward and bends.
上記従来方法によれば、 従来例(1)の反射型光センサによる方法は、機構は
比較的簡単であるが、リードの間隔が狭いので隣接する
リードの反射光のために検出精度が悪く誤検出を生じる
ことがある。According to the above-mentioned conventional method, the method using the reflection-type optical sensor of the conventional example (1) has a relatively simple mechanism, but the interval between the leads is narrow, and the detection accuracy is poor due to the reflected light of the adjacent leads. May cause detection.
従来例(2)のプローブによる方法では、検出精度は
比較的良好であるが、リード抜け防止曲げ加工機構,即
ち、多数のプローブを保持している保持部材の退避/復
帰機構,及び受け台のセットのための移動機構が必要で
機構が複雑になる。In the method using the probe of the conventional example (2), the detection accuracy is relatively good, but the lead-out prevention bending mechanism, that is, the retracting / returning mechanism of the holding member holding many probes, and the receiving stand A moving mechanism for setting is required, and the mechanism becomes complicated.
という問題点がある。There is a problem.
本発明は、簡単な機構でリードの誤検出を防止するこ
とができるリード検出機構を提供することを目的として
いる。An object of the present invention is to provide a lead detection mechanism that can prevent erroneous lead detection with a simple mechanism.
第1図は本発明の原理図を示す。 FIG. 1 shows a principle diagram of the present invention.
図において、2は部品、11は基板、12は孔、23はリー
ド、 3は基板11の孔12にリード23を挿入した時に基板11の
上側でリード23の各々に接触する導電性を有する接触部
材、 5は孔12の配列の内側で基板11の下面を保持し、保持
面の両縁から下方向に幅を狭くする方向に所定角度で所
定長さの勾配面50を形成した受け台、 8は導電性を有する硬質材料で形成された電極、 6は受け台5の左右に所定距離を置いて配置され、先
端に勾配面50に対向する面を有し、剛性を有する絶縁材
で形成され、複数の電極8を孔12の配列方向の間隔で先
端で露出させて内蔵し、先端以外の位置から電極8の他
端を導出させ、孔12に挿入されたリード23を勾配面50に
押圧する方向に駆動手段によって進退自在に連動する一
対の押圧部材である。In the figure, 2 is a component, 11 is a substrate, 12 is a hole, 23 is a lead, and 3 is a conductive contact that contacts each of the leads 23 above the substrate 11 when the lead 23 is inserted into the hole 12 of the substrate 11. A member 5 for holding the lower surface of the substrate 11 inside the array of the holes 12 and forming a gradient surface 50 having a predetermined length at a predetermined angle in a direction of decreasing the width downward from both edges of the holding surface; Reference numeral 8 denotes an electrode formed of a hard material having conductivity. Reference numeral 6 denotes a plate disposed at a predetermined distance on the left and right sides of the cradle 5 and having a surface opposed to the inclined surface 50 at its tip and formed of a rigid insulating material. Then, a plurality of electrodes 8 are exposed at the tips at intervals in the arrangement direction of the holes 12 and are built in. The other ends of the electrodes 8 are led out from positions other than the tips, and the leads 23 inserted into the holes 12 are It is a pair of pressing members which are linked to each other so as to be able to move forward and backward by the driving means in the pressing direction.
従って基板11上の孔12にリード23を自動挿入した時
に、左右の押圧部材6を前進させて先端でリード23を勾
配面50に押圧し、複数の電極8の各々と接触部材3の間
に電圧を印加するように構成されている。Therefore, when the lead 23 is automatically inserted into the hole 12 on the substrate 11, the left and right pressing members 6 are advanced to press the lead 23 against the inclined surface 50 at the tip, and between each of the plurality of electrodes 8 and the contact member 3. It is configured to apply a voltage.
基板11の孔12に部品2のリード23が自動挿入される
と、左右の押圧部材6が前進して、先端でリード23を受
け台5の角部に押圧してリード23を曲げると共に、電極
8の夫々の先端が各リード23に接触して、基板11の上側
で各リード23に接触している接触部材3との間に電圧を
印加して導通可否を検出することにより、リード挿入の
正否を検出することができる。When the lead 23 of the component 2 is automatically inserted into the hole 12 of the substrate 11, the left and right pressing members 6 advance, press the lead 23 at the tip against the corner of the receiving base 5 to bend the lead 23, and 8 is in contact with each lead 23, and a voltage is applied between the contact member 3 in contact with each lead 23 on the upper side of the substrate 11 to detect whether or not conduction is present. Correctness can be detected.
このようにして、押圧部材6の押圧によりリード23を
曲げた時に、強い圧力でリード23と電極8の先端が接触
するので、簡単な機構でリード挿入正否の確実な検出が
できる。In this manner, when the lead 23 is bent by the pressing of the pressing member 6, the lead 23 and the tip of the electrode 8 come into contact with a strong pressure, so that the correct insertion of the lead can be reliably detected by a simple mechanism.
第2図及び第3図により本発明の一実施例を説明す
る。全図を通じ同一符号は同一対象物を示す。また第2
図で第1図に対応するものは1点鎖線で囲んで示してい
る。An embodiment of the present invention will be described with reference to FIGS. The same reference numerals indicate the same objects throughout the drawings. Also the second
In the figure, those corresponding to FIG. 1 are surrounded by dashed lines.
第2図は自動挿入装置1bのリード検出機構4bを示し、
図において、押圧部材6c,6dは、従来例で説明した押圧
部材6a,6bと外形はほぼ同じであるが、剛性を有する絶
縁材,例えばセラミックスで形成され、先端部に電極8
a,8b,…の先端を基板11aの孔12a,12b,…に対応する間隔
で露出させて内蔵し、中間位置から電極8a,8b,…の後端
が導き出されている。電極8a,8b,…は導電性を有する材
料,例えば超硬金属材で形成されている。第3図(a)
に押圧部材6c,6dの斜視図を示している。FIG. 2 shows a lead detection mechanism 4b of the automatic insertion device 1b,
In the drawing, the pressing members 6c and 6d have substantially the same outer shape as the pressing members 6a and 6b described in the conventional example, but are formed of a rigid insulating material, for example, ceramics, and the electrode 8
, are exposed at intervals corresponding to the holes 12a, 12b,... of the substrate 11a, and are built in. The rear ends of the electrodes 8a, 8b,. The electrodes 8a, 8b,... Are formed of a conductive material, for example, a hard metal material. Fig. 3 (a)
5 shows a perspective view of the pressing members 6c and 6d.
また電極8a,8b,…は制御部9に接続され、電極ヘッド
3a,3bはアースされて、電極8a,8b,…とヘッド3a,3bの間
に電圧が印加されている。制御部9は電極8a,8b,…とヘ
ッド3a,3bの間のリード23a,23b,…に電流が流れたか否
かを検出して、リード挿入の正否を判定する機能を備え
ている。The electrodes 8a, 8b,...
3a, 3b are grounded, and a voltage is applied between the electrodes 8a, 8b,... And the heads 3a, 3b. The controller 9 has a function of detecting whether or not a current has flowed through the leads 23a, 23b,... Between the electrodes 8a, 8b,.
このような構成を有するので、基板11aの孔12a,12b,
…に部品2aのリード23a,23b,…が自動挿入されると、第
3図(b)に示すように、左右の押圧部材6c,6dが連動
して前進し、先端でリード23a,23b,…を受け台5aの勾配
面50a及び垂直面51が形成する角部に押圧してリード23
a,23b,…を曲げると共に、電極8a,8b,…の夫々の先端が
各リード23a,23b,…に接触して、すでに基板11aの上側
で各リード23a,23b,…に接触しているヘッド3a,3bとの
間に電流が流れて、制御部9によって検出され、挿入が
正常と判定される。またリード23a,23b,…のいずれかに
挿入不良があれば、電極8a,8b,…の該当する位置の電極
がリードに接触しないので電流が流れず挿入不良と判定
する。With such a configuration, the holes 12a, 12b,
When the leads 23a, 23b,... Of the component 2a are automatically inserted into the..., The right and left pressing members 6c, 6d move forward in conjunction with each other as shown in FIG. .. Are pressed against the corners formed by the inclined surface 50a and the vertical surface 51 of the receiving table 5a,
a, 23b,... are bent, and the respective tips of the electrodes 8a, 8b,... come into contact with the leads 23a, 23b, and so on, and are already in contact with the leads 23a, 23b,. A current flows between the heads 3a and 3b and is detected by the control unit 9, and it is determined that the insertion is normal. If any of the leads 23a, 23b,... Has an improper insertion, the electrode at the corresponding position of the electrodes 8a, 8b,.
リード曲げ及び検出が済むと左右の押圧部材6c,6dは
後退して元の位置に復帰する。When the lead bending and the detection are completed, the left and right pressing members 6c and 6d retreat and return to the original positions.
このようにして押圧部材6a,6bのリード23a,23b,…を
押圧する圧力で電極8a,8b,…がリード23a,23b,…に接触
するので、高い精度で検出することができる。In this manner, the electrodes 8a, 8b,... Contact the leads 23a, 23b,... With the pressure pressing the leads 23a, 23b,.
以上説明したように本発明によれば、押圧部材による
挿入部品のリードの抜け防止曲げ時に、先端に露出して
内蔵された導電材がリードに強い圧力で接触するので、
簡単な機構でしかも高い検出精度が得られるという効果
がある。As described above, according to the present invention, at the time of bending of the lead of the inserted part by the pressing member, the conductive material exposed at the tip and built in comes into contact with the lead with strong pressure,
There is an effect that high detection accuracy can be obtained with a simple mechanism.
第1図は本発明の原理図、 第2図は本発明の実施例を示す構成図、 第3図は実施例の説明図、 第4図は従来例(1)を示す構成図、 第5図は複数リード部品を例示する説明図、 第6図は従来例(1)の説明図、 第7図は従来例(2)を示す構成図である。 図において、 2は部品、2aはIC、 3は接触部材、3a,3bはヘッド、 5,5aは受け台、6,6a〜6dは押圧部材、 8,8a,8bは電極、11,11aは基板、 12,12a,12bは孔、23,23a,23bはリード、 50,50aは勾配面である。 FIG. 1 is a diagram showing the principle of the present invention, FIG. 2 is a block diagram showing an embodiment of the present invention, FIG. 3 is an explanatory diagram of the embodiment, FIG. 4 is a block diagram showing a conventional example (1), FIG. FIG. 6 is an explanatory diagram illustrating a plurality of lead components, FIG. 6 is an explanatory diagram of a conventional example (1), and FIG. 7 is a configuration diagram illustrating a conventional example (2). In the figure, 2 is a component, 2a is an IC, 3 is a contact member, 3a and 3b are heads, 5,5a is a pedestal, 6,6a to 6d are pressing members, 8,8a, 8b are electrodes, 11,11a are Substrates, 12, 12a and 12b are holes, 23, 23a and 23b are leads, and 50 and 50a are inclined surfaces.
Claims (1)
ド(23)を有する部品(2)の該リード(23)を自動挿
入装置によって基板(11)上の所定位置の孔(12)に自
動挿入した時に、対向するリード(23)を内側に所定角
度だけ夫々曲げ変形させると共に、該リード(23)の挿
入の正否を検出するリード検出機構であって、 前記基板(11)の孔(12)に前記リード(23)を挿入し
た時に該基板(11)の上側で該リード(23)の各々に接
触する導電性を有する接触部材(3)と、 該孔(12)の配列の内側で該基板(11)の下面を保持
し、保持面の両縁から下方向に幅を狭くする方向に所定
角度で所定長さの勾配面(50)を形成した受け台(5)
と、 該受け台(5)の左右に所定距離を置いて配置され、先
端に該勾配面(50)に対向する面を有し、剛性を有する
絶縁材で形成され、該リード(23)が挿入される孔(1
2)の配列方向の間隔で導電性を有する硬質材料で形成
された複数の電極(8)を先端で露出させて内蔵し、該
先端以外の位置から該電極(8)の他端を導出させ、該
勾配面(50)の方向に駆動手段によって進退自在に連動
する一対の押圧部材(6)とを備え、 該基板(11)上の孔(12)に該リード(23)を自動挿入
した時に、該左右の押圧部材(6)を前進させて該先端
で該リード(23)を該勾配面(50)に押圧し、該複数の
電極(8)の各々の他端と該接触部材(3)の間に電圧
を印加することを特徴とするリード検出機構。1. A component (2) having at least a pair of leads (23) arranged on opposing side faces, wherein said leads (23) are automatically inserted into holes (12) at predetermined positions on a substrate (11) by an automatic insertion device. A lead detecting mechanism for bending the opposing leads (23) inward by a predetermined angle, and detecting whether the leads (23) are inserted correctly or not, wherein the holes (12) of the substrate (11) A conductive contact member (3) that contacts each of the leads (23) above the substrate (11) when the leads (23) are inserted into the substrate (11); A pedestal (5) holding the lower surface of the substrate (11) and forming a gradient surface (50) having a predetermined length at a predetermined angle in a direction of decreasing the width downward from both edges of the holding surface.
The lead (23) is disposed at a predetermined distance on the left and right sides of the cradle (5), has a surface facing the inclined surface (50) at the tip, is formed of a rigid insulating material, and the lead (23) is Hole to be inserted (1
A plurality of electrodes (8) formed of a conductive hard material are exposed at the tips at the intervals in the arrangement direction of (2) and built in, and the other ends of the electrodes (8) are led out from positions other than the tips. A pair of pressing members (6) which are movable in the direction of the inclined surface (50) by a driving means so as to be able to move forward and backward, and the lead (23) is automatically inserted into the hole (12) on the substrate (11). At this time, the left and right pressing members (6) are advanced to press the lead (23) against the inclined surface (50) at the tip, and the other end of each of the plurality of electrodes (8) and the contact member ( 3) A lead detection mechanism wherein a voltage is applied during the period.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1090033A JP2611424B2 (en) | 1989-04-10 | 1989-04-10 | Lead detection mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1090033A JP2611424B2 (en) | 1989-04-10 | 1989-04-10 | Lead detection mechanism |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02268499A JPH02268499A (en) | 1990-11-02 |
JP2611424B2 true JP2611424B2 (en) | 1997-05-21 |
Family
ID=13987353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1090033A Expired - Fee Related JP2611424B2 (en) | 1989-04-10 | 1989-04-10 | Lead detection mechanism |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2611424B2 (en) |
-
1989
- 1989-04-10 JP JP1090033A patent/JP2611424B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH02268499A (en) | 1990-11-02 |
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