JP2564734Y2 - Dielectric resonator - Google Patents
Dielectric resonatorInfo
- Publication number
- JP2564734Y2 JP2564734Y2 JP1991039390U JP3939091U JP2564734Y2 JP 2564734 Y2 JP2564734 Y2 JP 2564734Y2 JP 1991039390 U JP1991039390 U JP 1991039390U JP 3939091 U JP3939091 U JP 3939091U JP 2564734 Y2 JP2564734 Y2 JP 2564734Y2
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- substrate
- coupling
- resonator
- dielectric resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Non-Reversible Transmitting Devices (AREA)
Description
【考案の詳細な説明】[Detailed description of the invention]
【０００１】[0001]
【産業上の利用分野】この考案はフィルタなどに用いら
れる誘電体同軸共振器を用いた誘電体共振装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric resonator using a dielectric coaxial resonator used for a filter or the like.
【０００２】[0002]
【従来の技術】たとえば多段の誘電体フィルタは、複数
の誘電体同軸共振器と、これらの共振器の内導体間を結
合させる結合用基板およびこれらを収納するケースなど
から構成されている。2. Description of the Related Art For example, a multi-stage dielectric filter is composed of a plurality of dielectric coaxial resonators, a coupling substrate for coupling the inner conductors of these resonators, and a case for accommodating them.
【０００３】図５に従来の誘電体フィルタの主要部の構
造を斜視図として示す。同図において１〜４はそれぞれ
誘電体同軸共振器、５〜８は誘電体同軸共振器１〜４の
それぞれ中心孔に挿入されて内導体と導通をとる結合端
子である。また９はその上面に４つの電極１０〜１３が
形成された結合基板、更に１４，１５は結合基板９の裏
面に形成されている電極（不図示）に接続される入出力
端子である。結合端子５〜８はそれぞれ下方に押さえら
れた状態で、またはくせづけされた後、結合基板側の電
極１０〜１３に対しそれぞれ半田付けされる。この構成
によって各誘電体同軸共振器の内導体間が結合基板９の
電極間に形成されている静電容量により結合して、全体
として帯域通過型フィルタが構成される。FIG. 5 is a perspective view showing the structure of a main part of a conventional dielectric filter. In the figure, reference numerals 1 to 4 denote dielectric coaxial resonators, and reference numerals 5 to 8 denote coupling terminals which are inserted into respective central holes of the dielectric coaxial resonators 1 to 4 and conduct with the inner conductor. Reference numeral 9 denotes a coupling substrate having four electrodes 10 to 13 formed on the upper surface thereof, and reference numerals 14 and 15 denote input / output terminals connected to electrodes (not shown) formed on the rear surface of the coupling substrate 9. The coupling terminals 5 to 8 are soldered to the electrodes 10 to 13 on the coupling substrate side, respectively, in a state where the coupling terminals 5 to 8 are pressed downward or after the connection terminals 5 to 8 are formed. With this configuration, the inner conductors of the respective dielectric coaxial resonators are coupled by the capacitance formed between the electrodes of the coupling substrate 9 to form a band-pass filter as a whole.
【０００４】[0004]
【考案が解決しようとする課題】ところが、このように
結合端子を用いて誘電体同軸共振器の内導体を基板上の
電極に接続するようにした従来の誘電体共振装置におい
ては、その誘電体フィルタを電子機器に組み込む際、回
路基板上にリフロー半田法により実装するような場合、
誘電体フィルタ全体が加熱されるため、結合端子５〜８
と結合基板上の電極１０〜１３との接続半田が再溶融す
ることがある。その場合、結合端子５〜８がその弾性に
よって基板９の表面から跳ね上がり、結合端子先端部が
結合基板上の電極から離れてオープン状態となるおそれ
があった。また、結合基板９、誘電体同軸共振器１〜
４、結合端子５〜８、入出力端子１４，１５及びケース
との間で相互にズレが生じた場合にはフィルタとしての
電気的特性が変化したり特性が不安定となるおそれがあ
った。However, in such a conventional dielectric resonator in which the inner conductor of the dielectric coaxial resonator is connected to the electrode on the substrate by using the coupling terminal, the dielectric is When incorporating filters into electronic devices, when mounting them on circuit boards by the reflow soldering method,
Since the entire dielectric filter is heated, coupling terminals 5 to 8 are connected.
And the connection solder between the electrodes 10 and 13 on the coupling board may be re-melted. In this case, the coupling terminals 5 to 8 may jump from the surface of the substrate 9 due to its elasticity, and the leading end of the coupling terminal may be separated from the electrode on the coupling substrate to be in an open state. Further, the coupling substrate 9, the dielectric coaxial resonators 1 to
4. If the coupling terminals 5 to 8, the input / output terminals 14, 15 and the case are mutually displaced, the electric characteristics of the filter may be changed or the characteristics may be unstable.
【０００５】この考案の目的は、電子機器内に組み込む
際に加えられる熱によって各部の半田付け部が再溶融し
た場合でも、結合端子の跳ね上がりや各部間の相互ずれ
が防止される信頼性の高い誘電体共振装置を提供するこ
とにある。An object of the present invention is to provide a highly reliable method that prevents the jumping of the connecting terminals and the mutual displacement between the parts even when the soldered parts of the respective parts are re-melted by the heat applied when the parts are incorporated into the electronic equipment. An object of the present invention is to provide a dielectric resonator.
【０００６】[0006]
【課題を解決するための手段】この考案の請求項１に係
る誘電体共振装置は、複数の誘電体同軸共振器を用いた
誘電体共振装置であって、各誘電体同軸共振器を互いに
所定箇所で半田付けするとともに、各誘電体同軸共振器
をケースの内面に、前記半田の溶融温度以下の温度で可
塑性を示さない樹脂により接着固定したことを特徴とす
る。A dielectric resonator according to a first aspect of the present invention is a dielectric resonator using a plurality of dielectric coaxial resonators, wherein each dielectric coaxial resonator is fixed to one another. Solder in place, and make each dielectric coaxial resonator
On the inner surface of the case at a temperature below the melting temperature of the solder.
It is characterized by being fixedly adhered with a resin that does not exhibit plasticity .
【０００７】また、請求項２に係る誘電体共振装置は、
誘電体同軸共振器の内導体を結合端子を介して基板上の
電極に接続してなる誘電体共振装置であって、結合端子
の先端部を基板上の電極に半田付けするとともに、前記
結合端子の根元部を前記半田の溶融温度以下の温度で可
塑性を示さない樹脂により前記基板に接着固定したこと
を特徴とする。The dielectric resonator according to claim 2 is
What is claimed is: 1. A dielectric resonator device comprising an inner conductor of a dielectric coaxial resonator connected to an electrode on a substrate via a coupling terminal, wherein a tip of the coupling terminal is soldered to an electrode on the substrate, and At the temperature below the melting temperature of the solder.
It is characterized in that it is bonded and fixed to the substrate with a resin that does not show plasticity .
【０００８】[0008]
【作用】この考案の請求項１に係る誘電体共振装置で
は、各誘電体同軸共振器が互いに所定箇所で半田付けさ
れているとともに、各誘電体同軸共振器がケースの内面
に、前記半田の溶融温度以下の温度で可塑性を示さない
樹脂により接着固定されている。そのため、誘電体共振
装置全体の加熱によって各半田部が再溶融したとして
も、各誘電体同軸共振器は樹脂によりケースの内面に接
着固定されたままとなり、その後の冷却により接続部の
半田は再硬化する。そのため、装置全体が加熱されても
各部間に相互ずれが生じることもなく、所期の電気的特
性が維持される。In the dielectric resonator device according to the first aspect of the present invention, the dielectric coaxial resonators are soldered to each other at predetermined positions, and each dielectric coaxial resonator is connected to the inner surface of the case.
In addition, it is bonded and fixed with a resin that does not exhibit plasticity at a temperature equal to or lower than the melting temperature of the solder . Therefore, even if each solder portion is re-melted due to heating of the entire dielectric resonator device, each dielectric coaxial resonator remains fixed to the inner surface of the case by the resin, and is connected by cooling thereafter. The solder in the part is re-hardened. Therefore, even if the entire apparatus is heated, there is no mutual displacement between the parts, and the desired electrical characteristics are maintained.
【０００９】また、請求項２に係る誘電体共振装置で
は、結合端子の先端部が基板上の電極に半田付けされ、
結合端子の根元部が前記半田の溶融温度以下の温度で可
塑性を示さない樹脂により基板に対し接着固定されてい
る。そのため、誘電体共振装置全体の加熱によって結合
端子先端部と基板上の電極間の半田が再溶融したとして
も、結合端子は基板に対し樹脂により接着固定されたま
まとなり、その後の冷却により接続部の半田は再硬化す
る。したがって結合端子が基板表面から跳ね上がるオー
プン不良が発生することもない。Further, in the dielectric resonator according to the second aspect, the tip of the coupling terminal is soldered to an electrode on the substrate,
It is possible that the root of the coupling terminal is at a temperature below the melting temperature of the solder.
It is bonded and fixed to the substrate with a resin that does not show plasticity . Therefore, even if the solder between the tip of the coupling terminal and the electrode on the substrate is re-melted due to the heating of the entire dielectric resonator, the coupling terminal remains adhered and fixed to the substrate with the resin, and then the connection portion is cooled by cooling. Is re-hardened. Therefore, an open defect in which the coupling terminal jumps from the substrate surface does not occur.
【００１０】[0010]
【実施例】この考案の第１の実施例に係る誘電体共振装
置の構造を図１および図２に示す。図１は全体の斜視
図、図２は側面図である。1 and 2 show the structure of a dielectric resonator according to a first embodiment of the present invention. 1 is an overall perspective view, and FIG. 2 is a side view.
【００１１】図１において１〜４はそれぞれ誘電体同軸
共振器、５〜８は誘電体同軸共振器１〜４の中心孔に挿
入されて内導体と導通する結合端子である。また９はそ
の表面に４つの電極１０〜１３を形成した結合基板、１
４，１５は結合基板９の裏面に形成されている電極（不
図示）に接続した入出力端子である。結合端子５〜８の
先端部は結合基板９上の電極１０〜１３に対しそれぞれ
半田１６〜１９により半田付けしている。また結合端子
５〜８の根元部は結合基板９に対し樹脂２０〜２３によ
り接着固定している。図２において２５は下部ケースの
底面であり、このケース底面に対し誘電体同軸共振器を
固定し、結合基板９をスペーサ２４を介してケース底面
２５に固定している。尚、図２では入出力端子を省略し
ている。In FIG. 1, reference numerals 1 to 4 denote dielectric coaxial resonators, and reference numerals 5 to 8 denote coupling terminals which are inserted into the center holes of the dielectric coaxial resonators 1 to 4 and are electrically connected to the inner conductor. Reference numeral 9 denotes a coupling substrate having four electrodes 10 to 13 formed on the surface thereof;
Reference numerals 4 and 15 denote input / output terminals connected to electrodes (not shown) formed on the back surface of the coupling substrate 9. The tips of the coupling terminals 5 to 8 are soldered to the electrodes 10 to 13 on the coupling substrate 9 by solders 16 to 19, respectively. The roots of the coupling terminals 5 to 8 are bonded and fixed to the coupling substrate 9 with resins 20 to 23. In FIG. 2, reference numeral 25 denotes a bottom surface of the lower case. The dielectric coaxial resonator is fixed to the bottom surface of the lower case, and the coupling substrate 9 is fixed to the case bottom surface 25 via the spacer 24. In FIG. 2, input / output terminals are omitted.
【００１２】前記樹脂２０〜２３としてはＵＶ硬化樹脂
や耐熱エポキシ樹脂などを用いることができる。また結
合端子５〜８の半田付け後にこれらの樹脂を用いて端子
５〜８を固定するが、逆に樹脂により接着固定の後、半
田付けしてもよい。As the resins 20 to 23, UV curable resins, heat-resistant epoxy resins and the like can be used. The terminals 5 to 8 are fixed using these resins after the soldering of the coupling terminals 5 to 8. Alternatively, the terminals 5 to 8 may be soldered after being bonded and fixed with the resin.
【００１３】以上のように構成したため、装置全体が加
熱されて半田１６〜１９が再溶融したとしても、結合端
子５〜８は結合基板９の表面から跳ね上がることがな
く、その後の冷却により半田１６〜１９が再硬化して元
の状態に戻る。With the above construction, even if the entire device is heated and the solders 16 to 19 are re-melted, the connection terminals 5 to 8 do not jump from the surface of the connection substrate 9 and are cooled by the subsequent cooling. 19 are re-hardened and return to the original state.
【００１４】次に、第２の実施例に係る誘電体共振装置
の斜視図を図３に、また側面図を図４にそれぞれ示す。
図１および図２に示した第１の実施例と異なる点は、樹
脂２０〜２３によって結合端子５〜８の根元部と結合基
板９及び誘電体同軸共振器１〜４をケース底面に対し接
着固定したことである。図４に示すように結合端子８に
ついては、樹脂２３によって結合端子８の根元部と結合
基板９の端部、スペーサ２４および誘電体同軸共振器４
がケース２５に固定している。なお誘電体同軸共振器１
〜４の側面間も同様に樹脂により接着固定して一体化し
ている。FIG. 3 is a perspective view of a dielectric resonator according to a second embodiment, and FIG. 4 is a side view of the dielectric resonator.
The difference from the first embodiment shown in FIGS. 1 and 2 is that the bases of the coupling terminals 5 to 8, the coupling substrate 9 and the dielectric coaxial resonators 1 to 4 are adhered to the bottom of the case by the resins 20 to 23. It is fixed. As shown in FIG. 4, the coupling terminal 8 is formed by a resin 23 with the base of the coupling terminal 8 and the end of the coupling substrate 9, the spacer 24 and the dielectric coaxial resonator 4.
Are fixed to the case 25. The dielectric coaxial resonator 1
Similarly, the side surfaces of No. to No. 4 are integrally bonded and fixed with resin.
【００１５】このように結合端子を結合基板に接着固定
するだけでなく、結合基板と誘電体同軸共振器、さらに
はケースとの間でも接着固定したことにより、装置全体
が加熱されて各半田付け部が再溶融したとしても、各部
間にズレが生じることがなく、フィルタとしての電気的
特性は安定に保たれる。As described above, not only the bonding terminal is bonded and fixed to the bonding substrate, but also the bonding terminal is bonded and fixed to the dielectric coaxial resonator and further to the case. Even if the parts are re-melted, no deviation occurs between the parts, and the electrical characteristics of the filter are kept stable.
【００１６】なお、第１・第２の実施例では帯域通過フ
ィルタを例としたが、同様にして帯域阻止フィルタにつ
いても適用することができる。In the first and second embodiments, a band-pass filter is used as an example. However, the present invention can be similarly applied to a band-elimination filter.
【００１７】[0017]
【考案の効果】この考案の請求項１記載の誘電体共振装
置によれば、各誘電体同軸共振器が互いに所定箇所で半
田付けされているとともに、各誘電体同軸共振器がケー
スの内面に、前記半田の溶融温度以下の温度で可塑性を
示さない樹脂により梓着固定されているため、誘電体共
振装置全体の加熱によって各半田部が再溶融したとして
も、各誘電体同軸共振器は樹脂によりケースの内面に接
着固定されたままとなり、その後の冷却により接続部の
半田は再硬化する。そのため、装置全体が加熱されても
各部間に相互ずれが生じることもなく、電気的特性も安
定し、耐衝撃性などの機械的強度も向上する。According to the dielectric resonator device of the first aspect of the present invention, the dielectric coaxial resonators are soldered to each other at predetermined positions, and each of the dielectric coaxial resonators is connected to the cable.
On the inner surface of the solder at a temperature below the melting temperature of the solder
Each dielectric coaxial resonator is fixed to the inner surface of the case with resin even if each solder part is re-melted due to heating of the entire dielectric resonator device because it is fixed by resin not shown. The solder at the connection portion is re-hardened by the subsequent cooling. Therefore, even if the entire apparatus is heated, there is no mutual displacement between the parts, the electrical characteristics are stable, and the mechanical strength such as impact resistance is improved.
【００１８】また、請求項２記載の誘電体共振装置で
は、結合端子の先端部が基板上の電極に半田付けされ、
結合端子の根元部が前記半田の溶融温度以下の温度で可
塑性を示さない樹脂により基板に対し接着固定されてい
るため、誘電体共振装置全体の加熱によって結合端子先
端部と基板上の電極間の半田が再溶融したとしても、結
合端子は基板に対し樹脂により接着固定されたままとな
り、その後の冷却により接続部の半田は再硬化する。し
たがって結合端子が基板表面から跳ね上がるオープン不
良が発生することもない。In the dielectric resonator according to the second aspect, the tip of the coupling terminal is soldered to an electrode on the substrate,
It is possible that the root of the coupling terminal is at a temperature below the melting temperature of the solder.
Since the resin that does not show plasticity is adhered and fixed to the board, even if the solder between the tip of the connection terminal and the electrode on the board is re-melted due to the heating of the entire dielectric resonator, the connection terminal is attached to the board by the resin. As a result, the solder at the connection portion is re-hardened by the subsequent cooling. Therefore, an open defect in which the coupling terminal jumps from the substrate surface does not occur.
【図１】第１の実施例に係る誘電体共振装置の主要部の
斜視図である。FIG. 1 is a perspective view of a main part of a dielectric resonator device according to a first embodiment.
【図２】第１の実施例に係る誘電体共振装置の部分側面
図である。FIG. 2 is a partial side view of the dielectric resonator device according to the first embodiment.
【図３】第２の実施例に係る誘電体共振装置の主要部の
斜視図である。FIG. 3 is a perspective view of a main part of a dielectric resonator device according to a second embodiment.
【図４】第２の実施例に係る誘電体共振装置の部分側面
図である。FIG. 4 is a partial side view of a dielectric resonator according to a second embodiment.
【図５】従来の誘電体共振装置の主要部の斜視図であ
る。FIG. 5 is a perspective view of a main part of a conventional dielectric resonator.
１〜４−誘電体同軸共振器 ５〜８−結合端子 ９−結合基板 １０〜１３−電極 １４，１５−入出力端子 １６〜１９−半田 ２０〜２３−樹脂 ２４−スペーサ ２５−下部ケース 1-4 dielectric coaxial resonator 5-8 coupling terminal 9 coupling substrate 10-13 electrode 14, 15-input / output terminal 16-19 solder 20-23 resin 24 spacer 25 lower case
Claims (2)
振装置において、 各誘電体同軸共振器を互いに所定箇所で半田付けすると
ともに、各誘電体同軸共振器をケースの内面に、前記半
田の溶融温度以下の温度で可塑性を示さない樹脂により
接着固定したことを特徴とする誘電体共振装置。1. A dielectric resonator using a plurality of dielectric coaxial resonators, wherein each of the dielectric coaxial resonators is soldered to each other at a predetermined position, and each of the dielectric coaxial resonators is mounted on an inner surface of a case. Half
A dielectric resonator device, which is bonded and fixed with a resin that does not exhibit plasticity at a temperature equal to or lower than the melting temperature of a field .
して基板上の電極に接続してなる誘電体共振装置におい
て、 結合端子の先端部を基板上の電極に半田付けするととも
に、前記結合端子の根元部を前記半田の溶融温度以下の
温度で可塑性を示さない樹脂により前記基板に接着固定
したことを特徴とする誘電体共振装置。2. A dielectric resonator comprising an inner conductor of a dielectric coaxial resonator connected to an electrode on a substrate via a coupling terminal, wherein a tip of the coupling terminal is soldered to an electrode on the substrate. The root of the coupling terminal is not higher than the melting temperature of the solder.
1. A dielectric resonator device, wherein the substrate is bonded and fixed to the substrate with a resin that does not exhibit plasticity at a temperature .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991039390U JP2564734Y2 (en) | 1991-05-29 | 1991-05-29 | Dielectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991039390U JP2564734Y2 (en) | 1991-05-29 | 1991-05-29 | Dielectric resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04132704U JPH04132704U (en) | 1992-12-09 |
| JP2564734Y2 true JP2564734Y2 (en) | 1998-03-09 |
Family
ID=31920675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991039390U Expired - Lifetime JP2564734Y2 (en) | 1991-05-29 | 1991-05-29 | Dielectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2564734Y2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61202902U (en) * | 1985-06-05 | 1986-12-20 | ||
| JPS622596A (en) * | 1985-06-27 | 1987-01-08 | 株式会社デンソー | Coating of electronic component with resin for reinforcing solder |
| JPS62141802A (en) * | 1985-12-16 | 1987-06-25 | Murata Mfg Co Ltd | Fixing structure for dielectric coaxial resonator |
| JPS63155666U (en) * | 1987-03-31 | 1988-10-12 |
-
1991
- 1991-05-29 JP JP1991039390U patent/JP2564734Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04132704U (en) | 1992-12-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |