JPH0730360A - Piezoelectric vibration device - Google Patents
Piezoelectric vibration deviceInfo
- Publication number
- JPH0730360A JPH0730360A JP19166893A JP19166893A JPH0730360A JP H0730360 A JPH0730360 A JP H0730360A JP 19166893 A JP19166893 A JP 19166893A JP 19166893 A JP19166893 A JP 19166893A JP H0730360 A JPH0730360 A JP H0730360A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pedestal
- lead wire
- hole
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリード線を備えた圧電体
を表面実装可能な形状とした圧電振動装置に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrating device having a surface mountable piezoelectric body having lead wires.
【０００２】[0002]
【従来の技術】電子回路基板の高密度実装化が進み、そ
こに使用される抵抗、コンデンサ等の電子部品はリード
線のない表面実装型（以下ＳＭＤと呼ぶ）の部品が増え
て来ている。ＳＭＤ化は水晶振動子、水晶発振器、水晶
フィルタ、圧電セラミック等の圧電振動装置にも波及
し、種々のＳＭＤ振動子が開発されている。2. Description of the Related Art As electronic circuit boards are increasingly mounted at high density, surface mounted type (hereinafter referred to as SMD) parts without lead wires are increasing in electronic parts such as resistors and capacitors used therein. . The SMD process has spread to piezoelectric vibrators such as crystal oscillators, crystal oscillators, crystal filters, and piezoelectric ceramics, and various SMD oscillators have been developed.
【０００３】以下に従来のＳＭＤ振動子の例を用いて説
明する。実開平１−１１５３２３号公報によれば、水晶
振動子１１のリード線１２は台１３の穴部１４と端子板
１６の穴１７を貫通して凹部１５に引き出されている。
リード線１２と端子板１６との電気的な接続は導電性接
着剤等の固着部材２１を用い凹部でなされている。表面
実装時の熱による接続部分の劣化防止のため凹部にエポ
キシ樹脂等の絶縁物２２を充填した構成を有している。An example of a conventional SMD oscillator will be described below. According to Japanese Utility Model Laid-Open No. 1-115323, the lead wire 12 of the crystal unit 11 penetrates the hole 14 of the base 13 and the hole 17 of the terminal plate 16 and is drawn out to the recess 15.
The electrical connection between the lead wire 12 and the terminal board 16 is made in a recess using a fixing member 21 such as a conductive adhesive. In order to prevent deterioration of the connection portion due to heat during surface mounting, the recess is filled with an insulator 22 such as epoxy resin.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、実開平
１−１１５３２３号公報のＳＭＤ振動子の構成ではリー
ド線１２と端子板１６とを接続するという単なる１工程
が導電性接着剤を塗布する工程、これを硬化せしめる工
程、凹部に絶縁物を充填する工程、これを硬化せしめる
工程と、少なくとも４つの工程になってしまい製造効率
が悪くコストアップとなる欠点があった。However, in the configuration of the SMD oscillator disclosed in Japanese Utility Model Laid-Open No. 1-115323, only one step of connecting the lead wire 12 and the terminal plate 16 is a step of applying a conductive adhesive, At least four steps are required: a step of hardening this, a step of filling the concave portion with an insulator, and a step of hardening the same, resulting in poor manufacturing efficiency and cost increase.
【０００５】本発明の目的は上記課題を解決しようとす
るもので、従来のＳＭＤ振動子より非常に製造効率が良
いＳＭＤ振動子を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide an SMD oscillator having a manufacturing efficiency much higher than that of a conventional SMD oscillator.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
の本発明の要旨は引出部を設けた台座に圧電体を載置固
定し表面実装可能な形状とした圧電振動装置において、
該台座は中央部に貫通部を設け、該圧電体のリード線を
案内し接続するための孔を有する引出部を台座の厚みの
ほぼ中心付近に埋設し、前記リード線が引出部の孔を貫
通し嵌合されかつ該孔のふち起こし部で溶接されている
ことを特徴とするものである。Means for Solving the Problems The gist of the present invention to achieve the above object is to provide a piezoelectric vibrating device having a shape capable of being surface-mounted by mounting and fixing a piezoelectric body on a pedestal provided with a drawer portion,
The pedestal is provided with a penetrating portion at the center, and a lead-out portion having a hole for guiding and connecting the lead wire of the piezoelectric body is embedded near the center of the thickness of the pedestal, and the lead wire forms a hole for the lead-out portion. It is characterized in that it is penetrated and fitted and is welded at the raised portion of the hole.
【０００７】また、引出部の孔のふち起こし部高さｈと
リード線径Ｄとの関係がｈ≧０．２×Ｄであることを特
徴とするものである。Further, the relation between the height h of the raised portion of the hole of the lead-out portion and the diameter D of the lead wire is h ≧ 0.2 × D.
【０００８】リード線および引出部の材料は各々の融点
温度差が２５０℃以内であることを特徴とするものであ
る。The material of the lead wire and the lead portion is characterized in that the melting point temperature difference between them is within 250 ° C.
【０００９】リード線および引出部の材料はニッケル系
の合金または銅系の合金であることを特徴とするもので
ある。The material of the lead wire and the lead portion is characterized by being a nickel-based alloy or a copper-based alloy.
【００１０】[0010]
【作用】すなわち本発明におけるＳＭＤ圧電振動装置は
その台座の引出部と圧電体のリード線と電気的な接続お
よび固定を溶接工程で同時にできる構成となっているの
で半田耐熱性があり、製造効率がよい圧電振動装置とな
っている。In other words, the SMD piezoelectric vibrating device according to the present invention has a structure in which the lead-out portion of the pedestal and the lead wire of the piezoelectric body can be electrically connected and fixed at the same time in the welding process, so that they have solder heat resistance and manufacturing efficiency It is a good piezoelectric vibration device.
【００１１】[0011]
【実施例】以下図面により本発明の実施例を詳述する。
図１は本発明の圧電振動装置３０を形成する部品の斜視
図である。水晶振動子３１は図示してないが水晶板が金
属容器に気密封止されており、コバール等のニッケル合
金等からなるリード線３２を介してその電気信号を外部
に取り出せる構造になっている。リード線３２と金属容
器およびリード線同志はそれぞれ絶縁されている。台座
３３は中央部に貫通部３４が設けてあり、その厚みのほ
ぼ中心付近にリード線３２と同数の引出部３６が図のよ
うに埋設されている。また、台座３３は金属の薄板より
所要の形状にプレス加工した引出部３６を耐熱性のプラ
スチックでインサート成形後、引出部３６の先端を図２
のように曲げ加工することで簡単に作ることができる。Embodiments of the present invention will be described in detail below with reference to the drawings.
FIG. 1 is a perspective view of components forming the piezoelectric vibration device 30 of the present invention. Although not shown, the crystal oscillator 31 has a crystal plate hermetically sealed in a metal container, and has a structure in which an electric signal thereof can be taken out through a lead wire 32 made of nickel alloy such as Kovar. The lead wire 32, the metal container, and the lead wire are insulated from each other. The pedestal 33 is provided with a penetrating portion 34 at the center, and the same number of lead-out portions 36 as the lead wires 32 are buried near the center of the thickness thereof as shown in the figure. In addition, as for the pedestal 33, after the lead-out portion 36 pressed from a thin metal plate into a desired shape is insert-molded with heat-resistant plastic, the tip of the lead-out portion 36 is shown in FIG.
It can be easily made by bending like.
【００１２】尚、引出部３６は部品の軽薄短小化および
材料費を考慮すると、０．５ｍｍ以下の板厚にするのが
望ましい。図２は図１の圧電振動装置３０の各部品を組
立てた側面図である。図において接合部３８はリード線
３２とふち起こし部３７が溶融し接合した部分である。It is desirable that the lead-out portion 36 has a plate thickness of 0.5 mm or less in consideration of lightness, thinness and shortness of parts and material cost. FIG. 2 is a side view in which each component of the piezoelectric vibration device 30 of FIG. 1 is assembled. In the figure, the joint portion 38 is a portion where the lead wire 32 and the raised portion 37 are melted and joined.
【００１３】次に図３を用いて更に詳細な説明をする。
図３は図１の孔３５にリード線３２を嵌合させた状態を
示すＩ−Ｉ断面図である。図によれば、引出部３６には
ふち起こし加工（バーリングとも呼ぶ）によって形成し
た孔が設けてある。リード線３２は孔３５に貫通し、ふ
ち起こし部３７の下端よりはみだして嵌合され、ふち起
こし部３７とレーザー溶接により強固に溶接される。Next, a more detailed description will be given with reference to FIG.
FIG. 3 is a sectional view taken along line I-I showing a state in which the lead wire 32 is fitted in the hole 35 of FIG. According to the drawing, the drawn-out portion 36 is provided with a hole formed by a frying process (also called burring). The lead wire 32 penetrates the hole 35, is fitted and protrudes from the lower end of the ridged portion 37, and is firmly welded to the ridged portion 37 by laser welding.
【００１４】しかし、図３のふち起こし部３７の高さｈ
が小さすぎるとリード線３２とふち起こし部３７との溶
接はうまくできない。例えば、ｈ＝０の時、即ち、ふち
起こし加工のない孔とリード線３２との溶接を行うと、
孔３５の周辺が先に溶けてしまいうまく溶接できない。
リード線径Ｄとふち起こし部３７の高さｈとの関係がｈ
≧０．２×Ｄであれば強固に溶接できることが実験によ
り判った。However, the height h of the raised portion 37 in FIG.
If is too small, the welding of the lead wire 32 and the raised portion 37 cannot be performed well. For example, when h = 0, that is, when welding is performed between the lead wire 32 and the hole without edging,
The periphery of the hole 35 is melted first and welding cannot be performed well.
The relationship between the lead wire diameter D and the height h of the raised portion 37 is h
Experiments have shown that if ≧ 0.2 × D, strong welding can be performed.
【００１５】また、リード線３２とふち起こし部３７と
の溶接は同じ材料同志で行うのが好ましいが、同一材に
できない場合は両者の融点温度差が２５０℃以内であ
り、かつニッケル系の合金又は銅系の合金であればうま
く溶接できることも判った。以上で水晶振動子３１と台
座３３との固定と電気的な接続が同時に完了したことに
なる。Further, it is preferable that the lead wire 32 and the raised portion 37 are welded by the same material, but if the same material cannot be used, the melting point temperature difference between the two is within 250 ° C. and the nickel alloy is used. It has also been found that a copper-based alloy can be welded well. As described above, the fixing and electrical connection of the crystal unit 31 and the pedestal 33 are completed at the same time.
【００１６】尚、実施例では圧電体として水晶振動子３
１の例を挙げたが水晶発振器、水晶フィルタであっても
よい。また振動子は水晶振動子に限らず圧電セラミック
等の振動子であってもよい。更に、リード線と引出部と
の接合方法としてレーザー溶接法を例として挙げたがろ
う付けで行ってもよい。In the embodiment, the crystal unit 3 is used as the piezoelectric body.
However, a crystal oscillator or a crystal filter may be used. The oscillator is not limited to a crystal oscillator, but may be an oscillator such as a piezoelectric ceramic. Further, the laser welding method has been taken as an example of the method for joining the lead wire and the lead portion, but brazing may be used.
【００１７】[0017]
【発明の効果】上記の如く本発明によれば、圧電体が載
置固定される台座の引出部と圧電体のリード線との電気
的な接続および固定が溶接によって同時に完了できる構
成になっているので非常に製造効率がよい圧電振動装置
を提供できる。As described above, according to the present invention, the electrical connection and fixing between the lead-out portion of the pedestal on which the piezoelectric body is mounted and fixed and the lead wire of the piezoelectric body can be simultaneously completed by welding. Therefore, it is possible to provide a piezoelectric vibrating device with extremely high manufacturing efficiency.
【００１８】また、本発明のＳＭＤ圧電振動装置はリー
ド線および引出部をニッケル系の合金又は銅系の合金で
作り、これらを直接溶接しているのでリフローの熱に強
く、また、引出部の材料選択や設計の自由度が広がり製
造コストが安くなるので極めて効果が高いものである。Further, in the SMD piezoelectric vibration device of the present invention, the lead wire and the lead portion are made of a nickel-based alloy or a copper-based alloy, and these are directly welded. This is extremely effective because it offers more flexibility in material selection and design and lowers manufacturing costs.
【図１】本発明の圧電振動装置を形成する部品の斜視図
である。FIG. 1 is a perspective view of components forming a piezoelectric vibration device of the present invention.
【図２】図１の圧電振動装置３０の各部品を組立てた側
面図である。FIG. 2 is a side view in which respective parts of the piezoelectric vibration device 30 of FIG. 1 are assembled.
【図３】図１の孔３５にリード線３２を嵌合させた状態
を示すＩ−Ｉ断面図である。3 is a sectional view taken along line I-I showing a state in which the lead wire 32 is fitted in the hole 35 in FIG.
３０ 圧電振動装置 ３１ 水晶振動子 ３２ リード線 ３３ 台座 ３４ 貫通部 ３５ 孔 ３６ 引出部 ３７ ふち起こし部 ３８ 接合部 30 Piezoelectric Vibration Device 31 Crystal Oscillator 32 Lead Wire 33 Pedestal 34 Penetration Part 35 Hole 36 Drawout Part 37 Folding Part 38 Joint Part
Claims (4)
を載置固定し表面実装可能な形状とした圧電振動装置に
おいて、該台座に貫通部を設け、該圧電体のリード線を
案内し接続するための孔を有する引出部を台座に埋設
し、前記リード線が引出部の孔を貫通し嵌合されかつ該
孔のふち起こし部で溶接又はろう付けされていることを
特徴とする圧電振動装置。1. A piezoelectric vibration device having a shape capable of being surface-mounted by mounting and fixing a piezoelectric body on a pedestal provided with a lead-out portion for an electric signal, wherein a penetrating portion is provided on the pedestal to guide a lead wire of the piezoelectric body. And a lead-out portion having a hole for connection is embedded in the pedestal, and the lead wire is fitted through the hole of the lead-out portion and welded or brazed at the raised portion of the hole. Piezoelectric vibration device.
ード線径Ｄとの関係が、ｈ≧０．２×Ｄであることを特
徴とする請求項１記載の圧電振動装置。2. The piezoelectric vibrating device according to claim 1, wherein the relationship between the height h of the raised portion of the hole of the lead-out portion and the lead wire diameter D is h ≧ 0.2 × D.
点温度差が２５０℃以内であることを特徴とする請求項
２記載の圧電振動装置。3. The piezoelectric vibrating device according to claim 2, wherein the materials of the lead wire and the lead portion have a melting point temperature difference of 250 ° C. or less.
系の合金または銅系の合金であることを特徴とする請求
項２記載の圧電振動装置。4. The piezoelectric vibration device according to claim 2, wherein the material of the lead wire and the lead portion is a nickel alloy or a copper alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19166893A JPH0730360A (en) | 1993-07-06 | 1993-07-06 | Piezoelectric vibration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19166893A JPH0730360A (en) | 1993-07-06 | 1993-07-06 | Piezoelectric vibration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0730360A true JPH0730360A (en) | 1995-01-31 |
Family
ID=16278475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19166893A Pending JPH0730360A (en) | 1993-07-06 | 1993-07-06 | Piezoelectric vibration device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730360A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6477908B1 (en) * | 1999-07-07 | 2002-11-12 | Canon Kabushiki Kaisha | Pedestal with vibration sensor, and exposure apparatus having the same |
| JP2006180574A (en) * | 2004-12-20 | 2006-07-06 | Toyota Motor Corp | Bus bar for electronic apparatus and method for bonding connection terminal to bus bar for electronic apparatus |
-
1993
- 1993-07-06 JP JP19166893A patent/JPH0730360A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6477908B1 (en) * | 1999-07-07 | 2002-11-12 | Canon Kabushiki Kaisha | Pedestal with vibration sensor, and exposure apparatus having the same |
| JP2006180574A (en) * | 2004-12-20 | 2006-07-06 | Toyota Motor Corp | Bus bar for electronic apparatus and method for bonding connection terminal to bus bar for electronic apparatus |
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