JP2563169Y2 - Substrate dividing device and substrate sheet structure - Google Patents
Substrate dividing device and substrate sheet structureInfo
- Publication number
- JP2563169Y2 JP2563169Y2 JP1992021155U JP2115592U JP2563169Y2 JP 2563169 Y2 JP2563169 Y2 JP 2563169Y2 JP 1992021155 U JP1992021155 U JP 1992021155U JP 2115592 U JP2115592 U JP 2115592U JP 2563169 Y2 JP2563169 Y2 JP 2563169Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sheet structure
- separating
- present
- substrate sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Details Of Cutting Devices (AREA)
- Nonmetal Cutting Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、基板及び基板の分割装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate and an apparatus for dividing the substrate.
【０００２】[0002]
【従来の技術】従来、トランジスタ、マイクロコンピュ
ータ、抵抗、コンデンサー、コイルその他の電気、電子
部品を搭載した基板が、大量に使用されているが、係る
実装基板を効率的に製造する為に、複数個の基板相当部
を連続して形成した長尺状のシートを準備し、該複数の
基板相当部に当たる部分に、同時に若しくは逐次的に、
所定の上記電気、電子部品を手動若しくは自動装填装置
を用いて所定の位置に搭載させ、目的の実装基板が完成
された後に、各基板相当部を分割して、それぞれの独立
した実装基板となし、所定の電気機器に使用している。2. Description of the Related Art Conventionally, substrates on which transistors, microcomputers, resistors, capacitors, coils, and other electric and electronic components are mounted are used in large quantities. Prepare a long sheet in which a plurality of substrate equivalent parts are continuously formed, and at a portion corresponding to the plurality of substrate equivalent parts, simultaneously or sequentially,
The predetermined electrical and electronic components are mounted at predetermined positions using a manual or automatic loading device, and after a target mounting board is completed, each board equivalent portion is divided into independent mounting boards. , For certain electrical equipment.
【０００３】処で、従来に於ける係る実装基板の製造工
程に於いて、連続した基板相当部をもつ該長尺状のシー
トを、所定の電子部品を実装した後に切断して分割する
際には、図６（Ａ）に示される様に、上下２枚の対向し
た回転刃１０、１１の間に分割されるべき複数個の独立
した実装基板部分が連続して形成されているシート１２
を図６（Ｂ）に示される様に通過させて、該シート１２
を当該回転刃の刃間で押し切る様に切断する方法が採用
されている。In the conventional mounting board manufacturing process, when a long sheet having a continuous board equivalent portion is cut and divided after mounting predetermined electronic components, It is, as shown in FIG. 6 (a), the sheet 12 in which a plurality of independent mounting substrate portion to be divided between the two upper and lower opposed rotary blade 10, 11 are formed continuously
Was allowed to pass through as shown in FIG. 6 (B), the sheet 12
Is cut so as to push off between the blades of the rotary blade.
【０００４】係る方法に於いては、係る切断操作を効率
化する為、当該シート１２に、予め切断すべき部分にＶ
字状の溝部、即ちＶカット部１５を設けておく場合もあ
る。一方、図７に示す様に、当該回転刃１０、１１は、
その刃体の周縁部が互いに若干重なり合った状態で設定
されていて、該重なり合った部分に、該シート１２を通
過させて、分割切断する方法も行われている。In such a method, in order to increase the efficiency of the cutting operation, a portion of the sheet 12 to be cut in advance has a V
There may be a case where a V-shaped portion 15 is provided. On the other hand, as shown in FIG. 7, the rotary blade 10, 11,
A method is also used in which the peripheral portions of the blades are set to be slightly overlapped with each other, and the sheet 12 is passed through the overlapped portion to cut the blades.
【０００５】係る方法に於いては、刃の取付け精度、或
いは刃体の重なりしろ、等に関して数１０μｍレベルの
調整、管理が要求されており、作業効率が低下すると言
う問題も有った。又、係る方法に於いては、刃体の摩擦
等により、該所定の切断操作、例えば２０００回、毎に
当該刃体を交換しなければならず、又その度に、所定の
調整操作や管理を実行する必要があり、煩雑で有った。In such a method, adjustment and management of several tens of μm are required in terms of blade mounting accuracy, blade overlap, and the like, and there has been a problem that work efficiency is reduced. Further, in such a method, the blade must be replaced every predetermined cutting operation, for example, 2000 times, due to friction of the blade, etc., and each time a predetermined adjustment operation or management is performed. Must be performed, which is complicated.
【０００６】一方、係る方法により、切断分割されるシ
ート１２、或いは基板１３には、係る押し切り操作の為
に分割操作時に、ストレスがかかるので、図８に示す様
に、基板相当部１２を該回転刃１０、１１で分割して基
板１３と１３’を形成するに際し、基板１３が反り返っ
たり、歪んだりする事が多く、その為、実装部品１４が
破損、或いは破壊されると言う問題があり、又図８
（Ｂ）に示される様な、例えばモールド割れが生じ、そ
れによっても実装部品１４が破損、或いは破壊されると
言う問題が発生していた。[0006] On the other hand, according to such a method, a system to be cut and divided is used.
The sheet 12 or the substrate 13 is provided with
Because stress is applied during the split operation,8As shown
Then, the substrate equivalent part 12 is divided by the rotary blades 10 and 11 and
In forming the plates 13 and 13 ', the substrate 13 warps.
Or distorted in many cases, so the mounting parts 14
There is a problem that it is damaged or destroyed.8
For example, as shown in FIG.
As a result, if the mounted component 14 is damaged or destroyed,
The problem was to say.
【０００７】従って、従来に於いては、該基板に実装さ
れる実装部品は、当該シート１２の切断予定線からかな
り離れた位置に配置する必要があり、その為、基板１３
の周辺に空間部が形成されるのが避けられず、その為、
高集積化が阻害されると言う問題も見られた。Therefore, conventionally, the mounting components mounted on the board need to be arranged at a position far away from the cutting line of the sheet 12, so that the board 13
It is unavoidable that a space is formed around the
There was also a problem that high integration was hindered.
【０００８】[0008]
【考案が解決しようとする課題】本考案の目的は、上記
した従来技術の欠点を改良し、実装部品に破損、損傷を
与えずに、効率的に且つ基板の歪み、変形を与えること
なく、複数の基板相当部が形成されている長尺状のシー
トを分離切断し得ると同時に、基板内の空間部を減少さ
せて高集積化を実現しうる基板の分離切断装置、並びに
係る分離切断に適したシート状の基板用シート構造体を
提供するものである。SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks of the prior art, and to efficiently and without distorting or deforming the board without damaging or damaging the mounted components. At the same time the long sheet in which a plurality of substrates corresponding portion is formed that obtained was separated off, separating the cutting device of the substrate which can realize high integration by decreasing the space in the substrate, the separation cut according to the sequence there is provided a sheet-like substrate sheet structure that is appropriate to.
【０００９】[0009]
【課題を解決するための手段】本考案は上記した目的を
達成するため、以下に記載されたような技術構成を採用
するものである。即ち、基板を一対の回転刃の噛み合わ
せ部に通過させて分割分離する装置に於いて、該回転刃
の近傍に、該回転刃間に供給される直前の該基板の構成
素材を加熱する加熱手段が設けられている基板分割装置
である。 The present invention employs the following technical configuration to achieve the above object. That is, at the base plate to the apparatus for dividing separated by passing the engaging portion of the pair of rotating blades, in the vicinity of the rotary blade, heating the constituent material of the substrate immediately before being supplied between the rotary blade Ru substrate dividing apparatus der heating means.
【００１０】[0010]
【作用】本考案は、上記の様な構成を採用しているの
で、該複数の基板相当部が連続的に配置形成されてい
る、実装基板用のシート構成体を分離切断するに際し
て、当該シート体に与えられる歪み或いは変形力が従来
に比べて著しく小さくなっているので、該回転刃により
切断操作を実行する場合でも、基板相当部分に変形や破
壊が生じないので、実装部品が破壊、損傷を受ける心配
がない。Since the present invention adopts the above-described structure, the sheet is used for separating and cutting a sheet structure for a mounting substrate on which the plurality of substrate-corresponding portions are continuously arranged and formed. Since the strain or deformation force applied to the body is significantly smaller than in the past, even when a cutting operation is performed by the rotary blade, no deformation or destruction occurs in a portion corresponding to the substrate, so that the mounted component is broken or damaged. There is no worry about receiving.
【００１１】又、本考案に於いては、上記の様に、該回
転刃で切断分離される基板相当部が変形する心配がない
ので、該分離切断予定線の近傍に迄実装部品を搭載させ
る事が可能となるので、実装基板の集積度を向上させる
事が可能となる。Further, in the present invention, as described above, since there is no fear that the portion corresponding to the substrate cut and separated by the rotary blade is deformed, the mounted components are mounted close to the planned separation and cutting line. Therefore, the degree of integration of the mounting substrate can be improved.
【００１２】[0012]
【実施例】以下に、本考案に係る基板分割装置の具体例
を図面を参照しながら詳細に説明する。図１は、本考案
に係る基板分割装置の一具体例を説明する図であり、図
中、基板形成用の基板相当部を有する長尺状のシート構
造体１２を一対の回転刃１０、１１の噛み合わせ部に通
過させて分割分離する装置に於いて、該回転刃１０、１
１の近傍に、該回転刃１０、１１間に供給される直前の
該基板形成用の基板相当部を有する長尺状のシート構成
体１２の構成素材を加熱する加熱手段１、２が設けられ
ている基板分割装置が示されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific example of a substrate dividing apparatus according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a view for explaining a specific example of the substrate dividing device according to the present invention. In FIG.
In the forming body 12 to a device allowed to divide separated is passed through the meshing portions of the pair of rotary blades 10 and 11, the rotary blade 10, 1
Heating means 1 and 2 are provided in the vicinity of 1 for heating the constituent material of the elongated sheet structure 12 having a portion corresponding to the substrate for forming the substrate immediately before being supplied between the rotary blades 10 and 11. Is shown.
【００１３】本考案に於ける基板１３を形成する為に、
基板相当部を複数個連続的に配置形成させた該基板用シ
ート構造体１２は、例えば、ガラス・エポキシ樹脂等の
絶縁性を有する公知の樹脂材料にで、構成されたもので
ある。本考案に於ける該加熱手段は、該基板用シート構
造体１２の少なくとも片面、場合によってはその両面を
加熱する様に構成されている。In order to form the substrate 13 in the present invention,
The substrate sheet structure 12 in which a plurality of substrate equivalent portions are continuously arranged and formed is made of a known resin material having an insulating property, such as a glass epoxy resin. The heating means in the present invention is configured to heat at least one side of the substrate sheet structure 12, and in some cases, both sides thereof.
【００１４】本考案においては、該基板用シート構造体
を該回転刃１０、１１により分離切断する直前に該加熱
手段により、少なくとも該基板用シート構造体の切断予
定部分、即ち切断予定線とその近傍を構成する樹脂成分
を軟化させる事により、分割処理を実行している間、当
該基板用シート構造体１２にストレスが付加されない様
に構成されるものである。In the present invention, immediately before the substrate sheet structure is separated and cut by the rotary blades 10 and 11, at least the portion of the substrate sheet structure to be cut, that is, the cutting line and the cutting line of the substrate sheet structure are cut by the heating means. By softening the resin component constituting the vicinity, no stress is applied to the substrate sheet structure 12 during the dividing process.
【００１５】本考案における加熱手段１、２としては、
図１（Ａ）に示す様に、例えばホットエアを適宜のノズ
ルを用いて、当該基板用シート構造体１２の所定の位置
に吹きつける様にしたもので有っても良く、又図１
（Ｂ）に示す様に、マイクロトーチ３又は４を用いて、
該基板用シート構造体１２の所定の位置にガスバーナの
炎を当てる事により、該基板用シート構造体１２の所定
の部分の樹脂成分を軟化させるもので有っても良い。The heating means 1 and 2 in the present invention include:
As shown in FIG. 1A, for example, hot air may be blown to a predetermined position of the substrate sheet structure 12 by using an appropriate nozzle.
As shown in (B), using the micro torch 3 or 4,
The resin component in a predetermined portion of the substrate sheet structure 12 may be softened by applying a gas burner flame to a predetermined position of the substrate sheet structure 12.
【００１６】更に、本考案に於いては、図１（Ｃ）に示
す様に、当該基板用シート構造体１２の片面に若しくは
両面に接触して或いは所定の間隙を介して、所定の温度
に加熱されたヒートプレート５を配置して該基板用シー
ト構造体１２の所定の部分の樹脂成分を軟化させるもの
で有っても良い。更に、図１（Ｄ）に示す様に、該基板
用シート構造体１２の片面に若しくは両面に所定の間隙
を介して、赤外線等の放射熱源を有する加熱体６を設け
て、当該基板用シート構造体１２の表面の雰囲気温度を
加熱して、該基板用シート構造体の所定の部分の樹脂成
分を軟化させるもので有っても良い。Further, in the present invention, as shown in FIG. 1C, a predetermined temperature is brought into contact with one side or both sides of the substrate sheet structure 12 or through a predetermined gap. The heated heat plate 5 may be arranged to soften a resin component in a predetermined portion of the substrate sheet structure 12. Further, as shown in FIG. 1 (D), a heater 6 having a radiant heat source such as infrared rays is provided on one side or both sides of the substrate sheet structure 12 with a predetermined gap therebetween. It may be one that heats the ambient temperature on the surface of the structure 12 to soften the resin component in a predetermined portion of the substrate sheet structure.
【００１７】又、図１（Ｅ）に示す様に、例えば赤外線
加熱手段６とホットエアノズル１、２とを組合せて使用
することも可能であり、係る組合せは、自由に設定する
事が出来る。本考案に係る上記具体例を採用する事によ
り、基板用シート構造体１２に与えられるストレスが小
さくなるので、基板が変形したり、破損したりする事が
ないので、分割ラインの極近傍迄、実装部品を配置する
事が出来るので、実装区域が拡大し、集積度が向上する
と共に、生産コストを低減させる事が可能となる。As shown in FIG. 1E, for example, the infrared heating means 6 and the hot air nozzles 1 and 2 can be used in combination, and such a combination can be freely set. By adopting the above specific example according to the present invention, the stress applied to the substrate sheet structure 12 is reduced, so that the substrate is not deformed or damaged, so that it is very close to the division line. Since the mounted components can be arranged, the mounting area is expanded, the integration degree is improved, and the production cost can be reduced.
【００１８】[0018]
【００１９】[0019]
【００２０】[0020]
【００２１】[0021]
【００２２】本考案に於いては、上記した方法を採用し
て、当該基板用シート構造体１２に必要な実装部品を搭
載してから、個々の基板に分割切断するものであるが、
更に、切断操作を向上し且つ該実装部品の破壊、損傷を
確実に防止して、生産効率の向上と生産コストの低下を
計る必要から、図２乃至図５に示す様な、基板用シート
構造体１２を併用するものである。In the present invention, the above-described method is employed to mount necessary components on the board sheet structure 12, and then cut into individual boards.
Moreover, destruction of and the mounting component to improve the cutting operation, to reliably prevent damage, the need to measure the reduction in the increase and production costs of the production efficiency, such as shown in FIGS. 2-5, the substrate sheet structure The body 12 is used in combination.
【００２３】即ち、基板用シート構造体１２を一対の回
転刃１０、１１の噛み合わせ部に通過させて分割分離す
る装置を於いて、該基板分割装置により切断される該基
板用シート構造体１２は、該回転刃１０、１１により分
割分離される該基板用シート構造体１２の当該分割線１
５の内側縁部に沿って歪み吸収部１６が形成されている
基板用シート構造体２０である。That is, in a device for separating and separating the substrate sheet structure 12 by passing it through the engagement portion of the pair of rotary blades 10, 11, the substrate sheet structure 12 cut by the substrate dividing device is separated. Is the dividing line 1 of the substrate sheet structure 12 divided and separated by the rotary blades 10 and 11.
5 is a substrate sheet structure 20 in which a strain absorbing portion 16 is formed along the inner edge of the substrate structure 5.
【００２４】つまり、本考案に於いては、上記の様な分
離分割装置を使用しても、未だ多少のストレスが係る事
になり、又該分割装置を通過する前後の基板用シート構
造体１２を手割りする場合も有り、該基板用シート構造
体、つまり基板そのものの変形、伸び、収縮等の発生に
よって、当該実装部品の破損、破壊が発生する可能性が
残っている。That is, in the present invention, even if the above-described separating and dividing apparatus is used, some stress is still applied, and the sheet structure 12 for the substrate before and after passing through the dividing apparatus. In some cases, deformation, elongation, shrinkage, or the like of the board sheet structure, that is, the board itself, may cause damage or destruction of the mounted component.
【００２５】本考案に於いては、その様な問題を解決す
る為に、分離切断操作に供される基板用シート構造体１
２に、分離切断操作時に、その時のストレスが実装区域
に伝播しない様な、ストレス吸収部を形成配置したもの
である。具体的には、図２に示す様に、基板用シート構
造体１２に予め設けられた、Ｖカット溝部よりなる分離
切断線つまり分割線１５の内側部でかつ実装区域との間
に該歪み伝播防止用の歪み吸収部１６を該分割線１５と
略並行に配置形成したものである。In the present invention, in order to solve such a problem, the substrate sheet structure 1 to be subjected to the separation and cutting operation is provided.
Second, a stress absorbing portion is formed and arranged so that the stress at that time does not propagate to the mounting area during the separating and cutting operation. Specifically, as shown in FIG. 2 , the propagation of the strain between the mounting section and the inner side of the separation / cutting line formed of the V-cut groove, that is, the dividing line 15, which is provided in advance on the substrate sheet structure 12. The distortion absorbing portion 16 for prevention is arranged and formed substantially parallel to the dividing line 15.
【００２６】該歪み伝播防止用の歪み吸収部１６の構成
は、例えば分割線１５と同様にＶカット状の溝部として
も良く、又孔あきのスリット状に構成したもので有って
も良い。係る構成を採用する事により、該基板用シート
構造体２０は、図３に示す様に、例えストレスが加わっ
て、変形したとしても、該歪み吸収部１６の存在の為、
該歪み、変形の影響が吸収されて実装区域に迄到達する
事がなく、その為、実装部品の破損、破壊の発生が確実
に防止される。The structure of the strain absorbing portion 16 for preventing the propagation of strain may be a V-cut groove, for example, like the dividing line 15, or may be a slit having a hole. By adopting such a configuration, as shown in FIG. 3 , even if the sheet structure 20 for a substrate is deformed due to stress, as shown in FIG.
The influence of the distortion and deformation is absorbed and does not reach the mounting area, so that the occurrence of breakage and destruction of the mounted component is reliably prevented.
【００２７】尚、図４は、本考案に係る該基板用シート
構造体２０に於いて、当該歪み吸収部１６としてＶカッ
ト状の溝部を採用した例を示す平面図であり、又図５
は、当該歪み吸収部１６として、孔あきスリットを採用
した例を示す平面図であり、当該孔あきスリットの中間
部の適宜の位置に非孔あきスリット部１７を設けたもの
である。FIG.4Is the substrate sheet according to the present invention.
In the structure 20, a V-shaped bracket is used as the strain absorbing portion 16.
FIG. 5 is a plan view showing an example in which a5
Adopts a perforated slit as the strain absorbing part 16
FIG. 4 is a plan view showing an example in which
With a non-perforated slit section 17 at an appropriate position in the section
It is.
【００２８】係る具体例は、例えば手割りによって、該
基板用シート構造体２０を分割する様な場合にも有効で
ある。Such a specific example is also effective in a case where the substrate sheet structure 20 is divided, for example, by hand splitting.
【００２９】[0029]
【考案の効果】本考案は上記の様な構成を採用している
ので、実装部品に破損、損傷を与えずに、効率的に且つ
基板の歪み、変形を与えることなく、複数の基板相当部
が形成されている長尺状のシートを分離切断しえると同
時に、基板内の空間部を減少させて高集積化を実現しう
る基板の分離切断装置、並びに係る分離切断に適したシ
ート状の基板構成体を得る事が出来るのである。[Effects of the Invention] Since the present invention adopts the above-described structure, a plurality of parts corresponding to a plurality of substrates can be efficiently provided without damaging or damaging the mounted components and without causing distortion or deformation of the substrates. A separation and cutting device for a substrate capable of separating and cutting a long sheet on which is formed, and at the same time, realizing high integration by reducing a space portion in the substrate, and a sheet-shaped sheet suitable for such separation and cutting. A substrate structure can be obtained.
【図１】図１は、本考案に係る基板分割装置の一具体例
の構成を説明する図である。FIG. 1 is a diagram illustrating a configuration of a specific example of a substrate dividing device according to the present invention.
【図２】図２は、本考案に使用される基板用シート構造
体の構成例を説明する図である。FIG. 2 is a diagram illustrating a configuration example of a substrate sheet structure used in the present invention.
【図３】図３は、本考案に使用される基板用シート構造
体の構成例を説明する図である。FIG. 3 is a diagram illustrating a configuration example of a sheet structure for a substrate used in the present invention.
【図４】図４は、本考案に使用される基板用シート構造
体の構成例を説明する図である。FIG. 4 is a diagram illustrating a configuration example of a substrate sheet structure used in the present invention.
【図５】図５は、本考案に使用される基板用シート構造
体の他の構成例を説明する図である。FIG. 5 is a diagram illustrating another configuration example of the substrate sheet structure used in the present invention.
【図６】図６は、従来に於ける基板分割装置の例を説明
する図である。FIG. 6 is a diagram illustrating an example of a conventional substrate dividing apparatus.
【図７】図７は、従来に於ける基板分割装置の他の例を
説明する図である。FIG. 7 is a diagram illustrating another example of a conventional substrate dividing apparatus.
【図８】図８は、従来の基板分割装置に於ける問題点を
説明する図である。FIG. 8 is a diagram for explaining a problem in a conventional substrate dividing apparatus.
１〜６…加熱手段 １０、１１…回転刃 １２、２０…基板用シート構造体 １３…基板 １４…実装部品 １５…分割線 １６…歪み吸収部 １７…非孔あきスリット部 1 to 6: heating means 10, 11: rotary blade 12, 20: substrate sheet structure 13: substrate 14: mounting component 15: dividing line 16: strain absorbing portion 17: non-perforated slit portion
フロントページの続き (72)考案者 米本 宜司 兵庫県神戸市兵庫区御所通１丁目２番28 号 富士通テン株式会社内 (56)参考文献 特開 昭64−40210（ＪＰ，Ａ)Continuation of the front page (72) Inventor Yoshiji Yonemoto 1-28-28 Goshodori, Hyogo-ku, Kobe City, Hyogo Prefecture Inside Fujitsu Ten Co., Ltd. (56) References JP-A-64-40210 (JP, A)
Claims (3)
るシート構造体を一対の回転刃の噛み合わせ部に通過さ
せて分割分離する装置に於いて、該回転刃の近傍に、該
回転刃間に供給される直前の該シート構造体の構成素材
を加熱する加熱手段が設けられている事を特徴とする基
板分割装置。An apparatus for separating and separating a sheet structure having a plurality of substrate-equivalent portions for forming a substrate by passing through a meshing portion of a pair of rotary blades, wherein the rotary member is provided near the rotary blade. A substrate dividing apparatus comprising a heating means for heating a constituent material of the sheet structure immediately before being supplied between the blades.
とも片面を加熱する様に構成されている事を特徴とする
請求項１記載の基板分割装置。2. The substrate dividing apparatus according to claim 1, wherein said heating means is configured to heat at least one side of said sheet structure.
るシート構造体を一対の回転刃の噛み合わせ部に通過さ
せて分割分離する基板分割装置に於いて、該基板分割装
置により切断される該シート構造体は、該回転刃により
分割分離される該シート構造体の当該分割線の内側縁部
に沿って歪み吸収部が形成されている事を特徴とする基
板用シート構造体。3. A substrate dividing apparatus for separating and separating a sheet structure having a plurality of substrate-forming portions for forming a substrate by passing through a meshing portion of a pair of rotary blades. The sheet structure according to claim 1, wherein the sheet structure is divided and separated by the rotary blade, and a strain absorbing portion is formed along an inner edge of the dividing line of the sheet structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992021155U JP2563169Y2 (en) | 1992-04-07 | 1992-04-07 | Substrate dividing device and substrate sheet structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992021155U JP2563169Y2 (en) | 1992-04-07 | 1992-04-07 | Substrate dividing device and substrate sheet structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0582069U JPH0582069U (en) | 1993-11-05 |
| JP2563169Y2 true JP2563169Y2 (en) | 1998-02-18 |
Family
ID=12047021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992021155U Expired - Fee Related JP2563169Y2 (en) | 1992-04-07 | 1992-04-07 | Substrate dividing device and substrate sheet structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2563169Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4814773B2 (en) * | 2006-12-06 | 2011-11-16 | 株式会社セーコウ | Paper sheet cutting device, sheet handling device including the same, and image forming apparatus |
| JP2010251488A (en) * | 2009-04-15 | 2010-11-04 | Ricoh Microelectronics Co Ltd | Substrate cutting method and substrate cutter |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6440210A (en) * | 1987-08-05 | 1989-02-10 | Fujitsu Ltd | Dividing device for printed board |
| JPH0785876B2 (en) * | 1990-09-05 | 1995-09-20 | 株式会社シー・ティー・エム | Printed resin board cutting method |
-
1992
- 1992-04-07 JP JP1992021155U patent/JP2563169Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582069U (en) | 1993-11-05 |
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