JP3152449B2 - Lead bonding apparatus and method for IC parts - Google Patents
Lead bonding apparatus and method for IC partsInfo
- Publication number
- JP3152449B2 JP3152449B2 JP11848091A JP11848091A JP3152449B2 JP 3152449 B2 JP3152449 B2 JP 3152449B2 JP 11848091 A JP11848091 A JP 11848091A JP 11848091 A JP11848091 A JP 11848091A JP 3152449 B2 JP3152449 B2 JP 3152449B2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- component
- lead
- pressing
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はＩＣ部品のリードをプリ
ント基板やガラス基板に設けられた電極に接合する方法
及びその装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for joining leads of an IC component to electrodes provided on a printed circuit board or a glass substrate.
【０００２】[0002]
【従来の技術】例えば、図６に示すように、液晶表示装
置１のガラス基板２に並列して設けられた多数の透明電
極３に、液晶を駆動するＩＣ部品４のアウターリード６
を接合する方法としては、透明電極３上にその並列方向
に沿って異方導電性シート７を配置し、その上に各透明
電極３に対応させてＩＣ部品４のアウターリード６を配
置し、ヒータを内蔵した加熱ツール２１にて並列配置さ
れたすべてのアウターリード６を一括して押圧すること
によって各透明電極３とアウターリード６を接合してい
た。2. Description of the Related Art As shown in FIG. 6, for example, outer leads 6 of IC parts 4 for driving liquid crystal are provided on a number of transparent electrodes 3 provided in parallel with a glass substrate 2 of a liquid crystal display device 1.
As a method of bonding, the anisotropic conductive sheet 7 is arranged on the transparent electrode 3 along the parallel direction, and the outer leads 6 of the IC component 4 are arranged thereon so as to correspond to each transparent electrode 3, The transparent electrodes 3 and the outer leads 6 are joined by pressing all the outer leads 6 arranged in parallel by the heating tool 21 having a built-in heater.
【０００３】詳しく説明すると、異方導電性シート７は
樹脂中に金属粒子若しくは樹脂球に金属メッキを施した
ものを分散させてあるシートであり、押圧して加熱する
と強く押圧された部分では分散された金属粒子又は金属
メッキ球が互いに接触して導電性を示すが他の部分は絶
縁性をもつものであり、加熱ツール２１にてアウターリ
ード６を一括して押圧すると、各透明電極３とアウター
リード６の間は強く押圧されて電気的に接合され、透明
電極３、３間およびアウターリード６、６間では金属粒
子又は金属メッキ球が分散し絶縁性を有している状態で
樹脂が加熱硬化して固定されるのである。[0003] More specifically, the anisotropic conductive sheet 7 is a sheet in which metal particles or resin balls are plated with metal in a resin, and when pressed and heated, the sheet is dispersed in a strongly pressed portion. Metal particles or metal-plated spheres are in contact with each other and exhibit conductivity, but the other portions are insulative. When the outer leads 6 are collectively pressed by the heating tool 21, each of the transparent electrodes 3 The outer leads 6 are strongly pressed and electrically connected to each other, and the resin is dispersed between the transparent electrodes 3 and 3 and between the outer leads 6 and 6 in a state where metal particles or metal plating spheres are dispersed and have insulating properties. It is fixed by heating.
【０００４】また、異方導電性シート７を用いる代わり
に、紫外線硬化性樹脂を用いて透明電極３上に塗布し、
その上にアウターリード６を配置して加圧ツールにてア
ウターリード６を一括して押圧することにより、透明電
極３とアウターリード６の間の樹脂を押し出して互いに
接触させ、その状態でガラス基板２を通して紫外線硬化
性樹脂に紫外線を照射し、樹脂を硬化させることによっ
て透明電極３とアウターリード６を接合固定する方法も
知られている。In addition, instead of using the anisotropic conductive sheet 7, an ultraviolet curable resin is used to coat the transparent electrode 3,
The outer lead 6 is disposed thereon, and the outer lead 6 is collectively pressed by a pressing tool, whereby the resin between the transparent electrode 3 and the outer lead 6 is extruded and brought into contact with each other. A method is also known in which the transparent electrode 3 and the outer lead 6 are joined and fixed by irradiating an ultraviolet-curable resin with ultraviolet rays through the substrate 2 and curing the resin.
【０００５】尚、図６におけるＩＣ部品４は、フレキシ
ブルなキャリアテープ５にインナーリード４１及びアウ
ターリード６を設けるとともにインナーリード４１にＩ
Ｃチップ４０を接合保持させたフレキシブルタイプのＩ
Ｃ部品であり、キャリアテープ５の一方に延出されたア
ウターリード６がガラス基板２の透明電極３に接合さ
れ、他方に延出されたアウターリード６が回路基板２２
の電極２３に接合されている。In the IC component 4 shown in FIG. 6, an inner lead 41 and an outer lead 6 are provided on a flexible carrier tape 5 and an inner lead 41 is provided on the inner lead 41.
Flexible type I with C chip 40 bonded and held
The outer lead 6 extending to one side of the carrier tape 5 is joined to the transparent electrode 3 of the glass substrate 2, and the outer lead 6 extending to the other side is connected to the circuit board 22.
Electrode 23.
【０００６】[0006]
【発明が解決しようとする課題】ところが、上記従来の
リード接合方法では、加熱ツール２１や加圧ツールをガ
ラス基板２に対して高精度に平行にしないと、すべての
アウターリード６を高い信頼性をもって透明電極３に接
合することができないが、並列配置された多数のアウタ
ーリード６をカバーをするためにかなりの長さを有する
これらツールの平行度を高精度に出すのは困難であるた
め、信頼性の高い接合を得ることが難しいという問題が
あった。また、加熱ツール２１では、その全長にわたっ
て均一に加熱することも困難であり、均一な接合状態を
得ることが難しく、また広い範囲を加熱するので近傍部
分に熱損傷を与える恐れがあり、さらに信頼性の高い接
合を確保するには加熱ツール２１や加圧ツールのクリー
ニングや交換が頻繁に必要となり、生産性も低下すると
いう問題があった。However, in the above-described conventional lead bonding method, if the heating tool 21 and the pressing tool are not parallel to the glass substrate 2 with high precision, all the outer leads 6 can have high reliability. Can not be joined to the transparent electrode 3 by the above method, but it is difficult to obtain the parallelism of these tools having a considerable length with high precision in order to cover a large number of outer leads 6 arranged in parallel. There is a problem that it is difficult to obtain a highly reliable joint. Further, in the heating tool 21, it is difficult to uniformly heat the entire length of the heating tool 21, it is difficult to obtain a uniform joining state, and since a large area is heated, there is a possibility that a nearby portion may be damaged by heat. Cleaning and replacement of the heating tool 21 and the pressurizing tool are frequently required in order to secure high bonding, and there is a problem that productivity is reduced.
【０００７】本発明は上記従来の問題点に鑑み、信頼性
の高い接合状態を簡単なツールを用いて容易にかつ生産
性良く実現できるＩＣ部品のリード接合方法及びその装
置を提供することを目的とする。The present invention has been made in view of the above-mentioned conventional problems, and has as its object to provide a method and an apparatus for bonding leads of IC components which can realize a highly reliable bonding state easily and with high productivity by using a simple tool. And
【０００８】[0008]
【課題を解決するための手段】本発明は、基板に設けら
れた複数の電極上に樹脂製の接合材を介してＩＣ部品の
各リードを配置したＩＣ部品のリードに対して加熱する
加熱手段と、前記加熱手段とは別に前記ＩＣ部品のリー
ドを押圧する押圧手段とを備え、前記ＩＣ部品の各リー
ド及び接合材を加熱手段によって加熱し、ＩＣ部品の１
辺に隣接して設けられたリードの一部である１又は複数
のリードのみを単位として順次押圧してリードと電極と
を接合することを特徴とするものである。According to the present invention, there is provided a heating means for heating a lead of an IC component in which each lead of the IC component is arranged via a resin bonding material on a plurality of electrodes provided on a substrate. And pressing means for pressing the leads of the IC component separately from the heating means. Each of the leads and the bonding material of the IC component is heated by the heating means.
The method is characterized in that the lead and the electrode are joined by sequentially pressing only one or a plurality of leads which are a part of the leads provided adjacent to the side.
【０００９】好適には、接合材として異方導電性シート
を用い、加熱手段としてはレーザ光や赤外線光等の光エ
ネルギーの照射手段、あるいは熱風吹付け手段がある。Preferably, an anisotropic conductive sheet is used as the bonding material, and the heating means is a means for applying light energy such as laser light or infrared light, or a means for blowing hot air.
【００１０】また、基板に設けられた複数の電極上に紫
外線硬化性樹脂を塗布し、紫外線硬化性樹脂を介して電
極上にＩＣ部品の各リードを配置し、各リードを１又は
複数づつ押圧手段にて順次押圧するとともに押圧部に紫
外線を照射してリードと電極を接合してもよい。[0010] Further, an ultraviolet curable resin is applied on a plurality of electrodes provided on the substrate, each lead of the IC component is arranged on the electrode via the ultraviolet curable resin, and each lead is pressed by one or more. Alternatively, the lead and the electrode may be joined by applying pressure sequentially and irradiating the pressing portion with ultraviolet rays.
【００１１】[0011]
【作用】本発明によれば、基板の各電極上に異方導電性
シートなどの樹脂製の接合材を介してＩＣ部品のリード
を配置し、ＩＣ部品の１辺に隣接して設けられたリード
の一部である１又は複数のリードのみを単位として順次
押圧するとともに光エネルギーや熱風や加熱した押圧手
段で熱を加えることによって順次接合するので、押圧手
段として技術的に確立されているワイヤボンディングに
おけるキャピラリと同様の手段や加圧ローラ等を適用す
ることによって、押圧手段の平行度調整やクリーニング
や交換等が頻繁に必要でなくなり、また局部加熱するの
で周囲に熱損傷を与える恐れがなく、容易にかつ生産性
良く信頼性の高い接合が可能となる。また、紫外線硬化
性樹脂を用いて接合する場合も同様である。According to the present invention, the leads of an IC component are arranged on each electrode of a substrate via a resin bonding material such as an anisotropic conductive sheet, and are provided adjacent to one side of the IC component. Wires that have been technically established as pressing means because they are sequentially pressed by applying only one or a plurality of leads that are part of the leads as a unit and heat is applied by light energy, hot air, or heated pressing means. By applying the same means as the capillary in bonding or a pressure roller, etc., the parallelism adjustment, cleaning and replacement of the pressing means are not required frequently, and there is no danger of causing heat damage to the surroundings because it is locally heated. Thus, highly reliable bonding can be easily performed with good productivity. The same applies to the case of joining using an ultraviolet curable resin.
【００１２】[0012]
【実施例】以下、本発明のＩＣ部品のリード接合方法の
一実施例を図１、図２を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for bonding leads of an IC component according to the present invention will be described below with reference to FIGS.
【００１３】２は液晶表示装置１における一方のガラス
基板であり、その一側部に多数の透明電極３が微小ピッ
チで並列して形成されている。５は、図６において説明
したフレキシブルタイプのＩＣ部品４のキャリアテープ
であり、その一側部の一面に各透明電極３に対応するよ
うに多数のアウターリード６が設けられている。このア
ウターリード６の透明電極３との接合部分ではキャリア
テープ５に開口５ａが形成され、アウターリード６の先
端部をキャリアテープ５で支持してアウターリード６の
変形を防止している。Reference numeral 2 denotes one glass substrate in the liquid crystal display device 1, on which a large number of transparent electrodes 3 are formed in parallel at a minute pitch on one side. Reference numeral 5 denotes a carrier tape of the flexible type IC component 4 described with reference to FIG. 6, and a plurality of outer leads 6 are provided on one surface of one side portion so as to correspond to the respective transparent electrodes 3. An opening 5a is formed in the carrier tape 5 at the joint portion of the outer lead 6 with the transparent electrode 3, and the tip of the outer lead 6 is supported by the carrier tape 5 to prevent deformation of the outer lead 6.
【００１４】７は、ガラス基板２上の透明電極３の上に
その並列方向に沿って配置された異方導電性シートであ
り、この異方導電性シート７を介して各透明電極３上に
それぞれ対応する各アウターリード６が載置されるよう
にＩＣ部品４が配置される。Reference numeral 7 denotes an anisotropic conductive sheet disposed on the transparent electrode 3 on the glass substrate 2 along the direction parallel to the transparent electrode 3, and is provided on each transparent electrode 3 via the anisotropic conductive sheet 7. The IC components 4 are arranged such that the corresponding outer leads 6 are placed.
【００１５】８はワイヤボンディング装置のキャピラリ
に準じて構成された押圧手段であり、高速で各アウター
リード６を順次押圧するように構成されている。９はレ
ーザ光や赤外線光などの光エネルギー９ａを照射する光
エネルギー照射手段であり、押圧手段８によるアウター
リード６及び異方導電性シート７の押圧部又はその近傍
を押圧時又はそれに先行して加熱するように構成されて
いる。Reference numeral 8 denotes a pressing means configured in accordance with a capillary of a wire bonding apparatus, and is configured to sequentially press the outer leads 6 at a high speed. Reference numeral 9 denotes light energy irradiating means for irradiating light energy 9a such as laser light or infrared light. The light energy irradiating means 9 presses the pressing portion of the outer lead 6 and the anisotropic conductive sheet 7 or the vicinity thereof by the pressing means 8 or before the pressing. It is configured to heat.
【００１６】以上の構成において、ガラス基板２の透明
電極３とＩＣ部品４のアウターリード６を接合する際に
は、ガラス基板２の透明電極３上に異方導電性シート７
を配置し、その上にＩＣ部品４のアウターリード６を配
置し、各アウターリード６に対して光エネルギー照射手
段９から光エネルギー９ａを照射して加熱するとともに
押圧手段８にて押圧する。すると、異方導電性シート７
は押圧された部分だけが電気的に接合され、他の部分は
絶縁性を保持しており、その状態で樹脂が加熱されて硬
化することによって対応する透明電極３とアウターリー
ド６が電気的に接合されるとともに機械的に固定され
る。この接合動作を各アウターリード６に対して高速で
順次繰り返し、すべてのアウターリード６を対応する透
明電極３に接合する。In the above configuration, when the transparent electrode 3 of the glass substrate 2 and the outer lead 6 of the IC component 4 are joined, the anisotropic conductive sheet 7 is placed on the transparent electrode 3 of the glass substrate 2.
Are disposed thereon, and the outer leads 6 of the IC component 4 are disposed thereon. The outer leads 6 are irradiated with light energy 9a from the light energy irradiating means 9 to be heated and pressed by the pressing means 8. Then, the anisotropic conductive sheet 7
Only the pressed part is electrically connected, and the other part retains insulation. When the resin is heated and cured in that state, the corresponding transparent electrode 3 and outer lead 6 are electrically connected. Joined and mechanically fixed. This joining operation is sequentially repeated for each outer lead 6 at high speed, and all the outer leads 6 are joined to the corresponding transparent electrodes 3.
【００１７】このように、各アウターリード６に対して
順次光エネルギー９ａを照射して加熱するとともに押圧
手段８にて押圧することによって、押圧手段８の平行度
調整が不要でかつ各アウターリード６を確実に押圧する
ことができ、また局部加熱するので周囲に熱損傷を与え
る恐れもなく、さらに押圧手段８に樹脂が付着すること
もないのでクリーニングや交換等が頻繁に必要でなくな
り、容易にかつ生産性良く信頼性の高い接合が可能とな
る。As described above, the outer leads 6 are sequentially irradiated with the light energy 9a, heated and pressed by the pressing means 8, so that the parallelism adjustment of the pressing means 8 is unnecessary and each outer lead 6 is not required. Can be reliably pressed, and there is no danger of heat damage to the surroundings due to local heating, and no resin adheres to the pressing means 8, so that cleaning and replacement are not required frequently, and can be easily performed. In addition, highly reliable bonding can be achieved with good productivity.
【００１８】尚、上記実施例では押圧手段８にて単一の
アウターリード６を順次押圧する例を説明したが、場合
によっては２〜３本のアウターリード６を一度に押圧す
ることもできる。又、押圧手段８として上下移動して押
圧する例を示したが、加圧ローラを用い、この加圧ロー
ラを転動させて順次押圧することもできる。さらに、基
板がガラス基板２である場合には、図１に仮想線で示す
ようにガラス基板１及び透明電極３を通してガラス基板
２の裏面側から異方導電性シート７に光エネルギー９ａ
を照射することもできる。In the above-described embodiment, an example in which the single outer lead 6 is sequentially pressed by the pressing means 8 has been described. However, in some cases, two or three outer leads 6 may be pressed at once. Further, although an example in which the pressing means 8 is moved up and down and pressed is shown, a pressing roller may be used, and the pressing roller may be rolled and pressed sequentially. Further, when the substrate is the glass substrate 2, the light energy 9 a is applied to the anisotropic conductive sheet 7 from the back side of the glass substrate 2 through the glass substrate 1 and the transparent electrode 3 as shown by phantom lines in FIG.
Can also be irradiated.
【００１９】次に、本発明の第２実施例を図３により説
明する。上記第１実施例では加熱方法として光エネルギ
ー９ａを照射する方法を例示したが、本実施例は熱風を
アウターリード６に吹き付けて加熱するようにしてい
る。そのため、押圧手段８に熱風通路１１を設け、この
押圧手段８を用いて接合すべきアウターリード６に対し
て集中的に熱を供給し、必要な箇所のみを効率的に加熱
するようにしている。Next, a second embodiment of the present invention will be described with reference to FIG. In the first embodiment, the method of irradiating the light energy 9a is exemplified as the heating method. However, in this embodiment, the outer lead 6 is heated by blowing hot air. Therefore, a hot air passage 11 is provided in the pressing means 8, heat is intensively supplied to the outer leads 6 to be joined using the pressing means 8, and only necessary portions are efficiently heated. .
【００２０】次に、本発明の第３実施例を図４により説
明する。上記第２実施例では押圧手段８から吹き出す熱
風にて加熱する例を示したが、本実施例では押圧手段８
自体をヒータ１２にて加熱し、この加熱された押圧手段
８にてアウターリード６を伝熱加熱するようにしてい
る。この場合、伝熱加熱であってもポイント加熱するの
で、押圧手段８の押圧部の温度制御が容易で均一な加熱
接合が可能である。Next, a third embodiment of the present invention will be described with reference to FIG. In the above-described second embodiment, an example is shown in which heating is performed by hot air blown from the pressing means 8, but in this embodiment, the pressing means 8 is heated.
The outer lead 6 itself is heated by the heater 12, and the outer lead 6 is heat-transferred and heated by the heated pressing means 8. In this case, since the point heating is performed even in the case of the heat transfer heating, the temperature control of the pressing portion of the pressing means 8 is easy and the uniform heating bonding is possible.
【００２１】以上の各実施例では、接合手段として異方
導電性シート７を用いた例を示したが、液晶表示装置１
にはガラス基板２に透明電極３に代えてアルミニウムか
ら成る電極を設け、液晶表示装置１の耐熱性の向上を図
ったものがあり、その場合には接合手段として異方導電
性シート７に代えてこの電極又はアウターリード６、又
はその両者に形成した半田メッキや半田バンプ等の接合
金属層を接合手段として用いることができ、その場合も
上記各実施例と同様に実施することにより同様の作用を
奏することができる。In each of the above embodiments, an example in which the anisotropic conductive sheet 7 is used as the joining means has been described.
There is one in which an electrode made of aluminum is provided on the glass substrate 2 in place of the transparent electrode 3 to improve the heat resistance of the liquid crystal display device 1. In this case, the anisotropic conductive sheet 7 is used as a joining means. A bonding metal layer such as a solder plating or a solder bump formed on the lever electrode and / or the outer lead 6 or both can be used as the bonding means. In this case, the same operation as in each of the above embodiments can be achieved. Can be played.
【００２２】次に、本発明の第４実施例を図５により説
明する。この実施例は接合手段として紫外線硬化性樹脂
１３を用いた例であり、ガラス基板２の透明電極３の上
に紫外線硬化性樹脂１３を塗布した後、その上にＩＣ部
品４のアウターリード６を各透明電極３に対応するよう
に配置し、押圧手段８にて順次アウターリード６を透明
電極３に向けて押圧するとともにガラス基板２の裏面側
から紫外線局部照射手段１４にて押圧している透明電極
３及びアウターリード６の近傍にのみ局部的に紫外線を
照射して押圧部位の紫外線硬化性樹脂１３を硬化させ
る。Next, a fourth embodiment of the present invention will be described with reference to FIG. In this embodiment, an ultraviolet-curable resin 13 is used as a joining means. After applying the ultraviolet-curable resin 13 on the transparent electrode 3 of the glass substrate 2, the outer leads 6 of the IC component 4 are placed thereon. The transparent electrodes 3 are arranged so as to correspond to the respective transparent electrodes 3, and the outer leads 6 are sequentially pressed toward the transparent electrodes 3 by the pressing means 8, and at the same time pressed by the ultraviolet local irradiation means 14 from the back side of the glass substrate 2. An ultraviolet ray is locally irradiated only to the vicinity of the electrode 3 and the outer lead 6 to cure the ultraviolet curable resin 13 at the pressed portion.
【００２３】この接合方法は、押圧手段８にてアウター
リード６を押圧することによってアウターリード６と透
明電極３間から紫外線硬化性樹脂１３が押し出されて両
者が電気的に接合され、その状態で紫外線硬化性樹脂１
３が硬化することによって機械的に固定接合されるもの
であり、アウターリード６、６間及び透明電極３、３間
は紫外線硬化性樹脂１３にて絶縁されている。この接合
方法においても１又は複数のアウターリード６を順次押
圧するとともにその押圧部に対して紫外線を照射して硬
化することにより、押圧手段８の平行度調整やクリーニ
ングや交換等が頻繁に必要でなくなり、容易にかつ生産
性良く信頼性の高い接合ができる。In this bonding method, the ultraviolet curable resin 13 is extruded from between the outer lead 6 and the transparent electrode 3 by pressing the outer lead 6 with the pressing means 8, and the two are electrically bonded. UV curable resin 1
3 is hardened mechanically by being cured, and the outer leads 6, 6 and the transparent electrodes 3, 3 are insulated by an ultraviolet curable resin 13. Also in this joining method, one or a plurality of outer leads 6 are sequentially pressed and the pressed portion is irradiated with ultraviolet rays to be hardened, so that the parallelism adjustment of the pressing means 8, cleaning and replacement are frequently required. The bonding can be easily performed with high productivity and high reliability.
【００２４】[0024]
【発明の効果】本発明によれば、押圧手段として技術的
に確立されているワイヤボンディングにおけるキャピラ
リと同様の手段や加圧ローラ等を適用することによっ
て、押圧手段の平行度調整やクリーニングや交換等が頻
繁に必要でなくなり、また局部加熱するので周囲に熱損
傷を与える恐れもなく、容易にかつ生産性良く信頼性の
高い接合が可能となるという効果を発揮する。また、紫
外線硬化性樹脂を用いて接合する場合も同様の効果を発
揮する。According to the present invention, the parallelism adjustment, cleaning and replacement of the pressing means are achieved by applying means similar to a capillary in wire bonding and a pressing roller, etc., which are technically established as the pressing means. And the like are not frequently required, and since the local heating is performed, there is no danger of causing thermal damage to the surroundings, so that the effect of easily and highly productively and highly reliable bonding can be achieved. Also, the same effect is exhibited when bonding is performed using an ultraviolet curable resin.
【図１】本発明の第１実施例の要部の縦断面図である。FIG. 1 is a longitudinal sectional view of a main part of a first embodiment of the present invention.
【図２】本発明の第１実施例の要部の斜視図である。FIG. 2 is a perspective view of a main part of the first embodiment of the present invention.
【図３】本発明の第２実施例の要部の縦断面図である。FIG. 3 is a longitudinal sectional view of a main part of a second embodiment of the present invention.
【図４】本発明の第３実施例の要部の縦断面図である。FIG. 4 is a longitudinal sectional view of a main part of a third embodiment of the present invention.
【図５】本発明の第４実施例の要部の縦断面図である。FIG. 5 is a longitudinal sectional view of a main part of a fourth embodiment of the present invention.
【図６】従来例の要部の縦断面図である。FIG. 6 is a longitudinal sectional view of a main part of a conventional example.
２ ガラス基板 ３ 透明電極 ４ ＩＣ部品 ６ アウターリード ７ 異方導電性シート ８ 押圧手段 ９ 光エネルギー照射手段 １１ 熱風通路 １２ ヒータ １３ 紫外線硬化性樹脂 １４ 紫外線局部照射手段 2 Glass substrate 3 Transparent electrode 4 IC component 6 Outer lead 7 Anisotropic conductive sheet 8 Pressing means 9 Light energy irradiation means 11 Hot air passage 12 Heater 13 UV curable resin 14 UV local irradiation means
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−241836（ＪＰ，Ａ) 特開 平２−252248（ＪＰ，Ａ) 特開 昭63−143854（ＪＰ，Ａ) 特開 平２−237044（ＪＰ，Ａ) 特開 平２−186653（ＪＰ，Ａ) 特開 平４−346240（ＪＰ，Ａ) 実開 昭63−177045（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 311 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A 1-241836 (JP, A) JP-A 2-252248 (JP, A) JP-A 63-143854 (JP, A) JP-A 2- 237044 (JP, A) JP-A-2-186653 (JP, A) JP-A-4-346240 (JP, A) JP-A-6-1777045 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60 311
Claims (7)
の接合材を介してＩＣ部品の各リードを配置したＩＣ部
品のリードに対して加熱する加熱手段と、前記加熱手段
とは別に前記ＩＣ部品のリードを押圧する押圧手段とを
備え、前記ＩＣ部品の各リード及び接合材を加熱手段に
よって加熱し、ＩＣ部品の１辺に隣接して設けられたリ
ードの一部である１又は複数のリードのみを単位として
順次押圧してリードと電極とを接合するＩＣ部品のリー
ド接合装置。1. A heating means for heating a lead of an IC component in which respective leads of the IC component are arranged via a resin-made bonding material on a plurality of electrodes provided on a substrate; Pressing means for pressing the leads of the IC component, wherein each lead and the bonding material of the IC component are heated by a heating means, and a rib provided adjacent to one side of the IC component is provided.
IC component leads bonding apparatus and <br/> sequentially pressing one or more leads only the units that are part of the over-de joining the leads and electrodes.
電性シートを介してＩＣ部品の各リードを配置したＩＣ
部品のリードに対して光エネルギーを照射する光エネル
ギー照射手段と前記光エネルギー照射手段とは別に前記
ＩＣ部品のリードを押圧する押圧手段とを備え、前記Ｉ
Ｃ部品の各リード及び異方導電性シートを光エネルギー
照射手段によって加熱し、ＩＣ部品の１辺に隣接して設
けられたリードの一部である１又は複数のリードのみを
単位として順次押圧してリードと電極とを接合するＩＣ
部品のリード接合装置。2. An IC in which each lead of an IC component is arranged on a plurality of electrodes provided on a substrate via an anisotropic conductive sheet.
A light energy irradiating means for irradiating light of the leads of the component; and a pressing means for pressing the leads of the IC component separately from the light energy irradiating means;
Each lead of the C component and the anisotropic conductive sheet are heated by light energy irradiating means, and are placed adjacent to one side of the IC component.
Only one or more leads that are part of the
An IC that joins leads and electrodes by pressing them sequentially as a unit
Device lead joining device.
電性シートを介してＩＣ部品の各リードを配置したＩＣ
部品のリードに対して熱風を吹き付ける熱風吹付け手段
と、前記熱風吹付け手段とは別に前記ＩＣ部品のリード
を押圧する押圧手段とを備え、前記ＩＣ部品の各リード
及び異方導電性シートを熱風によって加熱し、ＩＣ部品
の１辺に隣接して設けられたリードの一部である１又は
複数のリードのみを単位として順次押圧してリードと電
極とを接合するＩＣ部品のリード接合装置。3. An IC in which leads of an IC component are arranged on a plurality of electrodes provided on a substrate via an anisotropic conductive sheet.
Hot air blowing means for blowing hot air onto the component leads, and pressing means for pressing the leads of the IC component separately from the hot air blowing means, wherein each of the leads and the anisotropic conductive sheet of the IC component is provided. Heated by hot air, IC parts
An IC component lead bonding apparatus for sequentially pressing only one or a plurality of leads, which are part of leads provided adjacent to one side, and bonding the leads and electrodes.
電性シートを介してＩＣ部品の各リードを配置したＩＣ
部品のリードに対して光エネルギーを照射する光エネル
ギー照射手段と、前記光エネルギー照射手段とは別に前
記ＩＣ部品のリードを押圧する押圧手段とを備え、前記
ＩＣ部品の各リード及び異方導電性シートを光エネルギ
ー照射手段によって加熱し、ＩＣ部品の１辺に隣接して
設けられたリードの一部である１又は複数のリードのみ
を単位として順次押圧してリードと電極とを接合するＩ
Ｃ部品のリード接合方法。4. An IC in which each lead of an IC component is arranged on a plurality of electrodes provided on a substrate via an anisotropic conductive sheet.
A light energy irradiating means for irradiating light energy to the lead of the component, and a pressing means for pressing the lead of the IC component separately from the light energy irradiating means, wherein each lead of the IC component and anisotropic conductive The sheet is heated by the light energy irradiating means, and adjacent to one side of the IC component
Only one or more leads that are part of the provided leads
To join the lead and the electrode by sequentially pressing in units of
Lead joining method for C parts.
電性シートを介してＩＣ部品の各リードを配置したＩＣ
部品のリードに対して熱風を吹き付ける熱風吹付け手段
と、前記熱風吹付け手段とは別に前記ＩＣ部品のリード
を押圧する押圧手段とを備え、前記ＩＣ部品の各リード
及び異方導電性シートを熱風によって加熱し、ＩＣ部品
の１辺に隣接して設けられたリードの一部である１又は
複数のリードのみを単位として順次押圧してリードと電
極とを接合するＩＣ部品のリード接合方法。5. An IC in which leads of an IC component are arranged on a plurality of electrodes provided on a substrate via an anisotropic conductive sheet.
Hot air blowing means for blowing hot air onto the component leads, and pressing means for pressing the leads of the IC component separately from the hot air blowing means, wherein each of the leads and the anisotropic conductive sheet of the IC component is provided. Heated by hot air, IC parts
And a method of bonding IC components by sequentially pressing only one or a plurality of leads which are a part of the leads provided adjacent to one side to bond the leads and the electrodes.
硬化性樹脂を塗布する工程と、紫外線硬化性樹脂を介し
て電極上にＩＣ部品の各リードを配置する工程と、ＩＣ
部品の１辺に隣接して設けられたリードの一部である１
又は複数のリードのみを単位として押圧手段にて順次押
圧するとともに各リードの押圧部に紫外線を照射してリ
ードと電極とを接合する工程とを有するＩＣ部品のリー
ド接合方法。6. A process for applying a UV-curable resin onto a plurality of electrodes provided on the substrate, placing the leads of the IC component on the electrode via an ultraviolet curing resin, IC
1 which is a part of a lead provided adjacent to one side of the component
Alternatively, a method of bonding IC components to a lead, comprising the steps of sequentially pressing the leads by pressing means in units of only a plurality of leads and irradiating a pressing portion of each lead with ultraviolet rays to bond the leads and the electrodes.
の接合材を介してＩＣ部品の各リードを配置し、前記Ｉ
Ｃ部品の各リード及び接合材を加熱手段によって加熱
し、ＩＣ部品の１辺に隣接して設けられたリードの一部
である１又は複数のリードのみを単位として順次押圧し
てリードと電極とを接合するＩＣ部品のリード接合方
法。7. Each lead of an IC component is arranged on a plurality of electrodes provided on a substrate via a resin bonding material,
Each lead of the C component and the bonding material are heated by a heating means, and a part of the lead provided adjacent to one side of the IC component
And a method of bonding IC components by sequentially pressing only one or a plurality of leads as a unit to bond leads and electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11848091A JP3152449B2 (en) | 1991-05-23 | 1991-05-23 | Lead bonding apparatus and method for IC parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11848091A JP3152449B2 (en) | 1991-05-23 | 1991-05-23 | Lead bonding apparatus and method for IC parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04346237A JPH04346237A (en) | 1992-12-02 |
| JP3152449B2 true JP3152449B2 (en) | 2001-04-03 |
Family
ID=14737720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11848091A Expired - Fee Related JP3152449B2 (en) | 1991-05-23 | 1991-05-23 | Lead bonding apparatus and method for IC parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3152449B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581972B (en) * | 2012-03-23 | 2017-05-11 | Dexerials Corp | A method of manufacturing a connecting body, and a method of connecting an electronic component |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6291165B2 (en) * | 2013-03-15 | 2018-03-14 | デクセリアルズ株式会社 | Manufacturing method of connecting body and connecting method of electronic component |
-
1991
- 1991-05-23 JP JP11848091A patent/JP3152449B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581972B (en) * | 2012-03-23 | 2017-05-11 | Dexerials Corp | A method of manufacturing a connecting body, and a method of connecting an electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04346237A (en) | 1992-12-02 |
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