JP2556884Y2 - Building board - Google Patents
Building boardInfo
- Publication number
- JP2556884Y2 JP2556884Y2 JP1993026232U JP2623293U JP2556884Y2 JP 2556884 Y2 JP2556884 Y2 JP 2556884Y2 JP 1993026232 U JP1993026232 U JP 1993026232U JP 2623293 U JP2623293 U JP 2623293U JP 2556884 Y2 JP2556884 Y2 JP 2556884Y2
- Authority
- JP
- Japan
- Prior art keywords
- building board
- thickness
- plywood
- less
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Finishing Walls (AREA)
- Panels For Use In Building Construction (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、厚みが薄くてもサネ強
度の大きい建築板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a building board having a high resilience even though it is thin.
【０００２】[0002]
【従来技術とその欠点】従来、全厚６ｍｍ以下の合板、
ＭＤＦ等の木質系板材にサネ加工を施して建築板を形成
する場合、サネ部分の厚みが木質基材の全厚みのうち、
その略３分の１の２ｍｍ程度しかとれないために非常に
弱く、テノ−ナ−等を用いてサネ加工している最中や施
工、運搬時にサネ部分が割れるという問題点があった。
特にサネ加工部分にＭＤＦのようなそれ程強度がない材
料がくれば問題が大きかった。2. Description of the Related Art Conventionally, plywood with a total thickness of 6 mm or less has been used.
When a building board is formed by subjecting a wood-based board material such as MDF to burring, the thickness of the burring portion is, of the total thickness of the wood base material,
It is very weak because it can only take about one-third of about 2 mm, and there is a problem in that the part of the seed is cracked during the processing of the seed using a tenor or the like, or during the construction or transportation.
In particular, if a material having a relatively low strength, such as MDF, is used in the portion to be processed, the problem is serious.
【０００３】[0003]
【課題を解決するための手段】本考案は、「二枚の木質
系板材と、該二枚の木質系板材に挟まれた厚み０．５ｍ
ｍ以下の樹脂含浸紙または和紙または不織布からなるシ
ートによって構成された全厚６ｍｍ以下の建築板におい
て、該シートが該建築板に施されたサネの厚み方向の略
中央部に位置するようにした建築板。」を提供すること
に係る。本考案において使用できる木質系板材とは、合
板、ＭＤＦ、パーティクルボード等を指し、シートとは
フェノール樹脂、メラミン樹脂、尿素樹脂等の樹脂を含
浸させた樹脂含浸紙以外に和紙、不織布の厚みに関係な
く引っ張り強度の大きいものが使用できる。なお、建築
板の厚みを６ｍｍ以下としたのは、これより厚ければサ
ネの厚みも十分に取ることができ、中間にシートをサン
ドイッチする必要がないからである。また、シートの厚
みを０．５ｍｍ以下としたのは、０．５ｍｍを超えると
全体の厚みにまで影響し、厚みの薄い建築板を得ること
ができないからである。Means for Solving the Problems The present invention is based on the following object: "Two wood-based boards and a thickness of 0.5 m between the two wood-based boards.
m or less, in a building board having a total thickness of 6 mm or less made of a sheet made of resin-impregnated paper or Japanese paper or a nonwoven fabric having a thickness of about m or less, the sheet is provided at a substantially central portion in the thickness direction of the sash applied to the building board. Architectural board to be located in. ”. The wood-based board material that can be used in the present invention refers to plywood, MDF, particle board, etc., and the sheet refers to the thickness of Japanese paper and nonwoven fabric in addition to resin-impregnated paper impregnated with resins such as phenolic resin, melamine resin, and urea resin. Irrespective of the tensile strength, it can be used. The reason why the thickness of the building board is set to 6 mm or less is that if the thickness is larger than this, the thickness of the seeds can be sufficiently increased, and it is not necessary to sandwich the sheet in the middle. The reason why the thickness of the sheet is set to 0.5 mm or less is that if the thickness exceeds 0.5 mm, the entire thickness is affected, and a thin building board cannot be obtained.
【０００４】[0004]
【考案の効果】全厚６ｍｍ以下の建築板を形成する場合
でも建築板のサネ部が形成される場所に位置するように
また、全厚が６ｍｍを越えないように厚み０．５ｍｍ以
下の樹脂含浸紙または和紙または不織布からなるシート
が挟着されているためサネの強度が大きくなり、サネ加
工時や施工、運搬時に割れが生じない、厚みの薄い建築
板を得ることができる。[Effects of the Invention] Even when a building board having a total thickness of 6 mm or less is formed, a resin having a thickness of 0.5 mm or less is to be located at a place where the reed portion of the building board is formed and so that the total thickness does not exceed 6 mm. Since the sheet made of impregnated paper, Japanese paper or nonwoven fabric is sandwiched between the sheets, the strength of the seeds is increased, and a thin building board that does not crack during seed processing, construction, or transportation can be obtained.
【０００５】[0005]
【実施例１】図１に示すように厚み１．３ｍｍの単板１
に接着剤を塗布し、２枚を繊維方向が直交するように貼
り合せたものを２組用意し、次に、図２のようにそのう
ちの１組の合板の表面部に接着剤を塗布した後、厚み
０．２ｍｍの不織布２を貼着した。次に該不織布２の表
面部に接着剤を塗布し、その上にもう１組の合板を重ね
合わせ、合板基材３を形成した。次に、図３に示すよう
に合板基材３を三分割した後、テノ−ナ−を用いて、合
板基材３の四周に図４に示すような雌ザネと雄ザネ４を
形成し、建築板５を製造した。EXAMPLE 1 A single plate 1 having a thickness of 1.3 mm as shown in FIG.
An adhesive was applied, and two sets were prepared by laminating two sheets so that the fiber directions were orthogonal to each other. Then, as shown in FIG. 2, the adhesive was applied to the surface of one set of plywood. Thereafter, a nonwoven fabric 2 having a thickness of 0.2 mm was attached. Next, an adhesive was applied to the surface portion of the nonwoven fabric 2, and another set of plywood was superimposed thereon to form a plywood substrate 3. Next, as shown in FIG. 3, after the plywood base material 3 is divided into three parts, a female seed and a male seed 4 as shown in FIG. 4 are formed around the plywood base 3 using a tenoner. Building board 5 was manufactured.
【０００６】[0006]
【実施例２】図５に示すように厚み２．５ｍｍのＭＤＦ
６を２枚用意し、表裏両面に接着剤を塗布した厚み０．
３ｍｍのレジンシ−ト７を２枚のＭＤＦ６の間に挟み、
貼着した。次に図６に示すようにＭＤＦ基材８を分割し
た後、テノ−ナ−を用いて分割された各ＭＤＦ基材８に
図７に示すような雌ザネと雄ザネ９を形成し、建築板１
０を製造した。Embodiment 2 As shown in FIG. 5, a 2.5 mm thick MDF
6 was prepared, and an adhesive was applied on both front and back surfaces to a thickness of 0.
A 3 mm resin sheet 7 is sandwiched between two MDFs 6,
Affixed. Next, after dividing the MDF base material 8 as shown in FIG. 6, female and male gantry 9 as shown in FIG. 7 are formed on each of the divided MDF base materials 8 using a tenor. Board 1
0 was produced.
【０００７】[0007]
【図１】本考案の実施例１に係り、２枚を貼り合せて形
成した２組の合板の斜視図である。FIG. 1 is a perspective view of two sets of plywood formed by bonding two sheets according to a first embodiment of the present invention.
【図２】本考案の実施例１に係る２組の合板と、その間
に挟まれ貼着される不織布との位置関係を示す斜視図で
ある。FIG. 2 is a perspective view showing a positional relationship between two sets of plywood according to the first embodiment of the present invention and a nonwoven fabric sandwiched and adhered therebetween.
【図３】本考案の実施例１に係り、建築板の原型を形成
するために分割された合板基材の斜視図である。FIG. 3 is a perspective view of a plywood substrate divided to form a building board prototype according to the first embodiment of the present invention.
【図４】本考案の実施例１に係り、分割された合板基材
にサネを形成した建築板の斜視図である。FIG. 4 is a perspective view of a building board according to the first embodiment of the present invention, in which plywood is formed on a divided plywood substrate.
【図５】本考案の実施例２に係る２枚のＭＤＦと、その
間に挟まれ貼着されるレジンシ−トとの位置関係を示す
斜視図である。FIG. 5 is a perspective view showing a positional relationship between two MDFs according to a second embodiment of the present invention and a resin sheet sandwiched and adhered therebetween.
【図６】本考案の実施例２に係る分割されたＭＤＦ基材
である。FIG. 6 is a divided MDF substrate according to a second embodiment of the present invention.
【図７】本考案の実施例２に係り、分割されたＭＤＦ基
材にサネを形成した建築板の斜視図である。FIG. 7 is a perspective view of a building board according to a second embodiment of the present invention, in which a split is formed on a divided MDF substrate.
１ 単板 ２ 不織布 ３ 合板基材 ４ サネ ５ 建築板 ６ ＭＤＦ ７ レジンシ−ト ８ ＭＤＦ基材 ９ サネ １０ 建築板 DESCRIPTION OF SYMBOLS 1 Single board 2 Nonwoven fabric 3 Plywood base material 4 Sane 5 Building board 6 MDF 7 Resin sheet 8 MDF base material 9 Sane 10 Building board
Claims (1)
材に挟まれた厚み０．５ｍｍ以下の樹脂含浸紙または和
紙または不織布からなるシートによって構成された全厚
６ｍｍ以下の建築板において、該シートが該建築板に施
されたサネの厚み方向の略中央部に位置するようにした
建築板。1. A wood impregnated paper having a thickness of 0.5 mm or less sandwiched between two wood-based boards,
In total thickness 6mm or less of the building board constituted by a sheet made of paper or nonwoven fabric, building board to which the sheet is to be positioned at a substantially central portion in the thickness direction of Sane decorated with the building board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993026232U JP2556884Y2 (en) | 1993-04-20 | 1993-04-20 | Building board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1993026232U JP2556884Y2 (en) | 1993-04-20 | 1993-04-20 | Building board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0678430U JPH0678430U (en) | 1994-11-04 |
| JP2556884Y2 true JP2556884Y2 (en) | 1997-12-08 |
Family
ID=12187594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1993026232U Expired - Lifetime JP2556884Y2 (en) | 1993-04-20 | 1993-04-20 | Building board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2556884Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0445837U (en) * | 1990-08-22 | 1992-04-17 |
-
1993
- 1993-04-20 JP JP1993026232U patent/JP2556884Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0678430U (en) | 1994-11-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970107 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970701 |
|
| EXPY | Cancellation because of completion of term |