JPH0678430U - Building board - Google Patents
Building boardInfo
- Publication number
- JPH0678430U JPH0678430U JP2623293U JP2623293U JPH0678430U JP H0678430 U JPH0678430 U JP H0678430U JP 2623293 U JP2623293 U JP 2623293U JP 2623293 U JP2623293 U JP 2623293U JP H0678430 U JPH0678430 U JP H0678430U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- building board
- sheet
- base material
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finishing Walls (AREA)
- Panels For Use In Building Construction (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】
【目的】 厚みが薄くてもサネ強度の大きい建築板を得
る。
【構成】表裏両面に接着剤を塗布した厚み0.2mmの
レジンシ−トを二枚のMDFで挟んで貼着した後、厚み
方向中央部に該シ−トが位置するように木質基材にサネ
加工を施す。
(57) [Summary] [Purpose] To obtain a building board that has a high sane strength even if it is thin. [Structure] A resin sheet having a thickness of 0.2 mm, which is coated with an adhesive on both front and back sides, is sandwiched between two MDFs and attached, and then the sheet is placed on a wooden base material so that the sheet is positioned at the center in the thickness direction. Apply sane processing.
Description
【0001】[0001]
本考案は、厚みが薄くてもサネ強度の大きい建築板に関するものである。 The present invention relates to a building board which has a large thickness even though it has a small thickness.
【0002】[0002]
従来、全厚6mm以下の合板、MDF等の木質系板材にサネ加工を施して建築 板を形成する場合、サネ部分の厚みが木質基材の全厚みのうち、その略3分の1 の2mm程度しかとれないために非常に弱く、テノ−ナ−等を用いてサネ加工し ている最中や施工、運搬時にサネ部分が割れるという問題点があった。特にサネ 加工部分にMDFのようなそれ程強度がない材料がくれば問題が大きかった。 Conventionally, when a building board is formed by applying a shading process to a wood-based board material with a total thickness of 6 mm or less, such as MDF, the thickness of the shading part is about 1/3 of the total thickness of the wood-based material, which is 2 mm. Since it can only be taken to a certain degree, it is very weak, and there was a problem that the sprouting part cracks during the sane processing using a tenor or the like, or during construction or transportation. In particular, if a material such as MDF that is not so strong comes to be used for the shading portion, the problem is serious.
【0003】[0003]
本考案は、「二枚の木質系板材と、該二枚の木質系板材に挟まれた厚み0.5 mm以下のシ−トによって構成された全厚6mm以下の建築板において、該シ− トが該木質基材に施されたサネの厚み方向の略中央部に位置するようにした建築 板。」を提供することに係る。 本考案において使用できる木質系板材とは、合板、MDF、パ−ティクルボ−ド 等を指し、シ−トとはフェノ−ル樹脂、メラミン樹脂、尿素樹脂等の樹脂を含浸 させた樹脂含浸紙以外に和紙、不織布等の引っ張り強度の大きいものが使用でき る。なお、建築板の厚みを6mm以下としたのは、これより厚ければサネの厚み も十分にとることができ、中間にシ−トをサンドイッチする必要がないからであ る。 また、シ−トの厚みを0.5mm以下としたのは、0.5mmを越えると全体 の厚みにまで影響し、厚みの薄い建築板を得ることができないからである。 The present invention provides a construction board having a total thickness of 6 mm or less, which is composed of two wood-based boards and a sheet sandwiched between the two wood-based boards and having a thickness of 0.5 mm or less. The construction board in which the toe is located substantially in the center in the thickness direction of the seeds applied to the wooden base material. " The wood board which can be used in the present invention refers to plywood, MDF, particle board and the like, and the sheet is other than resin impregnated paper impregnated with resin such as phenol resin, melamine resin and urea resin. It is possible to use Japanese paper, non-woven fabric, etc. with high tensile strength. The thickness of the building board is set to 6 mm or less because if it is thicker than this, the thickness of the hood can be sufficient and it is not necessary to sandwich the sheet in the middle. The reason why the thickness of the sheet is set to 0.5 mm or less is that if it exceeds 0.5 mm, the entire thickness is affected and a thin building board cannot be obtained.
【0004】[0004]
建築板のサネ部が形成される場所に位置するようにシ−トが挟着されているた めサネの強度が大きくなり、サネ加工時や施工、運搬時に割れが生じない、厚み の薄い建築板を得ることができる。 Since the sheet is sandwiched so that it is located in the place where the cane part of the building board is formed, the strength of the cane is increased, and there is no cracking during the canning process, construction, or transportation. The board can be obtained.
【0005】[0005]
【実施例1】 図1に示すように厚み1.3mmの単板1に接着剤を塗布し、2枚を繊維方向 が直交するように貼り合せたものを2組用意し、次に、図2のようにそのうちの 1組の合板の表面部に接着剤を塗布した後、厚み0.2mmの不織布2を貼着し た。次に該不織布2の表面部に接着剤を塗布し、その上にもう1組の合板を重ね 合わせ、合板基材3を形成した。次に、図3に示すように合板基材3を三分割し た後、テノ−ナ−を用いて、合板基材3の四周に図4に示すような雌ザネと雄ザ ネ4を形成し、建築板5を製造した。Example 1 As shown in FIG. 1, an adhesive was applied to a veneer 1 having a thickness of 1.3 mm and two sets were prepared by laminating two sheets so that the fiber directions were orthogonal to each other. After applying an adhesive to the surface of one set of plywood as in 2, a non-woven fabric 2 having a thickness of 0.2 mm was attached. Next, an adhesive was applied to the surface of the non-woven fabric 2, and another set of plywood was laminated thereon to form a plywood base material 3. Next, as shown in FIG. 3, the plywood base material 3 is divided into three parts, and then a tenor is used to form female and male zones 4 on the four circumferences of the plywood base material 3 as shown in FIG. Then, the building board 5 was manufactured.
【0006】[0006]
【実施例2】 図5に示すように厚み2.5mmのMDF6を2枚用意し、表裏両面に接着剤 を塗布した厚み0.3mmのレジンシ−ト7を2枚のMDF6の間に挟み、貼着 した。次に図6に示すようにMDF基材8を分割した後、テノ−ナ−を用いて分 割された各MDF基材8に図7に示すような雌ザネと雄ザネ9を形成し、建築板 10を製造した。Example 2 As shown in FIG. 5, two sheets of MDF 6 having a thickness of 2.5 mm were prepared, and a resin sheet 7 having a thickness of 0.3 mm having an adhesive applied on both front and back surfaces was sandwiched between the two sheets of MDF 6. I attached it. Next, after dividing the MDF substrate 8 as shown in FIG. 6, female and male zones 9 as shown in FIG. 7 are formed on each MDF substrate 8 divided by using a tenor. A building board 10 was manufactured.
【0007】[0007]
【図1】本考案の実施例1に係り、2枚を貼り合せて形
成した2組の合板の斜視図である。FIG. 1 is a perspective view of two sets of plywood formed by bonding two sheets according to the first embodiment of the present invention.
【図2】本考案の実施例1に係る2組の合板と、その間
に挟まれ貼着される不織布との位置関係を示す斜視図で
ある。FIG. 2 is a perspective view showing a positional relationship between two sets of plywood according to the first embodiment of the present invention and a nonwoven fabric sandwiched and affixed therebetween.
【図3】本考案の実施例1に係り、建築板の原型を形成
するために分割された合板基材の斜視図である。FIG. 3 is a perspective view of a plywood base material divided to form a prototype of a building board according to the first embodiment of the present invention.
【図4】本考案の実施例1に係り、分割された合板基材
にサネを形成した建築板の斜視図である。FIG. 4 is a perspective view of a building board according to the first embodiment of the present invention, in which awning is formed on a divided plywood base material.
【図5】本考案の実施例2に係る2枚のMDFと、その
間に挟まれ貼着されるレジンシ−トとの位置関係を示す
斜視図である。FIG. 5 is a perspective view showing a positional relationship between two MDFs according to the second embodiment of the present invention and a resin sheet sandwiched and affixed therebetween.
【図6】本考案の実施例2に係る分割されたMDF基材
である。FIG. 6 is a divided MDF substrate according to a second embodiment of the present invention.
【図7】本考案の実施例2に係り、分割されたMDF基
材にサネを形成した建築板の斜視図である。FIG. 7 is a perspective view of a building board according to a second embodiment of the present invention, in which a awning is formed on a divided MDF base material.
1 単板 2 不織布 3 合板基材 4 サネ 5 建築板 6 MDF 7 レジンシ−ト 8 MDF基材 9 サネ 10 建築板 DESCRIPTION OF SYMBOLS 1 Single plate 2 Nonwoven fabric 3 Plywood base material 4 Panel 5 Building board 6 MDF 7 Resin sheet 8 MDF base material 9 Panel 10 Building board
Claims (1)
材に挟まれた厚み0.5mm以下のシ−トによって構成
された全厚6mm以下の建築板において、該シ−トが該
木質基材に施されたサネの厚み方向の略中央部に位置す
るようにした建築板。1. A building board having a total thickness of 6 mm or less, which is composed of two wood-based board materials and a sheet having a thickness of 0.5 mm or less sandwiched between the two wood-based board materials. Is a building board which is located substantially at the center in the thickness direction of the seeds applied to the wooden base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1993026232U JP2556884Y2 (en) | 1993-04-20 | 1993-04-20 | Building board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1993026232U JP2556884Y2 (en) | 1993-04-20 | 1993-04-20 | Building board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0678430U true JPH0678430U (en) | 1994-11-04 |
JP2556884Y2 JP2556884Y2 (en) | 1997-12-08 |
Family
ID=12187594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1993026232U Expired - Lifetime JP2556884Y2 (en) | 1993-04-20 | 1993-04-20 | Building board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2556884Y2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0445837U (en) * | 1990-08-22 | 1992-04-17 |
-
1993
- 1993-04-20 JP JP1993026232U patent/JP2556884Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0445837U (en) * | 1990-08-22 | 1992-04-17 |
Also Published As
Publication number | Publication date |
---|---|
JP2556884Y2 (en) | 1997-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970107 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970701 |
|
EXPY | Cancellation because of completion of term |