JP2528646Y2 - Wafer for electric parts - Google Patents
Wafer for electric partsInfo
- Publication number
- JP2528646Y2 JP2528646Y2 JP10590990U JP10590990U JP2528646Y2 JP 2528646 Y2 JP2528646 Y2 JP 2528646Y2 JP 10590990 U JP10590990 U JP 10590990U JP 10590990 U JP10590990 U JP 10590990U JP 2528646 Y2 JP2528646 Y2 JP 2528646Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- punch
- resin
- connecting piece
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacture Of Switches (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電気部品用ウエハー、特に埋め込み成形後
に、端子部の連結片とその周辺の樹脂部とが同時にポン
チで打ち抜き加工される電気部品用ウエハーに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application field] The present invention relates to a wafer for electric parts, particularly for electric parts in which a connecting piece of a terminal part and a resin part around the same are simultaneously punched with a punch after embedding molding. For wafers.
第３図（ａ）〜（ｄ）及び第４図はこの種の従来の電
気部品用ウエハーを説明する図であり、第４図に示すよ
うにウエハー１は共通端子２、接点端子3,3……、これ
らの共通端子２、接点端子３からそれぞれ延設された取
出端子4,4……などが樹脂材に埋め込み成形されてい
る。3 (a) to 3 (d) and FIG. 4 are views for explaining this kind of conventional electric component wafer. As shown in FIG. 4, the wafer 1 has a common terminal 2 and contact terminals 3,3. .., The extraction terminals 4 extending from the common terminal 2 and the contact terminal 3, respectively, are embedded in a resin material and molded.
これらの各端子2,3,4は板材を打ち抜き成形してフー
プ材とし、このフープ材に樹脂成形しているので、各端
子2,3,4の配置がずれないように各端子2,3,4間は所定個
所で連結片５によつて連結されており、樹脂成形後、ポ
ンチで打ち抜き加工して連結片５を切断し、所望の回路
としていた。６は連結片５の打ち抜きにより生じた孔で
ある。These terminals 2, 3, and 4 are formed by stamping a plate material into a hoop material and resin-molding the hoop material, so that the terminals 2, 3, and 4 are not misaligned. 4 are connected at predetermined locations by connecting pieces 5, and after resin molding, the connecting pieces 5 are cut by punching with a punch to form a desired circuit. Reference numeral 6 denotes a hole formed by punching the connecting piece 5.
ところで、前記従来技術では、前述した打ち抜き加工
は、第３図（ａ）〜（ｄ）に示すようにして行われる。
打ち抜き加工部分においては、連結片５とその周辺の樹
脂部1a,1aとは、同一面になつており、表面側と背面側
にそれぞれ凹部1b、1cが形成されている。この表面側の
凹部1bの径は、ポンチ11の径よりも大きく設定され、背
面側の凹部1cの径は表面側の凹部1bの径よりも大きく設
定されている。By the way, in the prior art, the above-described punching is performed as shown in FIGS. 3 (a) to 3 (d).
In the punched portion, the connecting piece 5 and the resin portions 1a, 1a around the connecting piece 5 are flush with each other, and concave portions 1b, 1c are formed on the front side and the back side, respectively. The diameter of the concave portion 1b on the front side is set larger than the diameter of the punch 11, and the diameter of the concave portion 1c on the back side is set larger than the diameter of the concave portion 1b on the front side.
このようなウエハー１をポンチ11の径よりも僅かに大
きな開口端部径を有し、その径が内部で拡大しているダ
イ入子12上に、第３図（ａ）に示すように載置し、同図
（ｂ）に矢印で示すようにポンチ11を押し込んで、連結
片５と周辺の樹脂部1aの一部を切断する。この切断によ
つて同図（ｃ）に示すように、打ち抜き加工部分におい
て、連結片５とその周辺の樹脂部1a、1aの一部が切り落
され、基板１には孔６が形成される。そして、この連結
片５と、その周辺の樹脂部切断片７、７とはばらばらに
分離する。比較的重い連結片５はダイ入子12の開口内を
落下して行くが、軽い樹脂部切断片７、７は、第３図
（ｄ）に示すようにポンチ11の端面に付いている潤滑油
によつてポンチ11の端面に付着することがある。As shown in FIG. 3 (a), such a wafer 1 is mounted on a die insert 12 having an opening end diameter slightly larger than the diameter of the punch 11 and having an enlarged diameter inside. The punch 11 is pushed in as shown by the arrow in FIG. 4B to cut off the connecting piece 5 and a part of the peripheral resin portion 1a. By this cutting, as shown in FIG. 3C, in the punched portion, the connecting piece 5 and a part of the resin portions 1a, 1a around it are cut off, and a hole 6 is formed in the substrate 1. . Then, the connecting piece 5 and the resin portion cut pieces 7, 7 around the connecting piece 5 are separated separately. The relatively heavy connecting piece 5 falls through the opening of the die insert 12, but the light resin portion cut pieces 7, 7 are lubricated on the end face of the punch 11 as shown in FIG. The oil may adhere to the end face of the punch 11.
また、樹脂部切断片７、７が、ダイ入子12の開口内を
落下する過程で静電気によつて、ダイ入子12の開口の周
面に付着することもある。In addition, the resin pieces 7, 7 may adhere to the peripheral surface of the opening of the die insert 12 due to static electricity in the process of falling through the opening of the die insert 12.
これら状態で、ウエハーの次の加工個所にポンチ11を
押し込むと、ポンチ11の端面の前面がウエハー１の加工
面に正しく当接せずに打ち抜きが行われる。このため、
打ち抜き加工部が歪んだり、場合によつてはウエハー１
が損傷することもある。また、ポンチ11がダイ入子12の
開口内をスムーズに通過しなくなつて打ち抜き加工に支
障が生じる虞れもある。In this state, when the punch 11 is pushed into the next processing position of the wafer, the punching is performed without the front surface of the end face of the punch 11 properly contacting the processing surface of the wafer 1. For this reason,
The punched part may be distorted or, in some cases, the wafer 1
May be damaged. Further, the punch 11 may not pass through the opening of the die insert 12 smoothly, and there is a possibility that the punching process may be hindered.
本考案は、前述した従来技術の課題に鑑みてなされた
ものであり、その目的は、打ち抜き加工時に連結片とと
もに打ち抜かれる樹脂部が、ポンチの端面に付着した
り、ダイ入子の開口の周面に付着したりすることのない
電気部品用ウエハーを提供することにある。The present invention has been made in view of the above-mentioned problems of the prior art, and the purpose is to make a resin portion punched together with a connecting piece at the time of a punching process adhere to an end face of a punch or to form a periphery of an opening of a die insert. An object of the present invention is to provide a wafer for electric parts which does not adhere to a surface.
前記目的を達成するために、本考案は、端子部を埋め
込み成形後に、前記端子部の連結片とその周辺の樹脂部
とを同時にポンチで打ち抜き加工して回路を構成する電
気部品ウエハーにおいて、前記打ち抜き個所の前記連結
片の両側の樹脂を互いに接続する接続部を設けた構成に
してある。In order to achieve the above object, the present invention provides an electric component wafer in which a terminal portion is embedded and molded, and a connecting piece of the terminal portion and a resin portion around the terminal portion are simultaneously punched with a punch to form a circuit. A connecting portion for connecting the resin on both sides of the connecting piece at the punching position is provided.
前記手段により、ポンチで打ち抜き加工が行われる
と、連結片の両側の樹脂部が、互いに接続する接続部に
よつて、打ち抜かれる連結片を包むようにして一体に打
ち抜かれる。When the punching process is performed by the punch by the means, the resin portions on both sides of the connecting piece are integrally punched by the connecting portions connected to each other so as to wrap the connecting piece to be punched.
したがつて、重い連結片を包み込んだ樹脂部切断片及
び接続部は、ポンチの端面やダイ入子の開口の周面に付
着することなく、連結片と一体に落下する。Accordingly, the resin cut piece and the connection portion enclosing the heavy connection piece fall together with the connection piece without adhering to the end face of the punch or the peripheral surface of the opening of the die insert.
以下、本考案の一実施例を図面を参照して説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）及び第２図（ａ）、（ｂ）は、
実施例を説明する図であり、第１図（ａ）、（ｂ）はウ
エハーの打ち抜き加工前のそれぞれ要部平面図及び断面
図、第２図（ａ）、（ｂ）はウエハーの被打ち抜き片の
それぞれ正面図及び平面図である。なお、第１図
（ａ）、（ｂ）及び第２図（ａ）、（ｂ）において、す
でに説明した第３図（ａ）〜（ｄ）及び第４図と同一部
分には同一符号を付して詳細な説明を省略する。FIGS. 1 (a) and (b) and FIGS. 2 (a) and (b)
FIGS. 1 (a) and 1 (b) are plan views and cross-sectional views of essential parts before punching a wafer, and FIGS. 1 (a) and 1 (b) are punched wafers. It is the front view and top view of a piece, respectively. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b), the same parts as those in FIGS. 3 (a) to 3 (d) and FIG. The detailed description is omitted.
第１図（ａ）、（ｂ）に示すように、打ち抜き加工さ
れる位置の連結片５の両側の樹脂部1a、1aには、連結片
５の下面を横切って樹脂部1a、1aを互いに接続する接続
部13が、樹脂材で凹部1c側に一体形成されている。As shown in FIGS. 1 (a) and 1 (b), the resin portions 1a, 1a on both sides of the connecting piece 5 at the position where the punching process is performed are attached to the resin portions 1a, 1a across the lower surface of the connecting piece 5. The connecting portion 13 to be connected is integrally formed on the concave portion 1c side with a resin material.
実施例においても、すでに第３図（ａ）〜（ｄ）を参
照して従来のウエハーについて説明したようにしてウエ
ハー１をダイ入子12上に載置し、ポンチ11によつて打ち
抜き加工が行われる。そして、本実施例ではポンチ11を
凹部1b内に押し込んで打ち抜きを行うと、ウエハー１か
らは、第２図（ａ）、（ｂ）に示すように、連結片５と
この連結片５を包み込むように一体化されている樹脂部
切断片７、７及び接続部13とが、一体に打ち抜かれ、ダ
イ入子12の開口内を一体に落下する。Also in the embodiment, the wafer 1 is placed on the die insert 12 as described with reference to FIGS. 3A to 3D for the conventional wafer, and the punching process is performed by the punch 11. Done. In this embodiment, when the punch 11 is pressed into the recess 1b and punched out, the connecting piece 5 and the connecting piece 5 are wrapped from the wafer 1 as shown in FIGS. 2 (a) and 2 (b). The resin portion cut pieces 7, 7 and the connecting portion 13 integrated as described above are punched out integrally, and fall integrally in the opening of the die insert 12.
従って、従来のように樹脂材の切断片がポンチの端面
に付着したり、あるいは落下の過程で樹脂材の切断片が
ダイ入子12の開口の周面に付着したりすることがない。
このため、次の打ち抜き加工時に樹脂材の切断片の付着
したポンチの端面が、ウエハー１の被加工部に当接し
て、打ち抜き加工部が歪んだりウエハー１が損傷するこ
とがない。また、ダイ入子12の開口の周面に付着した樹
脂材の切断片が、ダイ入子12の開口内をスムーズに通過
し、打ち抜き加工の支障とならない。Accordingly, unlike the related art, the cut piece of the resin material does not adhere to the end face of the punch, or the cut piece of the resin material does not adhere to the peripheral surface of the opening of the die insert 12 during the falling process.
For this reason, the end face of the punch to which the cut piece of the resin material adheres at the time of the next punching process does not come into contact with the processed portion of the wafer 1, so that the punched portion is not distorted and the wafer 1 is not damaged. Further, the cut piece of the resin material adhered to the peripheral surface of the opening of the die insert 12 smoothly passes through the opening of the die insert 12 and does not hinder the punching process.
以上説明したように、本考案によれば、打ち抜き加工
時に連結片とともに打ち抜かれる樹脂部が、ポンチの端
面に付着したり、ダイ入子の開口の周面に付着したりす
ることのない電気部品用ウエハーを提供できる。As described above, according to the present invention, an electric component that does not adhere to the end face of the punch or the peripheral surface of the opening of the die insert, because the resin portion that is punched together with the connecting piece during the punching process does not adhere. Can be provided.
第１図（ａ）、（ｂ）及び第２図（ａ）、（ｂ）は本考
案の一実施例を説明するためのもので、第１図（ａ）、
（ｂ）はウエハーのそれぞれ要部平面図及び断面図、第
２図（ａ）、（ｂ）はウエハーの被打ち抜き片の正面図
及び平面図、第３図（ａ）〜（ｄ）及び第４図は従来の
電気部品用ウエハーを説明するためのもので、第３図
（ａ）〜（ｄ）は打ち抜き加工の各工程を示す説明図、
第４図は電気部品用ウエハーの平面図である。 １……ウエハー、1a……樹脂部、2,3,4……端子部、11
……ポンチ、12……ダイ入子、13……接続部。FIGS. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b) are for explaining one embodiment of the present invention, and FIGS.
(B) is a plan view and a cross-sectional view of a principal part of the wafer, respectively. FIGS. 2 (a) and (b) are a front view and a plan view of a punched piece of the wafer, and FIGS. 3 (a) to (d) and FIG. FIG. 4 is a view for explaining a conventional electric component wafer, and FIGS. 3 (a) to 3 (d) are explanatory views showing steps of punching.
FIG. 4 is a plan view of the electric component wafer. 1 ... wafer, 1a ... resin part, 2,3,4 ... terminal part, 11
... punch, 12 ... die insert, 13 ... connection part.
Claims (1)
連結片とその周辺の樹脂部とを同時にポンチで打ち抜き
加工して回路を構成する電気部品ウエハーにおいて、前
記打ち抜き個所の前記連結片の両側の樹脂を互いに接続
する接続部を設けたことを特徴とする電気部品用ウエハ
ー。An electric component wafer for forming a circuit by simultaneously punching a connecting piece of the terminal part and a resin part around the terminal part with a punch after embedding and molding the terminal part, wherein the connecting piece of the punching part is formed. A wafer for an electric component, comprising a connecting portion for connecting resins on both sides to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10590990U JP2528646Y2 (en) | 1990-10-11 | 1990-10-11 | Wafer for electric parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10590990U JP2528646Y2 (en) | 1990-10-11 | 1990-10-11 | Wafer for electric parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463512U JPH0463512U (en) | 1992-05-29 |
| JP2528646Y2 true JP2528646Y2 (en) | 1997-03-12 |
Family
ID=31851789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10590990U Expired - Fee Related JP2528646Y2 (en) | 1990-10-11 | 1990-10-11 | Wafer for electric parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528646Y2 (en) |
-
1990
- 1990-10-11 JP JP10590990U patent/JP2528646Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0463512U (en) | 1992-05-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |