JP2519222B2 - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JP2519222B2 JP2519222B2 JP61262805A JP26280586A JP2519222B2 JP 2519222 B2 JP2519222 B2 JP 2519222B2 JP 61262805 A JP61262805 A JP 61262805A JP 26280586 A JP26280586 A JP 26280586A JP 2519222 B2 JP2519222 B2 JP 2519222B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- powder
- resin
- metal
- metal powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、密着性に優れ、安価で、低抵抗の導電性ペ
ーストに関する。Description: TECHNICAL FIELD The present invention relates to a conductive paste having excellent adhesion, low cost, and low resistance.
［従来の技術］ 通常、セラミック等の無機物質に直接適用される導電
性ペーストは、有機バインダを有機溶剤で溶かしたいわ
ゆる有機ビイクル中に金属粉を分散させたものが良く知
られている。金属粉には、Ag,Pd,Au,Pt,Cu,Niなどの金
属粉末、または、それらの混合物が用いられるが、特に
銀粉が広く使用されている。有機ビイクルとしては、エ
チルセルローズを代表とするセルローズ系やアクリル樹
脂などの樹脂が用いられている。導電性ペーストはこれ
らの金属粉に無機物質との密着性を向上させるためにPb
O−SiO2−B2O3系などのガラスフリットを混合した後、
有機ビイクルを混練して製作している。[Prior Art] It is well known that a conductive paste that is directly applied to an inorganic substance such as ceramics is one in which metal powder is dispersed in a so-called organic vehicle in which an organic binder is dissolved in an organic solvent. As the metal powder, metal powder such as Ag, Pd, Au, Pt, Cu and Ni, or a mixture thereof is used, and particularly silver powder is widely used. As the organic vehicle, a resin such as ethyl cellulose or a resin such as an acrylic resin is used. Conductive paste is used to improve the adhesion of these metal powders to inorganic substances.
After mixing the glass frit, such as O-SiO 2 -B 2 O 3 system,
It is made by kneading organic vehicles.
［発明が解決しようとする問題点］ しかしながら、金属粉が銀粉であると、その価格が高
く、また樹脂よりも比重が高いために保存中に樹脂と分
離を起し易く、使用に際しては部分的に不均一性が現
れ、作業性も劣り、金属粉が銅やニッケル等の卑金属で
ある場合には、安価であるが高温安定性に問題があっ
た。さらに、これら金属粉と導電性ペーストによって処
理されるセラミックス等の無機物質との熱伝導率の違い
により130℃前後の高温放置時に密着性が落ちるという
欠点があった。[Problems to be Solved by the Invention] However, when the metal powder is silver powder, the price is high and the specific gravity is higher than that of the resin, so that the metal powder easily separates from the resin during storage, and therefore, it may be partially used. However, when the metal powder is a base metal such as copper or nickel, it is inexpensive but there is a problem in high temperature stability. Further, there is a drawback that the adhesiveness is deteriorated when left at a high temperature of about 130 ° C. due to a difference in thermal conductivity between the metal powder and an inorganic substance such as ceramics treated with the conductive paste.
本発明は、上記の事情に鑑み、より密着性の優れた、
安価な導電性ペーストを提供することを目的とする。In view of the above circumstances, the present invention is more excellent in adhesiveness,
An object is to provide an inexpensive conductive paste.
［問題点を解決するための手段］ 本発明は、上記の目的を達成すべくなされたもので、
その要旨は、金属酸化物からなる半導体粉と、金属粉
と、樹脂の混合物である導電性ペーストにある。[Means for Solving Problems] The present invention has been made to achieve the above object,
The gist thereof is a conductive paste which is a mixture of semiconductor powder made of metal oxide, metal powder and resin.
［発明の具体的構成および作用］ 以下、本発明の導電性ペーストについて説明する。[Specific Structure and Action of the Invention] The conductive paste of the present invention will be described below.
本発明に於いて使用する金属酸化物としては、電導度
が10-5S・cm-1から103S・cm-1の間にある半導体であ
り、一般に、粉末状で使用される。代表例としては、二
酸化マンガン、二酸化スズ、二酸化タングステン、二酸
化鉛、二酸化チタン、一酸化銅、一酸化亜鉛、一酸化ニ
ッケル、一酸化コバルト、三二酸化鉄、酸化タンタル、
三二酸化バナジウム、三酸化タングステン等が挙げら
れ、好ましくは、二酸化マンガン、二酸化鉛、一酸化亜
鉛が挙げられる。これらの金属酸化物に適当な公知のド
ーパントを入れることにより電導度を調節して使用して
もよい。The metal oxide used in the present invention is a semiconductor having an electric conductivity of 10 −5 S · cm −1 to 10 3 S · cm −1 , and is generally used in powder form. Typical examples are manganese dioxide, tin dioxide, tungsten dioxide, lead dioxide, titanium dioxide, copper monoxide, zinc monoxide, nickel monoxide, cobalt monoxide, iron sesquioxide, tantalum oxide,
Examples thereof include vanadium trioxide and tungsten trioxide, and preferably manganese dioxide, lead dioxide and zinc monoxide. The conductivity may be adjusted by adding an appropriate known dopant to these metal oxides before use.
次に本発明に於いて使用される金属粉としては、市販
の何れの金属粉でも適用可能である。金属粉の代表例と
して、銀粉、金粉、パラジウム粉、銅粉、ニッケル粉、
銀コートニッケル粉、銀コート銅粉およびこれらの合金
粉等があげられる。Next, as the metal powder used in the present invention, any commercially available metal powder can be applied. As typical examples of metal powder, silver powder, gold powder, palladium powder, copper powder, nickel powder,
Examples thereof include silver-coated nickel powder, silver-coated copper powder and alloy powders thereof.
金属酸化物の使用割合は、重量で、金属粉の1/6倍か
ら６倍の範囲であることが好ましい。金属酸化物の割合
が金属粉の1/6倍未満であると作製した導電性ペースト
の高温安定性が不充分になる可能性があり、また金属酸
化物の割合が金属粉の６倍を越えると導電性が不充分に
なる可能性がある。The ratio of the metal oxide used is preferably in the range of 1/6 to 6 times the weight of the metal powder. If the ratio of metal oxide is less than 1/6 times that of metal powder, the high-temperature stability of the prepared conductive paste may be insufficient, and the ratio of metal oxide exceeds 6 times that of metal powder. And the conductivity may be insufficient.
次に本発明に於いて使用される樹脂としては、市販の
何れの樹脂でも適用可能である。又作業性を最適状態に
する為の粘度調節用として溶剤を添加することも可能で
ある。Next, as the resin used in the present invention, any commercially available resin can be applied. It is also possible to add a solvent for adjusting the viscosity for optimizing workability.
また、使用する金属酸化物と金属粉の合量と樹脂との
比率を適当に調節することにより任意の導電率を有する
導電性ペーストが得られるが、ペースト中に占める金属
酸化物と金属粉の合量の好ましい割合は、35〜95重量％
であり、とりわけ、55〜95重量％が好ましい。金属酸化
物と金属粉の合量の割合が35重量％未満では、ペースト
の導電性が不充分であり、また95重量％を越えるとペー
ストの接着性が不充分であり、共に本発明を満足しな
い。Further, a conductive paste having an arbitrary conductivity can be obtained by appropriately adjusting the ratio of the total amount of the metal oxide and the metal powder to be used and the resin, but the metal oxide and the metal powder occupying the paste A preferable ratio of the total amount is 35 to 95% by weight.
And in particular, 55 to 95% by weight is preferable. If the total ratio of the metal oxide and the metal powder is less than 35% by weight, the conductivity of the paste is insufficient, and if it exceeds 95% by weight, the adhesiveness of the paste is insufficient, and both satisfy the present invention. do not do.
以下、本発明の実施例、比較例について説明する。 Hereinafter, examples and comparative examples of the present invention will be described.
［実 施 例］ 実施例 １ 電導度が0.3S・cm-1の一酸化亜鉛粉末60部、銀粉30部
にアクリルラッカーを加えて均一に混合して、樹脂以外
の固形分が約90重量％の導電性ペーストを作製した。無
機物質として、一酸化亜鉛の焼結体にこの導電性ペース
トを塗布し120℃で１時間乾燥した。尚、導電性ペース
トの表面抵抗は0.3Ω／□であり、130℃で200時間放置
してもペーストと焼結体との密着性は不変であった。[Examples] Example 1 Acrylic lacquer was added to 60 parts of zinc monoxide powder and 30 parts of silver powder having an electric conductivity of 0.3 S · cm −1 and uniformly mixed, and solid content other than resin was about 90% by weight. A conductive paste of was prepared. This conductive paste was applied to a sintered body of zinc monoxide as an inorganic substance and dried at 120 ° C. for 1 hour. The surface resistance of the conductive paste was 0.3Ω / □, and the adhesiveness between the paste and the sintered body was unchanged even when left at 130 ° C. for 200 hours.
実施例 ２ 電導度が0.05S・cm-1の二酸化マンガン粉末35部、銀
コート銅粉50部にアルキッド樹脂（商品名 フタルキッ
ド365−70 日立化成工業KK製）を加えて均一に混合し
て樹脂以外の固形分が85重量％の導電性ペーストを作製
した。無機物質として二酸化マンガンからなる基板に、
この導電性ペーストを塗布し140℃で１時間乾燥した。
尚、導電性ペーストの表面抵抗は0.1Ω／□であり、130
℃で2000時間放置してもペーストと基板との密着性は不
変であった。Example 2 Alkyd resin (trade name: Phtalkid 365-70, manufactured by Hitachi Chemical Co., Ltd. KK) was added to 35 parts of manganese dioxide powder having an electric conductivity of 0.05 S · cm −1 and 50 parts of silver-coated copper powder, and the mixture was uniformly mixed to obtain a resin. A conductive paste having a solid content of other than 85% by weight was prepared. A substrate made of manganese dioxide as an inorganic substance,
This conductive paste was applied and dried at 140 ° C. for 1 hour.
The surface resistance of the conductive paste is 0.1Ω / □.
The adhesiveness between the paste and the substrate remained unchanged even after being left to stand at ℃ for 2000 hours.
実施例 ３ 電導度が1.2S・cm-1の二酸化鉛粉末50部、銀コート銀
粉42部にウレタン樹脂（商品名 パラプレンP22−SRNAT
日本ポリウレタンKK製）を加えて均一に混合して樹脂
以外の固形分が92重量％の導電性ペーストを作製した。
無機物質として二酸化鉛からなる基板にこの導電性ペー
ストを塗布し120℃で１時間乾燥した。尚、導電性ペー
ストの表面抵抗は0.1Ω／□であり、130℃で2000時間放
置してもペーストと基板との密着性は不変であった。Example 3 50 parts of lead dioxide powder having an electric conductivity of 1.2 S · cm −1 , 42 parts of silver-coated silver powder and urethane resin (trade name: Paraprene P22-SRNAT)
Nippon Polyurethane KK) was added and mixed uniformly to prepare a conductive paste having a solid content of 92% by weight other than resin.
This conductive paste was applied to a substrate made of lead dioxide as an inorganic substance and dried at 120 ° C. for 1 hour. The surface resistance of the conductive paste was 0.1 Ω / □, and the adhesiveness between the paste and the substrate was unchanged even when left at 130 ° C. for 2000 hours.
比較例 １ 実施例１で導電性ペースト中に一酸化亜鉛粉末を加え
ずに銀粉を90部とした以外は実施例１と同様にして導電
性ペーストを作製した。さらに、実施例１と同様な焼結
体にこの導電性ペーストを塗布して乾燥した後、130℃
で2000時間放置したところ、ペーストと焼結体の密着性
が減少し、系の抵抗が増大した。Comparative Example 1 A conductive paste was prepared in the same manner as in Example 1 except that 90 parts of silver powder was used without adding zinc monoxide powder to the conductive paste. Furthermore, after applying this conductive paste to a sintered body similar to that in Example 1 and drying,
After 2000 hours, the adhesiveness between the paste and the sintered body decreased and the resistance of the system increased.
［発明の効果］ 以上のように、本発明は、金属酸化物からなる半導体
と金属粉と樹脂とを均一に混合した導電性ペーストであ
り、粉体と樹脂との配合比はそれぞれ諸性質によって異
るが、何れの場合にも最適混合比を決定することによっ
て導電性、接着性、作業性など全ての点で満足するもの
が得られ、その材料費も廉価であり、またセラミックス
等の無機物質との130℃前後の高温放置時の密着性が優
れ、広く工業的用途に供するものである。[Advantages of the Invention] As described above, the present invention is a conductive paste in which a semiconductor made of a metal oxide, a metal powder, and a resin are uniformly mixed. Although different, in any case, by determining the optimum mixing ratio, it is possible to obtain one that satisfies all points such as conductivity, adhesiveness, workability, the material cost is low, and the inorganic material such as ceramics is also used. It has excellent adhesion to a substance when left at a high temperature of around 130 ° C and is widely used in industrial applications.
Claims (1)
導電率が10-5S・cm-1〜103・Ｓ・cm-1からなる前記金属
酸化物半導体粉（Meは、Mn,Sn,W,Pb,Ti,Cu,Zn,Ni,Co,F
e,Ta,V、Ｘは1,2,3、Ｙは1,2,3,5）と金属粉と樹脂の混
合物であり、130℃以下で使用することを特徴とする導
電性ペースト。1. A metal oxide semiconductor powder (Me X O Y of one kind of metal, which has a conductivity of 10 −5 S · cm −1 to 10 3 · S · cm −1). Is Mn, Sn, W, Pb, Ti, Cu, Zn, Ni, Co, F
e, Ta, V, X is 1,2,3, Y is 1,2,3,5), a mixture of metal powder and resin, and is used at 130 ° C or lower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262805A JP2519222B2 (en) | 1986-11-06 | 1986-11-06 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262805A JP2519222B2 (en) | 1986-11-06 | 1986-11-06 | Conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119105A JPS63119105A (en) | 1988-05-23 |
| JP2519222B2 true JP2519222B2 (en) | 1996-07-31 |
Family
ID=17380854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61262805A Expired - Lifetime JP2519222B2 (en) | 1986-11-06 | 1986-11-06 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519222B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101338548B1 (en) * | 2010-07-23 | 2013-12-06 | 엘지이노텍 주식회사 | Paste composition and solar cell |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444617A (en) * | 1987-08-12 | 1989-02-17 | Seiko Epson Corp | Protecting circuit |
| JP4544837B2 (en) * | 2002-07-17 | 2010-09-15 | 日本特殊陶業株式会社 | Copper paste for ceramic wiring board, ceramic wiring board, and method for manufacturing ceramic wiring board |
| JP4544838B2 (en) * | 2002-07-17 | 2010-09-15 | 日本特殊陶業株式会社 | Copper paste for via conductor and ceramic wiring board using the same |
| JP6242800B2 (en) * | 2012-10-19 | 2017-12-06 | ナミックス株式会社 | Sintered conductive paste |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5370395A (en) * | 1976-12-02 | 1978-06-22 | Fujitsu Ltd | Conductive paste |
| JPS58178903A (en) * | 1982-04-13 | 1983-10-20 | ティーディーケイ株式会社 | Conductive paste |
| JPS61107605A (en) * | 1984-10-31 | 1986-05-26 | 株式会社東芝 | Donductive paste |
-
1986
- 1986-11-06 JP JP61262805A patent/JP2519222B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101338548B1 (en) * | 2010-07-23 | 2013-12-06 | 엘지이노텍 주식회사 | Paste composition and solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63119105A (en) | 1988-05-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |