JPS63119105A - Conducting paste - Google Patents
Conducting pasteInfo
- Publication number
- JPS63119105A JPS63119105A JP26280586A JP26280586A JPS63119105A JP S63119105 A JPS63119105 A JP S63119105A JP 26280586 A JP26280586 A JP 26280586A JP 26280586 A JP26280586 A JP 26280586A JP S63119105 A JPS63119105 A JP S63119105A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive paste
- metal
- resin
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 8
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 5
- 239000004332 silver Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 2
- DZKDPOPGYFUOGI-UHFFFAOYSA-N tungsten(iv) oxide Chemical compound O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 description 2
- 239000004923 Acrylic lacquer Substances 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910021541 Vanadium(III) oxide Inorganic materials 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、密着性に優れ、安価で、低抵抗の導電性ペー
ストに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a conductive paste that has excellent adhesion, is inexpensive, and has low resistance.
［従来の技術］
通常、セラミック等の無機物質に直接適用される導電性
ペーストは、有機バインダを有機溶剤で溶かしたいわゆ
る有機ビイクル中に金属粉を分散させたものが良く知ら
れている。金属粉には、Ａｇ、Ｐｄ、Ａｕ、Ｐｔ、Ｃｕ
、Ｎｉなどの金属粉末、または、それらの混合物が用い
られるが、特に銀粉が広く使用されている。有機ビイク
ルとしては、エチルセルローズを代表とするセルローズ
系やアクリル樹脂などの樹脂が用いられている。[Prior Art] Generally, a well-known conductive paste that is directly applied to inorganic materials such as ceramics is one in which metal powder is dispersed in a so-called organic vehicle in which an organic binder is dissolved in an organic solvent. Metal powder includes Ag, Pd, Au, Pt, Cu.
, Ni, or a mixture thereof, and silver powder is particularly widely used. As the organic vehicle, cellulose resins such as ethyl cellulose and acrylic resins are used.
導電性ペーストはこれらの金属粉に無機物質との密着性
を向上させるなめにＰｂＯ−３ｉＯ７−Ｂ２０３系など
のガラスフリットを混合した後、有機ビイクルを混練し
て製作している。The conductive paste is produced by mixing these metal powders with glass frit such as PbO-3iO7-B203 to improve adhesion to inorganic substances, and then kneading the mixture with an organic vehicle.
［発明が解決しようとする問題点］
しかしながら、金属粉が銀粉であると、その価格が高く
、また樹脂よりも比重が高いために保存中に樹脂と分離
を起し易く、使用に際しては部分的に不均一性が現れ、
作業性も劣り、金属粉が銅やニッケル等の卑金属である
場合は、安価であるが高温安定性に問題があった。さら
に、これら金属粉と導電性ペーストによって処理される
セラミックス等の無機物質との熱伝導率の違いにより高
温放置時に密着性が落ちるという欠点があった。[Problems to be solved by the invention] However, when the metal powder is silver powder, its price is high, and its specific gravity is higher than that of resin, so it tends to separate from the resin during storage, and it is difficult to use it partially. Heterogeneity appears in
Workability is also poor, and when the metal powder is a base metal such as copper or nickel, although it is inexpensive, there are problems with high temperature stability. Furthermore, due to the difference in thermal conductivity between these metal powders and inorganic materials such as ceramics treated with the conductive paste, there is a drawback that adhesion deteriorates when left at high temperatures.
本発明は、上記の事情に鑑み、より密着性の優れた、安
価な導電性ペーストを提供することを目的とする。In view of the above circumstances, an object of the present invention is to provide an inexpensive conductive paste with better adhesiveness.
［問題点を解決するための手段］
本発明は、上記の目的を達成すべくなされたもので、そ
の要旨は、金属酸化物からなる半導体粉と、金属粉と、
樹脂の混合物である導電性ペーストにある。[Means for Solving the Problems] The present invention has been made to achieve the above object, and the gist thereof is to provide semiconductor powder made of a metal oxide, metal powder,
It is a conductive paste that is a mixture of resins.
［発明の具体的構成および作用］ 以下、本発明の導電性ペーストについて説明する。[Specific structure and operation of the invention] The conductive paste of the present invention will be explained below.
本発明に於いて使用する金属酸化物としては、電導度が
１０３−ａｎ から１ＯＳ−■−１の間にある半導体
であり、一般に、粉末状で使用される。The metal oxide used in the present invention is a semiconductor having an electrical conductivity between 10@3 -an and 1OS@--1, and is generally used in powder form.
代表例として、二酸化マンガン、二酸化スズ、二酸化タ
ングステン、二酸化鉛、二酸化チタン、−酸化銅、−酸
化亜鉛、−酸化ニッケル、−酸化コバルト、三二酸化鉄
、チタン酸バリウム、酸化タンタル、三二酸化バナジウ
ム、三酸化タングステン等が挙げられ、好ましくは、二
酸化マンガン、二酸化鉛、−酸化亜鉛が挙げられる。こ
れらの金属酸化物に適当な公知のドーパントを入れるこ
とにより電導度を調節して使用してもよい。Typical examples include manganese dioxide, tin dioxide, tungsten dioxide, lead dioxide, titanium dioxide, -copper oxide, -zinc oxide, -nickel oxide, -cobalt oxide, iron sesquioxide, barium titanate, tantalum oxide, vanadium sesquioxide, Examples include tungsten trioxide, and preferably manganese dioxide, lead dioxide, and zinc oxide. These metal oxides may be used with their electrical conductivity adjusted by adding a suitable known dopant.
次に本発明に於いて使用される金属粉としては、市販の
何れの金属粉でも適用可能である。金属粉の代表例とし
て、銀粉、金粉、パラジウム粉、銅粉、ニッケル粉、銀
コートニッケル粉、銀コート銅粉およびこれらの合金粉
等があげられる。Next, as the metal powder used in the present invention, any commercially available metal powder can be used. Typical examples of metal powder include silver powder, gold powder, palladium powder, copper powder, nickel powder, silver-coated nickel powder, silver-coated copper powder, and powders of alloys thereof.
金属酸化物の使用割合は、重量で、金属粉の１／６倍か
ら６倍の範囲であることが好ましい。The proportion of the metal oxide used is preferably in the range of 1/6 to 6 times the weight of the metal powder.
金属酸化物の割合が金属粉の１／６倍未満であると作製
した導電性ペーストの高温安定性が不充分になる可能性
があり、また金属酸化物の割合が金属粉の６倍を越える
と導電性が不充分になる可能性がある。If the ratio of metal oxide is less than 1/6 times that of metal powder, the high temperature stability of the prepared conductive paste may be insufficient, and the ratio of metal oxide is more than 6 times that of metal powder. This may result in insufficient conductivity.
次に本発明に於いて使用される樹脂としては、市販の何
れの樹脂でも適用可能である。又作業性を最適状態にす
る為の粘度調節用として溶剤を添加することも可能であ
る。Next, as the resin used in the present invention, any commercially available resin can be used. It is also possible to add a solvent to adjust the viscosity to optimize workability.
また、使用する金属酸化物と金属粉の合量と樹脂との比
率を適当に調節することにより任意の導電率を有する導
電性ペーストが得られるが、ペースト中に占める金属酸
化物と金属粉の合量の好ましい割合は、３５〜９５重量
％であり、とりわけ、５５〜９５重量％が好ましい。金
属酸化物と金属粉の合量の割合が３５重量％未満では、
ペーストの導電性が不充分であり、また９５重量％を越
えるとペーストの接着性が不充分であり、共に本発明を
満足しない。In addition, by appropriately adjusting the ratio of the total amount of metal oxide and metal powder used and the resin, a conductive paste with arbitrary conductivity can be obtained. A preferable ratio of the total amount is 35 to 95% by weight, particularly preferably 55 to 95% by weight. If the total ratio of metal oxide and metal powder is less than 35% by weight,
The conductivity of the paste is insufficient, and if it exceeds 95% by weight, the adhesiveness of the paste is insufficient, both of which do not satisfy the present invention.
以下、本発明の実施例、比較例について説明する。Examples and comparative examples of the present invention will be described below.
［実 施 例］
実施例 １
電導度が０．３Ｓ−ｃｘａ−’の一酸化亜鉛粉末６０部
、銀粉３０部にアクリルラッカーを加えて均一に混合し
て、樹脂以外の固形分が約９０重量％の導電性ペースト
を作製した。無機物質として、−酸化亜鉛の焼結体にこ
の導電性ペーストを塗布し１２０℃で１時間乾燥しな。[Example] Example 1 Acrylic lacquer was added to 60 parts of zinc monoxide powder with an electrical conductivity of 0.3S-cxa-' and 30 parts of silver powder and mixed uniformly, so that the solid content other than the resin was about 90 weight. % conductive paste was prepared. This conductive paste was applied to a sintered body of -zinc oxide as an inorganic substance and dried at 120°C for 1 hour.
尚、導電性ペーストの表面抵抗は０，３Ω／口であり、
１３０℃で２０００時間放置してもペーストと焼結体と
の密着性は不変であった。In addition, the surface resistance of the conductive paste is 0.3Ω/mouth,
Even after being left at 130° C. for 2000 hours, the adhesion between the paste and the sintered body remained unchanged.
実施例 ２
電導度が０．０５５−ａｎ−１の二酸化マンガン粉末３
５部、銀コート銅粉５０部にアルキッド樹脂（商品名
フタルキッド３６５−７０ 日立化成工業ＫＫ製）を
加えて均一に混合して樹脂以外の固形分が８５重量％の
導電性ペーストを作製しな。無機物質として二酸化マン
ガンからなる基板に、この導電性ペーストを塗布し１４
０℃で１時間乾燥した。尚、導電性ペーストの表面抵抗
は０．１Ω／口であり、１３０℃で２０００時間放置し
てもペーストと基板との密着性は不変であった。Example 2 Manganese dioxide powder 3 with electrical conductivity of 0.055-an-1
5 parts, 50 parts of silver-coated copper powder and alkyd resin (trade name)
Phthalkyd 365-70 (manufactured by Hitachi Chemical Co., Ltd.) was added and mixed uniformly to prepare a conductive paste with a solid content other than the resin of 85% by weight. This conductive paste was applied to a substrate made of manganese dioxide as an inorganic substance.
It was dried at 0°C for 1 hour. The surface resistance of the conductive paste was 0.1 Ω/hole, and the adhesion between the paste and the substrate remained unchanged even after being left at 130° C. for 2000 hours.
実施例 ３
電導度が１．２３−ａｎ−１の二酸化鉛粉末５０部、銀
コート銅粉４２部にウレタン樹脂（商品名 パラプレン
Ｐ ２２− ＳＲＮ八丁へ日本ポリウレタンＫＫ製）を
加えて均一に混合して樹脂以外の固形分が９２重量％の
導電性ペーストを作製した。無機物質として二酸化鉛か
らなる基板にこの導電性ペーストを塗布し１２０°Ｃで
１時間乾燥した。尚、導電性ペーストの表面抵抗は０．
１Ω／口であり、１３０℃で２０００時間放置してもペ
ーストと基板との密着性は不変であった。Example 3 Urethane resin (trade name: Paraprene P 22-SRN Hatcho, manufactured by Nippon Polyurethane KK) was added to 50 parts of lead dioxide powder with an electrical conductivity of 1.23-an-1 and 42 parts of silver-coated copper powder, and mixed uniformly. A conductive paste having a solid content other than resin of 92% by weight was prepared. This conductive paste was applied to a substrate made of lead dioxide as an inorganic substance and dried at 120°C for 1 hour. Note that the surface resistance of the conductive paste is 0.
1Ω/portion, and the adhesion between the paste and the substrate remained unchanged even after being left at 130° C. for 2000 hours.
比較例 １
実施例１で導電性ペースト中に一酸化亜釦粉末を加えず
に銀粉を９０部とした以外は実施例１と同様にして導電
性ペーストを作製した。さらに、実施例１と同様な焼結
体にこの導電性ペーストを塗布して乾燥した後、１３０
℃で２０００時間放置したところ、ペーストと焼結体の
密着性が減少し、系の抵抗が増大した。Comparative Example 1 A conductive paste was prepared in the same manner as in Example 1, except that 90 parts of silver powder was used instead of adding monoxide powder to the conductive paste. Furthermore, after applying this conductive paste to the same sintered body as in Example 1 and drying it,
When it was left for 2000 hours at ℃, the adhesion between the paste and the sintered body decreased and the resistance of the system increased.
［発明の効果］
以上のように、本発明は、金属酸化物からなる半導体と
金属粉と樹脂とを均一に混合した導電性ペーストであり
、粉体と樹脂との配合比はそれぞれ諸性質によって異る
が、何れの場合にも最適混合比を決定することによって
導電性、接着性、作業性など全ての点で満足するものが
得られ、その材料費も廉価であり、またセラミックス等
の無機物質との高温密着性が優れ、広く工業的用途に供
するものである。[Effects of the Invention] As described above, the present invention is a conductive paste in which a semiconductor made of a metal oxide, a metal powder, and a resin are uniformly mixed, and the mixing ratio of the powder and the resin varies depending on the respective properties. However, in any case, by determining the optimum mixing ratio, a product that satisfies all aspects such as conductivity, adhesion, and workability can be obtained, and the material cost is low, and inorganic materials such as ceramics It has excellent high-temperature adhesion to substances and can be used in a wide range of industrial applications.
Claims (1)
混合物であることを特徴とする導電性ペースト。1. A conductive paste characterized by being a mixture of semiconductor powder made of metal oxide, metal powder, and resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262805A JP2519222B2 (en) | 1986-11-06 | 1986-11-06 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262805A JP2519222B2 (en) | 1986-11-06 | 1986-11-06 | Conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63119105A true JPS63119105A (en) | 1988-05-23 |
| JP2519222B2 JP2519222B2 (en) | 1996-07-31 |
Family
ID=17380854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61262805A Expired - Lifetime JP2519222B2 (en) | 1986-11-06 | 1986-11-06 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519222B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444617A (en) * | 1987-08-12 | 1989-02-17 | Seiko Epson Corp | Protecting circuit |
| JP2004055559A (en) * | 2002-07-17 | 2004-02-19 | Ngk Spark Plug Co Ltd | Copper paste and wiring board using the same |
| JP2004055558A (en) * | 2002-07-17 | 2004-02-19 | Ngk Spark Plug Co Ltd | Copper paste and wiring board using the same |
| WO2014061765A1 (en) * | 2012-10-19 | 2014-04-24 | ナミックス株式会社 | Electroconductive paste |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101338548B1 (en) * | 2010-07-23 | 2013-12-06 | 엘지이노텍 주식회사 | Paste composition and solar cell |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5370395A (en) * | 1976-12-02 | 1978-06-22 | Fujitsu Ltd | Conductive paste |
| JPS58178903A (en) * | 1982-04-13 | 1983-10-20 | ティーディーケイ株式会社 | Conductive paste |
| JPS61107605A (en) * | 1984-10-31 | 1986-05-26 | 株式会社東芝 | Donductive paste |
-
1986
- 1986-11-06 JP JP61262805A patent/JP2519222B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5370395A (en) * | 1976-12-02 | 1978-06-22 | Fujitsu Ltd | Conductive paste |
| JPS58178903A (en) * | 1982-04-13 | 1983-10-20 | ティーディーケイ株式会社 | Conductive paste |
| JPS61107605A (en) * | 1984-10-31 | 1986-05-26 | 株式会社東芝 | Donductive paste |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6444617A (en) * | 1987-08-12 | 1989-02-17 | Seiko Epson Corp | Protecting circuit |
| JP2004055559A (en) * | 2002-07-17 | 2004-02-19 | Ngk Spark Plug Co Ltd | Copper paste and wiring board using the same |
| JP2004055558A (en) * | 2002-07-17 | 2004-02-19 | Ngk Spark Plug Co Ltd | Copper paste and wiring board using the same |
| JP4544838B2 (en) * | 2002-07-17 | 2010-09-15 | 日本特殊陶業株式会社 | Copper paste for via conductor and ceramic wiring board using the same |
| JP4544837B2 (en) * | 2002-07-17 | 2010-09-15 | 日本特殊陶業株式会社 | Copper paste for ceramic wiring board, ceramic wiring board, and method for manufacturing ceramic wiring board |
| WO2014061765A1 (en) * | 2012-10-19 | 2014-04-24 | ナミックス株式会社 | Electroconductive paste |
| CN104737238A (en) * | 2012-10-19 | 2015-06-24 | 纳美仕有限公司 | Electroconductive paste |
| JPWO2014061765A1 (en) * | 2012-10-19 | 2016-09-05 | ナミックス株式会社 | Conductive paste |
| US9574091B2 (en) | 2012-10-19 | 2017-02-21 | Namics Corporation | Conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519222B2 (en) | 1996-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |