JP2023120864A - 基板処理装置および基板処理方法 - Google Patents
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Abstract
Description
<1-1.基板処理装置の概略的な構成>
図1は、基板処理装置1の構成の一例を示す概略図である。基板処理装置1は、例えば、インデクサ装置2から搬入される基板G1に対して、洗浄、処理液の塗布、処理液の乾燥および加熱による塗布膜の形成、露光装置3への搬出、露光装置3からの搬入、露光後の現像、現像後の加熱による乾燥および冷却を行う装置である。基板処理装置1における処理後の基板G1は、インデクサ装置2に搬入される。基板G1には、例えば、平板状のガラス基板等が適用される。基板G1は、例えば、第1主面としての第1面(上面ともいう)と、この第1面とは逆の第2主面としての第2面(下面ともいう)と、を有する平板状の基板である。処理液には、例えば、レジスト液またはポリイミド前駆体と溶媒とを含む液(PI液ともいう)等の塗布用の液(塗布液ともいう)が適用される。ポリイミド前駆体には、例えば、ポリアミド酸(ポリアミック酸)等が適用される。溶媒には、例えば、NMP(N-メチル-2-ピロリドン:N-Methyl-2-Pyrrolidone)が適用される。
図2は、往路部分11の一部の構成の一例を模式的に示す平面図である。図3は、往路部分11の一部の構成の一例を模式的に示す縦断面図である。図2では、往路部分11のうちの洗浄部111から塗布部112へ基板G1を搬送するための構成が示されており、復路部分13の外縁が細い2点鎖線で模式的に示されている。図3では、図2で示される構成の縦断面が模式的に描かれている。
図4は、塗布部112が停止していない状態(通常状態ともいう)における洗浄部111から塗布部112への基板G1の搬送動作についての流れの一例を示すフローチャートである。図5は、塗布部112が何らかの原因で停止した異常状態で開始される洗浄部111から塗布部112への基板G1の搬送動作についての流れの一例を示すフローチャートである。図4および図5では、1枚の基板G1の搬送動作に着目したフローチャートが示されている。基板G1の搬送動作は、例えば、制御部141による各部の動作の制御によって実現され得る。
以上のように、第1実施形態に係る基板処理装置1では、例えば、往路部分11において、洗浄部111から塗布部112へ基板G1を搬送するために、搬送ロボット115とバッファ部116とが配置されている。これにより、例えば、仮に洗浄部111と塗布部112との間に基板待機エリアを有する中継コンベアを配置するよりも、往路部分11の長さが短縮され得る。その結果、例えば、基板処理装置1の長さを短縮することができる。
本発明は上述の第1実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更および改良等が可能である。
11 往路部分
11i 被搬入領域
111 洗浄部
112 塗布部
115,118,119 搬送ロボット
116 バッファ部
117 回転部
12 インターフェース部
13 復路部分
13o 被搬出領域
131 現像部
2 インデクサ装置
3 露光装置
A1 第1エリア
A2 第2エリア
Ax1 仮想回転軸
G1 基板
P1 第1パスライン
P2 第2パスライン
Claims (13)
- インデクサ装置から基板が搬入される被搬入領域から露光装置に向けて前記基板を搬出するインターフェース部に至るまで前記基板が移動する往路部分と、前記インターフェース部から前記インデクサ装置に向けて前記基板が搬出される被搬出領域に至るまで前記露光装置から前記インターフェース部に搬入された前記基板が移動する復路部分と、を有する基板処理装置であって、
前記往路部分は、
前記インデクサ装置から搬入された前記基板に洗浄処理を施す洗浄部と、
前記洗浄部で前記洗浄処理が施された前記基板上に処理液を塗布する塗布部と、
前記基板が一時的に収納されるバッファ部と、
前記洗浄部からの前記基板の搬出、前記バッファ部への前記基板の搬入、前記バッファ部からの前記基板の搬出、および前記塗布部への前記基板の搬入を行う搬送ロボットと、を含み、
前記復路部分は、
前記処理液に係る膜に現像処理を施す現像部、を含む、基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記搬送ロボットは、前記基板を昇降させる、基板処理装置。 - 請求項1または請求項2に記載の基板処理装置であって、
前記バッファ部は、前記洗浄部または前記塗布部に対して上下方向に重なるように位置している、基板処理装置。 - 請求項1または請求項2に記載の基板処理装置であって、
上方から平面視した場合に、前記バッファ部は、前記搬送ロボットの前記復路部分側のエリアに位置している、基板処理装置。 - 請求項1または請求項2に記載の基板処理装置であって、
上方から平面視した場合に、前記バッファ部は、前記搬送ロボットの前記復路部分とは逆側のエリアに位置している、基板処理装置。 - 請求項1から請求項5の何れか1つの請求項に記載の基板処理装置であって、
前記往路部分は、上下方向に沿った仮想的な回転軸を中心として前記基板を回転させる回転部、をさらに含み、
前記搬送ロボットは、前記回転部への前記基板の搬入および前記回転部からの前記基板の搬出を行う、基板処理装置。 - 請求項6に記載の基板処理装置であって、
前記回転部は、前記洗浄部または前記塗布部に対して上下方向に重なるように位置している、基板処理装置。 - 請求項6または請求項7に記載の基板処理装置であって、
上方から平面視した場合に、前記回転部は、前記搬送ロボットの前記復路部分側のエリアに位置している、基板処理装置。 - 請求項6または請求項7に記載の基板処理装置であって、
上方から平面視した場合に、前記回転部は、前記搬送ロボットの前記復路部分とは逆側のエリアに位置している、基板処理装置。 - 請求項1から請求項5の何れか1つの請求項に記載の基板処理装置であって、
上方から平面視した場合に、前記塗布部は、前記搬送ロボットの前記復路部分側のエリア、または前記搬送ロボットの前記復路部分とは逆側のエリアに位置している、基板処理装置。 - 請求項10に記載の基板処理装置であって、
上方から平面視した場合に、前記塗布部は、前記搬送ロボットの前記復路部分側のエリアに位置している、基板処理装置。 - 請求項10に記載の基板処理装置であって、
上方から平面視した場合に、前記塗布部は、前記搬送ロボットの前記復路部分とは逆側のエリアに位置している、基板処理装置。 - インデクサ装置から基板が搬入される被搬入領域から露光装置に向けて前記基板を搬出するインターフェース部に至るまで前記基板が移動する往路部分と、前記インターフェース部から前記インデクサ装置に向けて前記基板が搬出される被搬出領域に至るまで前記露光装置から前記インターフェース部に搬入された前記基板が移動する復路部分と、を有する基板処理装置を用いた基板処理方法であって、
前記往路部分は、前記インデクサ装置から搬入された前記基板に洗浄処理を施す洗浄部と、前記洗浄部で前記洗浄処理が施された前記基板上に処理液を塗布する塗布部と、前記基板が一時的に収納されるバッファ部と、搬送ロボットと、を含み、
前記復路部分は、前記処理液に係る膜に現像処理を施す現像部、を含み、
前記搬送ロボットによって、前記洗浄部から前記基板を搬出し、前記バッファ部への該基板の搬入および前記バッファ部からの該基板の搬出を経ることなく、前記塗布部に該基板を搬入する第1工程と、
前記搬送ロボットによって、前記洗浄部から前記基板を搬出し、前記バッファ部への該基板の搬入および前記バッファ部からの該基板の搬出を経て、前記塗布部に該基板を搬入する第2工程と、
を有する、基板処理方法。
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10154652A (ja) * | 1996-11-26 | 1998-06-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002043203A (ja) * | 2000-07-19 | 2002-02-08 | Tokyo Electron Ltd | 薄膜形成装置および基板洗浄装置 |
JP2002324740A (ja) * | 2001-04-24 | 2002-11-08 | Tokyo Electron Ltd | 処理装置 |
JP2005123430A (ja) * | 2003-10-17 | 2005-05-12 | Trecenti Technologies Inc | 半導体装置の製造方法及び半導体装置の製造システム |
JP2006041235A (ja) * | 2004-07-28 | 2006-02-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2008053331A (ja) * | 2006-08-23 | 2008-03-06 | Dainippon Screen Mfg Co Ltd | 姿勢変換装置および基板搬送装置 |
JP2010080856A (ja) * | 2008-09-29 | 2010-04-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010219435A (ja) * | 2009-03-18 | 2010-09-30 | Sokudo Co Ltd | 基板処理装置および基板処理方法 |
JP2016027588A (ja) * | 2013-08-30 | 2016-02-18 | 東京応化工業株式会社 | 光照射装置、基板処理装置及び基板処理装置の製造方法 |
JP2020035935A (ja) * | 2018-08-30 | 2020-03-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2021021748A (ja) * | 2019-07-24 | 2021-02-18 | 株式会社Screenホールディングス | 追加露光装置およびパターン形成方法 |
-
2022
- 2022-02-18 JP JP2022023968A patent/JP7405884B2/ja active Active
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Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10154652A (ja) * | 1996-11-26 | 1998-06-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2002043203A (ja) * | 2000-07-19 | 2002-02-08 | Tokyo Electron Ltd | 薄膜形成装置および基板洗浄装置 |
JP2002324740A (ja) * | 2001-04-24 | 2002-11-08 | Tokyo Electron Ltd | 処理装置 |
JP2005123430A (ja) * | 2003-10-17 | 2005-05-12 | Trecenti Technologies Inc | 半導体装置の製造方法及び半導体装置の製造システム |
JP2006041235A (ja) * | 2004-07-28 | 2006-02-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2008053331A (ja) * | 2006-08-23 | 2008-03-06 | Dainippon Screen Mfg Co Ltd | 姿勢変換装置および基板搬送装置 |
JP2010080856A (ja) * | 2008-09-29 | 2010-04-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010219435A (ja) * | 2009-03-18 | 2010-09-30 | Sokudo Co Ltd | 基板処理装置および基板処理方法 |
JP2016027588A (ja) * | 2013-08-30 | 2016-02-18 | 東京応化工業株式会社 | 光照射装置、基板処理装置及び基板処理装置の製造方法 |
JP2020035935A (ja) * | 2018-08-30 | 2020-03-05 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2021021748A (ja) * | 2019-07-24 | 2021-02-18 | 株式会社Screenホールディングス | 追加露光装置およびパターン形成方法 |
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