JP2023022720A - プローブカード - Google Patents
プローブカード Download PDFInfo
- Publication number
- JP2023022720A JP2023022720A JP2021127744A JP2021127744A JP2023022720A JP 2023022720 A JP2023022720 A JP 2023022720A JP 2021127744 A JP2021127744 A JP 2021127744A JP 2021127744 A JP2021127744 A JP 2021127744A JP 2023022720 A JP2023022720 A JP 2023022720A
- Authority
- JP
- Japan
- Prior art keywords
- probe pin
- probe
- tip
- cable
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 129
- 238000007689 inspection Methods 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 9
- 230000005489 elastic deformation Effects 0.000 claims description 5
- 239000012212 insulator Substances 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (3)
- 金属導体からなり弾性変形可能であって、先端部が前記端面から突出しているプローブピンと、前記プローブピン及び検査装置と電気的に接続される電気導体からなる芯体及び前記芯体を被覆する絶縁体からなる絶縁被膜を有するケーブルとを備えたプローブカードであって、
前記プローブピンの基端部と前記芯体の先端部とが直接的に接触していることを特徴とするプローブカード。 - 前記ケーブルは、先端側にて前記芯体の先端面が露出し、当該露出した前記芯体の先端面が研磨されているとともに、弾性変形により湾曲された前記プローブピンの基端側の突起部の先端が前記先端面に当接していることを特徴とする請求項1に記載のプローブカード。
- 前記ケーブルの基端側にて前記絶縁被膜から露出している前記芯体と前記プローブピンの基端部とが直接的に接触し、かつ、はんだ付けにより互いに固定されていることを特徴とする請求項1に記載のプローブカード。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021127744A JP2023022720A (ja) | 2021-08-03 | 2021-08-03 | プローブカード |
PCT/JP2022/028162 WO2023013413A1 (ja) | 2021-08-03 | 2022-07-20 | プローブカード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021127744A JP2023022720A (ja) | 2021-08-03 | 2021-08-03 | プローブカード |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2023022720A true JP2023022720A (ja) | 2023-02-15 |
Family
ID=85155537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021127744A Pending JP2023022720A (ja) | 2021-08-03 | 2021-08-03 | プローブカード |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2023022720A (ja) |
WO (1) | WO2023013413A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11344509A (ja) * | 1998-05-29 | 1999-12-14 | Hiroshi Katagawa | プローブカード及びプローブピン |
JP2000241453A (ja) * | 1999-02-19 | 2000-09-08 | Japan Electronic Materials Corp | プローブカード |
JP2001041974A (ja) * | 1999-07-28 | 2001-02-16 | Fuji Photo Film Co Ltd | 基板検査装置 |
JP2012018116A (ja) * | 2010-07-09 | 2012-01-26 | Hioki Ee Corp | 回路基板検査用プローブユニットおよび回路基板検査装置 |
US20200341053A1 (en) * | 2017-01-03 | 2020-10-29 | Teps Co., Ltd. | Vertical ultra low leakage probe card for dc parameter test |
-
2021
- 2021-08-03 JP JP2021127744A patent/JP2023022720A/ja active Pending
-
2022
- 2022-07-20 WO PCT/JP2022/028162 patent/WO2023013413A1/ja unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11344509A (ja) * | 1998-05-29 | 1999-12-14 | Hiroshi Katagawa | プローブカード及びプローブピン |
JP2000241453A (ja) * | 1999-02-19 | 2000-09-08 | Japan Electronic Materials Corp | プローブカード |
JP2001041974A (ja) * | 1999-07-28 | 2001-02-16 | Fuji Photo Film Co Ltd | 基板検査装置 |
JP2012018116A (ja) * | 2010-07-09 | 2012-01-26 | Hioki Ee Corp | 回路基板検査用プローブユニットおよび回路基板検査装置 |
US20200341053A1 (en) * | 2017-01-03 | 2020-10-29 | Teps Co., Ltd. | Vertical ultra low leakage probe card for dc parameter test |
Also Published As
Publication number | Publication date |
---|---|
WO2023013413A1 (ja) | 2023-02-09 |
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