JP2022165139A - ガラスインターポーザ - Google Patents
ガラスインターポーザ Download PDFInfo
- Publication number
- JP2022165139A JP2022165139A JP2021070373A JP2021070373A JP2022165139A JP 2022165139 A JP2022165139 A JP 2022165139A JP 2021070373 A JP2021070373 A JP 2021070373A JP 2021070373 A JP2021070373 A JP 2021070373A JP 2022165139 A JP2022165139 A JP 2022165139A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- wiring
- glass
- interposer
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 114
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 39
- 238000000034 method Methods 0.000 description 27
- 239000000523 sample Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000005498 polishing Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
12-ガラス基板
122-貫通配線部
124-面内配線部
126-スルーホール
128-配線充填用凹部
Claims (3)
- 複数の微細貫通孔を有するガラス基板であって、
前記ガラス基板の主面における配線形成予定位置に設けられた配線充填用凹部と、
前記微細貫通孔および前記配線充填用凹部にそれぞれ配置された導電性材料からなる配線部と、
を少なくとも備え、
前記配線充填用凹部に配置された配線部の上面とガラス基板の主面とが同一平面上に配置されており、かつ、それぞれ平滑面を有することを特徴とするガラス基板。 - 前記配線充填用凹部に配置された配線部の上面の平滑面とガラス基板の主面の平滑面との表面粗さRaがそれぞれ1nm以下であることを特徴とする請求項1に記載のガラス基板。
- 請求項1または2に記載のガラス基板を複数接合してなるガラスインターポーザ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021070373A JP7114036B1 (ja) | 2021-04-19 | 2021-04-19 | ガラスインターポーザ |
PCT/JP2022/017463 WO2022224855A1 (ja) | 2021-04-19 | 2022-04-11 | ガラス基板およびガラスインターポーザ |
TW111114625A TW202305973A (zh) | 2021-04-19 | 2022-04-18 | 玻璃基板及玻璃中介層 |
JP2022107231A JP2022165424A (ja) | 2021-04-19 | 2022-07-01 | ガラス基板およびガラスインターポーザ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021070373A JP7114036B1 (ja) | 2021-04-19 | 2021-04-19 | ガラスインターポーザ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022107231A Division JP2022165424A (ja) | 2021-04-19 | 2022-07-01 | ガラス基板およびガラスインターポーザ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7114036B1 JP7114036B1 (ja) | 2022-08-08 |
JP2022165139A true JP2022165139A (ja) | 2022-10-31 |
Family
ID=82748836
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021070373A Active JP7114036B1 (ja) | 2021-04-19 | 2021-04-19 | ガラスインターポーザ |
JP2022107231A Pending JP2022165424A (ja) | 2021-04-19 | 2022-07-01 | ガラス基板およびガラスインターポーザ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022107231A Pending JP2022165424A (ja) | 2021-04-19 | 2022-07-01 | ガラス基板およびガラスインターポーザ |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP7114036B1 (ja) |
TW (1) | TW202305973A (ja) |
WO (1) | WO2022224855A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005259801A (ja) * | 2004-03-09 | 2005-09-22 | Matsushita Electric Ind Co Ltd | 多層ガラス基板の製造方法 |
JP2014236102A (ja) * | 2013-05-31 | 2014-12-15 | 凸版印刷株式会社 | 貫通電極付き配線基板、その製造方法及び半導体装置 |
JP2017204527A (ja) * | 2016-05-10 | 2017-11-16 | 凸版印刷株式会社 | 配線回路基板及びその製造方法 |
JP2019036607A (ja) * | 2017-08-10 | 2019-03-07 | リード・エレクトロニクス株式会社 | 回路付きガラス基板含有多層配線板及びその製造方法 |
-
2021
- 2021-04-19 JP JP2021070373A patent/JP7114036B1/ja active Active
-
2022
- 2022-04-11 WO PCT/JP2022/017463 patent/WO2022224855A1/ja active Application Filing
- 2022-04-18 TW TW111114625A patent/TW202305973A/zh unknown
- 2022-07-01 JP JP2022107231A patent/JP2022165424A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005259801A (ja) * | 2004-03-09 | 2005-09-22 | Matsushita Electric Ind Co Ltd | 多層ガラス基板の製造方法 |
JP2014236102A (ja) * | 2013-05-31 | 2014-12-15 | 凸版印刷株式会社 | 貫通電極付き配線基板、その製造方法及び半導体装置 |
JP2017204527A (ja) * | 2016-05-10 | 2017-11-16 | 凸版印刷株式会社 | 配線回路基板及びその製造方法 |
JP2019036607A (ja) * | 2017-08-10 | 2019-03-07 | リード・エレクトロニクス株式会社 | 回路付きガラス基板含有多層配線板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW202305973A (zh) | 2023-02-01 |
WO2022224855A1 (ja) | 2022-10-27 |
JP7114036B1 (ja) | 2022-08-08 |
JP2022165424A (ja) | 2022-10-31 |
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