JP2022107427A - Transport device and carrier - Google Patents

Transport device and carrier Download PDF

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JP2022107427A
JP2022107427A JP2021002375A JP2021002375A JP2022107427A JP 2022107427 A JP2022107427 A JP 2022107427A JP 2021002375 A JP2021002375 A JP 2021002375A JP 2021002375 A JP2021002375 A JP 2021002375A JP 2022107427 A JP2022107427 A JP 2022107427A
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carrier
support portion
transport
transport device
magnetic
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泰一郎 青木
Taiichiro Aoki
俊介 岡部
Shunsuke Okabe
光晴 江澤
Mitsuharu Ezawa
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Canon Tokki Corp
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Canon Tokki Corp
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Priority to JP2021002375A priority Critical patent/JP2022107427A/en
Priority to KR1020210186067A priority patent/KR20220100509A/en
Priority to CN202111609937.5A priority patent/CN114752912A/en
Publication of JP2022107427A publication Critical patent/JP2022107427A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02—Control or detection
    • B65G2203/0266—Control or detection relating to the load carrier(s)
    • B65G2203/0283—Position of the load carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/042—Sensors
    • B65G2203/043—Magnetic

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

To provide a technique for reducing the influence of magnetism in magnetic transport on magnetic position detection.SOLUTION: A transport device includes a carrier on which a substrate is mounted, transport means that transports the carrier by magnetic force, and a magnetic position detection unit 3 that detects the position of the carrier in the transport direction, and the carrier includes a substrate support portion 10 that supports the substrate 110, and a magnet support portion 11 that is connected to the end portion of the substrate support portion via a connection portion 12 and supports permanent magnets M1 and M2 on which the magnetism of the transport means acts. The position detection unit is arranged closer to the substrate support portion than the connection portion. The connection portion is made of a magnetic material.SELECTED DRAWING: Figure 4

Description

本発明は、基板の搬送技術に関する。 The present invention relates to a substrate transport technique.

有機ＥＬ表示装置（有機ＥＬディスプレイ）は、スマートフォン、テレビ、自動車用ディスプレイだけでなく、ＶＲ－ＨＭＤ（Ｖｉｒｔｕａｌ Ｒｅａｌｉｔｙ－Ｈｅａｄ Ｍｏｕｎｔ Ｄｉｓｐｌａｙ）などにその応用分野が広がっており、特に、ＶＲ－ＨＭＤに用いられるディスプレイは画素パターンを高精度で形成することが求められる。有機ＥＬ表示装置の製造においては、有機ＥＬ表示装置を構成する有機発光素子（有機ＥＬ素子：ＯＬＥＤ）を形成する際に、成膜装置の蒸着源から放出された成膜材料を、画素パターンが形成されたマスクを介して基板に成膜することで、有機物層や金属層を形成する。 The application field of the organic EL display device (organic EL display) is expanding not only to displays for smartphones, televisions, and automobiles, but also to VR-HMD (Virtual Reality-Head Mount Display), and is particularly used for VR-HMD. The display is required to form a pixel pattern with high accuracy. In the manufacture of an organic EL display device, when the organic light emitting element (organic EL element: OLED) constituting the organic EL display device is formed, the film forming material discharged from the vapor deposition source of the film forming apparatus is subjected to a pixel pattern. An organic material layer or a metal layer is formed by forming a film on the substrate through the formed mask.

このような成膜装置においては、成膜中に基板の上にコンタミが付着することを防止する必要があるが、基板の搬送機構がコンタミの発生源となり得る。比較的コンタミの発生が少ない搬送機構として磁石を利用して搬送キャリアを搬送する磁気搬送がある。特に磁気浮上搬送は、基板とマスクを保持して搬送するキャリアと搬送機構の構成部品との接触を少なくして搬送される非接触搬送であり、コンタミの発生を抑制することができる。 In such a film forming apparatus, it is necessary to prevent contamination from adhering to the substrate during film formation, but the transfer mechanism of the substrate can be a source of contamination. As a transport mechanism that causes relatively little contamination, there is magnetic transport that transports a transport carrier using a magnet. In particular, the magnetic levitation transfer is a non-contact transfer in which contact between the carrier holding the substrate and the mask and the component of the transfer mechanism is reduced, and the occurrence of contamination can be suppressed.

この磁気浮上搬送おいて搬送キャリアを制御するためには、キャリアの位置を計測し制御情報として取得する必要があるが、その手法の一つとして磁気式の位置検知技術が知られている。これは磁気検出ヘッド（磁気センサ）と磁気パターンを記録した磁気スケールとを使用して非接触かつ高精度に位置を検出できる手法である（特許文献１等）。 In order to control the carrier in this magnetic levitation transfer, it is necessary to measure the position of the carrier and acquire it as control information, and a magnetic position detection technique is known as one of the methods. This is a method that can detect a position with high accuracy without contact by using a magnetic detection head (magnetic sensor) and a magnetic scale that records a magnetic pattern (Patent Document 1 and the like).

特開２００４－５６８９２号公報Japanese Unexamined Patent Publication No. 2004-56892

キャリアの搬送に磁気搬送を採用し、かつ、キャリアの位置検知に磁気式の位置検知技術を採用した場合、磁気搬送における磁気が磁気センサによる位置検知に影響を与える場合がある。 When magnetic transport is adopted for carrier transport and magnetic position detection technology is adopted for carrier position detection, the magnetism in magnetic transport may affect the position detection by the magnetic sensor.

本発明は、磁気搬送における磁気が磁気式の位置検知に与える影響を低減する技術を提供することにある。 An object of the present invention is to provide a technique for reducing the influence of magnetism on magnetic position detection in magnetic transport.

本発明によれば、
基板が搭載されるキャリアと、
前記キャリアを磁力により搬送する搬送手段と、
前記キャリアの搬送方向の位置を検知する磁気式の検知手段と、
を備えた搬送装置であって、
前記キャリアは、
前記基板を支持する基板支持部と、
前記基板支持部の端部に接続部を介して接続され、前記搬送手段の磁気が作用する永久磁石を支持する磁石支持部と、を備え、
前記検知手段は、前記接続部よりも前記基板支持部の側に配置され、
前記接続部が磁性材料で形成されている、
ことを特徴とする搬送装置が提供される。 According to the present invention
The carrier on which the board is mounted and
A transport means for transporting the carrier by magnetic force and
A magnetic detection means for detecting the position of the carrier in the transport direction, and
It is a transport device equipped with
The carrier
A substrate support portion that supports the substrate and
A magnet support portion that is connected to an end portion of the substrate support portion via a connection portion and supports a permanent magnet on which the magnetism of the transport means acts is provided.
The detection means is arranged closer to the substrate support portion than the connection portion.
The connection is made of a magnetic material,
A transport device characterized by this is provided.

本発明によれば、磁気搬送における磁気が磁気式の位置検知に与える影響を低減する技術を提供することができる。 According to the present invention, it is possible to provide a technique for reducing the influence of magnetism on magnetic position detection in magnetic transport.

本発明の実施形態に係る搬送装置を適用した成膜装置を模式的に示す概略図。The schematic diagram which shows typically the film-forming apparatus to which the transfer apparatus which concerns on embodiment of this invention is applied. 図１のＡ－Ａ線に沿うキャリア及び搬送装置の断面図。FIG. 3 is a cross-sectional view of a carrier and a transport device along the line AA of FIG. キャリアの平面図。Top view of the carrier. （Ａ）は比較例における磁束線を示す図、（Ｂ）は実施形態における磁束線を示す図。(A) is a diagram showing the magnetic flux lines in the comparative example, and (B) is a diagram showing the magnetic flux lines in the embodiment. （Ａ）は搬送装置における磁束線を示す図、（Ｂ）は別実施形態の構成例を示す図。(A) is a diagram showing magnetic flux lines in a transport device, and (B) is a diagram showing a configuration example of another embodiment. 別実施形態の構成例を示す図。The figure which shows the structural example of another embodiment. （Ａ）及び（Ｂ）は別実施形態の構成例を示す図。(A) and (B) are diagrams showing a configuration example of another embodiment.

以下、添付図面を参照して実施形態を詳しく説明する。尚、以下の実施形態は特許請求の範囲に係る発明を限定するものではない。実施形態には複数の特徴が記載されているが、これらの複数の特徴の全てが発明に必須のものとは限らず、また、複数の特徴は任意に組み合わせられてもよい。さらに、添付図面においては、同一若しくは同様の構成に同一の参照番号を付し、重複した説明は省略する。 Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of the plurality of features are essential to the invention, and the plurality of features may be arbitrarily combined. Further, in the attached drawings, the same or similar configurations are given the same reference numbers, and duplicate explanations are omitted.

＜第一実施形態＞
＜成膜装置の概要＞
図１は本発明の実施形態に係る搬送装置２を適用した成膜装置１００を模式的に示す概略図である。成膜装置１００は、基板１１０に蒸着物質を成膜する装置であり、マスク１１１を用いて所定のパターンの蒸着物質の薄膜を形成する。成膜装置１００で成膜が行われる基板１１０の材質は、ガラス、樹脂、金属等の材料を適宜選択可能であり、ガラス上にポリイミド等の樹脂層が形成されたものが好適に用いられる。蒸着物質としては、有機材料、無機材料（金属、金属酸化物など）などの物質である。成膜装置１００は、例えば表示装置（フラットパネルディスプレイなど）や薄膜太陽電池、有機光電変換素子（有機薄膜撮像素子）等の電子デバイスや、光学部材等を製造する製造装置に適用可能であり、特に、有機ＥＬパネルを製造する製造装置に適用可能である。以下の説明においては成膜装置１００が真空蒸着によって基板１１０に成膜を行う例を想定するが、本発明はこれに限定はされず、スパッタやＣＶＤ等の各種成膜方法を適用可能である。なお、各図において矢印Ｚは上下方向（重力方向）を示し、矢印Ｘ及び矢印Ｙは互いに直交する水平方向を示す。 <First Embodiment>
<Overview of film deposition equipment>
FIG. 1 is a schematic view schematically showing a film forming apparatus 100 to which the conveying apparatus 2 according to the embodiment of the present invention is applied. The film forming apparatus 100 is an apparatus for forming a film-deposited substance on the substrate 110, and forms a thin film of the vapor-deposited substance having a predetermined pattern by using the mask 111. As the material of the substrate 110 on which the film is formed by the film forming apparatus 100, a material such as glass, resin, or metal can be appropriately selected, and a material in which a resin layer such as polyimide is formed on the glass is preferably used. The vapor-deposited substance is a substance such as an organic material or an inorganic material (metal, metal oxide, etc.). The film forming apparatus 100 can be applied to, for example, an electronic device such as a display device (flat panel display or the like), a thin film solar cell, an organic photoelectric conversion element (organic thin film imaging element), or a manufacturing apparatus for manufacturing an optical member or the like. In particular, it is applicable to a manufacturing apparatus for manufacturing an organic EL panel. In the following description, it is assumed that the film forming apparatus 100 forms a film on the substrate 110 by vacuum deposition, but the present invention is not limited to this, and various film forming methods such as sputtering and CVD can be applied. .. In each figure, the arrow Z indicates the vertical direction (gravitational direction), and the arrows X and Y indicate the horizontal directions orthogonal to each other.

成膜装置１００は、基板１１０を搬送しながら蒸着物質を蒸着するインライン式の成膜装置であり、Ｘ方向に配列された基板搬入室１０１、マスク搬入室１０２、アライメント室１０３、成膜室１０４、マスク搬出室１０５及び基板搬出室１１０を備える。基板１１０及びマスク１１１はキャリア１を介して搬送装置２によってＸ方向に搬送される。図示の例では基板１１０は矩形である。 The film forming apparatus 100 is an in-line type film forming apparatus that deposits a vapor-deposited substance while transporting the substrate 110, and is a substrate carry-in chamber 101, a mask carry-in chamber 102, an alignment chamber 103, and a film-forming chamber 104 arranged in the X direction. , The mask carry-out chamber 105 and the substrate carry-out chamber 110 are provided. The substrate 110 and the mask 111 are conveyed in the X direction by the conveying device 2 via the carrier 1. In the illustrated example, the substrate 110 is rectangular.

キャリア１と未成膜の基板５は、基板搬入室１０１に投入され、基板搬入室１０１において基板５がキャリア１に搭載される。基板１１０を搭載したキャリア１がマスク搬入室１０２へ搬送され、ここでマスク１１１もキャリア１に搭載される。基板１１０及びマスク１１１を搭載したキャリア１はアライメント室１０３へ搬送され、ここで基板１１０とマスク１１１との位置合わせが行われる。マスク１１１は基板１１０の下に重なるように保持される。その後、基板１１０及びマスク１１１を搭載したキャリア１は成膜室１０４へ搬送される。成膜室１０４においては、蒸着源上を通過する際に、マスク１１１を介して蒸着物質が蒸着される。成膜室１０４は複数の蒸着室を含み、各蒸着室で蒸着材料を基板１１０に蒸着可能である。 The carrier 1 and the undeposited substrate 5 are put into the substrate carry-in chamber 101, and the substrate 5 is mounted on the carrier 1 in the substrate carry-in chamber 101. The carrier 1 on which the substrate 110 is mounted is conveyed to the mask carry-in chamber 102, where the mask 111 is also mounted on the carrier 1. The carrier 1 on which the substrate 110 and the mask 111 are mounted is conveyed to the alignment chamber 103, where the alignment between the substrate 110 and the mask 111 is performed. The mask 111 is held so as to overlap under the substrate 110. After that, the carrier 1 on which the substrate 110 and the mask 111 are mounted is conveyed to the film forming chamber 104. In the film forming chamber 104, when passing over the vapor deposition source, the vapor deposition substance is vapor-deposited through the mask 111. The film forming chamber 104 includes a plurality of vapor deposition chambers, and the vapor deposition material can be deposited on the substrate 110 in each vapor deposition chamber.

成膜済みの基板１１０及びマスク１１１を搭載したキャリア１は、マスク搬出室１０５に搬送され、キャリア１からマスク１１１が分離されて搬出される。その後、成膜済みの基板１１０を搭載したキャリア１は、基板搬出室１０６へ搬送され、キャリア１から基板１１０が分離されて搬出される。また、キャリア１も搬出される。 The carrier 1 on which the film-formed substrate 110 and the mask 111 are mounted is transported to the mask unloading chamber 105, and the mask 111 is separated from the carrier 1 and carried out. After that, the carrier 1 on which the film-formed substrate 110 is mounted is conveyed to the substrate unloading chamber 106, and the substrate 110 is separated from the carrier 1 and carried out. The carrier 1 is also carried out.

搬送装置２及びキャリア１の構成について、図１に加えて、図２及び図３を参照して説明する。図２は図１のＡ－Ａ線に沿う搬送装置２の断面図であり、図３はキャリア１の平面図である。 The configurations of the transport device 2 and the carrier 1 will be described with reference to FIGS. 2 and 3 in addition to FIG. FIG. 2 is a cross-sectional view of the transport device 2 along the line AA of FIG. 1, and FIG. 3 is a plan view of the carrier 1.

搬送装置２は、基板１１０の幅方向に離間した一対の搬送ユニットＣＵを備える。各搬送ユニットＣＵはＸ方向に延設されキャリア１のＸ方向の搬送経路を形成している。搬送ユニットＣＵは、キャリア１を磁力により浮上搬送するユニットである。搬送ユニットＣＵは、Ｘ方向に配列された複数の電磁石（コイル）２１及び永久磁石２３を備え、これらはフレーム２０に、Ｚ方向に離間して配置されている。電磁石２１のＹ方向の両側には磁気シールド２２が設けられている。磁気シールド２２は例えば磁性材料からなる板状の部材である。 The transport device 2 includes a pair of transport units CU separated in the width direction of the substrate 110. Each transport unit CU is extended in the X direction to form a transport path in the X direction of the carrier 1. The transport unit CU is a unit that floats and transports the carrier 1 by magnetic force. The transport unit CU includes a plurality of electromagnets (coils) 21 and permanent magnets 23 arranged in the X direction, and these are arranged on the frame 20 apart from each other in the Z direction. Magnetic shields 22 are provided on both sides of the electromagnet 21 in the Y direction. The magnetic shield 22 is, for example, a plate-shaped member made of a magnetic material.

搬送装置２は、また、キャリア１の移動範囲を規制する規制ユニット２４を備える。規制ユニット２４はフレーム２０に支持されてＸ方向に延設されている。規制ユニット２４は、キャリア１のＹ方向の移動範囲をローラＲ１と、キャリア１のＺ方向の移動範囲を規制するローラＲ２及びＲ３を備える。ローラＲ１は、Ｚ方向の回転軸の周りに自由回転可能に設けられた自由回転体であり、キャリア１のＹ方向の最端部に位置する当接部１３のＹ方向の端面に対向している。キャリア１が搬送経路からＹ方向に逸脱しようとすると、当接部１３にローラＲ１が当接して逸脱を防止する。ローラＲ２及びＲ３は、Ｙ方向の回転軸の周りに自由回転可能に設けられた自由回転体であり、Ｚ方向に離間して配置されている。ローラＲ２は当接部１３の上面に、ローラＲ３は当接部１３の下面に、それぞれ対向しており、キャリア１が上限位置又は下限位置に達すると、当接部１３にローラＲ２又はＲ３が当接してそれ以上のキャリア１のＺ方向の移動を規制する。ローラＲ１～Ｒ３はキャリア１の非浮上時（非浮上位置）においてキャリア１を支持する部材としても利用できる。 The transport device 2 also includes a regulation unit 24 that regulates the movement range of the carrier 1. The regulation unit 24 is supported by the frame 20 and extends in the X direction. The regulation unit 24 includes rollers R1 that regulate the movement range of the carrier 1 in the Y direction, and rollers R2 and R3 that regulate the movement range of the carrier 1 in the Z direction. The roller R1 is a free-rotating body provided so as to be freely rotatable around a rotation axis in the Z direction, and faces the end surface of the contact portion 13 located at the end of the carrier 1 in the Y direction in the Y direction. There is. When the carrier 1 tries to deviate from the transport path in the Y direction, the roller R1 abuts on the contact portion 13 to prevent the deviance. The rollers R2 and R3 are free-rotating bodies provided so as to be freely rotatable around a rotation axis in the Y direction, and are arranged apart from each other in the Z direction. The roller R2 faces the upper surface of the contact portion 13, and the roller R3 faces the lower surface of the contact portion 13, and when the carrier 1 reaches the upper limit position or the lower limit position, the rollers R2 or R3 come to the contact portion 13. It abuts and restricts further movement of the carrier 1 in the Z direction. The rollers R1 to R3 can also be used as a member for supporting the carrier 1 when the carrier 1 is not levitation (non-levitation position).

キャリア１は、平面視で矩形状を有しており、基板１１０を支持する基板支持部１０と、一対の磁石支持部１１と、マスク支持部１４とを備える。基板支持部１０はＹ方向の中央部に位置している。一対の磁石支持部１１は、接続部１２を介して基板支持部１０のＹ方向の各端部に接続されており、基板支持部１０のＹ方向に対向する二辺に沿って配置されている。基板支持部１０及び磁石支持部１１はいずれも矩形で板状の部材である。 The carrier 1 has a rectangular shape in a plan view, and includes a substrate support portion 10 that supports the substrate 110, a pair of magnet support portions 11, and a mask support portion 14. The substrate support portion 10 is located at the central portion in the Y direction. The pair of magnet support portions 11 are connected to each end of the substrate support portion 10 in the Y direction via a connection portion 12, and are arranged along two sides of the substrate support portion 10 facing the Y direction. .. The substrate support portion 10 and the magnet support portion 11 are both rectangular and plate-shaped members.

基板支持部１０はその下面に基板１１０を支持する。基板支持部１０は、基板１１０を保持する保持部を有し、保持部は例えば粘着材料を用いた粘着部、或いは、エアの吸引等による吸着部である。保持部は機械的に基板を挟持するクランプ機構部であってもよい。基板１１０はＸ－Ｙ平面上で水平姿勢で支持される。 The substrate support portion 10 supports the substrate 110 on its lower surface. The substrate support portion 10 has a holding portion for holding the substrate 110, and the holding portion is, for example, an adhesive portion using an adhesive material or a suction portion by suction of air or the like. The holding portion may be a clamp mechanism portion that mechanically sandwiches the substrate. The substrate 110 is supported in a horizontal position on the XY plane.

マスク支持部１４は、基板支持部１０に指示された基板１１０と重なるように基板１１０の下方にマスク１１１を支持する。マスク支持部１４は、マスク１１１を保持する保持部を有し、保持部は例えば粘着材料を用いた粘着部、或いは、エアの吸引等による吸着部である。保持部は機械的に基板を挟持するクランプ機構部であってもよい。マスク１１１はＸ－Ｙ平面上で水平姿勢で支持される。 The mask support portion 14 supports the mask 111 below the substrate 110 so as to overlap the substrate 110 instructed by the substrate support portion 10. The mask support portion 14 has a holding portion for holding the mask 111, and the holding portion is, for example, an adhesive portion using an adhesive material or a suction portion by suction of air or the like. The holding portion may be a clamp mechanism portion that mechanically sandwiches the substrate. The mask 111 is supported in a horizontal position on the XY plane.

各磁石支持部１１は、Ｙ方向で接続部１２側の端部と反対側の端部とを有する。規制ユニット２４と当接する当接部１３は、この反対側の端部に接続された板状の部材でありＸ方向に延設されている。 Each magnet support portion 11 has an end portion on the connecting portion 12 side and an end portion on the opposite side in the Y direction. The contact portion 13 that comes into contact with the regulation unit 24 is a plate-shaped member connected to the end portion on the opposite side thereof, and extends in the X direction.

各磁石支持部１１には、複数の永久磁石Ｍ１及びＭ２が支持されている。複数の永久磁石Ｍ１及びＭ２はＸ方向に配列され、不図示のヨークが設けられている。永久磁石Ｍ１は、搬送ユニットＣＵの永久磁石２３とＺ方向に対向するように磁石支持部１１の下面に固定されている。永久磁石２３と永久磁石Ｍ１との反発力によってキャリア１に浮上力が生じる。永久磁石Ｍ２は、搬送ユニットＣＵの電磁石２１とＺ方向に対向するように磁石支持部１１の上面に固定されている。磁力を発生させる電磁石２１を順次切り替えることにより、電磁石２１と永久磁石Ｍ２との吸引力によってキャリア１にＸ方向の移動力を生じさせることができる。 A plurality of permanent magnets M1 and M2 are supported on each magnet support portion 11. The plurality of permanent magnets M1 and M2 are arranged in the X direction, and a yoke (not shown) is provided. The permanent magnet M1 is fixed to the lower surface of the magnet support portion 11 so as to face the permanent magnet 23 of the transport unit CU in the Z direction. A levitation force is generated in the carrier 1 by the repulsive force between the permanent magnet 23 and the permanent magnet M1. The permanent magnet M2 is fixed to the upper surface of the magnet support portion 11 so as to face the electromagnet 21 of the transport unit CU in the Z direction. By sequentially switching the electromagnet 21 that generates the magnetic force, it is possible to generate a moving force in the X direction in the carrier 1 by the attractive force between the electromagnet 21 and the permanent magnet M2.

なお、本実施形態では、電磁石２１及び永久磁石２３が、成膜装置１００の各室（１０１～１０６）の内部（チャンバ内部）に配置された構成を想定しているが、チャンバ外部に配置された構成であってもよい。また、キャリア１の浮上搬送のために、永久磁石２３と永久磁石Ｍ１との反発力によってキャリア１に浮上力が生じさせる構成としたが、これらの永久磁石が無く、永久磁石Ｍ２と電磁石２１のみの構成においても、キャリア１の浮上搬送は可能である。 In the present embodiment, it is assumed that the electromagnet 21 and the permanent magnet 23 are arranged inside each chamber (101 to 106) of the film forming apparatus 100 (inside the chamber), but are arranged outside the chamber. It may have a different configuration. Further, for the levitation transfer of the carrier 1, the carrier 1 is configured to generate a levitation force by the repulsive force between the permanent magnet 23 and the permanent magnet M1, but there is no such permanent magnet and only the permanent magnet M2 and the electromagnet 21 are present. The carrier 1 can be levitated and transported even in the above configuration.

各接続部１２は磁性材料で形成されている。磁性材料は、例えば、鉄等の軟磁性材料である。キャリア１の他の構成（基板支持部１０、磁石支持部１１及び当接部１３）は例えばアルミニウム或いはアルミ合金などの非磁性材料で形成される。接続部１２を磁性材料で形成することで、永久磁石Ｍ１及びＭ２が生じる磁気の作用範囲を制限する。詳細は後述する。 Each connecting portion 12 is made of a magnetic material. The magnetic material is, for example, a soft magnetic material such as iron. Other configurations of the carrier 1 (board support portion 10, magnet support portion 11 and contact portion 13) are formed of a non-magnetic material such as aluminum or an aluminum alloy. By forming the connecting portion 12 with a magnetic material, the range of action of the magnetism generated by the permanent magnets M1 and M2 is limited. Details will be described later.

次に、搬送装置２はキャリア１の搬送方向（Ｘ方向）の位置を検知する磁気式の検知ユニット３を備える。検知ユニット３は、磁気スケール３１と、磁気センサ３２とを備える。本実施形態の場合、磁気スケール３１は移動側であるキャリア１に設けられ、磁気センサ３２は固定側であるフレーム２０に設けられている。 Next, the transport device 2 includes a magnetic detection unit 3 that detects the position of the carrier 1 in the transport direction (X direction). The detection unit 3 includes a magnetic scale 31 and a magnetic sensor 32. In the case of the present embodiment, the magnetic scale 31 is provided on the carrier 1 on the moving side, and the magnetic sensor 32 is provided on the frame 20 on the fixed side.

磁気スケール３１はＸ方向に延設された帯状の部材であり、Ｘ方向に磁気パターンが記録されている。本実施形態の場合、磁気スケール３１は基板支持部１０のＹの一端部に設けられている。磁気センサ３２は、磁気スケール３１の磁気パターンを読み取るセンサ（磁気検出ヘッド）であり、磁気スケール３１に対向する位置に配置されている。磁気センサ３２の検知結果によりキャリア１のＸ方向の位置を特定することができ、特定した位置に基づくフィードバック制御により電磁石２１を駆動して、キャリア１の搬送制御を行うことができる。図１に示すように磁気センサ３２は成膜装置１において搬送経路の複数個所に配置されている。なお、本実施形態では磁気スケール３１と磁気センサ３２とを、基板支持部１０のＹ方向の一端部側のみに配置したが、両端部に配置する構成も採用可能である。 The magnetic scale 31 is a strip-shaped member extending in the X direction, and a magnetic pattern is recorded in the X direction. In the case of this embodiment, the magnetic scale 31 is provided at one end of Y of the substrate support portion 10. The magnetic sensor 32 is a sensor (magnetic detection head) that reads the magnetic pattern of the magnetic scale 31, and is arranged at a position facing the magnetic scale 31. The position of the carrier 1 in the X direction can be specified by the detection result of the magnetic sensor 32, and the electromagnet 21 can be driven by the feedback control based on the specified position to control the carrier 1. As shown in FIG. 1, the magnetic sensors 32 are arranged at a plurality of locations in the transport path in the film forming apparatus 1. In the present embodiment, the magnetic scale 31 and the magnetic sensor 32 are arranged only on one end side of the substrate support portion 10 in the Y direction, but a configuration in which they are arranged on both ends can also be adopted.

検知ユニット３は、Ｙ方向において、接続部１２よりも基板支持部１０の側に配置されている。接続部１２を上記の通り磁性材料で形成したことにより、磁石支持部１１に支持された永久磁石Ｍ１及びＭ２の磁気が検知ユニット３の位置検知に与える影響を低減することができる。図４（Ａ）及び図４（Ｂ）はその説明図である。 The detection unit 3 is arranged closer to the substrate support portion 10 than the connection portion 12 in the Y direction. By forming the connecting portion 12 with the magnetic material as described above, it is possible to reduce the influence of the magnetism of the permanent magnets M1 and M2 supported by the magnet supporting portion 11 on the position detection of the detection unit 3. 4 (A) and 4 (B) are explanatory views thereof.

図４（Ａ）は比較例として、接続部１２に相当する構成がなく、基板支持部１０と磁石支持部１１とが接続されている構成例を示す。図示の例は、永久磁石Ｍ１及びＭ２が生じる磁束の磁束線Ｆ１を模式的に示している。永久磁石Ｍ１及びＭ２からは互いの磁石が影響しあい、キャリア１の移動や浮上に寄与しない漏れ磁束が発生する。図４（Ａ）はこの漏れ磁束のみの磁束線を示している。この磁束が、磁気スケール３１や磁気センサ３２に及ぶことにより、その位置検出精度を低下させる場合がある。 As a comparative example, FIG. 4A shows a configuration example in which the substrate support portion 10 and the magnet support portion 11 are connected without a configuration corresponding to the connection portion 12. The illustrated example schematically shows the magnetic flux line F1 of the magnetic flux generated by the permanent magnets M1 and M2. From the permanent magnets M1 and M2, the magnets affect each other, and a leakage flux that does not contribute to the movement or levitation of the carrier 1 is generated. FIG. 4A shows a magnetic flux line of only this leakage flux. When this magnetic flux reaches the magnetic scale 31 and the magnetic sensor 32, the position detection accuracy may be lowered.

図４（Ｂ）は本実施形態における磁束線Ｆ１、Ｆ２を示している。接続部１２を磁性材料で形成することで、磁束線Ｆ２で示されるように、永久磁石Ｍ１及びＭ２が生じる磁束を接続部１２に引き付ける作用が生じる。この結果、漏れ磁束が磁気スケール３１や磁気センサ３２に及ぶことを防止できる。本実施形態の接続部１２は、磁石支持部１１よりもＺ方向で上側に延びる部分１２ａを有している。部分１２ａは、永久磁石Ｍ２のＺ方向と同じ高さか、それよりもの高い位置に延在するように構成される。また、接続部１２は、磁石支持部１１よりもＺ方向で下側に延びる部分１２ｂを有している。部分１２ｂは、永久磁石Ｍ１のＺ方向と同じ高さか、それよりも低い位置に延在するように構成される。これにより、永久磁石Ｍ１及びＭ２が生じる磁束を接続部１２に引き付ける作用がより効果的に生じさせることができる。以上により、永久磁石Ｍ１及びＭ２の磁気が検知ユニット３の位置検知に与える影響を低減することができる。 FIG. 4B shows the magnetic flux lines F1 and F2 in this embodiment. By forming the connecting portion 12 with a magnetic material, as shown by the magnetic flux line F2, the action of attracting the magnetic flux generated by the permanent magnets M1 and M2 to the connecting portion 12 occurs. As a result, it is possible to prevent the leakage flux from reaching the magnetic scale 31 and the magnetic sensor 32. The connecting portion 12 of the present embodiment has a portion 12a extending upward in the Z direction from the magnet supporting portion 11. The portion 12a is configured to extend at a position equal to or higher than the Z direction of the permanent magnet M2. Further, the connecting portion 12 has a portion 12b extending downward in the Z direction from the magnet supporting portion 11. The portion 12b is configured to extend at a position equal to or lower than the Z direction of the permanent magnet M1. As a result, the action of attracting the magnetic flux generated by the permanent magnets M1 and M2 to the connecting portion 12 can be more effectively generated. As described above, the influence of the magnetism of the permanent magnets M1 and M2 on the position detection of the detection unit 3 can be reduced.

図５（Ａ）は電磁石２１が生じる磁束を磁気シールド２２で遮る作用を示している。キャリア１の移動に寄与しない、電磁石２１から生じる漏れ磁束Ｆ３は、磁気シールド１４によって遮られ、電磁石２１が生じる磁気が検知ユニット３の位置検知に与える影響も低減することができる。 FIG. 5A shows the action of blocking the magnetic flux generated by the electromagnet 21 with the magnetic shield 22. The leakage flux F3 generated from the electromagnet 21 that does not contribute to the movement of the carrier 1 is blocked by the magnetic shield 14, and the influence of the magnetism generated by the electromagnet 21 on the position detection of the detection unit 3 can be reduced.

＜第二実施形態＞
第一実施形態では、永久磁石Ｍ１及びＭ２の磁気が検知ユニット３の位置検知に与える影響を、磁性材料である接続部１２のみで低減したが、磁気シールドとの併用も可能である。図５（Ｂ）はその一例を示す。図示の例では、接続部１２に対応する接続部１２’が、部分１２ａを有しない構成である。これに代わって接続部１２’には磁気シールド部材１５が設けられている。磁気シールド部材１５はＬ字形状で、Ｘ方向に延設された部材であり、磁性材料で形成される。磁気シールド１５は、部分１２ａと同様に機能し、主に永久磁石Ｍ２が生じる磁束を引き付けて検知ユニット３に及ぼす影響を低減する。 <Second embodiment>
In the first embodiment, the influence of the magnetism of the permanent magnets M1 and M2 on the position detection of the detection unit 3 is reduced only by the connecting portion 12 which is a magnetic material, but it can also be used in combination with the magnetic shield. FIG. 5B shows an example thereof. In the illustrated example, the connection portion 12'corresponding to the connection portion 12 does not have the portion 12a. Instead of this, the connecting portion 12'is provided with a magnetic shield member 15. The magnetic shield member 15 is L-shaped and extends in the X direction, and is made of a magnetic material. The magnetic shield 15 functions in the same manner as the portion 12a, and mainly attracts the magnetic flux generated by the permanent magnet M2 to reduce the influence on the detection unit 3.

＜第三実施形態＞
第一実施形態では、キャリア１をＸ方向に浮上搬送する構成例を説明したが、互いに交差する二方向に浮上搬送する構成も採用可能である。図６は本実施形態のキャリア１の平面図、図７（Ａ）は本実施形態の搬送装置２の平面図である。本実施形態ではキャリア１をＸ方向とＹ方向に搬送可能な例を説明する。 <Third Embodiment>
In the first embodiment, a configuration example in which the carrier 1 is levitated and transported in the X direction has been described, but a configuration in which the carrier 1 is levitated and transported in two directions intersecting each other can also be adopted. FIG. 6 is a plan view of the carrier 1 of the present embodiment, and FIG. 7 (A) is a plan view of the transport device 2 of the present embodiment. In this embodiment, an example in which the carrier 1 can be conveyed in the X direction and the Y direction will be described.

キャリア１は、平面視で十字形状を有しており、第一実施形態と同様に基板支持部１０のＹ方向の対向する二辺に沿って磁石支持部１１が配置されていることに加えて、Ｘ方向の対向する二辺に沿って磁石支持部１１’が配置されている。磁石支持部１１’の構成は磁石支持部１１と同じであり、また、磁石支持部１１’は接続部１２を介して基板支持部１０に接続され、その端部には当接部１３が設けられている。 The carrier 1 has a cross shape in a plan view, and in addition to the magnet support portion 11 being arranged along two opposite sides of the substrate support portion 10 in the Y direction as in the first embodiment. , The magnet support portion 11'is arranged along two opposite sides in the X direction. The structure of the magnet support portion 11'is the same as that of the magnet support portion 11, and the magnet support portion 11'is connected to the substrate support portion 10 via the connection portion 12, and the contact portion 13 is provided at the end portion thereof. Has been done.

搬送装置２は、第一実施形態と同様の搬送ユニットＣＵを有すると共に、搬送ユニットＣＵと同様の構成の搬送ユニットＣＵ’を有している。搬送ユニットＣＵはＹ方向に延設されている。 The transport device 2 has a transport unit CU similar to that of the first embodiment, and also has a transport unit CU'having the same configuration as the transport unit CU. The transport unit CU extends in the Y direction.

検知ユニット３の磁気センサ３２は、搬送ユニットＣＵの搬送経路上及び搬送ユニットＣＵ’の搬送経路上にそれぞれ複数設けられている。また、検知ユニット３は、Ｘ方向に延設された磁気スケール３１と、Ｙ方向に延設された磁気スケール３１とを有しており、これらは基板支持部１０の端部に配置されている。 A plurality of magnetic sensors 32 of the detection unit 3 are provided on the transport path of the transport unit CU and on the transport path of the transport unit CU'. Further, the detection unit 3 has a magnetic scale 31 extending in the X direction and a magnetic scale 31 extending in the Y direction, and these are arranged at the end of the substrate support portion 10. ..

係る構成からなる搬送装置２においては、搬送ユニットＣＵと磁石支持部１１の永久磁石Ｍ１及びＭ２によってキャリア１をＸ方向に搬送し、また、搬送ユニットＣＵの終点から、搬送ユニットＣＵ’と磁石支持部１１’の永久磁石Ｍ１及びＭ２によってキャリア１をＹ方向に搬送することができる。この構成においても、磁性材料からなる接続部１２によって、磁石支持部１１及び１１’の各永久磁石Ｍ１及びＭ２の磁気が、検知ユニット３に影響することを防止できる。なお、本実施形態では、キャリア１の搬送方向を変えるときに、その向きを変えずに搬送する形態を採用したが、キャリア１の姿勢を９０度回転させる構成も採用可能である。 In the transfer device 2 having such a configuration, the carrier 1 is conveyed in the X direction by the transfer unit CU and the permanent magnets M1 and M2 of the magnet support portion 11, and the transfer unit CU'and the magnet support are provided from the end point of the transfer unit CU. The carrier 1 can be conveyed in the Y direction by the permanent magnets M1 and M2 of the portion 11'. Also in this configuration, the connecting portion 12 made of a magnetic material can prevent the magnetism of the permanent magnets M1 and M2 of the magnet supporting portions 11 and 11'from affecting the detection unit 3. In the present embodiment, when the transport direction of the carrier 1 is changed, the carrier 1 is transported without changing its direction, but a configuration in which the posture of the carrier 1 is rotated by 90 degrees can also be adopted.

＜第四実施形態＞
第一実施形態では、磁気スケール３１を移動側であるキャリア１に設けられ、磁気センサ３２を固定側であるフレーム２０に設けたが、逆の配置も採用可能である。図７（Ｂ）はその一例を示す。図示の例では、磁気センサ３２がキャリア１に搭載され、磁気スケール３１がフレーム２０に支持されている。磁気センサ３２は、一つのキャリア１に対して少なくとも一つ設けることができる。磁気スケール３１はキャリア１の搬送経路に沿って延設されるが、精密な位置精度が不要な区間においては設けられていなくてもよい。 <Fourth Embodiment>
In the first embodiment, the magnetic scale 31 is provided on the carrier 1 on the moving side, and the magnetic sensor 32 is provided on the frame 20 on the fixed side, but the reverse arrangement can also be adopted. FIG. 7B shows an example thereof. In the illustrated example, the magnetic sensor 32 is mounted on the carrier 1 and the magnetic scale 31 is supported by the frame 20. At least one magnetic sensor 32 can be provided for one carrier 1. The magnetic scale 31 extends along the transport path of the carrier 1, but may not be provided in a section where precise position accuracy is not required.

発明は上記実施形態に制限されるものではなく、発明の精神及び範囲から離脱することなく、様々な変更及び変形が可能である。従って、発明の範囲を公にするために請求項を添付する。 The invention is not limited to the above embodiments, and various modifications and modifications can be made without departing from the spirit and scope of the invention. Therefore, a claim is attached to make the scope of the invention public.

１００ 成膜装置、１１０ 基板、１１１ マスク、１ キャリア、２ 搬送装置、３ 位置検知ユニット、１０ 基板支持部、１１ 磁石支持部、１２ 接続部 100 film forming equipment, 110 substrate, 111 mask, 1 carrier, 2 transport equipment, 3 position detection unit, 10 substrate support, 11 magnet support, 12 connection

Claims (10)

基板が搭載されるキャリアと、
前記キャリアを磁力により搬送する搬送手段と、
前記キャリアの搬送方向の位置を検知する磁気式の検知手段と、
を備えた搬送装置であって、
前記キャリアは、
前記基板を支持する基板支持部と、
前記基板支持部の端部に接続部を介して接続され、前記搬送手段の磁気が作用する永久磁石を支持する磁石支持部と、を備え、
前記検知手段は、前記接続部よりも前記基板支持部の側に配置され、
前記接続部が磁性材料で形成されている、
ことを特徴とする搬送装置。 The carrier on which the board is mounted and
A transport means for transporting the carrier by magnetic force and
A magnetic detection means for detecting the position of the carrier in the transport direction, and
It is a transport device equipped with
The carrier
A substrate support portion that supports the substrate and
A magnet support portion that is connected to an end portion of the substrate support portion via a connection portion and supports a permanent magnet on which the magnetism of the transport means acts is provided.
The detection means is arranged closer to the substrate support portion than the connection portion.
The connection is made of a magnetic material,
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記検知手段は、
前記キャリアに支持された磁気スケールと、
前記キャリアの搬送経路上に配置され、前記磁気スケールを読み取る磁気センサと、を備える、
ことを特徴とする搬送装置。 The transport device according to claim 1.
The detection means
The magnetic scale supported by the carrier and
A magnetic sensor arranged on the carrier path of the carrier and reading the magnetic scale is provided.
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記接続部には、前記永久磁石と前記検知手段との間に配置された磁気シールド部材が設けられている、
ことを特徴とする搬送装置。 The transport device according to claim 1.
The connection portion is provided with a magnetic shield member arranged between the permanent magnet and the detection means.
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記搬送手段は、第一の方向と、前記第一の方向と交差する第二の方向に前記キャリアを搬送可能であり、
前記磁石支持部は、
前記第一の方向に沿って配置された第一の磁石支持部と、
前記第二の方向に沿って配置された第二の磁石支持部と、を含む、
ことを特徴とする搬送装置。 The transport device according to claim 1.
The transport means can transport the carrier in a first direction and a second direction that intersects the first direction.
The magnet support portion
With the first magnet support arranged along the first direction,
Includes a second magnet support located along the second direction.
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記磁石支持部には、
前記搬送手段からの第一の磁気によって、前記キャリアに浮上力を生じさせる第一の永久磁石と、
前記搬送手段からの第二の磁気によって、前記キャリアに前記搬送方向の移動力を生じさせる第二の永久磁石と、が支持される、
ことを特徴とする搬送装置。 The transport device according to claim 1.
The magnet support portion has
A first permanent magnet that causes a levitation force on the carrier by the first magnetism from the transport means,
The second magnetism from the transport means supports a second permanent magnet that causes the carrier to generate a moving force in the transport direction.
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記キャリアは、前記基板と重なるようにマスクを支持するマスク支持部を備える、
ことを特徴とする搬送装置。 The transport device according to claim 1.
The carrier includes a mask support portion that supports the mask so as to overlap the substrate.
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記基板支持部は、矩形の板状であり、
前記磁石支持部は、
前記基板支持部の対向する二辺に沿って配置された一対の第一の磁石支持部を含む、
ことを特徴とする搬送装置。 The transport device according to claim 1.
The substrate support portion has a rectangular plate shape and has a rectangular plate shape.
The magnet support portion
A pair of first magnet supports arranged along two opposing sides of the substrate support.
A transport device characterized by the fact that. 請求項４に記載の搬送装置であって、
前記第一の方向と前記第二の方向は直交し、
前記基板支持部は、矩形の板状であり、
前記磁石支持部は、
前記基板支持部の対向する二辺に沿って配置された一対の第一の磁石支持部と、
前記基板支持部の、前記二辺と異なる対向する二辺に沿って配置された一対の第二の磁石支持部と、を含む、
ことを特徴とする搬送装置。 The transport device according to claim 4.
The first direction and the second direction are orthogonal to each other.
The substrate support portion has a rectangular plate shape and has a rectangular plate shape.
The magnet support portion
A pair of first magnet support portions arranged along two opposite sides of the substrate support portion,
A pair of second magnet support portions of the substrate support portion arranged along two opposite sides different from the two sides, and the like.
A transport device characterized by the fact that. 請求項１に記載の搬送装置であって、
前記搬送方向と交差する方向での前記キャリアの移動範囲を規制する自由回転体を備え、
前記磁石支持部は、
前記接続部と接続される第一の端部と、
前記第一の端部と反対側の第二の端部と、を備え、
前記第二の端部には、前記自由回転体と当接可能な当接部が接続されている、
ことを特徴とする搬送装置。 The transport device according to claim 1.
A free rotating body that regulates the movement range of the carrier in a direction intersecting the transport direction is provided.
The magnet support portion
The first end connected to the connection,
The first end and the second end opposite to the first end are provided.
A contact portion capable of contacting the free rotating body is connected to the second end portion.
A transport device characterized by the fact that. 基板が搭載され、搬送手段により磁力により搬送され、搬送方向の位置が磁気式の検知手段で検知されるキャリアであって、
前記基板を支持する基板支持部と、
前記基板支持部の端部に接続部を介して接続され、前記搬送手段の磁気が作用する永久磁石を支持する磁石支持部と、を備え、
前記検知手段は、前記接続部よりも前記基板支持部の側に配置され、
前記接続部が磁性材料で形成されている、
ことを特徴とするキャリア。 A carrier on which a substrate is mounted, which is magnetically transported by a transport means, and whose position in the transport direction is detected by a magnetic detection means.
A substrate support portion that supports the substrate and
A magnet support portion that is connected to an end portion of the substrate support portion via a connection portion and supports a permanent magnet on which the magnetism of the transport means acts is provided.
The detection means is arranged closer to the substrate support portion than the connection portion.
The connection is made of a magnetic material,
A carrier characterized by that.
JP2021002375A 2021-01-08 2021-01-08 Transport device and carrier Pending JP2022107427A (en)

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