JP2022096834A - Grinding wheel - Google Patents

Grinding wheel Download PDF

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Publication number
JP2022096834A
JP2022096834A JP2020210048A JP2020210048A JP2022096834A JP 2022096834 A JP2022096834 A JP 2022096834A JP 2020210048 A JP2020210048 A JP 2020210048A JP 2020210048 A JP2020210048 A JP 2020210048A JP 2022096834 A JP2022096834 A JP 2022096834A
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Prior art keywords
grinding
grinding wheel
wheel
thickness
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JP2020210048A
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Japanese (ja)
Inventor
良吾 馬路
Ryogo Umaji
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Disco Corp
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Disco Abrasive Systems Ltd
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Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2020210048A priority Critical patent/JP2022096834A/en
Priority to US17/457,804 priority patent/US20220193855A1/en
Priority to KR1020210174291A priority patent/KR20220088314A/en
Priority to CN202111502083.0A priority patent/CN114643541A/en
Priority to TW110146649A priority patent/TW202224859A/en
Publication of JP2022096834A publication Critical patent/JP2022096834A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

To provide a grinding wheel capable of preventing a ductile material such as a resin and metal from extending and generating burrs than a conventional grinding wheel.SOLUTION: A grinding wheel 1 for grinding a ductile material includes a fixed-end 12 fixed to a lower end of a spindle, an annular wheel base 10 having a free end 13 opposite to workpiece to be ground, and a plurality of grinding grindstones 20 that have long sides aligned at a predetermined interval in a circumferential direction of the wheel base 10 and have rectangular plate shapes, on the free end 13. The grinding grindstones 20 are electrocasting grindstones that are obtained by fixing abrasive grains by nickel plating and have rectangular plate shapes, and have a thickness 23 of 1 mm or less and a value indicated by height 24/thickness 23 from the free end 13 of 5 or more and less than 35.SELECTED DRAWING: Figure 2

Description

本発明は、研削ホイールに関する。 The present invention relates to a grinding wheel.

半導体デバイスが形成される、シリコンやガリウムヒ素、セラミックスやガラス基板などを、研削砥石が環状に配置された研削ホイールを使って研削する技術が知られている（例えば、特許文献１参照）。 A technique for grinding silicon, gallium arsenide, ceramics, a glass substrate, or the like on which a semiconductor device is formed by using a grinding wheel in which a grinding wheel is arranged in an annular shape is known (see, for example, Patent Document 1).

特許第４８８５３７６号公報Japanese Patent No. 4885376

特許文献１では、研削ホイールの研削砥石は、ダイヤモンド砥粒がボンドで固定された矩形板状のセグメントであり、研削ホイールの下面（自由端部）に固定され、被加工物を研削する。この研削砥石に用いられるボンドは、樹脂（レジン）系、メタル系、ビトリファイド系から選択され、研削砥石のセグメントの厚さと高さ（突出量）は研削中に割れないよう設定され、厚さは２～４ｍｍ程度、高さは４～５ｍｍ程度である。例えば半導体デバイスチップがパッケージされた樹脂パッケージ基板をこのような従来の研削ホイールで研削すると、ウェーハレベルパッケージの薄化の要求もあり、樹脂や金属が延びてバリとなってしまうという問題があった。 In Patent Document 1, the grinding wheel of a grinding wheel is a rectangular plate-shaped segment in which diamond abrasive grains are fixed by a bond, and is fixed to the lower surface (free end portion) of the grinding wheel to grind a workpiece. The bond used for this grinding wheel is selected from resin (resin) type, metal type, and vitrified type, and the thickness and height (protrusion amount) of the segment of the grinding wheel are set so that they will not crack during grinding. The height is about 2 to 4 mm and the height is about 4 to 5 mm. For example, when a resin package substrate in which a semiconductor device chip is packaged is ground with such a conventional grinding wheel, there is a demand for thinning of the wafer level package, and there is a problem that the resin or metal extends and becomes burrs. ..

本発明は、かかる課題に鑑みてなされたものであり、その目的は、従来よりも樹脂や金属等の延性材料が延びてバリとなってしまうことを抑制できる研削ホイールを提供することである。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a grinding wheel capable of suppressing the ductile material such as resin or metal from extending and becoming burrs as compared with the conventional case.

上述した課題を解決し、目的を達成するために、本発明の研削ホイールは、延性材料を研削する研削ホイールであって、スピンドルの下端に固定される固定端部と、研削する被加工物に対面する自由端部とを有する環状のホイール基台と、該自由端部に、長辺が該ホイール基台の周方向に沿って所定の間隔で並ぶ矩形板状の複数の研削砥石と、を備え、該研削砥石は、砥粒がニッケルメッキで固定された矩形板状の電鋳砥石であり、厚さが１ｍｍ以下で、該自由端部からの高さ／厚さで示される値が５以上３５未満である。 In order to solve the above-mentioned problems and achieve the object, the grinding wheel of the present invention is a grinding wheel for grinding a ductile material, and has a fixed end fixed to the lower end of a spindle and a workpiece to be ground. An annular wheel base having facing free ends, and a plurality of rectangular plate-shaped grinding wheels having long sides arranged at predetermined intervals along the circumferential direction of the wheel base at the free ends. The grinding wheel is a rectangular plate-shaped electrocasting wheel in which the abrasive grains are fixed by nickel plating, the thickness is 1 mm or less, and the value indicated by the height / thickness from the free end is 5. It is more than 35 and less than 35.

矩形板状の該研削砥石は、厚さが０．５ｍｍ以下であってもよい。 The rectangular plate-shaped grinding wheel may have a thickness of 0.5 mm or less.

研削する被加工物は、被研削面に配置された樹脂、または金属を備えてもよい。 The workpiece to be ground may include a resin or metal arranged on the surface to be ground.

本発明は、従来よりも樹脂や金属等の延性材料が延びてバリとなってしまうことを抑制できる。 INDUSTRIAL APPLICABILITY According to the present invention, it is possible to prevent the ductile material such as resin and metal from extending and becoming burrs as compared with the conventional case.

図１は、実施形態に係る研削ホイールの構成例を示す底面図である。FIG. 1 is a bottom view showing a configuration example of a grinding wheel according to an embodiment. 図２は、図１の研削ホイールを示す断面図である。FIG. 2 is a cross-sectional view showing the grinding wheel of FIG. 図３は、図１の研削ホイールを装着した研削装置を示す断面図である。FIG. 3 is a cross-sectional view showing a grinding device equipped with the grinding wheel of FIG.

本発明を実施するための形態（実施形態）につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。 An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

〔実施形態〕
本発明の実施形態に係る研削ホイール１を図面に基づいて説明する。図１は、実施形態に係る研削ホイール１の構成例を示す底面図である。図２は、図１の研削ホイール１を示す断面図である。図２は、図１の（ＩＩ）－（ＩＩ）断面図である。図３は、図１の研削ホイール１を装着した研削装置１００を示す断面図である。実施形態に係る研削ホイール１は、図１及び図２に示すように、環状のホイール基台１０と、複数の研削砥石２０と、を備える。 [Embodiment]
The grinding wheel 1 according to the embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a bottom view showing a configuration example of the grinding wheel 1 according to the embodiment. FIG. 2 is a cross-sectional view showing the grinding wheel 1 of FIG. FIG. 2 is a cross-sectional view taken along the line (II)-(II) of FIG. FIG. 3 is a cross-sectional view showing a grinding device 100 equipped with the grinding wheel 1 of FIG. As shown in FIGS. 1 and 2, the grinding wheel 1 according to the embodiment includes an annular wheel base 10 and a plurality of grinding wheels 20.

研削ホイール１は、図３に示すように、研削装置１００のスピンドル１２０の下端１２１に設けられたホイール固定部１２２に固定されて、スピンドル１２０により回転軸２回りに回転駆動されて、スピンドル１２０の下端１２１側と回転軸２方向に対向して設けられた研削装置１００のチャックテーブル１１０上に保持された被加工物２００の被研削面２０１の研削処理に使用される。ここで、研削ホイール１の回転軸２は、ホイール基台１０の円環の中心軸と一致する。 As shown in FIG. 3, the grinding wheel 1 is fixed to a wheel fixing portion 122 provided at the lower end 121 of the spindle 120 of the grinding device 100, and is rotationally driven by the spindle 120 around a rotation shaft to drive the spindle 120. It is used for grinding the surface to be ground 201 of the workpiece 200 held on the chuck table 110 of the grinding device 100 provided so as to face the lower end 121 side in two directions of the rotating shaft. Here, the rotation axis 2 of the grinding wheel 1 coincides with the central axis of the ring of the wheel base 10.

研削ホイール１の研削対象である図３に示す被加工物２００は、本実施形態では、被研削面２０１に配置された延性材料を備える。延性材料は、本実施形態では、金属または樹脂である。被加工物２００は、例えば、樹脂により封止されたデバイスを複数有した円形状もしくは矩形状のパッケージ基板や、樹脂板、金属板、金属と樹脂とを含む複合材板などである。被加工物２００は、本発明ではこれに限定されず、シリコン、サファイア、シリコンカーバイド（ＳｉＣ）、ガリウムヒ素などを母材とする円板状の半導体ウエーハや光デバイスウエーハなどの被研削面２０１に樹脂膜や金属膜等の延性材料の膜が形成されたもの等でもよい。 The workpiece 200 shown in FIG. 3, which is the object of grinding of the grinding wheel 1, includes a ductile material arranged on the surface to be ground 201 in the present embodiment. The ductile material is, in this embodiment, a metal or resin. The workpiece 200 is, for example, a circular or rectangular package substrate having a plurality of devices sealed with resin, a resin plate, a metal plate, a composite material plate containing metal and resin, and the like. The workpiece 200 is not limited to this in the present invention, and may be a surface 201 to be ground such as a disk-shaped semiconductor wafer or an optical device wafer using silicon, sapphire, silicon carbide (SiC), gallium arsenide or the like as a base material. A film of a ductile material such as a resin film or a metal film may be formed.

ホイール基台１０は、図１及び図２に示すように、中央に、回転軸２方向に貫通する円形の貫通孔１１が形成されている。ホイール基台１０は、図３に示すように、回転軸２に直交する一方の面であり、スピンドル１２０の下端１２１に固定される側の面である固定端部１２と、回転軸２に直交する他方の面であり、研削装置１００に装着された際に研削する被加工物２００の被研削面２０１に対面する側の面である自由端部１３と、を有する。貫通孔１１は、本実施形態では、自由端部１３側に向かうに従って孔径が広がる方向にテーパが形成されているが、本発明ではこれに限定されず、テーパが形成されていなくてもよい。ホイール基台１０は、本実施形態では、例えばステンレス鋼などの金属で構成されている。 As shown in FIGS. 1 and 2, the wheel base 10 is formed with a circular through hole 11 penetrating in the two directions of the rotation axis in the center. As shown in FIG. 3, the wheel base 10 is one surface orthogonal to the rotation axis 2, and is orthogonal to the fixed end portion 12 which is the surface fixed to the lower end 121 of the spindle 120 and the rotation axis 2. It has a free end portion 13 which is a surface facing the surface 201 to be ground of the workpiece 200 to be ground when it is mounted on the grinding device 100. In the present embodiment, the through hole 11 is tapered in a direction in which the hole diameter increases toward the free end portion 13, but the present invention is not limited to this, and the taper may not be formed. In this embodiment, the wheel base 10 is made of a metal such as stainless steel.

ホイール基台１０は、図１及び図２に示すように、外周部の自由端部１３側に、複数の研削砥石２０を嵌め合わせ可能な幅の環状溝１４が形成されている。環状溝１４の幅は、研削砥石２０の厚さ２３に応じて決められる。環状溝１４の深さ方向は、本実施形態では、研削ホイール１の回転軸２の方向、すなわち、ホイール基台１０の厚み方向に沿っている。環状溝１４は、図１に示す例では、全周に渡って均一の深さで連続的に形成されているが、本発明ではこれに限定されず、例えば、研削砥石２０の長辺方向の長さ２１に対応する周方向の長さの溝が、周方向に所定の間隔２２を開けて断続的に形成されていてもよい。 As shown in FIGS. 1 and 2, the wheel base 10 is formed with an annular groove 14 having a width capable of fitting a plurality of grinding wheels 20 on the free end portion 13 side of the outer peripheral portion. The width of the annular groove 14 is determined according to the thickness 23 of the grinding wheel 20. In the present embodiment, the depth direction of the annular groove 14 is along the direction of the rotation axis 2 of the grinding wheel 1, that is, the thickness direction of the wheel base 10. In the example shown in FIG. 1, the annular groove 14 is continuously formed at a uniform depth over the entire circumference, but the present invention is not limited to this, and for example, the annular groove 14 is formed in the long side direction of the grinding wheel 20. Grooves having a circumferential length corresponding to the length 21 may be formed intermittently with a predetermined interval 22 in the circumferential direction.

ホイール基台１０は、図１及び図２に示すように、環状溝１４よりも内周側に、回転軸２方向に貫通する研削水供給路１５が形成されている。研削水供給路１５は、本実施形態では、自由端部１３側の開口が貫通孔１１のテーパ部分に形成されているが、本発明ではこれに限定されず、貫通孔１１のテーパ部分よりも外周側の自由端部１３に形成されていてもよい。研削水供給路１５は、本実施形態では、周方向に沿って一定の間隔で複数箇所（図１に示す例では６箇所）に形成されている。研削水供給路１５は、研削ホイール１が研削装置１００に装着された際に、固定端部１２側の開口が所定の研削水供給源に接続されて、研削水供給源からの研削水１２６を自由端部１３側の開口から、複数の研削砥石２０よりも内周側の領域と回転軸２方向に対向する被加工物２００の被研削面２０１上の領域に供給する。研削水１２６は、本実施形態では、例えば水（純水）である。 As shown in FIGS. 1 and 2, the wheel base 10 is formed with a grinding water supply path 15 penetrating in two directions of the rotation axis on the inner peripheral side of the annular groove 14. In the present embodiment, the free end portion 13 side opening of the grinding water supply path 15 is formed in the tapered portion of the through hole 11, but the present invention is not limited to this, and the grinding water supply path 15 is more than the tapered portion of the through hole 11. It may be formed on the free end portion 13 on the outer peripheral side. In the present embodiment, the grinding water supply passages 15 are formed at a plurality of locations (6 locations in the example shown in FIG. 1) at regular intervals along the circumferential direction. In the grinding water supply path 15, when the grinding wheel 1 is mounted on the grinding device 100, the opening on the fixed end 12 side is connected to a predetermined grinding water supply source, and the grinding water 126 from the grinding water supply source is connected. From the opening on the free end portion 13 side, supply is supplied to a region on the inner peripheral side of the plurality of grinding wheels 20 and a region on the ground surface 201 of the workpiece 200 facing the rotation axis in two directions. In this embodiment, the grinding water 126 is, for example, water (pure water).

ホイール基台１０は、図１及び図２に示すように、外周部の固定端部１２側に固定用ネジ穴１６が形成されている。固定用ネジ穴１６は、本実施形態では、周方向に沿って一定の間隔で複数箇所（図１に示す例では６箇所）に形成されている。また、固定用ネジ穴１６は、周方向において、互いに隣接する研削水供給路１５の中間の位置に対応する位置に形成されている。図３に示すように、研削装置１００のホイール固定部１２２の装着用孔１２３に挿入された複数のネジ１２４が固定用ネジ穴１６に締結されることにより、研削ホイール１がスピンドル１２０の下端１２１に固定される。 As shown in FIGS. 1 and 2, the wheel base 10 has a fixing screw hole 16 formed on the fixed end portion 12 side of the outer peripheral portion. In the present embodiment, the fixing screw holes 16 are formed at a plurality of locations (6 locations in the example shown in FIG. 1) at regular intervals along the circumferential direction. Further, the fixing screw hole 16 is formed at a position corresponding to an intermediate position of the grinding water supply passages 15 adjacent to each other in the circumferential direction. As shown in FIG. 3, a plurality of screws 124 inserted into the mounting holes 123 of the wheel fixing portion 122 of the grinding device 100 are fastened to the fixing screw holes 16, so that the grinding wheel 1 is attached to the lower end 121 of the spindle 120. Is fixed to.

研削砥石２０は、矩形板状であり、長さ２１の長辺方向がホイール基台１０の周方向に沿う方向に向けられて、周方向に所定の間隔２２で並んで配置されている。研削砥石２０は、短辺方向が回転軸２の方向（環状溝１４の深さ方向）に沿って、厚さ２３の方向がホイール基台１０の径方向に沿った方向に向けられ、環状溝１４に挿入されて嵌め合わせられて、金属用の接着剤等によりホイール基台１０の自由端部１３側に固定される。このため、研削砥石２０は、ホイール基台１０の自由端部１３側から、研削ホイール１の回転軸２の方向（ホイール基台１０の厚み方向）に沿って突出するように固定される。研削砥石２０は、本実施形態では、矩形板状の長辺方向が環状溝１４の周方向の湾曲に合わせて湾曲されて、環状溝１４に挿入されて嵌め合わせられて固定されているが、本発明ではこれに限定されず、湾曲されずに、長辺方向がホイール基台１０の周方向の接線方向に沿う方向に向けられて、環状溝１４に嵌め合わせられて固定されてもよい。 The grinding wheel 20 has a rectangular plate shape, and the long side direction of the length 21 is directed toward the circumferential direction of the wheel base 10, and the grinding wheels 20 are arranged side by side at predetermined intervals 22 in the circumferential direction. In the grinding wheel 20, the short side direction is directed along the direction of the rotation axis 2 (the depth direction of the annular groove 14), and the thickness 23 is directed along the radial direction of the wheel base 10. It is inserted into 14 and fitted to the wheel base 10 and fixed to the free end 13 side of the wheel base 10 with an adhesive for metal or the like. Therefore, the grinding wheel 20 is fixed so as to project from the free end 13 side of the wheel base 10 along the direction of the rotation axis 2 of the grinding wheel 1 (the thickness direction of the wheel base 10). In the present embodiment, the grinding grind 20 is curved in the long side direction of the rectangular plate shape in accordance with the curvature in the circumferential direction of the annular groove 14, and is inserted into the annular groove 14 to be fitted and fixed. In the present invention, the present invention is not limited to this, and the long side direction may be oriented along the tangential direction of the circumferential direction of the wheel base 10 and may be fitted and fixed to the annular groove 14 without being curved.

研削砥石２０は、ダイヤモンドやＣＢＮ（Cubic Boron Nitride）等の砥粒がニッケルメッキを含む電鋳ボンドで固定された矩形板状の電鋳砥石である。研削砥石２０は、厚さ２３が１ｍｍ以下であり、厚さ２３が０．５ｍｍ以下であることが好ましい。研削砥石２０は、ホイール基台１０の自由端部１３から突出した高さ（突出量）２４と厚さ２３との比の値であるアスペクト比（高さ２４／厚さ２３）が５以上３５未満である。研削砥石２０は、環状溝１４に嵌め合わせられた側と反対側の端面が、チャックテーブル１１０上の被加工物２００の被研削面２０１と接触して、被加工物２００の被研削面２０１を研削する研削面２５となる。研削砥石２０の研削面２５は、径方向の長さが厚さ２３であり、周方向の長さが長辺方向の長さ２１であり、周方向に細長い形状である。 The grinding wheel 20 is a rectangular plate-shaped electroformed grindstone in which abrasive grains such as diamond and CBN (Cubic Boron Nitride) are fixed by an electroformed bond containing nickel plating. The grinding wheel 20 preferably has a thickness 23 of 1 mm or less and a thickness 23 of 0.5 mm or less. The grinding wheel 20 has an aspect ratio (height 24 / thickness 23) of 5 or more and 35, which is a value of the ratio between the height (projection amount) 24 protruding from the free end portion 13 of the wheel base 10 and the thickness 23. Is less than. In the grinding wheel 20, the end surface on the side opposite to the side fitted in the annular groove 14 comes into contact with the surface to be ground 201 of the workpiece 200 on the chuck table 110, and the surface to be ground 201 of the workpiece 200 is touched. It becomes the grinding surface 25 to be ground. The grinding surface 25 of the grinding wheel 20 has a thickness 23 in the radial direction, a length 21 in the circumferential direction, and an elongated shape in the circumferential direction.

研削砥石２０に含まれる砥粒は、中心粒径が４μｍ以上３０μｍ以下である。研削砥石２０に含まれる砥粒は、中心粒径を粒度に変換すると、粒度が＃３６０（３６０番）以上＃２５００（２５００番）以下である。砥石の粒度の大きさは、ＪＩＳ規格「Ｒ６００１：研削といし用研磨材の粒度」で規定され、中心粒径が大きくなるに従って番号が小さくなり、中心粒径が小さくなるに従って番号が大きくなるパラメータである。 The abrasive grains contained in the grinding wheel 20 have a central particle size of 4 μm or more and 30 μm or less. The abrasive grains contained in the grinding wheel 20 have a particle size of # 360 (No. 360) or more and # 2500 (No. 2500) or less when the central particle size is converted into a particle size. The size of the grain size of the grindstone is defined by JIS standard "R6001: Grain size of abrasive material for grinding wheel", and the number decreases as the center particle size increases, and the number increases as the center particle size decreases. Is.

研削砥石２０は、所定の厚さ２３の大きな板状の電鋳砥石を形成した後、ワイヤー放電等により矩形状に切り出されて複数のセグメント状に形成される。研削砥石２０は、例えば、所定の厚さ２３が０．５ｍｍに形成され、長辺方向の長さ２１が１５ｍｍに、短辺方向の長さ（高さ）が５ｍｍに切り出され、隣接する研削砥石２０の所定の間隔２２を数ｍｍ程度として、１ｍｍの深さの環状溝１４に挿入されて嵌め合わせられて高さ２４を４ｍｍとして、ホイール基台１０の自由端部１３側に固定されて、アスペクト比が８となる。 The grinding wheel 20 is formed into a large plate-shaped electroformed grindstone having a predetermined thickness of 23, and then cut out into a rectangular shape by wire discharge or the like to be formed into a plurality of segments. The grinding grind 20 has, for example, a predetermined thickness 23 formed to 0.5 mm, a length 21 in the long side direction cut out to 15 mm, and a length (height) in the short side direction cut out to 5 mm, and adjacent grinding is performed. It is fixed to the free end 13 side of the wheel base 10 with a predetermined spacing 22 of the grindstone 20 of about several mm, inserted into an annular groove 14 having a depth of 1 mm and fitted, and a height 24 of 4 mm. , The aspect ratio is 8.

次に、本明細書は、実施形態に係る研削ホイール１を装着した研削装置１００の動作を図面に基づいて説明する。研削装置１００は、まず、複数のネジ１２４をホイール固定部１２２の装着用孔１２３に挿入してから研削ホイール１の固定用ネジ穴１６に締結することで、研削ホイール１をスピンドル１２０の下端１２１に固定する。研削装置１００は、次に、チャックテーブル１１０の保持面１１１に載置された被加工物２００を、被研削面２０１を研削ホイール１側に向けて吸引保持する。 Next, this specification describes the operation of the grinding apparatus 100 equipped with the grinding wheel 1 according to the embodiment based on the drawings. The grinding device 100 first inserts a plurality of screws 124 into the mounting holes 123 of the wheel fixing portion 122, and then fastens the grinding wheel 1 to the fixing screw holes 16 of the grinding wheel 1, thereby attaching the grinding wheel 1 to the lower end 121 of the spindle 120. To fix. Next, the grinding apparatus 100 sucks and holds the workpiece 200 placed on the holding surface 111 of the chuck table 110 with the surface 201 to be ground toward the grinding wheel 1.

研削装置１００は、そして、図３に示すように、不図示の回転駆動源によりチャックテーブル１１０を保持面１１１に直交する回転軸１１２回りに回転させることでチャックテーブル１１０上の被加工物２００を回転させる。また、研削装置１００は、スピンドル１２０を回転駆動して研削ホイール１を回転軸２回りに回転させる。研削装置１００は、また、図３に示すように、研削水供給路１５及び研削水供給部１２５により研削砥石２０のそれぞれ内周側及び外周側の各領域と回転軸２方向に対向する被加工物２００の被研削面２０１上の各領域に研削水１２６を供給する。研削装置１００は、このように研削水１２６を供給しながら、スピンドル１２０を回転軸２の方向に沿ってチャックテーブル１１０に近接移動させることで、回転軸２回りに回転する研削ホイール１の研削砥石２０を回転軸１１２回りに回転する被加工物２００の被研削面２０１に対して近接させて接触及び押圧することにより、研削ホイール１の研削砥石２０の研削面２５でチャックテーブル１１０上の被加工物２００の被研削面２０１を研削する。 As shown in FIG. 3, the grinding apparatus 100 then rotates the chuck table 110 around a rotation axis 112 orthogonal to the holding surface 111 by a rotation drive source (not shown) to rotate the workpiece 200 on the chuck table 110. Rotate. Further, the grinding device 100 rotationally drives the spindle 120 to rotate the grinding wheel 1 around two rotation axes. As shown in FIG. 3, the grinding device 100 also has a workpiece facing each region on the inner peripheral side and the outer peripheral side of the grinding wheel 20 in two directions of the rotation axis by the grinding water supply path 15 and the grinding water supply unit 125, respectively. Grinding water 126 is supplied to each region on the surface 201 to be ground of the object 200. The grinding device 100 moves the spindle 120 close to the chuck table 110 along the direction of the rotating shaft 2 while supplying the grinding water 126 in this way, so that the grinding wheel 1 of the grinding wheel 1 rotates around the rotating shaft 2. By contacting and pressing the 20 in close proximity to the surface 201 of the workpiece 200 rotating around the rotation axis 112, the workpiece 20 is processed on the chuck table 110 by the grinding surface 25 of the grinding wheel 20 of the grinding wheel 1. The surface 201 to be ground of the object 200 is ground.

従来では、研削砥石のセグメントは、研削中に割れないように、厚さが２ｍｍ～４ｍｍ程度に、高さが４ｍｍ～５ｍｍ程度に、アスペクト比が１～２．５程度に設定されていたため、樹脂や金属等の延性材料が延びてバリとなってしまっていた。しかしながら、以上のような構成を有する実施形態に係る研削ホイール１は、厚さ２３が１ｍｍ以下の薄板状の研削砥石２０が周方向に沿って環状に配置されており、ホイール基台１０の自由端部１３側からホイール基台１０の厚み方向に沿って突出するように固定されており、研削砥石２０のアスペクト比が５以上３５未満であるため、厚さ２３が１ｍｍ以下の周方向に細長い形状の研削面２５で樹脂や金属等の延性材料を切るように削り取ることができるので、従来よりも樹脂や金属等の延性材料が延びてバリとなってしまうことを抑制できるという作用効果を奏する。 Conventionally, the segment of the grinding wheel has a thickness of about 2 mm to 4 mm, a height of about 4 mm to 5 mm, and an aspect ratio of about 1 to 2.5 so as not to crack during grinding. Ductile materials such as resin and metal were stretched and became burrs. However, in the grinding wheel 1 according to the embodiment having the above configuration, a thin plate-shaped grinding wheel 20 having a thickness 23 of 1 mm or less is arranged in an annular shape along the circumferential direction, and the wheel base 10 is free. It is fixed so as to project from the end 13 side along the thickness direction of the wheel base 10, and since the aspect ratio of the grinding wheel 20 is 5 or more and less than 35, the thickness 23 is elongated in the circumferential direction of 1 mm or less. Since the ductile material such as resin or metal can be scraped off by the ground surface 25 of the shape, the ductile material such as resin or metal can be prevented from being stretched and becoming burrs more than before. ..

また、実施形態に係る研削ホイール１は、研削砥石２０が、砥粒がニッケルメッキを含む電鋳ボンドで固定された矩形板状の電鋳砥石であるため、従来の研削砥石のセグメントと比較して研削中に割れにくいので、厚さ２３が１ｍｍ以下や０．５ｍｍ以下と薄くても、アスペクト比が５以上３５未満となる高さ２４まで突出させても、研削砥石２０が割れることなく研削することができる。このため、実施形態に係る研削ホイール１は、アスペクト比を５以上３５未満と高くすることで、研削砥石２０が被加工物２００を研削することにより削れて使用できなくなるまでの寿命を長くすることができる。なお、研削ホイールは、アスペクト比が５未満である場合、寿命が短く、アスペクト比が３５以上である場合、研削砥石が研削中に割れて破損する恐れが生じてしまう。 Further, in the grinding wheel 1 according to the embodiment, since the grinding wheel 20 is a rectangular plate-shaped electric casting grindstone in which the abrasive grains are fixed by an electric casting bond containing nickel plating, it is compared with the segment of the conventional grinding wheel. Since it is hard to crack during grinding, even if the thickness 23 is as thin as 1 mm or less or 0.5 mm or less, even if it is projected to a height 24 where the aspect ratio is 5 or more and less than 35, the grinding wheel 20 does not crack and grinds. can do. Therefore, by increasing the aspect ratio of the grinding wheel 1 according to the embodiment to 5 or more and less than 35, the life until the grinding wheel 20 is scraped by grinding the workpiece 200 and becomes unusable is extended. Can be done. If the aspect ratio of the grinding wheel is less than 5, the life is short, and if the aspect ratio is 35 or more, the grinding wheel may be cracked and damaged during grinding.

また、実施形態に係る研削ホイール１は、研削砥石２０の厚さ２３が１ｍｍ以下であるため、砥粒がニッケルメッキを含む電鋳ボンドで固定した矩形板状の電鋳砥石を容易に形成でき、なおかつ、ホイール基台１０の環状溝１４へ容易に挿入できるので、研削ホイール１の製造コスト及び研削コストを低減できる。 Further, in the grinding wheel 1 according to the embodiment, since the thickness 23 of the grinding wheel 20 is 1 mm or less, it is possible to easily form a rectangular plate-shaped electric casting grindstone in which the abrasive grains are fixed by an electric casting bond containing nickel plating. Moreover, since it can be easily inserted into the annular groove 14 of the wheel base 10, the manufacturing cost and the grinding cost of the grinding wheel 1 can be reduced.

また、実施形態に係る研削ホイール１は、研削砥石２０の厚さ２３がさらに薄く０．５ｍｍ以下である場合、周方向に細長い形状の研削面２５の厚さ２３もさらに薄く０．５ｍｍ以下となるため、さらに好適に樹脂や金属等の延性材料を切るように削り取ることができるので、従来よりも樹脂や金属等の延性材料が延びてバリとなってしまうことをさらに抑制できる。また、実施形態に係る研削ホイール１は、研削砥石２０の厚さ２３がさらに薄く０．５ｍｍ以下である場合、砥粒がニッケルメッキを含む電鋳ボンドで固定した矩形板状の電鋳砥石をさらに容易に形成でき、なおかつ、ホイール基台１０の環状溝１４へさらに容易に挿入できるので、研削ホイール１の製造コスト及び研削コストをさらに低減できる。 Further, in the grinding wheel 1 according to the embodiment, when the thickness 23 of the grinding wheel 20 is further thin and 0.5 mm or less, the thickness 23 of the grinding surface 25 having an elongated shape in the circumferential direction is also thinner and 0.5 mm or less. Therefore, since the ductile material such as resin or metal can be more preferably scraped off, it is possible to further prevent the ductile material such as resin or metal from extending and becoming burrs as compared with the conventional case. Further, the grinding wheel 1 according to the embodiment is a rectangular plate-shaped electric casting grindstone in which the abrasive grains are fixed by an electric casting bond containing nickel plating when the thickness 23 of the grinding wheel 20 is further thin and is 0.5 mm or less. Since it can be formed more easily and can be more easily inserted into the annular groove 14 of the wheel base 10, the manufacturing cost and the grinding cost of the grinding wheel 1 can be further reduced.

また、実施形態に係る研削ホイール１は、研削砥石２０が、砥粒がニッケルメッキを含む電鋳ボンドで固定された矩形板状の電鋳砥石であるため、熱伝導性の高いので、研削で発生した熱を素早く放熱することで、樹脂や金属等の延性材料が延びてバリとなってしまったり、延性材料が研削砥石２０に付着して所謂目詰まりを発生させてしまったりすることをさらに抑制できる。 Further, in the grinding wheel 1 according to the embodiment, since the grinding wheel 20 is a rectangular plate-shaped electric casting grindstone in which the abrasive grains are fixed by an electric casting bond containing nickel plating, the grinding wheel 1 has high thermal conductivity. By quickly dissipating the generated heat, the ductile material such as resin or metal may stretch and become burrs, or the ductile material may adhere to the grinding wheel 20 and cause so-called clogging. It can be suppressed.

なお、本発明は上記実施形態に限定されるものではない。即ち、本発明の骨子を逸脱しない範囲で種々変形して実施することができる。たとえば、実施形態では、被加工物２００が自転しながら研削されるインフィード方式の研削例を示したが、回転する研削砥石２０に対して自転しない被加工物２００をスピンドル１２０の回転軸２に対しラジアル方向から進入させて研削砥石２０で研削するクリープフィード方式の研削に本願の研削ホイール１を用いても良い。 The present invention is not limited to the above embodiment. That is, it can be variously modified and carried out within a range that does not deviate from the gist of the present invention. For example, in the embodiment, an in-feed type grinding example in which the workpiece 200 is ground while rotating is shown, but the workpiece 200 that does not rotate with respect to the rotating grinding wheel 20 is used as the rotating shaft 2 of the spindle 120. On the other hand, the grinding wheel 1 of the present application may be used for creep-feed type grinding in which the grinding wheel 20 is used to grind by approaching from the radial direction.

１ 研削ホイール
１０ ホイール基台
１２ 固定端部
１３ 自由端部
２０ 研削砥石
２１ 長辺方向の長さ
２２ 間隔
２３ 厚さ
２４ 高さ
１２０ スピンドル
２００ 被加工物
２０１ 被研削面 1 Grinding wheel 10 Wheel base 12 Fixed end 13 Free end 20 Grinding wheel 21 Long side length 22 Spacing 23 Thickness 24 Height 120 Spindle 200 Work piece 201 Grinding surface

Claims (3)

延性材料を研削する研削ホイールであって、
スピンドルの下端に固定される固定端部と、研削する被加工物に対面する自由端部とを有する環状のホイール基台と、
該自由端部に、長辺が該ホイール基台の周方向に沿って所定の間隔で並ぶ矩形板状の複数の研削砥石と、を備え、
該研削砥石は、砥粒がニッケルメッキで固定された矩形板状の電鋳砥石であり、厚さが１ｍｍ以下で、該自由端部からの高さ／厚さで示される値が５以上３５未満である研削ホイール。 A grinding wheel that grinds ductile materials
An annular wheel base with a fixed end fixed to the lower end of the spindle and a free end facing the workpiece to be ground.
The free end is provided with a plurality of rectangular plate-shaped grinding wheels having long sides arranged at predetermined intervals along the circumferential direction of the wheel base.
The grinding wheel is a rectangular plate-shaped electroformed grindstone in which the abrasive grains are fixed by nickel plating, the thickness is 1 mm or less, and the value indicated by the height / thickness from the free end is 5 or more and 35. Grinding wheel that is less than. 矩形板状の該研削砥石は、厚さが０．５ｍｍ以下である請求項１に記載の研削ホイール。 The grinding wheel according to claim 1, wherein the rectangular plate-shaped grinding wheel has a thickness of 0.5 mm or less. 研削する被加工物は、被研削面に配置された樹脂、または金属を備える請求項１または２に記載の研削ホイール。 The grinding wheel according to claim 1 or 2, wherein the workpiece to be ground includes a resin or metal arranged on the surface to be ground.
JP2020210048A 2020-12-18 2020-12-18 Grinding wheel Pending JP2022096834A (en)

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KR1020210174291A KR20220088314A (en) 2020-12-18 2021-12-08 Grinding wheel
CN202111502083.0A CN114643541A (en) 2020-12-18 2021-12-09 Grinding wheel
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KR200179209Y1 (en) * 1999-11-19 2000-04-15 장경옥 Grinding plate for rigid materials
JP4885376B2 (en) 2001-07-04 2012-02-29 株式会社ディスコ Grinding wheel
SG119140A1 (en) * 2001-07-04 2006-02-28 Disco Corp Grinding wheel
JPWO2006137453A1 (en) * 2005-06-21 2009-01-22 大西　一正 Polishing equipment using ultrasonic vibration
JP6113015B2 (en) * 2013-07-24 2017-04-12 株式会社ディスコ Crack thickness detector
JP2016147359A (en) * 2015-02-13 2016-08-18 株式会社ディスコ Grinding whetstone
JP2016168660A (en) * 2015-03-13 2016-09-23 株式会社ディスコ Grinding wheel
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