JP2022007538A5 - - Google Patents
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- JP2022007538A5 JP2022007538A5 JP2020110571A JP2020110571A JP2022007538A5 JP 2022007538 A5 JP2022007538 A5 JP 2022007538A5 JP 2020110571 A JP2020110571 A JP 2020110571A JP 2020110571 A JP2020110571 A JP 2020110571A JP 2022007538 A5 JP2022007538 A5 JP 2022007538A5
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- substrate
- mask
- measuring
- distance
- supporting
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- 239000000758 substrate Substances 0.000 claims description 85
- 238000005259 measurement Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 7
- 230000005484 gravity Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Description
本発明によれば、例えば、
大型基板を分割して得られた複数の基板のうちのいずれかの基板の周縁部を支持する基板支持手段と、
マスクを支持するマスク支持手段と、
前記基板支持手段と前記マスク支持手段との重力方向の距離を調整する距離調整手段と、
前記基板支持手段に支持された前記基板と前記マスク支持手段に支持された前記マスクとの位置ずれ量を計測する計測動作を行う計測手段と、
前記基板と前記マスクとの相対位置を調整する位置調整動作を行う位置調整手段と、
前記位置調整手段及び前記距離調整手段を制御する制御手段と、を備え、
前記位置ずれ量が許容範囲内である場合に、前記基板と前記マスクとを互いに重ね合わせるアライメント装置であって、
前記基板支持手段によって支持されている基板の、分割前の前記大型基板における部位に関する基板情報を取得する取得手段を備え、
前記計測手段は、前記取得手段が取得した前記基板情報に基づいて、基板の辺の長さの違いに基因する撓み量の違いに応じて、前記距離調整手段によって前記基板と前記計測手段との間の距離を調整した後に、前記計測動作を行う、
ことを特徴とするアライメント装置が提供される。
According to the invention, for example,
substrate supporting means for supporting a peripheral portion of one of a plurality of substrates obtained by dividing a large substrate;
a mask support means for supporting the mask;
distance adjusting means for adjusting the distance in the gravitational direction between the substrate supporting means and the mask supporting means;
measuring means for performing a measuring operation for measuring a positional deviation amount between the substrate supported by the substrate supporting means and the mask supported by the mask supporting means;
Position adjusting means for performing a position adjusting operation for adjusting the relative position between the substrate and the mask;
and a control means for controlling the position adjustment means and the distance adjustment means,
An alignment apparatus for superimposing the substrate and the mask on each other when the amount of misalignment is within an allowable range,
Acquiring means for acquiring substrate information about a portion of the substrate supported by the substrate supporting means in the large substrate before division,
Based on the substrate information acquired by the acquisition means , the measurement means adjusts the distance between the substrate and the measurement means by the distance adjustment means according to the difference in the amount of deflection caused by the difference in the length of the sides of the substrate. Perform the measurement operation after adjusting the distance between
There is provided an alignment apparatus characterized by:
Claims (16)
マスクを支持するマスク支持手段と、
前記基板支持手段と前記マスク支持手段との重力方向の距離を調整する距離調整手段と、
前記基板支持手段に支持された前記基板と前記マスク支持手段に支持された前記マスクとの位置ずれ量を計測する計測動作を行う計測手段と、
前記基板と前記マスクとの相対位置を調整する位置調整動作を行う位置調整手段と、
前記位置調整手段及び前記距離調整手段を制御する制御手段と、を備え、
前記位置ずれ量が許容範囲内である場合に、前記基板と前記マスクとを互いに重ね合わせるアライメント装置であって、
前記基板支持手段によって支持されている基板の、分割前の前記大型基板における部位に関する基板情報を取得する取得手段を備え、
前記計測手段は、前記取得手段が取得した前記基板情報に基づいて、基板の辺の長さの違いに基因する撓み量の違いに応じて、前記距離調整手段によって前記基板と前記計測手段との間の距離を調整した後に、前記計測動作を行う、
ことを特徴とするアライメント装置。 substrate supporting means for supporting a peripheral portion of one of a plurality of substrates obtained by dividing a large substrate;
a mask support means for supporting the mask;
distance adjusting means for adjusting the distance in the gravitational direction between the substrate supporting means and the mask supporting means;
measuring means for performing a measuring operation for measuring a positional deviation amount between the substrate supported by the substrate supporting means and the mask supported by the mask supporting means;
Position adjusting means for performing a position adjusting operation for adjusting the relative position between the substrate and the mask;
and a control means for controlling the position adjustment means and the distance adjustment means,
An alignment apparatus for superimposing the substrate and the mask on each other when the amount of misalignment is within an allowable range,
Acquiring means for acquiring substrate information about a portion of the substrate supported by the substrate supporting means in the large substrate before division,
Based on the substrate information acquired by the acquisition means , the measurement means adjusts the distance between the substrate and the measurement means by the distance adjustment means according to the difference in the amount of deflection caused by the difference in the length of the sides of the substrate. Perform the measurement operation after adjusting the distance between
An alignment device characterized by:
マスクを支持するマスク支持手段と、
前記基板支持手段と前記マスク支持手段との重力方向の距離を調整する距離調整手段と、
前記基板支持手段に支持された前記基板と前記マスク支持手段に支持された前記マスクとの位置ずれ量を計測する計測動作を行う計測手段と、
前記基板と前記マスクとの相対位置を調整する位置調整動作を行う位置調整手段と、
前記位置調整手段及び前記距離調整手段を制御する制御手段と、を備え、
前記位置ずれ量が許容範囲内である場合に、前記基板と前記マスクとを互いに重ね合わせるアライメント装置であって、
前記基板支持手段によって支持されている基板の、分割前の前記大型基板における部位に関する基板情報を取得する取得手段を備え、
前記計測手段は、前記取得手段が取得した前記基板情報に基づいて、基板の辺の長さの違いに基因する撓み量の違いに応じて前記基板と前記計測手段との間の距離を異ならせて、前記計測動作を行う、
ことを特徴とするアライメント装置。 substrate supporting means for supporting a peripheral portion of one of a plurality of substrates obtained by dividing a large substrate;
a mask support means for supporting the mask;
distance adjusting means for adjusting the distance in the gravitational direction between the substrate supporting means and the mask supporting means;
measuring means for performing a measuring operation for measuring a positional deviation amount between the substrate supported by the substrate supporting means and the mask supported by the mask supporting means;
Position adjusting means for performing a position adjusting operation for adjusting the relative position between the substrate and the mask;
and a control means for controlling the position adjustment means and the distance adjustment means,
An alignment apparatus for superimposing the substrate and the mask on each other when the amount of misalignment is within an allowable range,
Acquiring means for acquiring substrate information about a portion of the substrate supported by the substrate supporting means in the large substrate before division,
Based on the substrate information acquired by the acquiring means, the measuring means varies the distance between the substrate and the measuring means according to the difference in the amount of deflection caused by the difference in the length of the sides of the substrate. to perform the measurement operation;
An alignment device characterized by:
ことを特徴とする請求項１又は２に記載のアライメント装置。 The distance adjusting means adjusts the distance between the substrate and the measuring means by moving the substrate supporting means in the direction of gravity based on the substrate information.
3. The alignment apparatus according to claim 1 or 2, characterized in that:
ことを特徴とする請求項１又は２に記載のアライメント装置。 The distance adjusting means adjusts the distance between the substrate and the measuring means by moving the mask supporting means in the direction of gravity based on the substrate information.
3. The alignment apparatus according to claim 1 or 2, characterized in that:
前記位置調整手段は、前記距離調整手段によって前記基板と前記マスクとを離隔させた状態で、前記位置調整動作を行う、
ことを特徴とする請求項１～４のいずれか１項に記載のアライメント装置。 the measuring means performs the measuring operation while the substrate and the mask are partially in contact with each other by the distance adjusting means;
The position adjustment means performs the position adjustment operation while the substrate and the mask are separated by the distance adjustment means.
The alignment apparatus according to any one of claims 1 to 4, characterized in that:
ことを特徴とする請求項１～５のいずれか１項に記載のアライメント装置。 The measurement operation and the position adjustment operation are repeatedly performed until the positional deviation amount falls within an allowable range.
The alignment apparatus according to any one of claims 1 to 5, characterized in that:
ことを特徴とする請求項５又は６に記載のアライメント装置。 The substrate support means includes a clamping portion that clamps at least part of the peripheral edge of the substrate,
7. The alignment apparatus according to claim 5 or 6, characterized in that:
前記制御手段は、
前記基板情報に対応した前記距離調整情報を前記記憶手段から読み出し、読み出した前記距離調整情報に従って前記距離調整手段を制御する、
ことを特徴とする請求項１～７のいずれか１項に記載のアライメント装置。 comprising storage means for storing distance adjustment information associated with the substrate information;
The control means is
reading the distance adjustment information corresponding to the substrate information from the storage means, and controlling the distance adjustment means according to the read distance adjustment information;
The alignment apparatus according to any one of claims 1 to 7, characterized in that:
ことを特徴とする請求項１～８のいずれか１項に記載のアライメント装置。 The position adjustment means adjusts the relative position by moving the substrate support means.
The alignment apparatus according to any one of claims 1 to 8, characterized in that:
ことを特徴とする請求項１～９のいずれか１項に記載のアライメント装置。 The measurement means is a camera that images the alignment marks of the substrate and the alignment marks of the mask.
The alignment apparatus according to any one of claims 1 to 9, characterized in that:
前記マスクを介して前記基板上に成膜する成膜手段と、を備える
ことを特徴とする成膜装置。 an alignment apparatus according to any one of claims 1 to 10;
and a film forming device for forming a film on the substrate through the mask.
前記基板とマスクとの位置ずれ量を計測手段によって計測する計測工程と、
前記計測工程の後に、前記基板と前記マスクとの相対位置を調整する位置調整工程と、
を備え、
前記位置ずれ量が許容範囲内である場合に、前記基板と前記マスクとを互いに重ね合わせるアライメント方法であって、
前記位置ずれ量の計測を行う基板の、分割前の前記大型基板における部位に関する基板情報を取得する取得工程と、
前記計測工程は、前記取得工程で取得した前記基板情報に基づいて、基板の辺の長さの違いに基因する撓み量の違いに応じて、前記基板と前記計測手段との間の距離を調整した後に行われる、
ことを特徴とするアライメント方法。 a substrate supporting step of supporting a peripheral portion of one of a plurality of substrates obtained by dividing a large substrate;
a measuring step of measuring a positional deviation amount between the substrate and the mask by a measuring means;
a position adjustment step of adjusting a relative position between the substrate and the mask after the measurement step;
with
An alignment method for superimposing the substrate and the mask on each other when the amount of positional deviation is within an allowable range,
an acquisition step of acquiring substrate information about a portion of the substrate on which the amount of positional deviation is to be measured in the large substrate before division;
The measuring step adjusts the distance between the substrate and the measuring means based on the substrate information acquired in the acquiring step , according to the difference in the amount of deflection caused by the difference in the length of the sides of the substrate. is done after
An alignment method characterized by:
前記基板とマスクとの位置ずれ量を計測手段によって計測する計測工程と、
前記計測工程の後に、前記基板と前記マスクとの相対位置を調整する位置調整工程と、
を備え、
前記位置ずれ量が許容範囲内である場合に、前記基板と前記マスクとを互いに重ね合わせるアライメント方法であって、
前記位置ずれ量の計測を行う基板の、分割前の前記大型基板における部位に関する基板情報を取得する取得工程と、
前記計測工程では、前記取得工程で取得した前記基板情報に基づいて、基板の辺の長さの違いに基因する撓み量の違いに応じて、前記基板と前記計測手段との間の距離を異ならせて、前記位置ずれ量を計測する、
ことを特徴とするアライメント方法。 a substrate supporting step of supporting one of a plurality of substrates obtained by dividing a large substrate;
a measuring step of measuring a positional deviation amount between the substrate and the mask by a measuring means;
a position adjustment step of adjusting a relative position between the substrate and the mask after the measurement step;
with
An alignment method for superimposing the substrate and the mask on each other when the amount of positional deviation is within an allowable range,
an acquisition step of acquiring substrate information about a portion of the substrate on which the amount of positional deviation is to be measured in the large substrate before division;
In the measuring step , based on the substrate information acquired in the acquiring step, the distance between the substrate and the measuring means is varied according to the difference in the amount of deflection caused by the difference in the length of the sides of the substrate. and measuring the amount of positional deviation,
An alignment method characterized by:
前記アライメント工程によって相対的な位置調整が行われた前記マスクを介して前記基板に成膜を行う成膜工程と、を含む、
ことを特徴とする電子デバイスの製造方法。 an alignment step of aligning the substrate and the mask by the alignment method according to claim 12 or 13;
a film forming step of forming a film on the substrate through the mask whose relative position is adjusted by the alignment step;
An electronic device manufacturing method characterized by:
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020110571A JP7440356B2 (en) | 2020-06-26 | 2020-06-26 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
| KR1020210077290A KR102625048B1 (en) | 2020-06-26 | 2021-06-15 | Alignment apparatus, film forming apparatus, alignment method, manufacturing method of electronic device, program, and storage medium |
| CN202110669672.1A CN113851407A (en) | 2020-06-26 | 2021-06-17 | Alignment apparatus, film forming apparatus, alignment method, method for manufacturing electronic device, and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020110571A JP7440356B2 (en) | 2020-06-26 | 2020-06-26 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022007538A JP2022007538A (en) | 2022-01-13 |
| JP2022007538A5 true JP2022007538A5 (en) | 2023-06-01 |
| JP7440356B2 JP7440356B2 (en) | 2024-02-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2020110571A Active JP7440356B2 (en) | 2020-06-26 | 2020-06-26 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7440356B2 (en) |
| KR (1) | KR102625048B1 (en) |
| CN (1) | CN113851407A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230153052A (en) * | 2022-04-28 | 2023-11-06 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method, manufacturing method of electronic device and computer program recording media |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6455176B2 (en) | 2015-01-23 | 2019-01-23 | コニカミノルタ株式会社 | Optical writing apparatus, image forming apparatus, and manufacturing method of optical writing apparatus |
| JP6212507B2 (en) * | 2015-02-05 | 2017-10-11 | Ｔｏｗａ株式会社 | Cutting apparatus and cutting method |
| JP2018072541A (en) * | 2016-10-28 | 2018-05-10 | キヤノン株式会社 | Pattern formation method, positioning method of substrate, positioning device, pattern formation device and manufacturing method of article |
| KR101893309B1 (en) | 2017-10-31 | 2018-08-29 | 캐논 톡키 가부시키가이샤 | Alignment apparatus, alignment method, film forming apparatus, film forming method and manufacturing method of electronic device |
| KR20190124610A (en) * | 2018-04-26 | 2019-11-05 | 캐논 톡키 가부시키가이샤 | Substrate conveying system, method and apparatus for manufacturing electronic devices |
| KR102405438B1 (en) * | 2018-06-25 | 2022-06-03 | 캐논 톡키 가부시키가이샤 | Mask position adjusting apparatus, film forming apparatus, mask position adjusting method, film forming method, and manufacturing method of electronic device |
| KR102374037B1 (en) | 2018-06-29 | 2022-03-11 | 캐논 톡키 가부시키가이샤 | Subtrate inspection system, manufacturing system of electronic device, subtrate inspection method, and manufacturing method of electronic device |
| JP7170524B2 (en) | 2018-12-14 | 2022-11-14 | キヤノントッキ株式会社 | Substrate mounting method, film forming method, film forming apparatus, organic EL panel manufacturing system |
| KR102128888B1 (en) * | 2019-02-19 | 2020-07-01 | 캐논 톡키 가부시키가이샤 | Film forming apparatus, film forming method and manufacturing method of electronic device |
-
2020
- 2020-06-26 JP JP2020110571A patent/JP7440356B2/en active Active
-
2021
- 2021-06-15 KR KR1020210077290A patent/KR102625048B1/en active IP Right Grant
- 2021-06-17 CN CN202110669672.1A patent/CN113851407A/en active Pending
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