JP2021524543A - 電気接点を製造するための銅ストリップ、及び銅ストリップを製造する方法、及びプラグインコネクタ - Google Patents
電気接点を製造するための銅ストリップ、及び銅ストリップを製造する方法、及びプラグインコネクタ Download PDFInfo
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- JP2021524543A JP2021524543A JP2020564679A JP2020564679A JP2021524543A JP 2021524543 A JP2021524543 A JP 2021524543A JP 2020564679 A JP2020564679 A JP 2020564679A JP 2020564679 A JP2020564679 A JP 2020564679A JP 2021524543 A JP2021524543 A JP 2021524543A
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- 239000010949 copper Substances 0.000 title claims abstract description 111
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 38
- 238000000576 coating method Methods 0.000 claims abstract description 78
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims description 68
- 229910052718 tin Inorganic materials 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 26
- 229910052709 silver Inorganic materials 0.000 claims description 26
- 239000004332 silver Substances 0.000 claims description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 25
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 238000007598 dipping method Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 5
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 23
- 230000032683 aging Effects 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 238000001816 cooling Methods 0.000 description 14
- 238000009792 diffusion process Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000007792 addition Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- -1 Cu-ETP or Cu-OFE Chemical compound 0.000 description 1
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/261—After-treatment in a gas atmosphere, e.g. inert or reducing atmosphere
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Physics & Mathematics (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Thermal Sciences (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (14)
- 銅又は銅合金の基材(2)と、
スズ被膜(3、4)と、
を有する、電気接点を作製するための銅ストリップ(1)であって、
前記スズ被膜(3、4)において、不溶性の析出物形成元素の割合が、0.003重量%〜1.0重量%、好ましくは0.5重量%まで、好ましくは0.05重量%まで、特に好ましくは0.01重量%までであることを特徴とする、銅ストリップ。 - 請求項1に記載の銅ストリップ(1)であって、
前記不溶性の析出物形成元素が、以下の元素:各々0.003重量%〜0.5重量%の割合での銀、ゲルマニウム、ニッケル、コバルトの1種以上から形成されることを特徴とする、銅ストリップ。 - 請求項1に記載の銅ストリップ(1)であって、
前記不溶性の析出物形成元素である銀が、Ag3Sn相(6)の形態で0.08重量%〜0.5重量%の割合で前記被膜(3、4)中に存在することを特徴とする、銅ストリップ。 - 請求項3に記載の銅ストリップ(1)であって、
前記Ag3Sn相(6)が、0.01μm2〜0.03μm2、好ましくは0.0140μm2〜0.0180μm2の平均面積値を有する粒径で前記被膜(3、4)中に存在することを特徴とする、銅ストリップ。 - 請求項3又は4に記載の銅ストリップ(1)であって、
前記Ag3Sn相(6)が、0.2μm〜0.8μm、好ましくは0.4μm〜0.6μmの平均円周を有する粒径で前記被膜(3、4)中に存在することを特徴とする、銅ストリップ。 - 請求項3〜5のいずれか一項に記載の銅ストリップ(1)であって、
前記被膜(3、4)及び/又は前記基材(2)において、前記銅の一部がCu6Sn5相(5)中に存在し、かつ、前記Ag3Sn相(6)が、該Cu6Sn5相(5)の領域に存在するか、又は該Cu6Sn5相(5)を包囲することを特徴とする、銅ストリップ。 - 請求項6に記載の銅ストリップ(1)であって、
前記Cu6Sn5相(5)が、前記基材(2)と前記被膜(2、3)との境界層中のAg3Sn相(6)、又は該境界層に隣接したAg3Sn相(6)に隣接して配置されていることを特徴とする、銅ストリップ。 - 請求項1〜7のいずれか一項に記載の銅ストリップ(1)であって、
前記不溶性の析出物形成元素が、以下の元素:各々0.02重量%〜1.0重量%の割合でのアンチモン又はビスマスの1種以上から形成されることを特徴とする、銅ストリップ。 - 請求項1〜8のいずれか一項に記載の銅ストリップ(1)であって、
前記被膜(3、4)が、前記基材(2)よりも高い硬度を有することを特徴とする、銅ストリップ。 - 請求項1〜9のいずれか一項に記載の、電気接点を製造するための銅ストリップ(1)を製造する方法であって、
前記銅ストリップ(1)が、
銅又は銅合金の基材(2)と、
スズ被膜(3、4)と、
を有し、
不溶性の析出物形成元素を、0.003重量%〜1.0重量%、好ましくは0.5重量%まで、好ましくは0.05重量%まで、特に好ましくは0.01重量%までの割合で用いた浸漬プロセス及び/又は電気めっきプロセスにおいて、前記スズ被膜(3、4)を前記基材(2)に適用することを特徴とする、方法。 - 前記電気めっきプロセスによる第1工程において、前記不溶性の析出物形成元素を前記基材(2)上に析出させ、
前記浸漬プロセスによる第2工程において、前記スズ被膜(3、4)を適用することを特徴とする、請求項10に記載の方法。 - 前記スズ被膜(3、4)を、電気めっきプロセスによって適用し、適用後にリフロー処理を行うことを特徴とする、請求項10又は11に記載の方法。
- 前記銅ストリップ(1)を空気に曝露することを特徴とする、請求項10〜12のいずれか一項に記載の方法。
- 請求項1〜9のいずれか一項に記載の銅ストリップ(1)、又は請求項10〜13のいずれか一項に記載の方法によって製造された銅ストリップ(1)から作製されたコネクタ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018208116.6A DE102018208116A1 (de) | 2018-05-23 | 2018-05-23 | Kupferband zur Herstellung von elektrischen Kontakten und Verfahren zur Herstellung eines Kupferbandes und Steckverbinder |
DE102018208116.6 | 2018-05-23 | ||
PCT/EP2019/063091 WO2019224197A1 (de) | 2018-05-23 | 2019-05-21 | Kupferband zur herstellung von elektrischen kontakten und verfahren zur herstellung eines kupferbandes und steckverbinder |
Publications (1)
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JP2021524543A true JP2021524543A (ja) | 2021-09-13 |
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JP2020564679A Withdrawn JP2021524543A (ja) | 2018-05-23 | 2019-05-21 | 電気接点を製造するための銅ストリップ、及び銅ストリップを製造する方法、及びプラグインコネクタ |
Country Status (9)
Country | Link |
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US (1) | US20210218171A1 (ja) |
EP (1) | EP3797181B1 (ja) |
JP (1) | JP2021524543A (ja) |
KR (1) | KR20210011951A (ja) |
CN (1) | CN112135918A (ja) |
DE (1) | DE102018208116A1 (ja) |
ES (1) | ES2935178T3 (ja) |
PL (1) | PL3797181T3 (ja) |
WO (1) | WO2019224197A1 (ja) |
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DE102020006059A1 (de) | 2020-10-05 | 2022-04-07 | Wieland-Werke Aktiengesellschaft | Elektrisch leitendes Material mit Beschichtung |
CN114347586B (zh) * | 2022-01-25 | 2024-05-03 | 宁波博威合金材料股份有限公司 | 一种铜-铜复合带材、制备方法以及应用 |
Citations (3)
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JPH11350190A (ja) * | 1998-06-03 | 1999-12-21 | Furukawa Electric Co Ltd:The | 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品 |
JP2008088477A (ja) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | 耐ウィスカー性に優れた銅合金リフローSnめっき材 |
JP2010280946A (ja) * | 2009-06-04 | 2010-12-16 | Mitsubishi Shindoh Co Ltd | めっき付き銅条材及びその製造方法 |
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GB546179A (en) * | 1941-01-10 | 1942-07-01 | Victor Alexander Lowinger | Improvements in and relating to processes for the coating of metals |
DE4005836C2 (de) * | 1990-02-23 | 1999-10-28 | Stolberger Metallwerke Gmbh | Elektrisches Steckverbinderpaar |
DE4443461C1 (de) * | 1994-12-07 | 1996-07-04 | Wieland Werke Ag | Band- bzw. drahtförmiges Verbundmaterial und seine Verwendung |
DE19752329A1 (de) * | 1997-11-26 | 1999-05-27 | Stolberger Metallwerke Gmbh | Verfahren zur Herstellung eines metallischen Verbundbands |
DE10025106A1 (de) | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
DE10025107A1 (de) * | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leifähiges Metallband und Steckverbinder |
US6924044B2 (en) * | 2001-08-14 | 2005-08-02 | Snag, Llc | Tin-silver coatings |
DE10139953A1 (de) | 2001-08-21 | 2003-03-27 | Stolberger Metallwerke Gmbh | Werkstoff für ein Metallband |
JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
EP2097254B1 (en) * | 2006-12-19 | 2011-10-05 | Mahle International GmbH | Sliding bearing |
US20080308300A1 (en) * | 2007-06-18 | 2008-12-18 | Conti Mark A | Method of manufacturing electrically conductive strips |
CN101905387B (zh) * | 2010-02-04 | 2012-02-15 | 哈尔滨工业大学 | 纳米Ag增强低温无铅复合焊膏的制备方法 |
CN102085604A (zh) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr低银无铅焊料 |
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2018
- 2018-05-23 DE DE102018208116.6A patent/DE102018208116A1/de not_active Ceased
-
2019
- 2019-05-21 EP EP19726624.0A patent/EP3797181B1/de active Active
- 2019-05-21 WO PCT/EP2019/063091 patent/WO2019224197A1/de unknown
- 2019-05-21 JP JP2020564679A patent/JP2021524543A/ja not_active Withdrawn
- 2019-05-21 PL PL19726624.0T patent/PL3797181T3/pl unknown
- 2019-05-21 US US17/055,016 patent/US20210218171A1/en not_active Abandoned
- 2019-05-21 KR KR1020207035991A patent/KR20210011951A/ko not_active Application Discontinuation
- 2019-05-21 CN CN201980033674.2A patent/CN112135918A/zh not_active Withdrawn
- 2019-05-21 ES ES19726624T patent/ES2935178T3/es active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11350190A (ja) * | 1998-06-03 | 1999-12-21 | Furukawa Electric Co Ltd:The | 電気・電子部品用材料とその製造方法、その材料を用いた電気・電子部品 |
JP2008088477A (ja) * | 2006-09-29 | 2008-04-17 | Nikko Kinzoku Kk | 耐ウィスカー性に優れた銅合金リフローSnめっき材 |
JP2010280946A (ja) * | 2009-06-04 | 2010-12-16 | Mitsubishi Shindoh Co Ltd | めっき付き銅条材及びその製造方法 |
Also Published As
Publication number | Publication date |
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EP3797181A1 (de) | 2021-03-31 |
DE102018208116A1 (de) | 2019-11-28 |
KR20210011951A (ko) | 2021-02-02 |
CN112135918A (zh) | 2020-12-25 |
ES2935178T3 (es) | 2023-03-02 |
EP3797181B1 (de) | 2022-11-16 |
WO2019224197A1 (de) | 2019-11-28 |
US20210218171A1 (en) | 2021-07-15 |
PL3797181T3 (pl) | 2023-03-20 |
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