JP2021188947A - Optical connector protection structure and connecting device - Google Patents

Optical connector protection structure and connecting device Download PDF

Info

Publication number
JP2021188947A
JP2021188947A JP2020091982A JP2020091982A JP2021188947A JP 2021188947 A JP2021188947 A JP 2021188947A JP 2020091982 A JP2020091982 A JP 2020091982A JP 2020091982 A JP2020091982 A JP 2020091982A JP 2021188947 A JP2021188947 A JP 2021188947A
Authority
JP
Japan
Prior art keywords
optical
optical connector
flanged
inspected
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020091982A
Other languages
Japanese (ja)
Inventor
翔 原子
Sho Harako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2020091982A priority Critical patent/JP2021188947A/en
Priority to TW110114048A priority patent/TWI785567B/en
Priority to CN202110563349.6A priority patent/CN113805026A/en
Publication of JP2021188947A publication Critical patent/JP2021188947A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Mechanical Coupling Of Light Guides (AREA)

Abstract

To enable each optical connector provided to a substrate to be protected and the handling of optical connectors provided to the substrate to be facilitated.SOLUTION: The present invention comprises: a plurality of flanged tubular members having a tubular body part and a flange part provided at one end of the tubular body part; a plurality of optical connectors inserted from the flange part side of each flanged tubular members toward the other end of the tubular body part, with the tip part located on the tubular body part side; and a substrate having a plurality of open holes provided in the thickness direction of the substrate. The tubular body part of each flanged tubular member having each optical connector inserted therein is removably inserted into each open hole of the substrate, with the flange part coming in contact with the periphery of the open hole and supporting the flanged tubular member. Each optical connector and the flange tubular member having each optical connector inserted therein are fixed in position.SELECTED DRAWING: Figure 1

Description

本発明は、光学的接続子保持構造及び接続装置に関する。 The present invention relates to an optical connector holding structure and a connecting device.

近年、シリコン基板等の基板上に、電気回路と光回路とを有する半導体素子（以下、「光デバイス」とも呼ぶ。）を集積する半導体レーザ集積技術の開発が進んでいる。このような半導体ウェハ上に形成された多数の光デバイスの特性を同時に検査する検査装置では、半導体ウェハ上の光デバイスと検査装置とを接続する接続装置が用いられる。 In recent years, the development of semiconductor laser integration technology for integrating a semiconductor element (hereinafter, also referred to as an “optical device”) having an electric circuit and an optical circuit on a substrate such as a silicon substrate has been progressing. In the inspection device for simultaneously inspecting the characteristics of a large number of optical devices formed on the semiconductor wafer, a connection device for connecting the optical device on the semiconductor wafer and the inspection device is used.

半導体ウェハ上の複数の光デバイスの検査に用いられる接続装置は、各光デバイスに対して電気信号を供給するための電気的接続子と、供給された電気信号に基づいて各光デバイスが発光した光を受光する光学的接続子とを有する。 The connector used for inspecting multiple optical devices on a semiconductor wafer is an electrical connector for supplying an electric signal to each optical device, and each optical device emits light based on the supplied electric signal. It has an optical connector that receives light.

接続装置において光デバイスが発光した光を受光する受光手段には様々な手段があるが、特許文献１には、光ファイバを用いて光デバイスからの光信号を受光することが開示されている。より具体的には、接続装置の構成部材であるセラミック基板において、光デバイスの発光部の位置と対応する位置に設けた貫通孔に光ファイバを挿入し、光ファイバが光デバイスの発光部からの光を受光することが開示されている。 There are various light receiving means for receiving light emitted by an optical device in a connecting device, but Patent Document 1 discloses that an optical fiber is used to receive an optical signal from an optical device. More specifically, in the ceramic substrate which is a component of the connecting device, the optical fiber is inserted into the through hole provided at the position corresponding to the position of the light emitting portion of the optical device, and the optical fiber is emitted from the light emitting portion of the optical device. It is disclosed that it receives light.

従来、図５に例示するように、光デバイスの発光部が発光した光を効率良く受光するため、セラミック基板９１に設けた貫通孔９２に光ファイバ４２を挿入し、発光部に対する光ファイバ４２の位置合わせを行ない、貫通孔９２の内壁面と光ファイバ４２とを接着材４６で直接接着して固定している。 Conventionally, as illustrated in FIG. 5, in order to efficiently receive the light emitted by the light emitting portion of the optical device, the optical fiber 42 is inserted into the through hole 92 provided in the ceramic substrate 91, and the optical fiber 42 is provided with respect to the light emitting portion. The alignment is performed, and the inner wall surface of the through hole 92 and the optical fiber 42 are directly bonded and fixed by the adhesive material 46.

特開２０１９−２１１２６５号公報Japanese Unexamined Patent Publication No. 2019-21165

しかしながら、上述した従来技術のように、セラミック基板等の基板に設けた貫通孔に光ファイバを直接固定してしまうと、光ファイバが基板に接触してしまい、光ファイバが破損してしまうことが生じ得、さらに破損してしまった光ファイバを個別に交換することが難しく、基板全体を交換する必要が生じてしまうおそれがある。半導体ウェハ上に形成された多数の光デバイスを同時に検査する場合、基板に設ける光ファイバの数も多くなるため、光ファイバの破損や交換等も増加し得ることになる。 However, if the optical fiber is directly fixed to the through hole provided in the substrate such as a ceramic substrate as in the above-mentioned conventional technique, the optical fiber may come into contact with the substrate and the optical fiber may be damaged. It may occur, and it is difficult to replace the damaged optical fiber individually, and it may be necessary to replace the entire substrate. When a large number of optical devices formed on a semiconductor wafer are inspected at the same time, the number of optical fibers provided on the substrate also increases, so that the damage or replacement of the optical fibers may increase.

そのため、上述した課題に鑑み、基板に設ける各光学的接続子（例えば光ファイバ等）を保護することができ、基板に設けた光学的接続子の取り扱いを容易にすることができる光学的接続子保持構造及び接続装置が求められている。 Therefore, in view of the above-mentioned problems, each optical connector provided on the substrate (for example, an optical fiber) can be protected, and the optical connector provided on the substrate can be easily handled. A holding structure and a connecting device are required.

かかる課題を解決するために、第１の本発明に係る光学的接続子保持構造は、管状本体部と、管状本体部の一方の端部に設けられた鍔部とを有する複数の鍔付管状部材と、各鍔付管状部材の鍔部側から管状本体部の他方の端部に向けて挿入され、先端部が管状本体部側に位置している複数の光学的接続子と、基板厚さ方向に設けられた複数の貫通孔を有する基板とを備え、各光学的接続子が挿入された各鍔付管状部材の管状本体部は、基板の各貫通孔に着脱可能に挿入されて、鍔部が、当該貫通孔の周縁部に当接して当該鍔付管状部材を支持するものであり、各光学的接続子と、各光学的接続子を挿入している鍔付管状部材とが固定されていることを特徴とする。 In order to solve such a problem, the first optical connector holding structure according to the present invention has a tubular main body portion and a plurality of flanged tubular portions having a flange portion provided at one end of the tubular main body portion. A member and a plurality of optical connectors inserted from the flange side of each flanged tubular member toward the other end of the tubular body portion, and the tip portion is located on the tubular body portion side, and the substrate thickness. The tubular body of each flanged tubular member with a substrate having a plurality of through holes provided in the direction and into which each optical connector is inserted is detachably inserted into each through hole of the substrate to form a flange. The portion abuts on the peripheral edge of the through hole to support the flanged tubular member, and each optical connector and the flanged tubular member into which each optical connector is inserted are fixed. It is characterized by being.

第２の本発明に係る接続装置は、供給された電気信号に基づいて光信号を発光する複数の被検査体と、検査装置との間を接続して、検査装置からの電気信号を前記各被検査体に供給して、前記各被検査体から発光された光信号を前記検査装置に与える接続装置において、複数の電気的接触子と、複数の光学的接続子とを有する基板を備え、前記各電気的接触子が、前記検査装置の電気信号端子と、前記各被検査体の電気信号端子とに対して電気的に接触し、前記各光学的接続子が、前記基板の厚さ方向に設けられた複数の貫通孔のそれぞれに挿入され、前記被検査体の発光に対して光学的に接続可能なものであり、前記各光学的接続子を有する前記基板が、第１の本発明に係る光学的接続子の基板保持構造を有することを特徴とする。 The second connection device according to the present invention connects between a plurality of objects to be inspected that emit an optical signal based on the supplied electric signal and the inspection device, and outputs an electric signal from the inspection device to each of the above. In a connection device that supplies an optical signal emitted from each of the inspected objects to the inspected object and supplies the optical signal to the inspected object, a substrate having a plurality of electrical contacts and a plurality of optical connectors is provided. Each of the electrical contacts electrically contacts the electrical signal terminal of the inspection device and the electrical signal terminal of each of the objects to be inspected, and each of the optical connectors is in the thickness direction of the substrate. The substrate, which is inserted into each of the plurality of through holes provided in the above and is optically connectable to the light emission of the object to be inspected and has each of the optical connectors, is the first invention. It is characterized by having a substrate holding structure of the optical connector according to the above.

本発明によれば、基板に設ける各光学的接続子を保護することができ、光学的接続子の交換でき、基板に設けた光学的接続子の取り扱いを容易にすることができる。 According to the present invention, each optical connector provided on the substrate can be protected, the optical connector can be replaced, and the optical connector provided on the substrate can be easily handled.

実施形態に係る接続装置の構成を示す構成図である。It is a block diagram which shows the structure of the connection device which concerns on embodiment. 図１の点線部分の拡大断面図であり、実施形態に係る接続子基板における電気的接触子及び光学的接続子の保持構造を示す図である。It is an enlarged sectional view of the dotted line part of FIG. 1, and is the figure which shows the holding structure of the electric contact and the optical connector in the connector substrate which concerns on embodiment. 実施形態に係る鍔付フェルールの構成を示す構成図である。It is a block diagram which shows the structure of the flanged ferrule which concerns on embodiment. 変形実施形態に係る鍔付フェルールの構成を示す構成図である。It is a block diagram which shows the structure of the flanged ferrule which concerns on a modification embodiment. 従来の接続子基板における電気的接触子及び光学的接続子の保持構造を示す図である。It is a figure which shows the holding structure of the electric contact and the optical connector in the conventional connector board.

（Ａ）実施形態
以下では、本発明に係る光学的接続子保持構造及び接続装置の実施形態を、図面を参照しながら詳細に説明する。光学的接続子保持構造とは、複数の光学的接続子を保持する基板において、複数の光学的接続子を保持する構造である。 (A) Embodiment In the following, an embodiment of the optical connector holding structure and the connecting device according to the present invention will be described in detail with reference to the drawings. The optical connector holding structure is a structure that holds a plurality of optical connectors in a substrate that holds a plurality of optical connectors.

（Ａ−１）実施形態の構成
図１は、実施形態に係る接続装置の構成を示す構成図である。 (A-1) Configuration of the Embodiment FIG. 1 is a configuration diagram showing a configuration of a connecting device according to the embodiment.

図１において、実施形態に係る接続装置１は、配線基板１１と、当該配線基板１１の下面に配置される接続子基板１２とを有する。 In FIG. 1, the connection device 1 according to the embodiment has a wiring board 11 and a connector board 12 arranged on the lower surface of the wiring board 11.

図１は、実施形態に係る接続装置１の主要な構成部材を模式的に図示したものであり、これらの部材に限定されない。また、図１の接続装置１は、配線基板１１、接続子基板１２等を組み立てる際には、実際は、例えばボルト等の固定部材を用いて基板間を固定するが、これらボルト等の固定部材の図示を省略している。また、図１の接続装置１の各構成部材の厚みや寸法などは現実のものと異なることに留意すべきである。さらに、図１に示す接続装置１の構成は、技術的思想を具体化するための構成を例示したものであり、構成部材の材質、形状、構造、配置等は図１に限定されない。以下では、図１の上方向又は下方向に着目して、「上」、「下」を言及する。 FIG. 1 schematically shows the main constituent members of the connecting device 1 according to the embodiment, and is not limited to these members. Further, in the connection device 1 of FIG. 1, when assembling the wiring board 11, the connector board 12, etc., the boards are actually fixed by using a fixing member such as a bolt, but the fixing member such as the bolt is used. Illustration is omitted. Further, it should be noted that the thickness and dimensions of each component of the connecting device 1 in FIG. 1 are different from the actual ones. Further, the configuration of the connecting device 1 shown in FIG. 1 exemplifies a configuration for embodying the technical idea, and the material, shape, structure, arrangement, etc. of the constituent members are not limited to FIG. In the following, "upper" and "lower" will be referred to by focusing on the upward or downward direction of FIG.

［被検査体］
被検査体５は、電気信号が供給されると、光を発光する半導体素子（光デバイス）である。被検査体５は、電気回路と光回路とを有する光デバイスを適用することができ、例えば、シリコンフォトニクスチップ、ＶＣＳＥＬ（Ｖｅｒｔｉｃａｌ Ｃａｖｉｔｙ Ｓｕｒｆａｃｅ Ｅｍｉｔｔｉｎｇ Ｌａｓｅｒ）等とすることができる。この実施形態では、被検査体５としての光デバイスが、シリコンフォトニクス技術により、半導体ウェハ上に高密度に集積されて形成された半導体素子とする。被検査体５は、電気信号を供給するための電気信号端子（以下では、「第２の接触対象」とも呼ぶ。）５１と、光信号を発光する光信号端子（以下、「発光部」とも呼ぶ。）５２とを有する。 [Inspected body]
The object 5 to be inspected is a semiconductor element (optical device) that emits light when an electric signal is supplied. An optical device having an electric circuit and an optical circuit can be applied to the object 5 to be inspected, and for example, a silicon photonics chip, a VCSEL (Vertical Cavity Surface Emitting Laser), or the like can be applied. In this embodiment, the optical device as the inspected object 5 is a semiconductor element formed by being densely integrated on a semiconductor wafer by silicon photonics technology. The object 5 to be inspected includes an electric signal terminal (hereinafter, also referred to as a "second contact target") 51 for supplying an electric signal and an optical signal terminal (hereinafter, also referred to as a "light emitting unit") that emits an optical signal. Call.) 52.

図１に示すように、半導体ウェハ上に形成された被検査体５が検査システム１０のステージ４の上面に載置される。被検査体５の特性検査のときに、検査装置（以下、「テスタ」とも呼ぶ。）２に接続している接続装置１と被検査体５とが電気的に接続されて、半導体ウェハ上に形成された複数の被検査体５が同時に検査される。 As shown in FIG. 1, the inspected body 5 formed on the semiconductor wafer is placed on the upper surface of the stage 4 of the inspection system 10. At the time of characteristic inspection of the object to be inspected 5, the connecting device 1 connected to the inspection device (hereinafter, also referred to as “tester”) 2 and the object to be inspected 5 are electrically connected to each other on a semiconductor wafer. The formed plurality of objects to be inspected 5 are inspected at the same time.

［接続装置］
接続装置１は、半導体ウェハ上に形成された複数の被検査体（光デバイス）５を同時に検査するため、検査装置（テスタ）２から電気信号を供給するための端子（以下、「第１の接触対象」とも呼ぶ。）と、被検査体５の電気信号端子（第２の接触対象）５１と電気的に接触する電気的接触子４１と、被検査体５の光信号端子（発光部）５２と光学的に接続する光学的接続子４２とを有して、検査装置（テスタ）２と被検査体５との間を電気的に接続するプローブカードである。 [Connecting device]
In order to simultaneously inspect a plurality of objects to be inspected (optical devices) 5 formed on the semiconductor wafer, the connecting device 1 is a terminal for supplying an electric signal from the inspection device (tester) 2 (hereinafter, "first". Also referred to as "contact target"), the electrical contactor 41 that electrically contacts the electrical signal terminal (second contact target) 51 of the inspected object 5, and the optical signal terminal (light emitting unit) of the inspected object 5. It is a probe card that has an optical connector 42 that optically connects the 52 and an inspection device (tester) 2 and an inspected object 5 that are electrically connected to each other.

ここで、「第１の接触対象」は、被検査体５の検査時に、検査装置（テスタ）２が出力した電気信号の供給を受ける電気信号端子をいう。「第２の接触対象」は、被検査体５が、電気的接触子４１を介して、検査に必要な電気信号が供給される電気信号端子をいう。したがって、被検査体５の検査時には、接続装置１によって保持される各電気的接触子４１は、検査装置（テスタ）２の電気信号端子（第１の接触対象）に電気的に接触すると共に、被検査体５の電気信号端子（第２の接触対象）に電気的に接触することにより、検査装置（テスタ）２の電気信号端子（第１の接触対象）からの電気信号を、被検査体５の電気信号端子（第２の接触対象）に導通させる。 Here, the "first contact target" refers to an electric signal terminal that receives an electric signal output by the inspection device (tester) 2 at the time of inspection of the inspected body 5. The "second contact target" refers to an electric signal terminal to which an electric signal necessary for inspection is supplied by the inspected body 5 via an electric contact 41. Therefore, at the time of inspection of the object to be inspected 5, each electric contact 41 held by the connecting device 1 electrically contacts the electric signal terminal (first contact target) of the inspection device (tester) 2 and at the same time. By electrically contacting the electric signal terminal (second contact target) of the inspected body 5, the electric signal from the electric signal terminal (first contact target) of the inspection device (tester) 2 is sent to the inspected body. Conduct the electric signal terminal 5 (second contact target).

「発光部」としての光信号端子５２は、電気信号の供給を受けた被検査体５が光信号を発光する部分である。 The optical signal terminal 52 as the "light emitting unit" is a portion where the inspected body 5 to which the electric signal is supplied emits an optical signal.

接続装置１は、検査装置（テスタ）２と接続しており、検査装置２から被検査体５の特性検査に係る電気信号が供給され、電気的に接続している被検査体５に対して電気信号を供給する。また、被検査体５の特性検査を行なう際、接続装置１は、上下方向に可動するステージ４の上面に載置された被検査体５と近接させ、被検査体５の電気信号端子５１と電気的に接続すると共に、被検査体５の光信号端子５２と光学的に接続する。 The connection device 1 is connected to the inspection device (tester) 2, and an electric signal related to the characteristic inspection of the inspected object 5 is supplied from the inspection device 2 to the inspected object 5 which is electrically connected. Supply electrical signals. Further, when inspecting the characteristics of the inspected body 5, the connecting device 1 is brought close to the inspected body 5 placed on the upper surface of the stage 4 which is movable in the vertical direction, and is brought close to the electric signal terminal 51 of the inspected body 5. It is electrically connected and optically connected to the optical signal terminal 52 of the object 5 to be inspected.

より具体的には、被検査体５の特性検査をするとき、接続装置１の接続子基板１２と被検査体５とを相対的に近接させ、接続子基板１２に保持されている電気的接触子４１及び光学的接続子４２を、被検査体５（光デバイス）の電気信号端子５１及び光信号端子５２に対応する位置に近接させて配置させる。そして、接続子基板１２の電気的接触子４１と、被検査体５の電気信号端子５１とを電気的に接触させると共に、光学的接続子４２と、被検査体５の光信号端子５２とを光学的に接続させる。 More specifically, when inspecting the characteristics of the object to be inspected 5, the connector board 12 of the connecting device 1 and the object 5 to be inspected are relatively close to each other, and the electrical contact held on the connector board 12 is held. The child 41 and the optical connector 42 are arranged close to the positions corresponding to the electric signal terminal 51 and the optical signal terminal 52 of the object 5 (optical device) to be inspected. Then, the electrical contact 41 of the connector board 12 and the electric signal terminal 51 of the inspected body 5 are electrically brought into contact with each other, and the optical connector 42 and the optical signal terminal 52 of the inspected body 5 are brought into contact with each other. Connect optically.

「光学的接続」とは、被検査体５としての光デバイスが発光した光信号の光損失が可能な限り少なくなるように、被検査体５の光信号端子５２に対して光学的接続子４２を接続配置させることをいう。光学的接続子４２と光信号端子５２とは、互いに近接する非接触の状態で光学的に接続させるようにしてもよい。光学的接続は、光デバイス（被検査体５）の光信号端子５２の端面と、光学的接続子４２の端面との位置精度を良好（例えば、位置ずれ量が閾値未満）とし、光デバイス（被検査体５）が発光する光の光軸と、接続子基板１２の光学的接続子４２の光軸との軸精度を良好（例えば、光軸のずれ量が閾値未満）とし、光信号端子５２の端面（例えば上端面）と光学的接続子４２の端面（例えば下端面）との間隙長を閾値未満となるように、光学的接続子４２を配置させる。 The "optical connection" is an optical connector 42 to the optical signal terminal 52 of the inspected object 5 so that the optical loss of the optical signal emitted by the optical device as the inspected object 5 is as small as possible. It means to connect and arrange. The optical connector 42 and the optical signal terminal 52 may be optically connected in a non-contact state in close proximity to each other. For the optical connection, the positional accuracy between the end face of the optical signal terminal 52 of the optical device (object 5 to be inspected) and the end face of the optical connector 42 is good (for example, the amount of misalignment is less than the threshold value), and the optical device (for example, the amount of misalignment is less than the threshold value). The optical axis of the light emitted by the object 5) and the optical axis of the optical connector 42 of the connector substrate 12 are set to have good axis accuracy (for example, the amount of deviation of the optical axis is less than the threshold value), and the optical signal terminal. The optical connector 42 is arranged so that the gap length between the end surface (for example, the upper end surface) of the 52 and the end surface (for example, the lower end surface) of the optical connector 42 is less than the threshold value.

被検査体５の検査時に、検査装置２から検査に係る電気信号が接続装置１に供給され、接続装置１は、電気的接触子４１を介して被検査体５の電気信号端子５１に電気信号を供給する。そして、電気信号が被検査体５に供給されると、被検査体５が電気信号を光信号に変換して光信号を発光し、その光信号が光学的接続子４２に入射する。 At the time of inspection of the inspected body 5, an electric signal related to the inspection is supplied from the inspection device 2 to the connecting device 1, and the connecting device 1 sends an electric signal to the electric signal terminal 51 of the inspected body 5 via the electric contact 41. Supply. Then, when the electric signal is supplied to the inspected body 5, the inspected body 5 converts the electric signal into an optical signal and emits an optical signal, and the optical signal is incident on the optical connector 42.

接続装置１には、図示しない光電変換素子が設けられており、被検査体５から受光した光信号を電気信号に変換して、電気信号を検査装置２に供給する。このように光電変換によって、受光した光の光量に基づく電気信号を検査装置２に供給することにより、検査装置２において被検査体５の特性を検査することができる。 The connection device 1 is provided with a photoelectric conversion element (not shown), converts an optical signal received from the object to be inspected 5 into an electric signal, and supplies the electric signal to the inspection device 2. By supplying the inspection device 2 with an electric signal based on the amount of light received by the photoelectric conversion in this way, the inspection device 2 can inspect the characteristics of the inspected body 5.

このように、接続装置１は被検査体５に対して検査に係る電気信号を供給し、被検査体５から発光された光を接続装置１は受光するため、実施形態に係る接続装置１は「受光型電気的接続装置」ともいえる。 As described above, the connecting device 1 supplies the electric signal related to the inspection to the inspected body 5, and the connecting device 1 receives the light emitted from the inspected body 5, so that the connecting device 1 according to the embodiment is used. It can also be said to be a "light receiving type electrical connection device".

なお、接続装置１は、被検査体５から受光した光信号を光電変換せずに、検査装置２に供給するようにしてもよく、その場合、検査装置２が光電変換機能を内部に備えるようにしてもよい。 The connecting device 1 may supply the optical signal received from the object to be inspected 5 to the inspection device 2 without photoelectric conversion. In that case, the inspection device 2 may have a photoelectric conversion function inside. You may do it.

［配線基板］
配線基板１１は、例えばポリイミド等の樹脂材料で形成されたプリント配線基板である。配線基板１１の上面の周縁部には、検査装置（テスタ）２のテストヘッド（図示しない）の接続端子２１と電気的に接続するための接続端子１１１が設けられている。配線基板１１の下面には配線パターンが形成されており、配線パターンの各接続端子（図示しない）が、電気的接触子４１の上端部（上端先端部）と電気的に接続するようになっている。 [Wiring board]
The wiring board 11 is a printed wiring board made of a resin material such as polyimide. A connection terminal 111 for electrically connecting to a connection terminal 21 of a test head (not shown) of an inspection device (tester) 2 is provided on the peripheral edge of the upper surface of the wiring board 11. A wiring pattern is formed on the lower surface of the wiring board 11, and each connection terminal (not shown) of the wiring pattern is electrically connected to the upper end portion (upper end tip portion) of the electrical contact 41. There is.

また、配線基板１１には、検査装置２の接続端子２２と電気的に接続する接続端子１１２が設けられており、光学的接続子４２により受光された光信号を光電変換した電気信号が、接続端子１１２から検査装置２の接続端子２２に導通される。なお、配線基板１４の上面には、被検査体５の検査に必要な複数の電子部品を配置してもよい。 Further, the wiring board 11 is provided with a connection terminal 112 that is electrically connected to the connection terminal 22 of the inspection device 2, and an electric signal obtained by photoelectrically converting an optical signal received by the optical connector 42 is connected. It is conducted from the terminal 112 to the connection terminal 22 of the inspection device 2. A plurality of electronic components necessary for inspection of the object to be inspected 5 may be arranged on the upper surface of the wiring board 14.

［接続子基板］
接続子基板１２は、複数の電気的接触子４１及び光学的接続子４２を保持する基板である。この実施形態では、例えば１つの被検査体（光デバイス）５に、１組の電気信号端子５１及び光信号端子５２が設けられており、被検査体５を検査する際に、１つの被検査体（光デバイス）５の１組の電気信号端子５１及び光信号端子５２に対して、１組の電気的接触子４１及び光学的接続子４２を接続させる場合を例示する。したがって、接続子基板１２には、被検査体５の数に応じた組数の電気的接触子４１及び光学的接続子４２が保持される。 [Connector board]
The connector board 12 is a board that holds a plurality of electrical contacts 41 and optical connectors 42. In this embodiment, for example, one set of electric signal terminals 51 and optical signal terminals 52 is provided on one inspected object (optical device) 5, and one inspected object 5 is inspected when the inspected object 5 is inspected. An example shows a case where a set of an electrical contactor 41 and an optical connector 42 are connected to a set of an electric signal terminal 51 and an optical signal terminal 52 of a body (optical device) 5. Therefore, the connector substrate 12 holds a set of electrical contacts 41 and optical connectors 42 according to the number of objects 5 to be inspected.

接続子基板１２は、セラミック基板１２１と、当該セラミック基板１２１の上面に配置される固定用板部材１２２とを有する。固定用板部材１２２は、後述するように、セラミック基板１２１に設けられる鍔付管状部材（鍔付フェルール）４５を固定するものである。 The connector substrate 12 has a ceramic substrate 121 and a fixing plate member 122 arranged on the upper surface of the ceramic substrate 121. As will be described later, the fixing plate member 122 fixes a flanged tubular member (flange ferrule) 45 provided on the ceramic substrate 121.

（電気的接触子）
電気的接触子４１は、被検査体５の電気信号端子５１に対して電気的に接触する接触子であり、例えば導電性材料で形成されるプローブを適用できる。電気的接触子４１は、例えばカンチレバータイプのプローブや、垂直タイプのプローブなどを適用することができるが、これに限定されず、任意の形状のプローブを適用できる。 (Electrical contactor)
The electric contact 41 is a contact that makes electrical contact with the electric signal terminal 51 of the inspected body 5, and for example, a probe made of a conductive material can be applied. As the electrical contact 41, for example, a cantilever type probe, a vertical type probe, or the like can be applied, but the electric contact 41 is not limited to this, and a probe of any shape can be applied.

（光学的接続子）
光学的接続子４２は、例えば光ファイバを適用できる。光学的接続子４２は、被検査体５の光信号端子５２に対して光学的に接続可能な位置に配置されて、光信号端子５２から発光された光信号が入射される。光学的接続子４２に適用する光ファイバは、シリコンフォトニクスデバイス（光デバイス）に対応させるため、シリコンの屈折率に合わせた材料で形成されるようにしてもよい。 (Optical connector)
For the optical connector 42, for example, an optical fiber can be applied. The optical connector 42 is arranged at a position where it can be optically connected to the optical signal terminal 52 of the object 5 to be inspected, and the optical signal emitted from the optical signal terminal 52 is incident. The optical fiber applied to the optical connector 42 may be made of a material suitable for the refractive index of silicon in order to correspond to a silicon photonics device (optical device).

電気的接触子４１と光学的接続子４２とは、検査時に検査対象とする被検査体５の電気信号端子５１と光信号端子５２に対して正確に接続するように、位置合わせされてセラミック基板１２１に設けられる。 The electrical contact 41 and the optical connector 42 are aligned with each other so as to be accurately connected to the electrical signal terminal 51 and the optical signal terminal 52 of the object 5 to be inspected at the time of inspection, and the ceramic substrate. It is provided in 121.

（光学的接続子の保持構造）
図２は、図１の点線部分４０の拡大断面図であり、実施形態に係る接続子基板１２における電気的接触子４１及び光学的接続子４２の保持構造を示す図である。 (Holding structure of optical connector)
FIG. 2 is an enlarged cross-sectional view of the dotted line portion 40 of FIG. 1 and is a diagram showing a holding structure of an electrical contactor 41 and an optical connector 42 in the connector substrate 12 according to the embodiment.

セラミック基板１２１には、複数の光学的接続子４２を保持するため、基板厚さ方向に複数の貫通孔１３２が設けられている。セラミック基板１２１に設けられる複数の貫通孔１３２のそれぞれの位置は、検査対象とする各被検査体（光デバイス）５の光信号端子５２の位置と対応する位置に設けられている。 The ceramic substrate 121 is provided with a plurality of through holes 132 in the substrate thickness direction in order to hold the plurality of optical connectors 42. The positions of the plurality of through holes 132 provided in the ceramic substrate 121 are provided at positions corresponding to the positions of the optical signal terminals 52 of each inspected object (optical device) 5 to be inspected.

したがって、各貫通孔１３２に光学的接続子４２が挿入された状態で、接続装置１とステージ４とが近接するように相対移動すると、各貫通孔１３２に保持されている光学的接続子４２の下端部（以下では、「先端部」とも呼ぶ。）が、被検査体５の光信号端子５２に対して、光学的に接続可能な位置に配置される。例えば、被検査体５が半導体ウェハの基板面に対して垂直上方に光を発光するものである場合、貫通孔１２に挿入された光学的接続子４２の下端部（先端部）は、被検査体５の光信号端子５２に対して垂直上方の位置に配置される。これにより、被検査体５からの光を、損失を少なくして効率的に光学的接続子４２に入射させることができる。 Therefore, when the connecting device 1 and the stage 4 are relatively moved so as to be close to each other with the optical connector 42 inserted in each through hole 132, the optical connector 42 held in each through hole 132 The lower end portion (hereinafter, also referred to as “tip portion”) is arranged at a position where it can be optically connected to the optical signal terminal 52 of the inspected object 5. For example, when the object 5 to be inspected emits light vertically upward with respect to the substrate surface of the semiconductor wafer, the lower end portion (tip portion) of the optical connector 42 inserted into the through hole 12 is to be inspected. It is arranged at a position perpendicular to the optical signal terminal 52 of the body 5. As a result, the light from the object to be inspected 5 can be efficiently incident on the optical connector 42 with less loss.

また、接続子基板１２に保持される電気的接触子４１は、当該電気的接触子４１の先端部が、各被検査体５の電気信号端子５１に対して電気的に接触が可能な位置に配置される。 Further, the electric contact 41 held on the connector board 12 is located at a position where the tip of the electric contact 41 can be electrically contacted with the electric signal terminal 51 of each inspected object 5. Be placed.

図２に例示するように、セラミック基板１２１に配置される各貫通孔１３２には、鍔付管状部材（以下、「鍔付フェルール」とも呼ぶ。）４５が挿入され、鍔付フェルール４５の管内に光学的接続子４２が挿通される。 As illustrated in FIG. 2, a flanged tubular member (hereinafter, also referred to as “flammed ferrule”) 45 is inserted into each through hole 132 arranged in the ceramic substrate 121, and the flanged ferrule 45 is inserted into the tube of the flanged ferrule 45. The optical connector 42 is inserted.

従来、例えばセラミック基板の貫通孔に光学的接続子を挿入して、位置合わせをした光学的接続子を保持するため、貫通孔に挿入した光学的接続子と貫通孔の内壁面とを接着している。そのため、例えば、作業中等に、基板に設けた光学的接続子を動かしたときなどに、光学的接続子が、基板に設けた貫通孔の縁と接触してしまい折れ曲がり等により、光学的接続子が破損してしまうことがあった。更に、破損してしまった光学的接続子の交換等が必要となったときには、光学的接続子を個別に交換することは難しくセラミック基板全体を交換している。 Conventionally, for example, in order to insert an optical connector into a through hole of a ceramic substrate and hold an aligned optical connector, the optical connector inserted into the through hole and the inner wall surface of the through hole are adhered to each other. ing. Therefore, for example, when the optical connector provided on the substrate is moved during work or the like, the optical connector comes into contact with the edge of the through hole provided on the substrate and is bent due to bending or the like. Was sometimes damaged. Further, when it is necessary to replace the damaged optical connector or the like, it is difficult to replace the optical connector individually, and the entire ceramic substrate is replaced.

これに対して、この実施形態によれば、セラミック基板１２１の貫通孔１３２に鍔付フェルール４５を挿入した後、鍔付フェルール４５の管内に光学的接続子４２を挿入する。このように、貫通孔１３２に挿入された鍔付フェルール４５の管内に光学的接続子４２を挿入することで、従来よりも光学的接続子４２の破損等を防ぐことができる。つまり、鍔付フェルール４５は光学的接続子４２の保護部材として機能して、光学的接続子４２を保護することができる。 On the other hand, according to this embodiment, after the flanged ferrule 45 is inserted into the through hole 132 of the ceramic substrate 121, the optical connector 42 is inserted into the tube of the flanged ferrule 45. In this way, by inserting the optical connector 42 into the tube of the flanged ferrule 45 inserted into the through hole 132, it is possible to prevent the optical connector 42 from being damaged more than before. That is, the flanged ferrule 45 functions as a protective member for the optical connector 42, and can protect the optical connector 42.

また、この実施形態では、光学的接続子４２を鍔付フェルール４５の管内に挿入する際、位置合わせをした光学的接続子４２を保持するため、鍔付フェルール４５の管内内壁面と光学的接続子４２の外周面とを接着材４６で接着するが、鍔付フェルール４５の外周面と貫通孔１３２の内壁面とは接着しないようにする。換言すると、光学的接続子４２が挿入されている鍔付フェルール４５は、貫通孔１３２に対して脱着可能に挿入されている。このように、光学的接続子４２と鍔付フェルール４５とを接着材４６で接着しているので、光学的接続子４２が破損したときには、互いに接着させた光学的接続子４２及び鍔付フェルール４５を貫通孔１３２から取り外して交換することができる。つまり、光学的接続子４２が破損したときには、破損した光学的接続子４２と、これと固定されている鍔付フェルール４５とを一緒に取り外して、破損した光学的接続子４２を個別に交換等することが可能となる。 Further, in this embodiment, when the optical connector 42 is inserted into the tube of the flanged ferrule 45, it is optically connected to the inner wall surface of the flanged ferrule 45 in order to hold the aligned optical connector 42. The outer peripheral surface of the child 42 is adhered with the adhesive material 46, but the outer peripheral surface of the flanged ferrule 45 and the inner wall surface of the through hole 132 are not adhered to each other. In other words, the flanged ferrule 45 into which the optical connector 42 is inserted is detachably inserted into the through hole 132. In this way, the optical connector 42 and the flanged ferrule 45 are adhered to each other by the adhesive material 46. Therefore, when the optical connector 42 is damaged, the optical connector 42 and the flanged ferrule 45 bonded to each other are bonded to each other. Can be removed from the through hole 132 and replaced. That is, when the optical connector 42 is damaged, the damaged optical connector 42 and the flanged ferrule 45 fixed to the damaged optical connector 42 are removed together, and the damaged optical connector 42 is replaced individually. It becomes possible to do.

図３は、実施形態に係る鍔付フェルール４５の構成を示す構成図である。図３（Ａ）は、実施形態に係る鍔付フェルール４５の外観斜視図であり、図３（Ｂ）は、実施形態に係る鍔付フェルール４５の断面図である。 FIG. 3 is a configuration diagram showing the configuration of the flanged ferrule 45 according to the embodiment. FIG. 3A is an external perspective view of the flanged ferrule 45 according to the embodiment, and FIG. 3B is a cross-sectional view of the flanged ferrule 45 according to the embodiment.

図３（Ａ）に示すように、実施形態の鍔付フェルール４５は、絶縁材料で形成された管状部材のフェルール本体部４５１と、フェルール本体部４５１の一方の端部（図３では上端部）に、絶縁材料で形成された鍔部４５２とを有する。 As shown in FIG. 3A, the flanged ferrule 45 of the embodiment has a ferrule main body portion 451 of a tubular member made of an insulating material and one end portion of the ferrule main body portion 451 (upper end portion in FIG. 3). Has a flange portion 452 formed of an insulating material.

フェルール本体部４５１は、例えば管状部材であり、フェルール本体部４５１の管内径（つまり、長手方向の貫通孔の内径）は光学的接続子４２の外形（例えば外形の直径）よりも、わずかに大きく形成されている。つまり、光ファイバ等の光学的接続子４２がフェルール本体部４５１の管内を挿通できるように、フェルール本体部４５１の管内径の大きさが形成されている。 The ferrule main body 451 is, for example, a tubular member, and the inner diameter of the tube (that is, the inner diameter of the through hole in the longitudinal direction) of the ferrule main body 451 is slightly larger than the outer diameter of the optical connector 42 (for example, the outer diameter). It is formed. That is, the size of the inner diameter of the tube of the ferrule body 451 is formed so that the optical connector 42 such as an optical fiber can pass through the tube of the ferrule body 451.

また、フェルール本体部４５１の外径の寸法は、セラミック基板１２１の貫通孔１３２の内径と同程度、若しくは、わずかに大きく形成されている。つまり、セラミック基板１２１の貫通孔１３２にフェルール本体部４５１を挿入可能とするため、フェルール本体部４５１の外径が形成されている。 Further, the outer diameter of the ferrule main body 451 is formed to be about the same as or slightly larger than the inner diameter of the through hole 132 of the ceramic substrate 121. That is, the outer diameter of the ferrule main body 451 is formed so that the ferrule main body 451 can be inserted into the through hole 132 of the ceramic substrate 121.

なお、上述したように、フェルール本体部４５１の長手方向の貫通孔の断面形状は、光ファイバ等の光学的接続子４２の外形と同様に円形又は略円形とすることが望ましいが、フェルール本体部４５１の外径断面形状は円形、方形等としてもよく、その場合、セラミック基板１２１に設ける貫通孔１３２の断面形状はフェルール本体部４５１の外径断面形状に合わせた形状としてもよい。 As described above, it is desirable that the cross-sectional shape of the through hole in the longitudinal direction of the ferrule main body 451 is circular or substantially circular like the outer shape of the optical connector 42 such as an optical fiber. The outer diameter cross-sectional shape of 451 may be circular, square, or the like, and in that case, the cross-sectional shape of the through hole 132 provided in the ceramic substrate 121 may be a shape that matches the outer diameter cross-sectional shape of the ferrule main body portion 451.

鍔部４５２は、フェルール本体部４５１の一方の端部（図３では上端部）に設けられる構成部材であり、鍔部４５２の断面形状の外形寸法（大きさ）は、フェルール本体部４５１自体の断面形状の外形寸法（大きさ）よりも大きく形成されており、セラミック基板１２１の貫通孔１３２の内径寸法よりも大きい。したがって、鍔付フェルール４５のフェルール本体部４５１が貫通孔１３２に挿入されたときに、鍔部４５２が、セラミック基板１２１の貫通孔１３２の入口周縁部（セラミック基板１２１の上面）に接触して、鍔部４５２が鍔付フェルール４５を支持する。換言すると、鍔部４５２は、鍔付フェルール４５を支持する支持部として機能する。 The flange portion 452 is a constituent member provided at one end portion (upper end portion in FIG. 3) of the ferrule main body portion 451, and the external dimension (size) of the cross-sectional shape of the flange portion 452 is the ferrule main body portion 451 itself. It is formed to be larger than the external dimension (size) of the cross-sectional shape, and is larger than the inner diameter dimension of the through hole 132 of the ceramic substrate 121. Therefore, when the ferrule main body portion 451 of the flanged ferrule 45 is inserted into the through hole 132, the flange portion 452 comes into contact with the inlet peripheral portion (upper surface of the ceramic substrate 121) of the through hole 132 of the ceramic substrate 121. The collar portion 452 supports the flanged ferrule 45. In other words, the flange portion 452 functions as a support portion that supports the flanged ferrule 45.

また、鍔部４５２は、フェルール本体部４５１の管内径（長手方向の貫通孔の直径）と同程度の径をもつ貫通孔４５３が設けられており、鍔部４５２がフェルール本体部４５１の上端部に設けられたときに、鍔部４５２の貫通孔４５３は、フェルール本体部４５１の管内径（貫通孔）と連続した孔を形成する。これにより、鍔付フェルール４５の管内への光学的接続子４２の挿入が可能となる。 Further, the flange portion 452 is provided with a through hole 453 having a diameter similar to the inner diameter of the pipe of the ferrule main body portion 451 (diameter of the through hole in the longitudinal direction), and the flange portion 452 is the upper end portion of the ferrule main body portion 451. The through hole 453 of the flange portion 452 forms a hole continuous with the inner diameter (through hole) of the pipe of the ferrule main body portion 451. This makes it possible to insert the optical connector 42 into the tube of the flanged ferrule 45.

なお、鍔部４５２は、フェルール本体部４５１とは異なる別の構成部材として形成され、例えば接着材等でフェルール本体部４５１の上端部に鍔部４５２が固定されることで、鍔付フェルール４５を形成するようにしてもよい。または、鍔部４５２とフェルール本体部４５１とが物理的に一体として形成されたものであってもよい。いずれにしても、鍔部４５２が鍔付フェルール４５を支持しながら、セラミック基板１２１の貫通孔１３２への挿入を可能とすると共に、鍔付フェルール４５の管内（貫通孔４５３）への光学的接続子４２の挿通が可能なように、鍔付フェルール４５は形成されている。 The flange portion 452 is formed as a component different from the ferrule main body portion 451. For example, the flange portion 452 is fixed to the upper end portion of the ferrule main body portion 451 with an adhesive or the like to form the flanged ferrule 45. It may be formed. Alternatively, the flange portion 452 and the ferrule main body portion 451 may be physically integrally formed. In any case, while the flange portion 452 supports the flanged ferrule 45, the ceramic substrate 121 can be inserted into the through hole 132, and the flanged ferrule 45 is optically connected to the inside of the pipe (through hole 453). The flanged ferrule 45 is formed so that the child 42 can be inserted.

（固定用板部材）
固定用板部材１２２は、セラミック基板１２１の上面に配置される板状部材であり、セラミック基板１２１の各貫通孔１３２に挿入された鍔付フェルール４５を固定する固定部材である。これにより、鍔付フェルール４５の抜け落ちを防止することができ、貫通孔１３２に挿入された鍔付フェルール４５を確実に固定することができる。 (Fixing plate member)
The fixing plate member 122 is a plate-shaped member arranged on the upper surface of the ceramic substrate 121, and is a fixing member for fixing the flanged ferrule 45 inserted into each through hole 132 of the ceramic substrate 121. As a result, it is possible to prevent the flanged ferrule 45 from falling off, and it is possible to securely fix the flanged ferrule 45 inserted in the through hole 132.

固定用板部材１２２の下面には、セラミック基板１２１の各貫通孔１３２の位置と対応する位置のそれぞれに凹部６２が形成されており、各貫通孔１３２に挿入された鍔付フェルール４５の鍔部４５２が各凹部６２に収まるようにしている。これにより、セラミック基板１２１の貫通孔１３２に鍔付フェルール４５が挿入されたときに、セラミック基板１２１の上面に突出する鍔部４５２を無くすことができる。また、固定用板部材１２２が鍔付フェルール４５の鍔部４５２を上方から下方に向けて押さえることにより、貫通孔１３２に挿入された鍔付フェルール４５を確実に固定することができる。 On the lower surface of the fixing plate member 122, recesses 62 are formed at the positions corresponding to the positions of the through holes 132 of the ceramic substrate 121, and the flange portions of the flanged ferrules 45 inserted into the through holes 132 are formed. The 452 is set to fit in each recess 62. As a result, when the flanged ferrule 45 is inserted into the through hole 132 of the ceramic substrate 121, the flange portion 452 protruding from the upper surface of the ceramic substrate 121 can be eliminated. Further, by pressing the flange portion 452 of the flanged ferrule 45 from above to downward by the fixing plate member 122, the flanged ferrule 45 inserted in the through hole 132 can be reliably fixed.

固定用板部材１２２の下面の各凹部６２の深さ（上下方向の長さ）は、鍔付フェルール４５の鍔部４５２の高さ（上下方向の長さ）と同程度、若しくはわずかに大きく形成することが望ましい。また、各凹部６２の天井部（上方の底面部）の中央には、光ファイバ等の光学的接続子４２の挿通を可能とするため、貫通孔６１が形成されている。 The depth (vertical length) of each recess 62 on the lower surface of the fixing plate member 122 is formed to be the same as or slightly larger than the height (vertical length) of the flange portion 452 of the flanged ferrule 45. It is desirable to do. Further, a through hole 61 is formed in the center of the ceiling portion (upper bottom surface portion) of each recess 62 in order to allow the insertion of an optical connector 42 such as an optical fiber.

［接続子基板の組み立て］
次に、図２を参照して、セラミック基板１２１の各貫通孔１３２に鍔付フェルール４５を挿入して、光学的接続子４２を設けるまでの接続子基板１２の組み立て方法の一例を説明する。なお、接続子基板１２の組み立て方法は、以下の例に限定されない。 [Assembly of connector board]
Next, with reference to FIG. 2, an example of an assembling method of the connector board 12 until the flanged ferrule 45 is inserted into each through hole 132 of the ceramic substrate 121 to provide the optical connector 42 will be described. The method of assembling the connector board 12 is not limited to the following examples.

まず、鍔付フェルール４５のフェルール本体部４５１を、セラミック基板１２１の貫通孔１３２の上方から挿入して、鍔部４５２が貫通孔１３２の入口周縁部に当接するまで、フェルール本体部４５１を貫通孔１３２に挿入する。 First, the ferrule main body 451 of the flanged ferrule 45 is inserted from above the through hole 132 of the ceramic substrate 121, and the ferrule main body 451 is inserted through the through hole until the flange 452 abuts on the inlet peripheral edge of the through hole 132. Insert into 132.

ここで、鍔付フェルール４５のフェルール本体部４５１の長手方向の長さは、セラミック基板１２１の厚さと同程度の長さとすることが望ましい。したがって、セラミック基板１２１の貫通孔１３２に、鍔付フェルール４５のフェルール本体部４５１が挿入され、鍔部４５２が貫通孔１３２の入口周縁部に接触した状態のときには、貫通孔１３２に挿入されたフェルール本体部４５１の下端部が、セラミック基板１２１の下面の位置と同程度の位置となる。 Here, it is desirable that the length of the ferrule body portion 451 of the flanged ferrule 45 in the longitudinal direction is about the same as the thickness of the ceramic substrate 121. Therefore, when the ferrule body portion 451 of the flanged ferrule 45 is inserted into the through hole 132 of the ceramic substrate 121 and the flange portion 452 is in contact with the inlet peripheral edge portion of the through hole 132, the ferrule inserted into the through hole 132. The lower end of the main body 451 is at a position similar to the position of the lower surface of the ceramic substrate 121.

セラミック基板１２１の各貫通孔１３２に、光学的接続子（例えば光ファイバ）４２が予め挿通された鍔付フェルール４５をそれぞれ挿入する。ここで、鍔付フェルール４５の管内に挿通された光学的接続子４２は、被検査体５の光信号端子５２に対して光学的接続が可能となる位置に位置合わせを行なう。例えば、鍔付フェルール４５の管内に挿通された光学的接続子４２の姿勢が、セラミック基板１２１の基板面に対して垂直となるように調整したり、光学的接続子４２の下方の先端部の位置と、鍔付フェルール４５のフェルール本体部４５１の下端部の位置との相対的な位置関係の調整をしたりする。 A flanged ferrule 45 into which an optical connector (for example, an optical fiber) 42 is previously inserted is inserted into each through hole 132 of the ceramic substrate 121. Here, the optical connector 42 inserted into the tube of the flanged ferrule 45 is aligned with the optical signal terminal 52 of the inspected object 5 at a position where optical connection is possible. For example, the posture of the optical connector 42 inserted into the tube of the flanged ferrule 45 may be adjusted to be perpendicular to the substrate surface of the ceramic substrate 121, or the lower tip of the optical connector 42 may be adjusted. The relative positional relationship between the position and the position of the lower end portion of the ferrule main body portion 451 of the flanged ferrule 45 is adjusted.

そして、鍔付フェルール４５の管内で位置合わせをした光学的接続子４２を固定するため、光学的接続子４２の外壁面と、鍔付フェルール４５の管内の内壁面との間に接着材４６を挿入して、光学的接続子４２と鍔付フェルール４５とを接着して固定する。このように、光学的接続子４２と鍔付フェルール４５とを接着して固定することで、鍔付フェルール４５が光学的接続子４２の折れ曲がりや破損等を防止することができる。換言すると、鍔付フェルール４２が光学的接続子４２の保護部材として機能する。 Then, in order to fix the optical connector 42 aligned in the tube of the flanged ferrule 45, an adhesive 46 is placed between the outer wall surface of the optical connector 42 and the inner wall surface in the tube of the flanged ferrule 45. It is inserted and the optical connector 42 and the flanged ferrule 45 are adhered and fixed. By adhering and fixing the optical connector 42 and the flanged ferrule 45 in this way, the flanged ferrule 45 can prevent the optical connector 42 from being bent or damaged. In other words, the flanged ferrule 42 functions as a protective member for the optical connector 42.

つまり、従来のように、セラミック基板１２１の各貫通孔１３２に各光学的接続子４２を挿入すると、各光学的接続子４２が各貫通孔１３２に接触して光学的接続子４２の破損等が生じやすかったが、この実施形態によれば、鍔付フェルール４５が光学的接続子４２の保護部材として機能するので、光学的接続子４２を貫通孔１３２に挿入するときの破損等を防止できる。 That is, when each optical connector 42 is inserted into each through hole 132 of the ceramic substrate 121 as in the conventional case, each optical connector 42 comes into contact with each through hole 132 and the optical connector 42 is damaged or the like. However, according to this embodiment, since the flanged ferrule 45 functions as a protective member for the optical connector 42, damage or the like when the optical connector 42 is inserted into the through hole 132 can be prevented.

さらに、セラミック基板１２１の各貫通孔１３２に挿入された各鍔付フェルール４５は、当該貫通孔１３２に固定されていないので、光学的接続子４２の交換が必要になったときには、その光学的接続子４２とこれに固定されている鍔付フェルール４５とを同時にセラミック基板１２１の貫通孔１３２から取り外すことができるので、光学的接続子４２の個別交換が可能となる。つまり、従来は、光学的接続子４２の個別交換ができず、光学的接続子４２を交換するときには、複数の光学的接続子４２が設けられているセラミック基板１２１全体を交換することが必要であったが、この実施形態によれば、交換が必要な光学的接続子４２を個別交換できるので、光学的接続子４２の交換作業が簡単になる。 Further, since each flanged ferrule 45 inserted into each through hole 132 of the ceramic substrate 121 is not fixed to the through hole 132, when the optical connector 42 needs to be replaced, the optical connection thereof is made. Since the child 42 and the flanged ferrule 45 fixed to the child 42 can be removed from the through hole 132 of the ceramic substrate 121 at the same time, the optical connector 42 can be individually replaced. That is, conventionally, the optical connectors 42 cannot be individually replaced, and when the optical connectors 42 are replaced, it is necessary to replace the entire ceramic substrate 121 provided with the plurality of optical connectors 42. However, according to this embodiment, the optical connector 42 that needs to be replaced can be individually replaced, so that the replacement work of the optical connector 42 becomes easy.

次に、セラミック基板１２１の上面に突出している各鍔付フェルール４５の鍔部４５２が、固定用板部材１２２の下面の凹部６２に嵌るように、セラミック基板１２１の上面に固定用板部材１２２を配置する。 Next, the fixing plate member 122 is placed on the upper surface of the ceramic substrate 121 so that the flange portion 452 of each flanged ferrule 45 protruding from the upper surface of the ceramic substrate 121 fits into the recess 62 on the lower surface of the fixing plate member 122. Deploy.

ここで、セラミック基板１２１と固定用板部材１２２との位置合わせを確実にするため、例えば、セラミック基板１２１及び固定用板部材１２２に、図示しない位置合わせピン及びピン受け部を設け、セラミック基板１２１及び固定用板部材１２２の位置合わせピンとピン受け部とを嵌合させながら、セラミック基板１２１の上面に固定用板部材１２２を配置するようにしてもよい。 Here, in order to ensure the alignment between the ceramic substrate 121 and the fixing plate member 122, for example, the ceramic substrate 121 and the fixing plate member 122 are provided with alignment pins and pin receiving portions (not shown), and the ceramic substrate 121 is provided. The fixing plate member 122 may be arranged on the upper surface of the ceramic substrate 121 while fitting the alignment pin of the fixing plate member 122 and the pin receiving portion.

さらに、セラミック基板１２１の上面に配置させた固定用板部材１２２を固定するため、例えばボルトなどの固定部材を用いて、セラミック基板１２１と、当該セラミック基板１２１の上面に配置した固定用板部材１２２とを固定するようにしてもよい。このように、セラミック基板１２１と固定用板部材１２２とを確実に固定することにより、貫通孔１３２に挿入された鍔付フェルール４５を確実に固定することができる。 Further, in order to fix the fixing plate member 122 arranged on the upper surface of the ceramic substrate 121, for example, using a fixing member such as a bolt, the ceramic substrate 121 and the fixing plate member 122 arranged on the upper surface of the ceramic substrate 121 are used. And may be fixed. By securely fixing the ceramic substrate 121 and the fixing plate member 122 in this way, the flanged ferrule 45 inserted in the through hole 132 can be reliably fixed.

（Ａ−２）実施形態の効果
以上のように、従来は、セラミック基板の各貫通孔に、直接、各光学的接続子を挿入していたので、光学的接続子がセラミック基板と接触してしまい、光学的接続子が破損等してしまうことがあった。これに対して、この実施形態によれば、セラミック基板の各貫通孔に、予め光学的接続子が挿入された鍔付フェルールを挿入するので、光学的接続子を貫通孔に挿入する際の破損を防ぐことができる。 (A-2) Effect of Embodiment As described above, conventionally, since each optical connector is directly inserted into each through hole of the ceramic substrate, the optical connector comes into contact with the ceramic substrate. As a result, the optical connector may be damaged. On the other hand, according to this embodiment, since the flanged ferrule in which the optical connector is inserted in advance is inserted into each through hole of the ceramic substrate, the optical connector is damaged when the optical connector is inserted into the through hole. Can be prevented.

また、実施形態によれば、セラミック基板の貫通孔と鍔付フェルールとは接着せず、鍔付フェルールと当該鍔付フェルールの管内に挿入した光学的接続子とを接着材等で固定することにより、破損してしまった光学的接続子を鍔付フェルールと一緒に、セラミック基板の貫通孔から取り出すことができるので、セラミック基板に設ける光学的接続子の交換性が良好となる。 Further, according to the embodiment, the through hole of the ceramic substrate and the flanged ferrule are not adhered to each other, but the flanged ferrule and the optical connector inserted into the tube of the flanged ferrule are fixed by an adhesive or the like. Since the damaged optical connector can be taken out from the through hole of the ceramic substrate together with the flanged ferrule, the interchangeability of the optical connector provided on the ceramic substrate is improved.

さらに、実施形態によれば、セラミック基板の貫通孔に挿入した鍔付フェルールを、固定用板部材で、上方から下方に向けて押さえて固定することにより、貫通孔に挿入された鍔付フェルールの抜け落ちやぐらつき等を無くし、鍔付フェルールを確実に固定することができる。 Further, according to the embodiment, the flanged ferrule inserted into the through hole of the ceramic substrate is fixed by pressing the flanged ferrule inserted into the through hole from above to the bottom with a fixing plate member. It is possible to eliminate falling out and wobbling, and to securely fix the ferrule with a collar.

また、実施形態によれば、固定用板部材の下面には、各鍔付フェルールの鍔部を嵌めるための複数の凹部が設けられているので、セラミック基板の上面に固定用板部材を配置することにより、セラミック基板の上面に突出する鍔部を無くしながら、各鍔付フェルールを確実に固定することができる。 Further, according to the embodiment, since the lower surface of the fixing plate member is provided with a plurality of recesses for fitting the flange portion of each flanged ferrule, the fixing plate member is arranged on the upper surface of the ceramic substrate. This makes it possible to securely fix each flanged ferrule while eliminating the flange portion protruding from the upper surface of the ceramic substrate.

（Ｂ）他の実施形態
上述した実施形態においても種々の変形実施形態を言及したが、本発明は、以下の変形実施形態にも適用できる。 (B) Other Embodiments Although various modified embodiments have been mentioned in the above-described embodiments, the present invention can also be applied to the following modified embodiments.

（Ｂ−１）上述した実施形態では、図３を用いて鍔付フェルール４５の構成を説明したが、鍔付フェルールは、図３に例示した構成に限定されず、別の構成としてもよい。図４を用いて鍔付フェルールの変形例を例示する。 (B-1) In the above-described embodiment, the configuration of the flanged ferrule 45 has been described with reference to FIG. 3, but the flanged ferrule is not limited to the configuration illustrated in FIG. 3, and may be another configuration. FIG. 4 is used to illustrate a modified example of the flanged ferrule.

（Ｂ−１−１）図４（Ａ）に例示する鍔付フェルール４５Ａは、鍔部４５２の上面に、例えば合成ゴム部材、ポリウレタン等の合成樹脂材料で形成された弾性部材４５４を有するものである。なお、弾性部材４５４の中央部には、光学的接続子４２の挿入を可能とするため、貫通孔が設けられている。 (B-1-1) The flanged ferrule 45A illustrated in FIG. 4A has an elastic member 454 formed of, for example, a synthetic rubber member or a synthetic resin material such as polyurethane on the upper surface of the flange portion 452. be. A through hole is provided in the central portion of the elastic member 454 in order to allow the optical connector 42 to be inserted.

例えば、被検査体５の端子（電気信号端子５１、光信号端子５２）に対して、接続装置１の電気的接触子４１等を電気的に接続させる際、接続装置１には、下から上に向けたコンタクト荷重が作用する。したがって、鍔部４５２の上面に弾性部材４５４を設けることにより、荷重を抑えることができ、鍔付フェルール４５Ｂの破壊や、当該鍔付きフェルール４５Ｂの管内に挿入された光学的接続子４２の破損等を防ぐことができる。 For example, when the electrical contactor 41 or the like of the connecting device 1 is electrically connected to the terminals (electric signal terminal 51, optical signal terminal 52) of the object to be inspected 5, the connecting device 1 is connected from the bottom to the top. The contact load towards is acting. Therefore, by providing the elastic member 454 on the upper surface of the flange portion 452, the load can be suppressed, the flanged ferrule 45B is broken, the optical connector 42 inserted in the tube of the flanged ferrule 45B is damaged, and the like. Can be prevented.

なお、図４（Ａ）の例では、鍔部４５２の上面に弾性部材４５４が設けられた場合を例示するが、これに限定されない。例えば、鍔部４５２を嵌める、固定用板部材１２２下面の各凹部６２の上面部（天井部）に弾性部材（図４（Ａ）の弾性部材４５４と同等の部材）を設けるようにしてもよい。 In addition, in the example of FIG. 4A, the case where the elastic member 454 is provided on the upper surface of the flange portion 452 is illustrated, but the case is not limited to this. For example, an elastic member (a member equivalent to the elastic member 454 of FIG. 4A) may be provided on the upper surface portion (ceiling portion) of each recess 62 on the lower surface of the fixing plate member 122 into which the flange portion 452 is fitted. ..

換言すると、貫通孔１３２に挿入された鍔付フェルール４５の鍔部４５２と、当該鍔部４５２を嵌める固定用板部材１２２の凹部６２との間に、荷重を抑えるための弾性部材を設けるようにしてもよい。 In other words, an elastic member for suppressing the load is provided between the flange portion 452 of the flanged ferrule 45 inserted into the through hole 132 and the recess 62 of the fixing plate member 122 into which the flange portion 452 is fitted. You may.

（Ｂ−１−２）図４（Ｂ）は、鍔付フェルール４５Ｂの鍔部４５２Ｂが、例えば合成ゴム部材、ポリウレタン等の合成樹脂材料で形成された弾性部材である場合を例示する。この場合も、（Ｂ−１−１）と同様に、コンタクト荷重を抑えることができる。また、上述した実施形態と同様に、鍔部４５２Ｂが貫通孔１３２の入口周縁部に当接することで、貫通孔１３２に挿入された鍔付フェルール４５Ｂを支持することができる。 (B-1-2) FIG. 4B illustrates a case where the flange portion 452B of the flanged ferrule 45B is an elastic member formed of, for example, a synthetic rubber member or a synthetic resin material such as polyurethane. In this case as well, the contact load can be suppressed as in (B-1-1). Further, as in the above-described embodiment, the flanged portion 452B abuts on the inlet peripheral edge portion of the through hole 132 to support the flanged ferrule 45B inserted in the through hole 132.

（Ｂ−２）上述した実施形態では、セラミック基板の上面に突出する鍔部を無くすために、固定用板部材の下面に凹部を設けたが、変形例として、セラミック基板の貫通孔の入口周縁部に凹部（ザグリ）を設けるようにしてもよい。これにより、セラミック基板の貫通孔に鍔付フェルールが挿入されたときに、鍔部が貫通孔の入口周縁部の凹部（ザグリ）に嵌るので、鍔部の突出を無くすことができる。 (B-2) In the above-described embodiment, a recess is provided on the lower surface of the fixing plate member in order to eliminate the flange portion protruding from the upper surface of the ceramic substrate. A recess (counterbore) may be provided in the portion. As a result, when the flanged ferrule is inserted into the through hole of the ceramic substrate, the flange portion fits into the concave portion (counterbore) at the inlet peripheral portion of the through hole, so that the protrusion of the flange portion can be eliminated.

（Ｂ−３）上述した実施形態では、固定部材としての固定用板部材が板状部材で形成される場合を例示したが、セラミック基板の貫通孔に挿入された鍔付フェルールを固定することができれば、固定部材はこれに限定されない。例えば、セラミック基板の上面に配置する固定部材は、合成樹脂製のフィルム等としてもよい。例えば（Ｂ−２）で述べたように、セラミック基板の貫通孔の入口周縁部に凹部（ザグリ）を設けた場合に、固定部材としてのフィルムで、貫通孔に挿入されている鍔付フェルールを固定することができる。 (B-3) In the above-described embodiment, the case where the fixing plate member as the fixing member is formed of the plate-shaped member is exemplified, but the flanged ferrule inserted into the through hole of the ceramic substrate can be fixed. If possible, the fixing member is not limited to this. For example, the fixing member arranged on the upper surface of the ceramic substrate may be a film made of synthetic resin or the like. For example, as described in (B-2), when a recess (counterbore) is provided at the entrance peripheral edge of the through hole of the ceramic substrate, a flanged ferrule inserted into the through hole is provided with a film as a fixing member. Can be fixed.

１…接続装置、１１…配線基板、１２…接続子基板、１２１…セラミック基板、１２２…固定用板部材、１２３…貫通孔、４１…電気的接触子、４２…光学的接続子、４５、４５Ａ及び４５Ｂ…鍔付フェルール、４５１…フェルール本体部、４５２及び４５２Ｂ…鍔部、４５３…貫通孔、４５４…弾性部材、４６…接着材、６１…貫通孔、６２…凹部。
1 ... Connection device, 11 ... Wiring board, 12 ... Connector board, 121 ... Ceramic board, 122 ... Fixing plate member, 123 ... Through hole, 41 ... Electrical contactor, 42 ... Optical connector, 45, 45A And 45B ... Ferrule with collar, 451 ... Ferrule body, 452 and 452B ... Flange, 453 ... Through hole, 454 ... Elastic member, 46 ... Adhesive, 61 ... Through hole, 62 ... Recess.

Claims (6)

管状本体部と、前記管状本体部の一方の端部に設けられた鍔部とを有する複数の鍔付管状部材と、
前記各鍔付管状部材の前記鍔部側から前記管状本体部の他方の端部に向けて挿入され、先端部が前記管状本体部側に位置している複数の光学的接続子と、
基板厚さ方向に設けられた複数の貫通孔を有する基板と
を備え、
前記各光学的接続子が挿入された前記各鍔付管状部材の前記管状本体部は、前記基板の前記各貫通孔に着脱可能に挿入されて、前記鍔部が、当該貫通孔の周縁部に当接して当該鍔付管状部材を支持するものであり、
前記各光学的接続子と、前記各光学的接続子を挿入している前記鍔付管状部材とが固定されている
ことを特徴とする光学的接続子保持構造。 A plurality of flanged tubular members having a tubular body portion and a flange portion provided at one end of the tubular body portion, and
A plurality of optical connectors inserted from the flange side of each flanged tubular member toward the other end of the tubular body portion and having the tip portion located on the tubular body portion side.
The board is provided with a board having a plurality of through holes provided in the board thickness direction.
The tubular body portion of each flanged tubular member into which each of the optical connectors is inserted is detachably inserted into each of the through holes of the substrate, and the flange portion is inserted into the peripheral edge of the through hole. It abuts and supports the flanged tubular member.
An optical connector holding structure, characterized in that the respective optical connectors and the flanged tubular member into which the respective optical connectors are inserted are fixed. 前記基板の上面に配置されるものであって、前記各貫通孔に挿入されている前記各鍔付管状部材の前記鍔部を固定する固定部材を備えることを特徴とする請求項１に記載の光学的接続子保持構造。 The first aspect of the present invention, which is arranged on the upper surface of the substrate and includes a fixing member for fixing the flange portion of each flanged tubular member inserted into the through holes. Optical connector holding structure. 前記固定部材の前記基板と対向する対向面には、前記各貫通孔の位置と対応する位置に、前記各貫通孔に挿入されている前記鍔付管状部材の前記鍔部を収める凹部が設けられていることを特徴とする請求項２に記載の光学的接続子保持構造。 On the facing surface of the fixing member facing the substrate, a recess for accommodating the flange portion of the flanged tubular member inserted into each through hole is provided at a position corresponding to the position of each through hole. 2. The optical connector holding structure according to claim 2. 前記固定部材の前記対向面に設けられている前記凹部と、対応する前記鍔付管状部材の前記鍔部との間に、弾性部材が設けられていることを特徴とする請求項３に記載の光学的接続子保持構造。 3. The third aspect of claim 3, wherein an elastic member is provided between the recess provided on the facing surface of the fixing member and the flange portion of the corresponding flanged tubular member. Optical connector holding structure. 前記鍔付管状部材に挿入される前記光学的接続子は接着材で固定されていることを特徴とする請求項１〜４のいずれかに記載の光学的接続子保持構造。 The optical connector holding structure according to any one of claims 1 to 4, wherein the optical connector inserted into the flanged tubular member is fixed with an adhesive. 供給された電気信号に基づいて光信号を発光する複数の被検査体と、検査装置との間を接続して、前記検査装置からの電気信号を前記各被検査体に供給して、前記各被検査体から発光された光信号を前記検査装置に与える接続装置において、
複数の電気的接触子と、複数の光学的接続子とを有する基板を備え、
前記各電気的接触子が、前記検査装置の電気信号端子と、前記各被検査体の電気信号端子とに対して電気的に接触し、
前記各光学的接続子が、前記基板の厚さ方向に設けられた複数の貫通孔のそれぞれに挿入され、前記被検査体の発光に対して光学的に接続可能なものであり、
前記各光学的接続子を有する前記基板が、請求項１〜５のいずれかに記載の光学的接続子保持構造を有する
ことを特徴とする接続装置。
A plurality of objects to be inspected that emit an optical signal based on the supplied electric signal and the inspection device are connected to each other, and the electric signal from the inspection device is supplied to each of the inspected objects. In the connection device that gives the optical signal emitted from the object to be inspected to the inspection device,
A substrate having a plurality of electrical contacts and a plurality of optical connectors.
Each of the electrical contacts electrically contacts the electrical signal terminal of the inspection device and the electrical signal terminal of each of the objects to be inspected.
Each of the optical connectors is inserted into each of a plurality of through holes provided in the thickness direction of the substrate, and can be optically connected to the light emission of the inspected object.
A connecting device, wherein the substrate having each of the optical connectors has the optical connector holding structure according to any one of claims 1 to 5.
JP2020091982A 2020-05-27 2020-05-27 Optical connector protection structure and connecting device Pending JP2021188947A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020091982A JP2021188947A (en) 2020-05-27 2020-05-27 Optical connector protection structure and connecting device
TW110114048A TWI785567B (en) 2020-05-27 2021-04-20 Holding structure for optical connector, and connecting apparatus
CN202110563349.6A CN113805026A (en) 2020-05-27 2021-05-24 Optical connector holding structure and connecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020091982A JP2021188947A (en) 2020-05-27 2020-05-27 Optical connector protection structure and connecting device

Publications (1)

Publication Number Publication Date
JP2021188947A true JP2021188947A (en) 2021-12-13

Family

ID=78849235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020091982A Pending JP2021188947A (en) 2020-05-27 2020-05-27 Optical connector protection structure and connecting device

Country Status (3)

Country Link
JP (1) JP2021188947A (en)
CN (1) CN113805026A (en)
TW (1) TWI785567B (en)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3848582B2 (en) * 2002-02-12 2006-11-22 株式会社日本マイクロニクス Electrical connection device
WO2006009104A1 (en) * 2004-07-16 2006-01-26 Jsr Corporation Inspection equipment of circuit board and inspection method of circuit board
JP5098339B2 (en) * 2007-01-11 2012-12-12 日本電産リード株式会社 Manufacturing method of substrate inspection jig
JP2009133722A (en) * 2007-11-30 2009-06-18 Tokyo Electron Ltd Probe device
JP5629545B2 (en) * 2009-12-18 2014-11-19 株式会社日本マイクロニクス Probe card and inspection device
JP2014197198A (en) * 2014-04-25 2014-10-16 サミー株式会社 Optical fiber connector for game machine
JP5996687B2 (en) * 2015-02-10 2016-09-21 浜松ホトニクス株式会社 Inspection apparatus and inspection method
JP6054468B2 (en) * 2015-05-19 2016-12-27 Ｎｔｔエレクトロニクス株式会社 Optical module
JP2017129395A (en) * 2016-01-19 2017-07-27 三菱電機株式会社 Semiconductor device inspection apparatus and semiconductor device inspection method
JP2018049174A (en) * 2016-09-21 2018-03-29 パナソニックＩｐマネジメント株式会社 Light source device
TWI647465B (en) * 2017-08-16 2019-01-11 旺矽科技股份有限公司 Optical inspection system
JP6781120B2 (en) * 2017-08-18 2020-11-04 株式会社日本マイクロニクス Inspection equipment
CN111913019A (en) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 Circular probe of probe card device
CN110068711B (en) * 2018-01-24 2022-04-26 台湾中华精测科技股份有限公司 Probe card device and rectangular probe
JP7101577B2 (en) * 2018-09-21 2022-07-15 株式会社日本マイクロニクス Inspection method and inspection system
JP7336256B2 (en) * 2019-05-10 2023-08-31 東京エレクトロン株式会社 Mounting table and manufacturing method of mounting table
CN113777368B (en) * 2020-06-10 2024-06-21 台湾中华精测科技股份有限公司 Vertical probe card and cantilever type probe thereof

Also Published As

Publication number Publication date
CN113805026A (en) 2021-12-17
TW202201015A (en) 2022-01-01
TWI785567B (en) 2022-12-01

Similar Documents

Publication Publication Date Title
TW201510547A (en) Device interface apparatus, test apparatus, and test method
US6685363B2 (en) Passive self-alignment technique for array laser transmitters and receivers for fiber optic applications
JP7441478B2 (en) connection device
US11762008B2 (en) Connecting device for inspection
CN110573920A (en) Photonic assembly and manufacturing method thereof
JP4699155B2 (en) Optical module
TWI785567B (en) Holding structure for optical connector, and connecting apparatus
WO2011089499A2 (en) Optical fiber socket
JP2022051109A (en) Connection device and tubular member
US11899054B2 (en) Connecting device for inspection
US11874511B2 (en) Connecting apparatus and light condensing substrate
US11592402B2 (en) Connecting device for inspection
JP2022018889A (en) Connection device
KR20110025009A (en) The interconnector that is easy to assemble and has the stable contacts
US20060228085A1 (en) High frequency test fixture
KR100357529B1 (en) Test Apparatus by Batch Type Contact of multiple semiconductor device
KR20230048341A (en) Contact module for contacting optoelectronic chips

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230516

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20231227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240109

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240308

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240528