CN113805026A - Optical connector holding structure and connecting device - Google Patents
Optical connector holding structure and connecting device Download PDFInfo
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- CN113805026A CN113805026A CN202110563349.6A CN202110563349A CN113805026A CN 113805026 A CN113805026 A CN 113805026A CN 202110563349 A CN202110563349 A CN 202110563349A CN 113805026 A CN113805026 A CN 113805026A
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- optical connector
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- 239000000758 substrate Substances 0.000 claims abstract description 117
- 230000002093 peripheral effect Effects 0.000 claims abstract description 11
- 238000007689 inspection Methods 0.000 claims description 40
- 238000012360 testing method Methods 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 8
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- 239000000463 material Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 description 62
- 239000013307 optical fiber Substances 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
The invention provides an optical connector holding structure and a connecting device, which can protect each optical connector arranged on a substrate and can facilitate the processing of the optical connector arranged on the substrate. The present invention is characterized by comprising: a plurality of flanged tubular members having a tubular body portion and a flange portion provided at one end of the tubular body portion; a plurality of optical connectors inserted from the flange portion side of each flanged tubular member toward the other end portion of the tubular body portion, the tip end portions being located on the tubular body portion side; and a substrate having a plurality of through holes provided in a thickness direction of the substrate, wherein the tubular body portion of each of the flanged tubular members into which each of the optical connectors is inserted is detachably inserted into each of the through holes of the substrate, the flange portion abuts against a peripheral edge portion of the through hole to support the flanged tubular member, and each of the optical connectors and the flanged tubular member into which each of the optical connectors is inserted are fixed.
Description
Technical Field
The invention relates to an optical connector holding structure and a connector.
Background
In recent years, development of semiconductor laser integration technology for integrating a semiconductor element (hereinafter also referred to as an "optical device") having an electric circuit and an optical circuit on a substrate such as a silicon substrate has been in progress. In an inspection apparatus that simultaneously inspects characteristics of a plurality of optical devices formed on such a semiconductor wafer, a connection apparatus that connects the optical devices on the semiconductor wafer and the inspection apparatus is used.
A connecting device for inspection of a plurality of optical devices on a semiconductor wafer has electrical connectors for supplying electrical signals to the respective optical devices, and optical connectors for receiving light emitted from the respective optical devices based on the supplied electrical signals.
In the connection device, there are various types of light receiving means for receiving light emitted from the optical device, and patent document 1 discloses a technique for receiving an optical signal from the optical device using an optical fiber. More specifically, it is disclosed that, in a ceramic substrate which is a component of a connection device, an optical fiber is inserted into a through hole provided at a position corresponding to a position of a light emitting portion of an optical device, and the optical fiber receives light from the light emitting portion of the optical device.
Conventionally, as shown in fig. 5, in order to efficiently receive light emitted from a light emitting portion of an optical device, an optical fiber 42 is inserted into a through hole 92 provided in a ceramic substrate 91, the optical fiber 42 is aligned with respect to the light emitting portion, and an inner wall surface of the through hole 92 and the optical fiber 42 are directly bonded and fixed by an adhesive 46.
[ patent document ]
Patent document 1: japanese patent laid-open publication No. 2019-211265
Disclosure of Invention
[ problems to be solved by the invention ]
However, if the optical fiber is directly fixed to the through hole provided in the substrate such as the ceramic substrate as in the above-described conventional technique, the optical fiber may come into contact with the substrate, and the optical fiber may be damaged. In the case of inspecting a plurality of optical devices formed on a semiconductor wafer at the same time, since the number of optical fibers provided on a substrate is also increased, breakage, replacement, and the like of the optical fibers are also increased.
In view of the above-described problems, an optical connector holding structure and a connecting device are desired that can protect each optical connector (e.g., optical fiber) provided on a substrate and facilitate handling of the optical connector provided on the substrate.
[ means for solving the problems ]
In order to solve the above problem, the 1 st aspect of the present invention provides an optical connector holding structure including: a plurality of flanged tubular members having a tubular body portion and a flange portion provided at one end portion of the tubular body portion; a plurality of optical connectors inserted from the flange portion side of each flanged tubular member toward the other end portion of the tubular body portion, and having distal end portions located on the tubular body portion side; and a substrate having a plurality of through holes provided in a thickness direction of the substrate, wherein the tubular body portion of each of the flanged tubular members into which each of the optical connectors is inserted is detachably inserted into each of the through holes of the substrate, the flange portion abuts against a peripheral edge portion of the through hole to support the flanged tubular member, and each of the optical connectors and the flanged tubular member into which each of the optical connectors is inserted are fixed.
The 2 nd aspect of the present invention provides a connecting device which connects a plurality of test objects which emit optical signals based on supplied electrical signals and an inspection apparatus, supplies electrical signals from the inspection apparatus to the respective test objects, and supplies the optical signals emitted from the respective test objects to the inspection apparatus, the connecting device comprises a substrate having a plurality of electrical contacts and a plurality of optical connectors, each of the electrical contacts being in electrical contact with an electrical signal terminal of the inspection device and an electrical signal terminal of each of the objects to be inspected, the optical connectors are respectively inserted into a plurality of through holes arranged along the thickness direction of the substrate, the substrate having the optical connectors can be optically connected to the light emission of the object to be inspected, and the substrate holding structure of the optical connector according to claim 1 is provided for the substrate having the optical connectors.
[ Effect of the invention ]
According to the present invention, it is possible to protect each optical connector provided on a substrate, to replace the optical connector, and to facilitate handling of the optical connector provided on the substrate.
Drawings
Fig. 1 is a configuration diagram showing a configuration of a connection device according to an embodiment.
Fig. 2 is an enlarged cross-sectional view of a dotted line portion of fig. 1, and shows a holding structure of the electrical contact and the optical connector in the connector substrate according to the embodiment.
Fig. 3 is a structural view showing a structure of a flanged bush according to the embodiment.
Fig. 4 is a structural view showing a structure of a flanged bush according to a modified embodiment.
Fig. 5 is a diagram showing a holding structure of an electrical contact and an optical connector in a conventional connector substrate.
Detailed Description
(A) Detailed description of the preferred embodiments
Hereinafter, embodiments of the optical connector holding structure and the connecting device according to the present invention will be described in detail with reference to the drawings. The optical connector holding structure is a structure that holds a plurality of optical connectors in a substrate that holds the plurality of optical connectors.
(A-1) construction of the embodiment
Fig. 1 is a configuration diagram showing a configuration of a connection device according to an embodiment.
In fig. 1, a connector 1 according to the embodiment includes a wiring board 11 and a connector board 12 disposed on a lower surface of the wiring board 11.
Fig. 1 is a diagram schematically illustrating main constituent members of a connection device 1 according to an embodiment, and is not limited to these members. In the connection device 1 of fig. 1, when the wiring board 11, the connector board 12, and the like are assembled, the boards are actually fixed to each other by fixing members such as bolts, for example, but the fixing members such as the bolts are not shown. Note that the thickness, size, and the like of each constituent member of the connecting device 1 of fig. 1 are different from actual ones. The structure of the connection device 1 shown in fig. 1 is an example for embodying the technical idea, and the material, shape, structure, arrangement, and the like of the constituent members are not limited to those shown in fig. 1. Hereinafter, the terms "upper" and "lower" are used with reference to the upper direction or the lower direction in fig. 1.
[ test object ]
The device under test 5 is a semiconductor element (optical device) that emits light when an electrical signal is supplied thereto. The device under test 5 may be an optical device having an electric circuit and an optical circuit, and may be, for example, a silicon photodiode chip, a VCSEL (Vertical Cavity Surface Emitting Laser), or the like. In this embodiment, the optical device as the object 5 is a semiconductor element formed by integrating a semiconductor wafer with high density by using a silicon photonics technique. The subject 5 has an electrical signal terminal (hereinafter also referred to as "2 nd contact object") 51 for supplying an electrical signal and an optical signal terminal (hereinafter also referred to as "light emitting part") 52 for emitting an optical signal.
As shown in fig. 1, a test object 5 formed on a semiconductor wafer is placed on the upper surface of a stage 4 of an inspection system 10. When the device under test 5 is subjected to a characteristic inspection, the device under test 5 and a connection device 1 connected to an inspection device (hereinafter also referred to as a "tester") 2 are electrically connected to each other, and a plurality of devices under test 5 formed on a semiconductor wafer are inspected at the same time.
[ connecting device ]
In order to simultaneously inspect a plurality of devices under inspection (optical apparatuses) 5 formed on a semiconductor wafer, the connection device 1 has a terminal (hereinafter, also referred to as "1 st contact object") for supplying an electrical signal from the inspection device (tester) 2, an electrical contact 41 electrically contacting an electrical signal terminal (2 nd contact object) 51 of the device under inspection 5, and an optical connector 42 optically connected to an optical signal terminal (light emitting portion) 52 of the device under inspection 5, and is a probe card electrically connecting the inspection device (tester) 2 and the device under inspection 5.
Here, the "1 st contact object" refers to an electrical signal terminal that receives supply of an electrical signal output by the inspection device (tester) 2 when the object 5 is inspected. The "2 nd contact object" is an electrical signal terminal to which an electrical signal necessary for inspection is supplied to the inspection object 5 via the electrical contact 41. Therefore, when the device under test 5 is inspected, the respective electrical contacts 41 held by the connection device 1 are brought into electrical contact with the electrical signal terminals (1 st contact object) of the inspection apparatus (tester) 2 and are brought into electrical contact with the electrical signal terminals (2 nd contact object) of the device under test 5, whereby electrical signals from the electrical signal terminals (1 st contact object) of the inspection apparatus (tester) 2 are conducted to the electrical signal terminals (2 nd contact object) of the device under test 5.
The optical signal terminal 52 as the "light emitting portion" is a portion that receives the supply of the electric signal and emits the optical signal from the device under test 5.
The connection device 1 is connected to an inspection device (tester) 2, and supplies an electrical signal related to a characteristic inspection of the object 5 from the inspection device 2, and supplies the electrical signal to the electrically connected object 5. In the performance test of the device under test 5, the connection device 1 is brought close to the device under test 5 mounted on the upper surface of the stage 4 movable in the vertical direction, electrically connected to the electrical signal terminal 51 of the device under test 5, and optically connected to the optical signal terminal 52 of the device under test 5.
More specifically, when the characteristic inspection of the device under test 5 is performed, the connector substrate 12 of the connection device 1 and the device under test 5 are relatively brought close to each other, and the electrical contacts 41 and the optical connector 42 held on the connector substrate 12 are arranged in positions corresponding to the electrical signal terminals 51 and the optical signal terminals 52 of the device under test 5 (optical equipment) in close proximity to each other. Then, the electrical contacts 41 of the connector substrate 12 are brought into electrical contact with the electrical signal terminals 51 of the object 5, and the optical connector 42 is optically connected to the optical signal terminals 52 of the object 5.
The term "optical connection" refers to a configuration in which the optical connector 42 is connected to the optical signal terminal 52 of the subject 5 so that the optical loss of the optical signal emitted from the optical device as the subject 5 is as small as possible. The optical connector 42 and the optical signal terminal 52 may be optically connected in a non-contact state in which they are close to each other. The optical connector 42 is arranged so that the positional accuracy of the end face of the optical signal terminal 52 of the optical device (object 5) and the end face of the optical connector 42 is good (for example, the amount of positional deviation is smaller than a threshold value), the axial accuracy of the optical axis of the light emitted from the optical device (object 5) and the optical axis of the optical connector 42 of the connector substrate 12 is good (for example, the amount of deviation of the optical axis is smaller than a threshold value), and the gap length between the end face (for example, the upper end face) of the optical signal terminal 52 and the end face (for example, the lower end face) of the optical connector 42 is smaller than a threshold value.
When the device under test 5 is inspected, an electrical signal to be inspected is supplied from the inspection apparatus 2 to the connection apparatus 1, and the connection apparatus 1 supplies the electrical signal to the electrical signal terminal 51 of the device under test 5 via the electrical contact 41. Then, when an electric signal is supplied to the object 5, the object 5 converts the electric signal into an optical signal to emit an optical signal, and the optical signal is incident on the optical connector 42.
The connection device 1 is provided with a photoelectric conversion element, not shown, and converts an optical signal received from the object 5 into an electric signal and supplies the electric signal to the inspection device 2. In this way, by supplying an electric signal based on the amount of light of the received light to the inspection apparatus 2 by photoelectric conversion, the characteristics of the object 5 can be inspected in the inspection apparatus 2.
In this way, since the connecting device 1 supplies the electrical signal for inspection to the object 5 and the connecting device 1 receives the light emitted from the object 5, the connecting device 1 according to the embodiment may be referred to as a "light-receiving type electrical connecting device".
In addition, the connection device 1 may supply the optical signal received from the object 5 to the inspection device 2 without performing photoelectric conversion, and in this case, the inspection device 2 may have a photoelectric conversion function therein.
[ Wiring Board ]
The wiring board 11 is a printed wiring board made of a resin material such as polyimide, for example. A connection terminal 111 for electrically connecting with a connection terminal 21 of a test head (not shown) of the inspection apparatus (tester) 2 is provided at a peripheral edge portion of an upper surface of the wiring substrate 11. A wiring pattern is formed on the lower surface of the wiring substrate 11, and each connection terminal (not shown) of the wiring pattern is electrically connected to an upper end portion (upper end distal end portion) of the electrical contact 41.
The wiring board 11 is provided with a connection terminal 112 electrically connected to the connection terminal 22 of the inspection apparatus 2, and an electrical signal obtained by photoelectrically converting an optical signal received by the optical connector 42 is conducted from the connection terminal 112 to the connection terminal 22 of the inspection apparatus 2. Further, a plurality of electronic components necessary for inspecting the device under test 5 may be arranged on the upper surface of the wiring substrate 14.
[ connecting piece base plate ]
The connector substrate 12 is a substrate that holds a plurality of electrical contacts 41 and optical connectors 42. In this embodiment, for example, a case is illustrated in which a set of electrical signal terminals 51 and optical signal terminals 52 is provided on one device under test (optical apparatus) 5, and the set of electrical contacts 41 and optical connector 42 are connected to the set of electrical signal terminals 51 and optical signal terminals 52 of the one device under test (optical apparatus) 5 when the device under test 5 is inspected. Therefore, the connector substrate 12 holds the electrical contacts 41 and the optical connectors 42 in the number of sets corresponding to the number of the devices 5.
The connector substrate 12 includes a ceramic substrate 121 and a plate member for fixing 122 disposed on the upper surface of the ceramic substrate 121. As described later, the fixing plate member 122 is used to fix the flanged tubular member (flanged sleeve) 45 provided on the ceramic substrate 121.
(Electrical contact)
The electrical contact 41 is a contact electrically contacting the electrical signal terminal 51 of the device under test 5, and for example, a probe made of a conductive material can be applied. For example, a cantilever-type probe, a vertical-type probe, or the like can be used as the electrical contact 41, but the invention is not limited thereto, and a probe having any shape can be used.
(optical connector)
The optical connector 42 may employ an optical fiber, for example. The optical connector 42 is disposed at a position where it can be optically connected to the optical signal terminal 52 of the subject 5, and the optical signal emitted from the optical signal terminal 52 enters the optical connector 42. To correspond to a silicon photonic device (optical device), an optical fiber suitable for the optical connector 42 may also be formed of a material that conforms to the refractive index of silicon.
The electrical contacts 41 and the optical connectors 42 are aligned so as to be accurately connected to the electrical signal terminals 51 and the optical signal terminals 52 of the object 5 to be inspected at the time of inspection, and are provided on the ceramic substrate 121.
(holding structure of optical connector)
Fig. 2 is an enlarged cross-sectional view of a dotted line portion 40 of fig. 1, and shows a holding structure of the electrical contact 41 and the optical connector 42 in the connector substrate 12 according to the embodiment.
The ceramic substrate 121 is provided with a plurality of through holes 132 in the substrate thickness direction for holding the plurality of optical connectors 42. The positions of the through holes 132 provided in the ceramic substrate 121 are set to positions corresponding to the positions of the optical signal terminals 52 of the respective test objects (optical devices) 5 to be tested.
Therefore, when the optical connector 42 is inserted into each through hole 132 and is relatively moved so that the connection device 1 and the stage 4 approach each other, the lower end portion (hereinafter also referred to as "distal end portion") of the optical connector 42 held in each through hole 132 is disposed at a position where it can be optically connected to the optical signal terminal 52 of the subject 5. For example, when the device under test 5 emits light vertically upward with respect to the substrate surface of the semiconductor wafer, the lower end portion (distal end portion) of the optical connector 42 inserted into the through hole 12 is disposed vertically upward with respect to the optical signal terminal 52 of the device under test 5. This reduces loss of light from the subject 5 and allows the light to be efficiently incident on the optical connector 42.
The electrical contacts 41 held on the connector substrate 12 are arranged at positions where the distal ends of the electrical contacts 41 can electrically contact the electrical signal terminals 51 of the respective devices 5.
As shown in fig. 2, a flanged tubular member (hereinafter also referred to as a "flanged sleeve") 45 is inserted into each through hole 132 disposed in the ceramic substrate 121, and the optical connector 42 is inserted into the pipe of the flanged sleeve 45.
Conventionally, for example, an optical connector is inserted into a through hole of a ceramic substrate, and the optical connector inserted into the through hole is bonded to an inner wall surface of the through hole to hold the aligned optical connector. Therefore, for example, when the optical connector provided on the substrate is moved during work or the like, the optical connector may be broken due to bending or the like caused by contact with the edge of the through hole provided on the substrate. Furthermore, when the damaged optical connector needs to be replaced, it is difficult to replace the optical connector individually and replace the entire ceramic substrate.
In contrast, according to this embodiment, after the flanged sleeve 45 is inserted into the through hole 132 of the ceramic substrate 121, the optical connector 42 is inserted into the tube of the flanged sleeve 45. By inserting the optical connector 42 into the pipe of the flanged sleeve 45 inserted into the through hole 132 in this manner, damage to the optical connector 42 and the like can be prevented compared to the conventional case. That is, the flanged sleeve 45 functions as a protective member for the optical connector 42, and can protect the optical connector 42.
In this embodiment, when the optical connector 42 is inserted into the tube of the flanged sleeve 45, the inner wall surface of the tube of the flanged sleeve 45 and the outer circumferential surface of the optical connector 42 are bonded with the adhesive 46, but the outer circumferential surface of the flanged sleeve 45 and the inner wall surface of the through hole 132 are not bonded, in order to hold the aligned optical connector 42. In other words, the flanged bush 45 into which the optical connector 42 is inserted is detachably inserted into the through hole 132. Since the optical connector 42 and the flanged sleeve 45 are bonded by the adhesive 46 in this manner, when the optical connector 42 is damaged, the optical connector 42 and the flanged sleeve 45 bonded to each other can be removed from the through hole 132 and replaced. That is, when the optical connector 42 is damaged, the damaged optical connector 42 can be removed together with the flanged sleeve 45 fixed thereto, and the damaged optical connector 42 and the like can be individually replaced.
Fig. 3 is a structural view showing a structure of a flanged bush 45 according to the embodiment. Fig. 3 (a) is an external perspective view of the flanged sleeve 45 of the embodiment, and fig. 3 (B) is a sectional view of the flanged sleeve 45 of the embodiment.
As shown in fig. 3 (a), the flanged sleeve 45 of the embodiment has: the sleeve body portion 451 is a tubular member formed of an insulating material, and the flange portion 452 is formed of an insulating material at one end portion (an upper end portion in fig. 3) of the sleeve body portion 451.
The ferrule body portion 451 is, for example, a tubular member, and the inner diameter of the tube of the ferrule body portion 451 (i.e., the inner diameter of the through hole in the longitudinal direction) is formed slightly larger than the outer shape (e.g., the diameter of the outer shape) of the optical connector 42. That is, the optical connector 42 such as an optical fiber is formed to have a size of the inner diameter of the tube of the ferrule main body portion 451 so as to be inserted into the tube of the ferrule main body portion 451.
The outer diameter of the sleeve body 451 is formed to be approximately the same as or slightly larger than the inner diameter of the through hole 132 of the ceramic substrate 121. That is, the sleeve main body portion 451 has an outer diameter such that the sleeve main body portion 451 can be inserted into the through hole 132 of the ceramic substrate 121.
As described above, the cross-sectional shape of the through hole in the longitudinal direction of the ferrule main body portion 451 is preferably circular or substantially circular, which is the same as the outer shape of the optical connector 42 such as an optical fiber, but the cross-sectional shape of the outer diameter of the ferrule main body portion 451 may be circular, square, or the like, and in this case, the cross-sectional shape of the through hole 132 provided in the ceramic substrate 121 may be a shape that matches the cross-sectional shape of the outer diameter of the ferrule main body portion 451.
The flange portion 452 is a component provided at one end portion (upper end portion in fig. 3) of the sleeve main body portion 451, and the outer dimension (size) of the cross-sectional shape of the flange portion 452 is formed larger than the outer dimension (size) of the cross-sectional shape of the sleeve main body portion 451 itself and larger than the inner diameter dimension of the through hole 132 of the ceramic substrate 121. Therefore, when the sleeve body portion 451 of the flanged sleeve 45 is inserted into the through hole 132, the flange portion 452 comes into contact with the inlet peripheral edge portion of the through hole 132 of the ceramic substrate 121 (the upper surface of the ceramic substrate 121), and the flange portion 452 supports the flanged sleeve 45. In other words, the flange portion 452 functions as a support portion that supports the flanged bush 45.
The flange portion 452 is provided with a through hole 453 having a diameter approximately equal to the pipe inner diameter (the diameter of the through hole in the longitudinal direction) of the sleeve main body 451, and when the flange portion 452 is provided at the upper end portion of the sleeve main body 451, the through hole 453 of the flange portion 452 forms a hole continuous with the pipe inner diameter (the through hole) of the sleeve main body 451. Thereby, the optical connector 42 can be inserted into the pipe of the flanged sleeve 45.
The flange portion 452 may be formed as another component different from the sleeve main body portion 451, and the flanged sleeve 45 may be formed by fixing the flange portion 452 to the upper end portion of the sleeve main body portion 451 by an adhesive or the like, for example. Alternatively, the flange portion 452 and the sleeve body portion 451 may be physically formed integrally. In any case, the flanged sleeve 45 is formed such that the flange portion 452 can be inserted into the through hole 132 of the ceramic substrate 121 while supporting the flanged sleeve 45, and the optical connector 42 can be inserted into the tube (through hole 453) of the flanged sleeve 45.
(plate member for fixing)
The fixing plate member 122 is a plate-like member disposed on the upper surface of the ceramic substrate 121, and is a fixing member that fixes the flanged bushing 45 inserted into each through hole 132 of the ceramic substrate 121. This can prevent the flanged bush 45 from coming off, and can reliably fix the flanged bush 45 inserted into the through hole 132.
The depth (vertical length) of each recess 62 on the lower surface of the fixing plate member 122 is preferably formed to be approximately the same as or slightly larger than the height (vertical length) of the flange portion 452 of the flanged sleeve 45. A through hole 61 is formed in the center of the top (upper bottom) of each recess 62 so that an optical connector 42 such as an optical fiber can be inserted therethrough.
[ Assembly of connector base plate ]
Next, an example of a method of assembling the connector substrate 12 by inserting the flanged sleeve 45 into each through hole 132 of the ceramic substrate 121 until the optical connector 42 is provided will be described with reference to fig. 2. The method of assembling the connector substrate 12 is not limited to the following example.
First, the sleeve main body portion 451 of the flanged sleeve 45 is inserted from above the through hole 132 of the ceramic substrate 121, and the sleeve main body portion 451 is inserted into the through hole 132 until the flange portion 452 comes into contact with the inlet peripheral edge portion of the through hole 132.
Here, the length of the sleeve body portion 451 of the flanged sleeve 45 in the longitudinal direction is preferably as long as the thickness of the ceramic substrate 121. Therefore, when the sleeve main body portion 451 of the flanged sleeve 45 is inserted into the through hole 132 of the ceramic substrate 121 and the flange portion 452 is in contact with the inlet peripheral edge portion of the through hole 132, the lower end portion of the sleeve main body portion 451 inserted into the through hole 132 is positioned at a position approximately equal to the position of the lower surface of the ceramic substrate 121.
A flanged ferrule 45 into which an optical connector (e.g., an optical fiber) 42 is inserted in advance is inserted into each through hole 132 of the ceramic substrate 121. Here, the optical connector 42 inserted into the tube of the flanged sleeve 45 is aligned at a position where it can be optically connected to the optical signal terminal 52 of the device under test 5. For example, the posture of the optical connector 42 inserted into the tube of the flanged sleeve 45 is adjusted to be perpendicular to the substrate surface of the ceramic substrate 121, or the relative positional relationship between the position of the lower tip of the optical connector 42 and the position of the lower end of the sleeve body portion 451 of the flanged sleeve 45 is adjusted.
In order to fix the aligned optical connector 42 in the pipe of the flanged sleeve 45, an adhesive 46 is inserted between the outer wall surface of the optical connector 42 and the inner wall surface of the pipe of the flanged sleeve 45, and the optical connector 42 and the flanged sleeve 45 are bonded and fixed. By bonding and fixing the optical connector 42 and the flanged sleeve 45 in this manner, the flanged sleeve 45 can prevent the optical connector 42 from being bent or broken. In other words, the flanged sleeve 45 functions as a protective member of the optical connector 42.
That is, as in the conventional art, when each optical connector 42 is inserted into each through hole 132 of the ceramic substrate 121, each optical connector 42 comes into contact with each through hole 132, and the optical connector 42 is likely to be damaged, but according to this embodiment, the flanged sleeve 45 functions as a protective member for the optical connector 42, and therefore, damage or the like when the optical connector 42 is inserted into the through hole 132 can be prevented.
Furthermore, since the flanged sleeves 45 inserted into the through holes 132 of the ceramic substrate 121 are not fixed to the through holes 132, when the optical connector 42 needs to be replaced, the optical connector 42 and the flanged sleeves 45 fixed thereto can be removed from the through holes 132 of the ceramic substrate 121 at the same time, so that the optical connector 42 can be replaced individually. That is, conventionally, the optical connector 42 cannot be individually replaced, and when the optical connector 42 is replaced, the entire ceramic substrate 121 provided with the plurality of optical connectors 42 needs to be replaced, but according to this embodiment, the optical connector 42 that needs to be replaced can be individually replaced, so the replacement work of the optical connector 42 becomes simple.
Next, the fixing plate member 122 is disposed on the upper surface of the ceramic substrate 121 such that the flange portion 452 of each flanged bushing 45 protruding from the upper surface of the ceramic substrate 121 is fitted into the recess 62 of the lower surface of the fixing plate member 122.
Here, in order to reliably align the ceramic substrate 121 and the fixing plate member 122, for example, alignment pins and pin receiving portions, not shown, may be provided on the ceramic substrate 121 and the fixing plate member 122, and the fixing plate member 122 may be disposed on the upper surface of the ceramic substrate 121 while the alignment pins and the pin receiving portions of the ceramic substrate 121 and the fixing plate member 122 are fitted.
Further, in order to fix the fixing plate member 122 disposed on the upper surface of the ceramic substrate 121, the ceramic substrate 121 and the fixing plate member 122 disposed on the upper surface of the ceramic substrate 121 may be fixed using a fixing member such as a bolt, for example. In this way, by reliably fixing the ceramic substrate 121 and the plate member for fixing 122, the flanged bush 45 inserted into the through hole 132 can be reliably fixed.
(A-2) effects of embodiment
As described above, conventionally, since each optical connector is directly inserted into each through hole of the ceramic substrate, the optical connector may come into contact with the ceramic substrate, and the optical connector may be damaged. In contrast, according to this embodiment, since the flanged sleeve into which the optical connector is inserted in advance is inserted into each through hole of the ceramic substrate, it is possible to prevent damage when the optical connector is inserted into the through hole.
Further, according to the embodiment, since the flange sleeve and the optical connector inserted into the tube of the flange sleeve are fixed by an adhesive or the like without bonding the through hole of the ceramic substrate and the flange sleeve, the broken optical connector can be taken out from the through hole of the ceramic substrate together with the flange sleeve, and hence the replaceability of the optical connector provided on the ceramic substrate is excellent.
Further, according to the embodiment, the flanged sleeve inserted into the through hole of the ceramic substrate is pressed and fixed from above to below by the plate member for fixing, so that the flanged sleeve inserted into the through hole can be prevented from coming off or rattling, and the flanged sleeve can be reliably fixed.
Further, according to the embodiment, since the plurality of recesses for fitting the flange portions of the respective flanged bushes are provided on the lower surface of the fixing plate member, the flange portions protruding from the upper surface of the ceramic substrate can be eliminated by disposing the fixing plate member on the upper surface of the ceramic substrate, and the respective flanged bushes can be reliably fixed.
(B) Other embodiments
Various modified embodiments have been described in the above embodiments, but the present invention can be applied to the following modified embodiments.
(B-1) in the above embodiment, the structure of the flanged sleeve 45 was described with reference to FIG. 3, but the flanged sleeve is not limited to the structure illustrated in FIG. 3, and may have another structure. A modification of the flanged bush will be described with reference to fig. 4.
(B-1-1) the flanged bush 45A illustrated in fig. 4 (a) has an elastic member 454 made of a synthetic resin material such as an elastomer member or urethane on the upper surface of the flange portion 452. Further, a through hole is provided in the center of the elastic member 454 so that the optical connector 42 can be inserted.
For example, when the electrical contacts 41 and the like of the connection device 1 are electrically connected to the terminals (the electrical signal terminals 51 and the optical signal terminals 52) of the test object 5, a contact load from below to above acts on the connection device 1. Therefore, by providing the elastic member 454 on the upper surface of the flange portion 452, it is possible to suppress the load, and it is possible to prevent breakage of the flanged sleeve 45B, breakage of the optical connector 42 inserted into the tube of the flanged sleeve 45B, and the like.
In the example of fig. 4 (a), the elastic member 454 is provided on the upper surface of the flange portion 452, but the present invention is not limited thereto. For example, an elastic member (a member equivalent to the elastic member 454 in fig. 4 a) may be provided in an upper surface portion (top surface portion) of each recess 62 on the lower surface of the fixing plate member 122 of the fitting flange portion 452.
In other words, an elastic member for suppressing a load may be provided between the flange portion 452 of the flanged bushing 45 inserted into the through hole 132 and the concave portion 62 of the fixing plate member 122 fitted into the flange portion 452.
(B-1-2) FIG. 4 (B) illustrates a case where the flange portion 452B of the flanged sleeve 45B is an elastic member formed of a synthetic resin material such as a synthetic rubber member or polyurethane. In this case, too, the contact load can be suppressed as in (B-1-1). Further, as in the above embodiment, the flanged sleeve 45B inserted into the through hole 132 can be supported by the flange portion 452B abutting against the inlet peripheral edge portion of the through hole 132.
(B-2) in the above embodiment, the recess is provided on the lower surface of the fixing plate member in order to eliminate the flange portion protruding on the upper surface of the ceramic substrate, but as a modification, a recess (spot facing) may be provided on the inlet peripheral edge portion of the through hole of the ceramic substrate. Thus, when the flanged sleeve is inserted into the through hole of the ceramic substrate, the flange portion is fitted into the recess (spot facing) of the inlet peripheral edge portion of the through hole, and therefore, the protrusion of the flange portion can be eliminated.
(B-3) in the above-described embodiment, the fixing plate member as the fixing member is formed as a plate-like member, but the fixing member is not limited thereto as long as the flanged bushing inserted into the through hole of the ceramic substrate can be fixed. For example, the fixing member disposed on the upper surface of the ceramic substrate may be a synthetic resin film or the like. For example, as described in (B-2), when a recess (spot facing) is provided in the inlet peripheral edge portion of the through hole of the ceramic substrate, the flanged sleeve inserted into the through hole can be fixed by the film serving as the fixing member.
[ description of symbols ]
1 … connection device, 11 … wiring substrate, 12 … connector substrate, 121 … ceramic substrate, 122 … fixing plate member, 123 … through hole, 41 … electric contact, 42 … optical connector, 45A, 45B … flanged sleeve, 451 … sleeve main body part, 452B … flange part, 453 … through hole, 454 … elastic member, 46 … adhesive material, 61 … through hole, 62 … recess.
Claims (6)
1. An optical connector holding structure comprising:
a plurality of flanged tubular members having a tubular body portion and a flange portion provided at one end of the tubular body portion;
a plurality of optical connectors inserted from the flange portion side of each of the flanged tubular members toward the other end portion of the tubular body portion with tip end portions located on the tubular body portion side; and
a substrate having a plurality of through holes provided in a thickness direction of the substrate,
the tubular body portion of each of the flanged tubular members into which each of the optical connectors is inserted is detachably inserted into each of the through holes of the substrate, the flange portion abuts against a peripheral edge portion of the through hole to support the flanged tubular member,
each of the optical connectors and the flanged tubular member inserted into each of the optical connectors are fixed.
2. The optical connector holding structure according to claim 1,
the fixing member is disposed on the upper surface of the substrate, and fixes the flange portion of each flanged tubular member inserted into each through hole.
3. The optical connector holding structure according to claim 2,
on the opposite surface of the fixing member facing the substrate, a recess is provided at a position corresponding to the position of each through hole, the recess receiving the flange portion of the flanged tubular member inserted into each through hole.
4. The optical connector holding structure according to claim 3,
an elastic member is provided between the concave portion provided on the facing surface of the fixed member and the flange portion of the corresponding flanged tubular member.
5. The optical connector holding structure according to claim 1,
the optical connector inserted into the flanged tubular member is fixed by an adhesive material.
6. A connecting device which connects a plurality of test objects which emit optical signals based on supplied electrical signals and an inspection device, supplies the electrical signals from the inspection device to the test objects, and supplies the optical signals emitted from the test objects to the inspection device, the connecting device being characterized in that,
comprising a substrate having a plurality of electrical contacts and a plurality of optical connectors,
each of the electrical contacts is in electrical contact with an electrical signal terminal of the inspection apparatus and an electrical signal terminal of each of the objects to be inspected,
each of the optical connectors is inserted into a plurality of through holes provided in a thickness direction of the substrate, and is capable of optically connecting to light emission of the object to be inspected,
the substrate having each of the optical connector has the optical connector holding structure according to any one of claims 1 to 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-091982 | 2020-05-27 | ||
| JP2020091982A JP2021188947A (en) | 2020-05-27 | 2020-05-27 | Optical connector protection structure and connecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113805026A true CN113805026A (en) | 2021-12-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110563349.6A Pending CN113805026A (en) | 2020-05-27 | 2021-05-24 | Optical connector holding structure and connecting device |
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| Country | Link |
|---|---|
| JP (1) | JP2021188947A (en) |
| CN (1) | CN113805026A (en) |
| TW (1) | TWI785567B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202201015A (en) | 2022-01-01 |
| TWI785567B (en) | 2022-12-01 |
| JP2021188947A (en) | 2021-12-13 |
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