JP2021150569A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2021150569A JP2021150569A JP2020050895A JP2020050895A JP2021150569A JP 2021150569 A JP2021150569 A JP 2021150569A JP 2020050895 A JP2020050895 A JP 2020050895A JP 2020050895 A JP2020050895 A JP 2020050895A JP 2021150569 A JP2021150569 A JP 2021150569A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 79
- 238000006243 chemical reaction Methods 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000004907 flux Effects 0.000 claims abstract description 7
- 230000035882 stress Effects 0.000 description 59
- 238000000034 method Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009429 distress Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003362 replicative effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/22—Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral
- H03K5/24—Circuits having more than one input and one output for comparing pulses or pulse trains with each other according to input signal characteristics, e.g. slope, integral the characteristic being amplitude
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/07—Hall effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/007—Environmental aspects, e.g. temperature variations, radiation, stray fields
- G01R33/0082—Compensation, e.g. compensating for temperature changes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/101—Semiconductor Hall-effect devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/0206—Three-component magnetometers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
- H03F2203/45—Indexing scheme relating to differential amplifiers
- H03F2203/45138—Two or more differential amplifiers in IC-block form are combined, e.g. measuring amplifiers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
図1は本実施形態に係る半導体装置の一例である半導体装置1の一部分を示す平面図である。図2はII−II線に沿う方向における半導体装置1、具体的にはX軸抵抗器21の切断面を示す断面図(II−II線断面図)である。なお、図1及び図2に示されるX軸、Y軸及びZ軸は、XYZの3次元直交座標系における各軸を示している。
半導体装置1は、ホール素子10と、垂直抵抗回路20と、増幅器30と、比較器40と、電流電圧変換回路(I/V変換回路)50と、を備えている。
KH=SI・IDRV
=SIREF[1+πH(σXX+σYY)]・IDRV …(1)
SI:単位駆動電流あたりの磁電変換係数
IDRV:ホール素子10の駆動電流
SIREF:基準応力における単位駆動電流当たりの磁電変換係数
πH:単位駆動電流当たりの磁電変換係数の対X−Y平面内軸応力ピエゾ係数
σXX:X方向の垂直応力
σYY:Y方向の垂直応力
σXX+σYY:X−Y平面内における等方性応力
ここで、「基準応力」とは、所定の状態において半導体装置1が含まれる半導体チップに作用する応力をいう。また、「所定の状態」とは、例えば、上面を覆う保護膜が形成された後の状態等、特定可能な一つの状態をいう。
VSIG=G・VH
=G・SI・IDRV・Bin …(2)
=G・SIREF[1+πH(σXX+σYY)]・IDRV・Bin …(3)
Bin:Z方向に印加される磁束密度
VBOP=VREF+R・IREF
=VREF+RREF[1+π12(σXX+σYY)]・IREF …(4)
VBOP:動作点電圧
VREF:電流電圧変換回路50の基準電圧
R:垂直抵抗回路20の合成抵抗値
IREF:基準電流
RREF:基準応力における垂直抵抗回路20の合成抵抗値
π12:垂直抵抗回路20のZ方向の抵抗値の対X−Y平面内軸応力ピエゾ係数
BOP≒(αRREF/G・SIREF)[1+(π12−πH)( σXX+σYY)] …(5)
6 電流源(第1の電流源)
7 電流源(第2の電流源)
10 ホール素子
20 垂直抵抗回路
21 X軸抵抗器(第1の抵抗器)
22 Y軸抵抗器(第2の抵抗器)
30 増幅器
40 比較器
41 信号入力端子
42 基準電圧入力端子
50 電流電圧変換回路
100 半導体基板
120 エピタキシャル層(N型の抵抗)
Claims (4)
- P型の半導体基板の上に形成される半導体装置であって、
N型の抵抗を含み、前記抵抗が前記半導体基板の表面に対して垂直方向の電流経路を形成する垂直抵抗回路と、
前記半導体基板の上に設けられ、前記半導体基板の表面に対して垂直方向の磁束密度に比例する電圧を出力するホール素子と、
前記ホール素子から出力される電圧を増幅して出力する増幅器と、
前記垂直抵抗回路を流れる基準電流と前記垂直抵抗回路の抵抗値との積を含む電圧を比較基準電圧として出力する電流電圧変換回路と、
前記増幅器から出力される電圧が入力される信号入力端子と、前記比較基準電圧が入力される基準電圧入力端子と、を有する比較器と、
を備えることを特徴とする半導体装置。 - 前記垂直抵抗回路は、前記半導体基板の表面に平行な第1の方向に沿って配置される第1の抵抗器と、
前記第1の抵抗器が有するピエゾ係数と同じピエゾ係数を有し、前記半導体基板の表面に平行かつ前記第1の方向に垂直な第2の方向に沿って配置される第2の抵抗器と、を有し、
前記第1の抵抗器及び前記第2の抵抗器が電気的に接続されて構成される請求項1記載の半導体装置。 - 前記ホール素子を駆動させる駆動電流を供給する第1の電流源と、
前記基準電流を供給する第2の電流源と、を備える請求項1又は2に記載の半導体装置。 - 前記ホール素子を駆動させる駆動電流を供給する第1の電流源と、
前記駆動電流を所定の電流比で複製し、複製した電流を前記基準電流として出力するカレントミラー回路を有する第2の電流源と、を備える請求項1又は2に記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020050895A JP7511368B2 (ja) | 2020-03-23 | 半導体装置 | |
US17/204,331 US11290097B2 (en) | 2020-03-23 | 2021-03-17 | Semiconductor device |
CN202110305771.1A CN113433492A (zh) | 2020-03-23 | 2021-03-23 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020050895A JP7511368B2 (ja) | 2020-03-23 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021150569A true JP2021150569A (ja) | 2021-09-27 |
JP7511368B2 JP7511368B2 (ja) | 2024-07-05 |
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Publication number | Publication date |
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US20210297070A1 (en) | 2021-09-23 |
US11290097B2 (en) | 2022-03-29 |
CN113433492A (zh) | 2021-09-24 |
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