JP2021117400A - レーザ加工システム用光学ユニット及びレーザ加工システム - Google Patents
レーザ加工システム用光学ユニット及びレーザ加工システム Download PDFInfo
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- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
- G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
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- G02B27/0916—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
- G02B27/0922—Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers the semiconductor light source comprising an array of light emitters
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- G—PHYSICS
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- G—PHYSICS
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- H—ELECTRICITY
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- H01S5/00—Semiconductor lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Semiconductor Lasers (AREA)
- Optical Elements Other Than Lenses (AREA)
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Abstract
Description
以下、本開示のレーザ加工システム用光学ユニットを実施形態に基づいて詳細に説明する。
図1は、本開示の一実施形態に係るレーザ加工システム用光学ユニット10(以下、光学ユニット10ともいう)の断面図を示す。光学ユニット10は、レーザダイオード1とレンズユニット3と保持ブロック4とを有する。レーザダイオード1は、レーザ光を出射する複数のレーザエミッタ2を有する。レーザダイオード1は、複数のレーザエミッタ2を有するLDチップであってよい。レーザエミッタ2の個数は特に限定されず、2つ以上であればよい。例えば、1つの半導体チップに数百μmのピッチで2つ以上の複数のレーザエミッタ2を配置させたレーザダイオード1を用いてもよい。
本実施形態では、遮光膜7が光吸収性を有する場合を説明する。すなわち、本実施形態では、遮光膜7は光吸収膜であり、遮光膜7に到達したレーザ光は、遮光膜7によって吸収される。光吸収膜の種類は特に限定されず、光を吸収可能であり、レンズユニット3と保持ブロック4との接着性を阻害しにくいものであればよい。なお、遮光膜7として光吸収膜を用いる場合、光を吸収することによって熱エネルギーが発生するが、レンズユニット3の熱容量が大きいため、発生する熱エネルギーの影響は小さい。
本実施形態では、図2を参照して、遮光膜7が第2接着剤6を兼ねている場合を説明する。この場合、第2接着剤6、すなわち遮光膜7は、レンズユニット3の保持ブロック4と対向する面の全面に設けられていてもよく、一部に設けられていてもよい。ただし、保持ブロック4へのレーザ光の到達を防ぐ観点から、第2接着剤6は、レンズユニット3と保持ブロック4と対向する面の全面に設けられていることが好ましい。
本開示の光学ユニット10を用いたレーザ加工システムについて、詳細に説明する。
2 レーザエミッタ
3 レンズユニット
31 FACレンズ
32 ビームツイスターレンズ
4 保持ブロック
5 第1接着剤
6 第2接着剤
7 遮光膜
10 レーザ加工システム用光学ユニット
Claims (9)
- レーザ光を出射する複数のレーザエミッタを有するレーザダイオードと、
複数のレンズを有するレンズユニットと、
光透過性を有する保持ブロックと、
遮光膜と、を備え、
前記保持ブロックと前記レーザダイオードとは、第1接着剤で接着され、
前記レンズユニットと前記保持ブロックとは、第2接着剤で接着され、
前記遮光膜は、前記レンズユニットと前記保持ブロックとの間に位置する、
レーザ加工システム用光学ユニット。 - 前記遮光膜は、前記第2接着剤によって構成されている、
請求項1に記載のレーザ加工システム用光学ユニット。 - 前記遮光膜は、アルミニウムを含有する、
請求項1に記載のレーザ加工システム用光学ユニット。 - 前記第2接着剤は、白色接着剤である、
請求項2に記載のレーザ加工システム用光学ユニット。 - 前記遮光膜は、光反射性を有する、
請求項1〜4のいずれか1項に記載のレーザ加工システム用光学ユニット。 - 前記遮光膜は、酸化クロムを含有する、
請求項1に記載のレーザ加工システム用光学ユニット。 - 前記第2接着剤は、黒色接着剤である、
請求項2に記載のレーザ加工システム用光学ユニット。 - 前記遮光膜は、光吸収性を有する、
請求項1、2、6、7のいずれか1項に記載のレーザ加工システム用光学ユニット。 - 請求項1〜8のいずれか1項に記載のレーザ加工システム用光学ユニットと、
前記レーザ光を集光させる集光手段と、を備える
レーザ加工システム。
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JP2020011712A JP7373745B2 (ja) | 2020-01-28 | 2020-01-28 | レーザ加工システム用光学ユニット及びレーザ加工システム |
US17/095,694 US11493743B2 (en) | 2020-01-28 | 2020-11-11 | Optical unit for laser processing system and laser processing system |
CN202110072182.3A CN113245691A (zh) | 2020-01-28 | 2021-01-19 | 激光加工***用光学组件以及激光加工*** |
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JP2019207426A (ja) * | 2013-09-06 | 2019-12-05 | コーニング インコーポレイテッド | レンズアセンブリ用uv保護被膜 |
JP2017146407A (ja) * | 2016-02-16 | 2017-08-24 | ウシオ電機株式会社 | 光源装置及びその製造方法 |
WO2018037663A1 (ja) * | 2016-08-26 | 2018-03-01 | パナソニックIpマネジメント株式会社 | レーザモジュール |
JP2019095705A (ja) * | 2017-11-27 | 2019-06-20 | 日本電産コパル株式会社 | レンズバレル、電子機器、羽根駆動装置、及びレンズバレルの組み立て方法 |
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US11493743B2 (en) | 2022-11-08 |
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