JP2021068852A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2021068852A JP2021068852A JP2019194859A JP2019194859A JP2021068852A JP 2021068852 A JP2021068852 A JP 2021068852A JP 2019194859 A JP2019194859 A JP 2019194859A JP 2019194859 A JP2019194859 A JP 2019194859A JP 2021068852 A JP2021068852 A JP 2021068852A
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- Prior art keywords
- recess
- lead frame
- recesses
- semiconductor element
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052751 metal Inorganic materials 0.000 claims description 25
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
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- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
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- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
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- 150000003949 imides Chemical class 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
E[GPa]≦20[GPa]・・・(1)
5≦86.4−5.45×E[GPa]+0.164×P[μm]≦H[μm]・・・(2)
まず、図1を参照して、本発明の第1実施形態による半導体装置1の構造について説明する。図1は、本発明の第1実施形態による半導体装置1の模式的断面図である。
E[GPa]≦20[GPa]・・・(1)
5≦86.4−5.45×E[GPa]+0.164×P[μm]≦H[μm]・・・(2)
(試料1)
無酸素銅(C1020)からなる銅板103(図4参照)の表面103aに、複数の凹部20を行列状に形成した。このとき、レーザ活性物質としてYbが添加されたファイバーレーザを用いて、出力25W、パルス周期40μsecで、凹部20を形成した。また、凹部20のピッチを108.6μm、凹部20の深さを5.4μmとした。そして、図4に示すように、銅板103の表面103a上に、70μm以下の粒径を有する無機フィラーを含有するエポキシ樹脂からなる樹脂体105を形成した。このとき、樹脂体105を、10mm2の底面積、4mmの高さ、7°のテーパ角度を有する円錐台形状に形成した。また、樹脂体105の曲げ弾性率を18.0GPaとした。
凹部20のピッチを109.5μm、凹部20の深さを20.3μmとした。樹脂体105の曲げ弾性率を10.8GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを111.1μm、凹部20の深さを101.2μmとした。樹脂体105の曲げ弾性率を20.0GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを111.1μm、凹部20の深さを101.2μmとした。樹脂体105の曲げ弾性率を18.0GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを111.1μm、凹部20の深さを101.2μmとした。樹脂体105の曲げ弾性率を10.8GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを168.1μm、凹部20の深さを5.4μmとした。樹脂体105の曲げ弾性率を20.0GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを168.1μm、凹部20の深さを20.4μmとした。樹脂体105の曲げ弾性率を18.0GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを168.6μm、凹部20の深さを99.1μmとした。樹脂体105の曲げ弾性率を10.8GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを409.5μm、凹部20の深さを5.8μmとした。樹脂体105の曲げ弾性率を10.8GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを409.5μm、凹部20の深さを20.5μmとした。樹脂体105の曲げ弾性率を20.0GPaとした。その他の構造は、試料1と同様にした。
凹部20のピッチを410.2μm、凹部20の深さを99.2μmとした。樹脂体105の曲げ弾性率を18.0GPaとした。その他の構造は、試料1と同様にした。
密着強度[MPa]=0.22×H[μm]+1.2×E[GPa]−0.036×P[μm]−2.5・・・(3)
86.4−5.45×E[GPa]+0.164×P[μm]≦H[μm]・・・(4)
次に、本発明の第2実施形態による半導体装置1の構造について説明する。第2実施形態では図6に示すように、上記第1実施形態と異なり、列C2に配列された凹部20が、列C1に配列された凹部20および列C3に配列された凹部20に比べて、大きいピッチおよび小さい深さの少なくとも一方を有するように形成されている場合について説明する。
y=−132・x3+277・x2−172・x+35・・・(5)
16.5[MPa]≦得られる密着強度[MPa]=0.22×H[μm]+1.2×16.0[GPa]−0.036×400[μm]−2.5・・・(6)
Claims (4)
- 第1リードフレームと、
前記第1リードフレームの搭載面に第1接合層を介して接合された半導体素子と、
前記半導体素子の表面と前記搭載面のうち前記半導体素子の周囲領域とを覆う封止樹脂体と、
を備え、
前記周囲領域には、円形状の複数の凹部が所定のピッチで前記半導体素子を囲うように複数列を成して形成されており、
前記半導体素子を囲うように配置された複数の列のうち、少なくとも最内周の列に配列された前記凹部のピッチをP[μm]、深さをH[μm]、前記封止樹脂体の曲げ弾性率をE[GPa]とすると、以下の式(1)および(2)を満たすことを特徴とする半導体装置。
E[GPa]≦20[GPa]・・・(1)
5≦86.4−5.45×E[GPa]+0.164×P[μm]≦H[μm]・・・(2) - 前記各列に配列された凹部は、前記式(2)を満たすことを特徴とする請求項1に記載の半導体装置。
- 前記複数の凹部は、前記最内周の列に配列された第1凹部と、最外周の列に配列された第2凹部と、前記最内周の列と前記最外周の列との間に配列された第3凹部と、を含み、
前記第3凹部は、前記第1凹部および前記第2凹部に比べて、大きいピッチおよび小さい深さの少なくとも一方を有するように形成されていることを特徴とする請求項1に記載の半導体装置。 - 前記半導体素子の前記第1リードフレームとは反対側の面に、第2接合層を介して接合された金属ブロックと、
前記金属ブロックの前記半導体素子とは反対側の面に、第3接合層を介して接合された第2リードフレームと、
をさらに備え、
前記第2リードフレームは、前記金属ブロックに対向するように配置される対向面を有し、
前記対向面のうち前記金属ブロックの周囲領域は、前記封止樹脂体により覆われており、
前記対向面には、円形状の複数の凹部が所定のピッチで前記金属ブロックを囲うように複数列を成して形成されており、
前記金属ブロックを囲うように配置された複数の列のうち、少なくとも最内周の列に配列された前記凹部は前記式(2)を満たすことを特徴とする請求項1〜3のいずれか1項に記載の半導体装置。
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269401A (ja) * | 1999-03-16 | 2000-09-29 | Toshiba Microelectronics Corp | 半導体装置 |
JP2006222347A (ja) * | 2005-02-14 | 2006-08-24 | Toyota Motor Corp | 半導体モジュールと半導体モジュールの製造方法 |
JP2014007363A (ja) * | 2012-06-27 | 2014-01-16 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
JP2015149370A (ja) * | 2014-02-06 | 2015-08-20 | 日立オートモティブシステムズ株式会社 | 半導体装置及びその製造方法 |
JP2017005124A (ja) * | 2015-06-11 | 2017-01-05 | Shマテリアル株式会社 | リードフレーム、リードフレームの製造方法、および半導体装置 |
JP2017076764A (ja) * | 2015-10-16 | 2017-04-20 | 新光電気工業株式会社 | リードフレーム及びその製造方法、半導体装置 |
JP2018150456A (ja) * | 2017-03-13 | 2018-09-27 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
JP2019040971A (ja) * | 2017-08-24 | 2019-03-14 | 富士電機株式会社 | 半導体装置 |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269401A (ja) * | 1999-03-16 | 2000-09-29 | Toshiba Microelectronics Corp | 半導体装置 |
JP2006222347A (ja) * | 2005-02-14 | 2006-08-24 | Toyota Motor Corp | 半導体モジュールと半導体モジュールの製造方法 |
JP2014007363A (ja) * | 2012-06-27 | 2014-01-16 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
JP2015149370A (ja) * | 2014-02-06 | 2015-08-20 | 日立オートモティブシステムズ株式会社 | 半導体装置及びその製造方法 |
JP2017005124A (ja) * | 2015-06-11 | 2017-01-05 | Shマテリアル株式会社 | リードフレーム、リードフレームの製造方法、および半導体装置 |
JP2017076764A (ja) * | 2015-10-16 | 2017-04-20 | 新光電気工業株式会社 | リードフレーム及びその製造方法、半導体装置 |
JP2018150456A (ja) * | 2017-03-13 | 2018-09-27 | 住友ベークライト株式会社 | 封止用樹脂組成物および半導体装置 |
JP2019040971A (ja) * | 2017-08-24 | 2019-03-14 | 富士電機株式会社 | 半導体装置 |
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